CN222680512U

CN222680512U - A surface grinding and polishing equipment

Info

Publication number: CN222680512U
Application number: CN202421228083.5U
Authority: CN
Inventors: 刘澎波; 傅强; 吴康; 张盛楷; 沈仁新
Original assignee: Hubei Yuanheda Technology Co ltd
Current assignee: Hubei Yuanheda Technology Co ltd
Priority date: 2024-05-31
Filing date: 2024-05-31
Publication date: 2025-03-28
Anticipated expiration: 2034-05-31

Abstract

The utility model discloses a plane grinding and polishing device, including a mechanical arm, a clamping assembly and a plane grinding assembly. The mechanical arm and the clamping assembly are located on the same plane with a gap between them. The plane grinding assembly is arranged at the end of the mechanical arm so as to control the movement of the plane grinding assembly through the mechanical arm. The utility model is a plane grinding and polishing device. By using the mechanical arm to grind the plane of the column of the crystal boat through the plane grinding assembly, the mechanical arm can finely control the plane grinding assembly, thereby eliminating the need for manual secondary grinding, thereby improving the grinding efficiency; by arranging a tension adjustment unit on the plane grinding assembly, the tension of the grinding belt during grinding can be adjusted, so that the grinding belt can better contact with the plane of the column of the crystal boat and ensure that the grinding force is within a suitable range, thereby improving the grinding accuracy.

Description

Plane polishing equipment

Technical Field

The utility model relates to the field of automation, in particular to plane grinding and polishing equipment.

Background

Wafer boats are devices used to store, transport and process wafers. Because the wafers are thinner and thinner, the wafer boat is used for protecting the wafers from being damaged in the transportation and transfer process. Generally, a wafer boat is designed to at least hold one wafer, and more particularly, the wafer boat mainly includes a plurality of wafer placement grooves, each of which is provided for placing one wafer. The wafer boat has higher precision requirement during production and processing, the two ends of the wafer boat need to be processed smoothly, and if the produced wafer boat has errors, the wafers cannot be inserted into the wafer boat, or after the wafers are inserted into the wafer boat, the wafers are cracked and scrapped due to the errors of the wafer boat. According to the design demand, have the plane of certain inclination on the stand of wafer boat, the plane on the stand is after all preliminary polishing through the lathe generally, and the rethread is meticulous to polish, but the human cost of manual work is higher, and workman's intensity of labour is great, is difficult to satisfy the automated processing needs of wafer boat.

Disclosure of utility model

The utility model aims to overcome the defects of the prior art and provides plane grinding and polishing equipment.

In order to solve the technical problems, the utility model provides the following technical scheme:

The utility model relates to plane polishing equipment which comprises a mechanical arm, a clamping assembly and a plane polishing assembly, wherein the mechanical arm and the clamping assembly are positioned on the same plane with a space therebetween, and the plane polishing assembly is arranged at the end part of the mechanical arm so as to control the plane polishing assembly to move through the mechanical arm;

The clamping assembly comprises a supporting platform, the top of supporting platform is equipped with adjustable base, the top of base is provided with the mounting bracket, be used for placing the wafer boat in the mounting bracket, the both sides of mounting bracket all are provided with two centre gripping cylinders and two first cambered surface clamping bars, every the piston rod of centre gripping cylinder all level orientation set up in the mounting bracket, and the tip of its piston rod all is equipped with horizontally second cambered surface clamping bar.

As a preferable technical scheme of the utility model, the two ends of the base are provided with limiting plates, the top of each limiting plate is provided with a threaded plunger, and the ball head of each threaded plunger faces into the mounting frame.

As a preferable technical scheme of the utility model, the plane polishing assembly comprises a rotating seat and a polishing belt, wherein the rotating seat is connected with the end part of the mechanical arm through flange transmission, one end of a vertical plate of the rotating seat is provided with a driving motor, the other end of the vertical plate is provided with a driving wheel coaxially connected with an output shaft of the driving motor and two first driven wheels positioned on two sides below the driving wheel, the bottom end of the vertical plate of the rotating seat is provided with a tension adjusting unit, and the polishing belt is sleeved on the driving wheel, the first driven wheels and the tension adjusting unit.

As a preferable technical scheme of the utility model, the tension adjusting unit comprises a guide rail and Y-shaped forks, wherein the guide rail is vertically arranged at the bottom end of a vertical plate of the rotating seat, the Y-shaped forks are arranged at the bottom end of a movable end of the guide rail, the forks of the Y-shaped forks are vertically downwards arranged, the Y-shaped forks are connected with the vertical plate of the rotating seat through two springs, and each fork foot of each Y-shaped fork is provided with a second driven wheel.

As a preferable technical scheme of the Y-shaped fork, a sliding block capable of sliding vertically is arranged between two fork legs of the Y-shaped fork, and the sliding block is connected with the Y-shaped fork through a spring.

As a preferable technical scheme of the utility model, the mechanical arm and the clamping assembly are arranged on the bottom wall in the bin body.

Compared with the prior art, the utility model has the following beneficial effects:

The plane polishing device comprises a plane polishing assembly, a mechanical arm, a tension adjusting unit and a tension adjusting unit, wherein the plane polishing assembly is used for polishing the plane of the upright post of the wafer boat, the mechanical arm is used for precisely controlling the plane polishing assembly, so that secondary polishing is not needed through manpower, polishing efficiency is improved, the tension adjusting unit is arranged on the plane polishing assembly, the tension of a polishing belt during polishing can be adjusted, the polishing belt is in better contact with the plane of the upright post of the wafer boat, polishing force is ensured to be in a proper range, and polishing precision is improved.

Drawings

The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:

FIG. 1 is a schematic view of the overall structure of the present utility model;

FIG. 2 is a side view of the present utility model;

FIG. 3 is a top view of the present utility model;

FIG. 4 is a schematic view of a partial structure of the present utility model;

FIG. 5 is a schematic view of a partial structure of the present utility model;

FIG. 6 is a schematic view of the structure of the bin of the utility model;

In the figure, 1, a mechanical arm, 2, a clamping assembly, 21, a supporting platform, 22, a base, 23, a mounting rack, 24, a clamping cylinder, 25, a first cambered surface clamping rod, 26, a second cambered surface clamping rod, 27, a limiting plate, 28, a threaded plunger, 3, a plane polishing assembly, 31, a rotating seat, 32, a polishing belt, 33, a driving motor, 34, a driving wheel, 35, a first driven wheel, 4, a tension adjusting unit, 41, a guide rail, 42, a Y-shaped fork, 43, a second driven wheel, 44, a sliding block, 5, a bin body, 6 and a wafer boat.

Detailed Description

The preferred embodiments of the present utility model will be described below with reference to the accompanying drawings, it being understood that the preferred embodiments described herein are for illustration and explanation of the present utility model only, and are not intended to limit the present utility model.

Wherein like reference numerals refer to like elements throughout.

As shown in fig. 1-6, the present utility model provides a plane polishing device, which comprises a mechanical arm 1, a clamping assembly 2 and a plane polishing assembly 3, wherein the mechanical arm 1 and the clamping assembly 2 are located on the same plane with a space therebetween, and the plane polishing assembly 3 is arranged at the end part of the mechanical arm 1 so as to control the plane polishing assembly 3 to move through the mechanical arm 1.

In this embodiment, the wafer boat 6 to be polished is placed in the clamping assembly 2 for fixing, and the mechanical arm 1 (usually a five-axis mechanical arm) in the prior art is started to drive the plane polishing assembly 3 to polish the plane of the upright post of the fixed wafer boat 6.

Further, the clamping assembly 2 comprises a supporting platform 21, an adjustable base 22 is arranged at the top end of the supporting platform 21, a mounting frame 23 is arranged at the top end of the base 22, and a wafer boat is placed in the mounting frame 23.

In this embodiment, the base 22 may slide on the supporting platform 21 to be adjusted, and is fixed on the supporting platform 21 by bolts, and the mounting frame 23 is used for placing the wafer boat 6 and for mounting other clamping tools.

Further, two sides of the mounting frame 23 are provided with two clamping cylinders 24 and two first cambered surface clamping rods 25, piston rods of the clamping cylinders 24 are horizontally arranged in the mounting frame 23, and the end parts of the piston rods of the clamping cylinders are provided with horizontal second cambered surface clamping rods 26.

In the embodiment, the clamping cylinder 24 pushes the second cambered surface clamping rod 26 to be matched with the opposite first cambered surface clamping rod 25 to clamp and fix the cambered surface of the upright post of the wafer boat 6;

When in use, the two clamping cylinders 24 on one side drive the corresponding second cambered surface clamping rods 26 to move towards the first cambered surface clamping rods 25 on the other side downwards until the second cambered surface clamping rods 26 and the first cambered surface clamping rods 25 clamp and fix the cambered surfaces of the upright posts on the two sides of the wafer boat 6 so as to fix the wafer boat 6.

Further, limiting plates 27 are arranged at two ends of the base 22, a threaded plunger 28 is arranged at the top of each limiting plate 27, and a ball head of the threaded plunger 28 faces into the mounting frame 23.

In this embodiment, the limiting plate 27 on the adjusting base 22 can limit the plane plate of the wafer boat 6 in the mounting frame 23 by using the threaded plunger 28 in the prior art, so as to fix the wafer boat 6.

Further, the plane polishing assembly 3 comprises a rotating seat 31 and a polishing belt 32, the rotating seat 31 is connected with the end part of the mechanical arm 1 through flange transmission, a driving motor 33 is arranged at one end of a vertical plate of the rotating seat 31, a driving wheel 34 coaxially connected with an output shaft of the driving motor 33 and two first driven wheels 35 positioned on two sides below the driving wheel 34 are arranged at the other end of the vertical plate, a tension adjusting unit 4 is arranged at the bottom end of the vertical plate of the rotating seat 31, and the polishing belt 32 is sleeved on the driving wheel 34, the first driven wheels 35 and the tension adjusting unit 4.

In this embodiment, the mechanical arm 1 can drive the rotating seat 31 to rotate, so as to change the polishing angle of the plane of the upright post of the wafer boat 6, and the driving motor 33 drives the driving wheel 34 to rotate, and the polishing belt 32 sleeved on the driving wheel 35 and the tension adjusting unit 4 is matched to rotate, so that the rotating polishing belt 32 polishes the plane of the upright post of the wafer boat 6.

Further, the tension adjusting unit 4 includes a guide rail 41 and a Y-shaped fork 42, the guide rail 41 is vertically arranged at the bottom end of the vertical plate of the rotating seat 31, the Y-shaped fork 42 is arranged at the bottom end of the movable end of the guide rail 41, the fork is vertically downwards arranged, the Y-shaped fork 42 is connected with the vertical plate of the rotating seat 31 through two springs, and each fork foot of the Y-shaped fork 42 is provided with a second driven wheel 43.

In this embodiment, the tension adjusting unit 4 is configured to adjust tension when the polishing belt 32 contacts with a plane of a column of the wafer boat 6, so as to avoid unqualified polishing caused by too large or too small contact force;

One end of the Y-shaped fork 42 is connected with the movable end of the guide rail 41, the grinding belt 32 is sleeved on the driven wheels 43 on the two fork legs of the Y-shaped fork 42 so that the grinding belt 32 rotates, when the tension of the grinding belt 32 changes during grinding, the extending length of the guide rail 41 can be changed so as to balance the tension of the grinding belt 32 during grinding, and the Y-shaped fork 42 and the guide rail 41 are reset through a spring between the Y-shaped fork 42 and the guide rail 41;

the guide rail 41 is a cross roller guide rail.

Further, a sliding block 44 capable of sliding vertically is arranged between two fork legs of the Y-shaped fork 42, and the sliding block 44 is connected with the Y-shaped fork 42 through a spring.

In this embodiment, the two sides of the sliding block 44 have protrusions, and the protrusions are matched with the sliding grooves between the two fork legs of the Y-shaped fork 42, so that the sliding block 44 can slide between the two fork legs of the Y-shaped fork 42 and is connected with the Y-shaped fork 42 through a spring to play a role in tension adjustment.

Further, the automatic feeding device also comprises a bin body 5, and the mechanical arm 1 and the clamping component 2 are arranged on the bottom wall in the bin body 5.

In this embodiment, the bin body 5 plays a role in protecting the mechanical arm 1, the clamping assembly 2 and the plane polishing assembly 3, the bin body 5 is provided with a plurality of bin gates, the top of the bin body is provided with a fan for heat dissipation, and an electric cabinet for controlling the mechanical arm 1 and the plane polishing assembly 3 is also arranged in the bin body 5.

The plane polishing equipment comprises a plane polishing component, a tension adjusting unit and a tension adjusting unit, wherein the plane polishing component is used for polishing the plane of the upright post of the wafer boat, the plane polishing component is used for fine control by the mechanical arm, so that secondary polishing is not needed, polishing efficiency is improved, the tension adjusting unit is arranged on the plane polishing component, the tension of a polishing belt during polishing can be adjusted, the polishing belt can be better contacted with the plane of the upright post of the wafer boat, polishing force is ensured to be in a proper range, and polishing precision is improved.

Finally, it should be noted that the above-mentioned embodiments are only preferred embodiments of the present utility model, and the present utility model is not limited to the above-mentioned embodiments, but it is possible for those skilled in the art to modify the technical solutions described in the above-mentioned embodiments or to make equivalent substitutions for some of the technical features. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The plane polishing equipment is characterized by comprising a mechanical arm (1), a clamping assembly (2) and a plane polishing assembly (3), wherein the mechanical arm (1) and the clamping assembly (2) are positioned on the same plane with a space therebetween, and the plane polishing assembly (3) is arranged at the end part of the mechanical arm (1) so as to control the plane polishing assembly (3) to move through the mechanical arm (1);

Clamping assembly (2) are including supporting platform (21), the top of supporting platform (21) is equipped with adjustable base (22), the top of base (22) is provided with mounting bracket (23), be used for placing the wafer boat in mounting bracket (23), the both sides of mounting bracket (23) all are provided with two centre gripping cylinders (24) and two first cambered surface clamping rods (25), every the piston rod of centre gripping cylinder (24) all level orientation set up in mounting bracket (23), and the tip of its piston rod all is equipped with horizontally second cambered surface clamping rod (26).

2. The plane polishing equipment according to claim 1, wherein limiting plates (27) are arranged at two ends of the base (22), a threaded plunger (28) is arranged at the top of each limiting plate (27), and a ball head of the threaded plunger (28) faces into the mounting frame (23).

3. The plane polishing equipment according to claim 1, wherein the plane polishing component (3) comprises a rotating seat (31) and a polishing belt (32), the rotating seat (31) is connected with the end part of the mechanical arm (1) through flange transmission, one end of a vertical plate of the rotating seat (31) is provided with a driving motor (33), the other end of the vertical plate is provided with a driving wheel (34) coaxially connected with an output shaft of the driving motor (33) and two first driven wheels (35) positioned on two sides below the driving wheel (34), the bottom end of the vertical plate of the rotating seat (31) is provided with a tension adjusting unit (4), and the polishing belt (32) is sleeved on the driving wheel (34), the first driven wheels (35) and the tension adjusting unit (4).

4. A plane burnishing and polishing device according to claim 3, characterized in that the tension adjusting unit (4) comprises a guide rail (41) and a Y-shaped fork (42), the guide rail (41) is vertically arranged at the bottom end of the vertical plate of the rotating seat (31), the Y-shaped fork (42) is arranged at the bottom end of the movable end of the guide rail (41), the fork is vertically downwards arranged, the Y-shaped fork (42) is connected with the vertical plate of the rotating seat (31) through two springs, and each fork foot of the Y-shaped fork (42) is provided with a second driven wheel (43).

5. The plane grinding and polishing device according to claim 4, wherein a sliding block (44) capable of sliding vertically is arranged between two fork legs of the Y-shaped fork (42), and the sliding block (44) is connected with the Y-shaped fork (42) through a spring.

6. A planar sanding polishing apparatus as defined in any one of claims 1-5, further comprising a housing (5), wherein the robotic arm (1) and the clamping assembly (2) are disposed on a bottom wall within the housing (5).