CN222655401U - Integrated circuit board integrated with heat dissipation waistcoat - Google Patents
Integrated circuit board integrated with heat dissipation waistcoat Download PDFInfo
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- CN222655401U CN222655401U CN202421305860.1U CN202421305860U CN222655401U CN 222655401 U CN222655401 U CN 222655401U CN 202421305860 U CN202421305860 U CN 202421305860U CN 222655401 U CN222655401 U CN 222655401U
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- circuit board
- heat dissipation
- heat
- board body
- vest
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Abstract
本实用新型公开了一种集成有散热马甲的集成电路板，包括电路板本体，包括设置于电路板本体上的散热马甲；位于散热马甲和电路板本体之间，且受散热马甲抵压的硅胶散热片；设置于散热马甲上，且第一端向硅胶散热片延伸的柱芯；水平方向贯通于散热马甲，并用于对柱芯通风散热的通风腔。该集成有散热马甲的集成电路板通过柱芯将硅胶散热片紧抵于电路板本体上，能够根据电路板本体上不同电子元件的厚度进行自适应调整，保障了整体的散热效率，柱芯将硅胶散热片的热量传递至弹性件上与外界传递，并通过通风腔的贯通设计，使得自然风流穿过时对柱芯进行散热，使得散热马甲自身具有较好的散热性能，不需要加装其他散热设备。
The utility model discloses an integrated circuit board with a heat dissipation vest, comprising a circuit board body, a heat dissipation vest arranged on the circuit board body; a silicone heat sink located between the heat dissipation vest and the circuit board body and pressed by the heat dissipation vest; a column core arranged on the heat dissipation vest, with a first end extending toward the silicone heat sink; and a ventilation cavity horizontally penetrating the heat dissipation vest and used for ventilating and dissipating heat from the column core. The integrated circuit board with the heat dissipation vest presses the silicone heat sink against the circuit board body through the column core, and can be adaptively adjusted according to the thickness of different electronic components on the circuit board body, thereby ensuring the overall heat dissipation efficiency. The column core transfers the heat of the silicone heat sink to the elastic member and the outside world, and through the through design of the ventilation cavity, the column core is cooled when natural wind flows through it, so that the heat dissipation vest itself has good heat dissipation performance, and no other heat dissipation equipment needs to be installed.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to an integrated circuit board integrated with a heat dissipation waistcoat.
Background
The circuit board is a board for connecting electronic components with each other through conductive paths, and because the electronic components generate heat during operation, the heat dissipation problem of the electric heating plate needs to be considered, and the conventional means is to solve the problem by adding a heat dissipation waistcoat, namely the circuit board integrated with the heat dissipation waistcoat.
In combination with publication No. CN219698276U, publication No. 2023-09-15 discloses a heat dissipating integrated circuit board.
In the prior art including above-mentioned patent, including circuit board main part, radiator unit and fixing base, the fixing base is provided with a plurality of support column, the circuit board main part with support column fixed connection, radiator unit with the fixing base is connected, radiator unit includes heat dissipation support and heat dissipation fan, the one end of heat dissipation support with the circuit board main part can dismantle and be connected, the heat dissipation fan install in the other end of heat dissipation support, the heat dissipation fan be the slope set up in the upper end of circuit board main part. Above-mentioned technique is through the radiating fan that inclines to set up for the circuit board main part can be in a large scale receive the cold wind that the radiating fan blown, reduces surface temperature, discharges the heat of circuit board main part effectively, but the radiating fan needs motor drive, also can produce the heat during the motor operation, and the space that the circuit board is located is comparatively narrow and small, makes the distance between the heat generation position of radiating fan and the circuit board nearer, can influence the circuit board heat dissipation on the contrary.
Disclosure of utility model
The utility model aims to provide an integrated circuit board integrated with a heat dissipation waistcoat, which is used for solving the problems.
In order to achieve the above purpose, the utility model provides the technical scheme that the integrated circuit board integrated with the heat dissipation waistcoat comprises a circuit board body, wherein the heat dissipation waistcoat arranged on the circuit board body is clamped and fixed on the circuit board body through a clamping assembly;
The silica gel radiating fin is positioned between the radiating waistcoat and the circuit board body and is pressed by the radiating waistcoat;
The column core is arranged on the heat dissipation waistcoat, the first end of the column core extends to the silica gel heat dissipation sheet, and the second end of the column core is provided with an elastic piece for keeping a preset height;
The horizontal direction is communicated with the heat dissipation waistcoat and is used for ventilating and dissipating the heat of the column core.
Preferably, the two ends of the ventilation cavity are provided with bucket-shaped heat dissipation openings, and one end with a narrower heat dissipation opening is communicated with the ventilation cavity.
Preferably, a plurality of heat conducting pipes communicated with the ventilation cavity are arranged on the ventilation cavity in a linear array mode.
Preferably, the heat conducting pipe is in sliding plug-in fit with the column core, and the elastic piece covers the end opening of the heat conducting pipe.
Preferably, the heat conducting tube comprises a tubular part and a bucket part extending to the silica gel radiating fin, and a gap between the tubular part and the column core is a radiating channel.
Preferably, the heat dissipation waistcoat is rotatably arranged relative to the circuit board body, the clamping assembly comprises a clamping piece arranged on the heat dissipation waistcoat and a fastener arranged on the circuit board body, and the clamping piece is tangent to the fastener to be clamped when the heat dissipation waistcoat is in a parallel state with the circuit board body.
According to the technical scheme, the integrated circuit board integrated with the heat dissipation waistcoat has the advantages that the silica gel heat dissipation fins are tightly abutted to the circuit board body through the column cores, the self-adaptive adjustment can be carried out according to the thickness of different electronic elements on the circuit board body, the overall heat dissipation efficiency is guaranteed, the column cores transfer the heat of the silica gel heat dissipation fins to the elastic piece to be transferred with the outside, and through the through design of the ventilation cavity, the column cores are enabled to dissipate heat when natural wind flows pass through, so that the heat dissipation waistcoat has good heat dissipation performance, and other heat dissipation devices do not need to be additionally arranged.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings required for the embodiments will be briefly described below, and it is apparent that the drawings in the following description are only some embodiments described in the present utility model, and other drawings may be obtained according to these drawings for a person having ordinary skill in the art.
FIG. 1 is a schematic view of an overall three-dimensional view provided by an embodiment of the present utility model;
fig. 2 is a schematic diagram of a heat dissipation waistcoat and a circuit board body according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of a heat dissipating waistcoat and a heat dissipating opening and an elastic member according to an embodiment of the present utility model;
Fig. 4 is a schematic sectional view of a heat dissipation port, a ventilation cavity and a heat conduction pipe according to an embodiment of the present utility model.
Reference numerals illustrate:
1. The circuit board comprises a circuit board body, a heat dissipation waistcoat, a silica gel heat dissipation sheet, a clamping piece, a fastener, a heat dissipation opening, a ventilation cavity, a heat conduction pipe, a tubular part, a bucket-shaped part, a column core and an elastic piece.
Detailed Description
In order to make the technical scheme of the present utility model better understood by those skilled in the art, the present utility model will be further described in detail with reference to the accompanying drawings.
As shown in fig. 1-4, an integrated circuit board integrated with a heat dissipation waistcoat comprises a circuit board body 1, and the integrated circuit board comprises a heat dissipation waistcoat 2 arranged on the circuit board body 1 and clamped on the circuit board body 1 through a clamping assembly;
The silica gel radiating fin 3 is positioned between the radiating waistcoat 2 and the circuit board body 1 and is pressed by the radiating waistcoat 2;
a column core 9 arranged on the heat radiation waistcoat 2 and having a first end extending to the silica gel heat radiation fin 3, and a second end provided with an elastic member 10 for maintaining a predetermined height;
a ventilation cavity 7 which penetrates through the heat dissipation waistcoat 2 in the horizontal direction and is used for ventilating and dissipating heat to the column core 9.
Specifically, the application on the heat dissipation vest 2 is the graphite alkene material, post core 9 and elastic component 10 are copper, the user hugs closely silica gel fin 3 and circuit board body 1, later through joint subassembly with heat dissipation vest 2 card solid on circuit board body 1, tightly support silica gel fin 3 on circuit board body 1 through post core 9, and because be equipped with elastic component 10 on the post core 9, can carry out the self-adaptation adjustment according to the thickness of different electronic component on the circuit board body 1, make post core 9 present different heights, and can make thinner electronic component also hug closely with silica gel fin 3, the holistic radiating efficiency has been ensured, post core 9 is with the heat transfer of silica gel fin 3 to on elastic component 10 with external transmission, and through ventilation cavity 7's link up design, make the heat dissipation to post core 9 when natural wind flows through.
In the above-mentioned technique, support silica gel fin 3 tightly on circuit board body 1 through post core 9, can carry out the self-adaptation adjustment according to the thickness of different electronic component on the circuit board body 1, ensured holistic radiating efficiency, post core 9 with the heat transfer of silica gel fin 3 to elastic component 10 on with external transmission, and through ventilation cavity 7 link up the design, make natural wind flow dispel the heat to post core 9 when passing, make heat dissipation vest 2 self have better heat dispersion, do not need install other firing equipment additional.
As an embodiment of the present invention, the two ends of the ventilation cavity 7 are provided with the bucket-shaped heat dissipation openings 6, and the narrower end of the heat dissipation opening 6 is communicated with the ventilation cavity 7.
Specifically, because the heat dissipation port 6 is the bucket-shaped structure, and narrower one end and ventilation chamber 7 intercommunication, then make wider one end towards the external world, consequently when external wind flows through, the cross-sectional area is by reducing greatly for the gas velocity of flow accelerates, appears the narrow pipe effect, makes the wind speed in the ventilation chamber 7 great and dispels the heat to post core 9, blows out the hot air in the ventilation chamber 7.
As a further embodiment of the present invention, the ventilation chamber 7 is provided with a plurality of heat conducting pipes 8 in communication with the ventilation chamber 7 in a linear array.
Specifically, the heat conducting pipe 8 is arranged on the ventilation cavity 7 along the vertical direction, when the temperature in the ventilation cavity 7 is increased, hot air rises and is directly discharged upwards through the heat conducting pipe 8, at this time, the air quantity in the heat conducting pipe 8 is reduced to form negative pressure, and air is fed from two sides through the heat radiating ports 6, so that cold air is heated and warmed after entering the ventilation cavity 7 from the heat radiating ports 6, hot air is discharged upwards from the heat conducting pipe 8 to form heat radiating circulation, and the column core 9 is slidingly inserted in the heat conducting pipe 8, so that heat on the column core 9 can be transferred into the heat conducting pipe 8 through the part connected with the heat conducting pipe 8, and the heat is transferred out in the ventilation process of the heat conducting pipe 8, so that heat is further radiated, and the elastic piece 10 can avoid the dust falling from the upper part to enter the heat conducting pipe 8 to cause blockage to the heat conducting pipe 8.
As still another embodiment of the present invention, the heat conduction pipe 8 includes a tubular portion 81 and a bucket portion 82 extending toward the silica gel heat sink 3, and a gap between the tubular portion 81 and the column core 9 is a heat dissipation passage.
Specifically, when the column core 9 is under the predetermined height by the elastic piece 10, the lower end of the column core 9 is flush with the lower port of the bucket-shaped part 82, in the process of fixing the heat dissipation waistcoat 2, the column core 9 is propped against the silica gel heat dissipation sheet 3 along with the heat dissipation waistcoat 2, the column core 9 is enabled to be retracted into the bucket-shaped part 82 by the reaction force of the silica gel heat dissipation sheet 3, after long-time use, impurities coming from the silica gel heat dissipation sheet 3 can be attached to the column core 9, after the clamping connection is released, the silica gel heat dissipation sheet 3 is replaced, the column core 9 can be driven to extend downwards by pressing the elastic piece 10 downwards, part of impurities are extruded out of the bucket-shaped part 82 in the moving process, then the column core 9 is loosened, the column core 9 is restored to be flush with the lower port of the bucket-shaped part 82 again, the impurities on the surface of the column core 9 are enabled to fall off through mutual friction pairs between the column core 9 and the lower port of the bucket-shaped part 82, the column core 9 is convenient to clean, a gap between the column core 9 and the tubular part 81 is communicated with the ventilation cavity 7, and a ventilation channel of the column core 9 and the ventilation cavity 7 is formed.
As still another embodiment of the present invention, the heat dissipation waistcoat 2 is rotatably disposed relative to the circuit board body 1, the fastening assembly includes a fastening member 4 disposed on the heat dissipation waistcoat 2 and a fastening member 5 disposed on the circuit board body 1, and the fastening member 4 is tangent to the fastening member 5 in a fastening manner in a parallel state of the heat dissipation waistcoat 2 and the circuit board body 1.
Specifically, fastener 4 is the deformable material, heat dissipation vest 2 rotates through the pivot and sets up on circuit board body 1, when needing to change silica gel fin 3, along the tangent line of fastener 5 and fastener 4, upwards break off fastener 4 with the fingers and thumb for fastener 4 deformation and break away from with fastener 5, rotatable heat dissipation vest 2 changes silica gel fin 3 this moment, then makes heat dissipation vest 2 rotate to parallel with circuit board body 1 again, in the rotation process, fastener 4 is blockked producing bending deformation by fastener 5, and slide along fastener 5 outer wall, until fastener 4 is tangent with fastener 5 and the block under the deformation potential energy of fastener 4 self.
When the silica gel radiating fin 3 needs to be replaced, the clamping piece 4 is upwards broken along the tangent line between the clamping piece 5 and the clamping piece 4, so that the clamping piece 4 deforms and is separated from the clamping piece 5, at the moment, the radiating waistcoat 2 can be rotated to replace the silica gel radiating fin 3, then the radiating waistcoat 2 is rotated to be parallel to the circuit board body 1 again, in the rotating process, the clamping piece 4 is blocked by the clamping piece 5 to generate bending deformation and slides along the outer wall of the clamping piece 5 until the clamping piece 4 is tangent to the clamping piece 5 and is clamped under the deformation potential energy of the clamping piece 4, the silica gel radiating fin 3 is tightly abutted to the circuit board body 1 through the column core 9, and as the elastic piece 10 is arranged on the column core 9, the column core 9 can be adaptively adjusted according to the thickness of different electronic elements on the circuit board body 1, so that the column core 9 presents different heights, the thinner electronic elements can be tightly attached to the silica gel radiating fin 3, and the column core 9 can be contracted into the bucket-shaped part 82 under the action force of the silica gel radiating fin 3; the column core 9 transfers the heat of the silica gel cooling fin 3 into the heat conducting tube 8, when the temperature in the ventilation cavity 7 is increased, the hot air is increased and directly discharged upwards through the heat conducting tube 8, at the moment, the air quantity in the heat conducting tube 8 is reduced to form negative pressure, the air inlet at two sides generates a narrow tube effect through the design of the cooling hole 6, the ventilation cavity 7 is cooled, the hot air is discharged, cold air is heated and warmed after entering the ventilation cavity 7 from the cooling hole 6, hot air is discharged upwards from the heat conducting tube 8 to form a heat dissipation cycle, after long-term use, the silica gel cooling fin 3 is replaced, the elastic piece 10 is pressed downwards to drive the column core 9 to extend downwards, part of impurities are extruded out of the bucket-shaped part 82 in the moving process, then the hand is loosened, the column core 9 is restored to be flush with the lower port of the bucket-shaped part 82 again, impurities on the surface of the column core 9 are separated by mutual friction between the column core 9 and the lower port of the bucket-shaped part 82, so that the cleaning is convenient.
While certain exemplary embodiments of the present utility model have been described above by way of illustration only, it will be apparent to those of ordinary skill in the art that modifications may be made to the described embodiments in various different ways without departing from the spirit and scope of the utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive of the scope of the utility model, which is defined by the appended claims.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421305860.1U CN222655401U (en) | 2024-06-11 | 2024-06-11 | Integrated circuit board integrated with heat dissipation waistcoat |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421305860.1U CN222655401U (en) | 2024-06-11 | 2024-06-11 | Integrated circuit board integrated with heat dissipation waistcoat |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222655401U true CN222655401U (en) | 2025-03-21 |
Family
ID=95016522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421305860.1U Active CN222655401U (en) | 2024-06-11 | 2024-06-11 | Integrated circuit board integrated with heat dissipation waistcoat |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222655401U (en) |
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2024
- 2024-06-11 CN CN202421305860.1U patent/CN222655401U/en active Active
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