CN222637275U - IGBT module and structural member thereof - Google Patents

Abstract

The utility model discloses an IGBT module and a structural member thereof, wherein the IGBT structural member comprises a supporting frame, a first terminal and a second terminal are arranged at the end part of the supporting frame, a containing groove is formed in the supporting frame and used for installing and placing a chip, the first terminal and the second terminal can be electrically connected with the chip in a bonding mode, a first bonding pad of the first terminal and a second bonding pad of the second terminal extend into the containing groove, and an electricity blocking wall is arranged between the first bonding pad and the second bonding pad. This IGBT structure is provided with the fender electric wall between first pad and second pad, even increase the size of first pad and second pad and also can avoid appearing the creepage phenomenon, consequently can not increase the size of first pad and second pad as far as possible under the prerequisite that does not increase IGBT structure overall dimension and does not take place structural interference with other parts, and then increase the bonding area between terminal and the chip to in with the chip equipment to braced frame.

Description

IGBT module and structural member thereof

Technical Field

The utility model relates to the technical field of IGBT (insulated gate bipolar transistor), in particular to an IGBT module and a structural member thereof.

Background

In an IGBT module, when the chip is assembled into the support frame, the electrode leads of the chip need to be connected to the leads in the terminal pads on the support frame, a process also called bonding, and the quality of bonding directly affects the performance and reliability of the IGBT module. In the prior art, an IGBT module used in a specific occasion generally has a specific external dimension, the dimension of a terminal pad on a supporting frame is smaller, the bonding area between a terminal and a chip is smaller, wire bonding is inconvenient, the bonding quality is easy to cause, and the performance of the IGBT module is further affected. If the size of the bonding pad is directly increased, the overall size of the IGBT module is increased, the installation universality is not met, if the overall size of the IGBT module is not increased, structural interference between the bonding pad and other components is caused, creepage phenomenon between terminals is also caused, and the performance of the IGBT module is affected and even failure is caused.

Disclosure of utility model

In order to overcome the defects in the prior art, the utility model aims to provide an IGBT structural member, which can increase the bonding area between a terminal and a chip as much as possible so as to facilitate the assembly of the chip into a supporting frame.

In order to solve the problems, the technical scheme includes that the IGBT structural member comprises a supporting frame, a first terminal and a second terminal are arranged at the end part of the supporting frame, a containing groove is formed in the supporting frame, a first bonding pad of the first terminal and a second bonding pad of the second terminal extend into the containing groove, and a power blocking wall is arranged between the first bonding pad and the second bonding pad.

Compared with the prior art, the IGBT structural member has the beneficial effects that the electric blocking wall is arranged between the first bonding pad and the second bonding pad, and the creepage phenomenon can be avoided even if the sizes of the first bonding pad and the second bonding pad are increased, so that the sizes of the first bonding pad and the second bonding pad can be increased as much as possible on the premise that the overall size of the IGBT structural member is not increased and structural interference with other components is not generated, and the bonding area between the terminal and the chip is increased, so that the chip is assembled into the supporting frame conveniently.

According to the IGBT structural member, the electricity blocking wall protrudes out of the first bonding pad and the second bonding pad in the first direction.

According to the IGBT structural member, the electricity blocking wall protrudes out of the first bonding pad and the second bonding pad in the second direction.

According to the IGBT structural member, the size of the electricity blocking wall in the first direction is 7mm, the size of the electricity blocking wall in the second direction is 3.2mm, and the size of the electricity blocking wall in the third direction is 1.1mm.

According to the IGBT structural member, the size of the first bonding pad and the second bonding pad in the third direction is 16mm.

According to the IGBT structural member, the center distance between the first terminal and the second terminal is 22mm.

The IGBT structural member is characterized in that the side wall of the accommodating groove is connected with a clamping structure.

The utility model also provides an IGBT module, which comprises the IGBT structural member, and at least has all the beneficial effects brought by the IGBT structural member because the IGBT structural member is adopted by the IGBT module.

The utility model is described in further detail below with reference to the drawings and the detailed description.

Drawings

Fig. 1 is a front view of an IGBT structure according to an embodiment of the utility model;

Fig. 2 is a perspective view of an IGBT structure according to an embodiment of the utility model.

The reference numerals indicate that the support frame 100, the accommodating groove 110, the clamping structure 120, the first terminal 200, the first bonding pad 210, the second terminal 300, the second bonding pad 310 and the 400 electricity blocking wall.

Detailed Description

The following describes embodiments of the present utility model in detail, referring to fig. 1 and 2, the embodiments of the present utility model provide an IGBT structural member, which includes a support frame 100, a first terminal 200 and a second terminal 300 are provided at ends of the support frame 100, a receiving groove 110 is provided in the support frame 100, the receiving groove 110 is used for mounting and placing a chip, and the first terminal 200 and the second terminal 300 can be electrically connected with the chip in a bonding manner. The first bonding pad 210 of the first terminal 200 and the second bonding pad 310 of the second terminal 300 extend into the accommodating groove 110, and a power blocking wall 400 is arranged between the first bonding pad 210 and the second bonding pad 310. This IGBT structure is provided with keeps off electric wall 400 between first pad 210 and second pad 310, even increase the size of first pad 210 and second pad 310 also can avoid appearing the creepage phenomenon, therefore can be under the prerequisite that does not increase IGBT structure spare overall dimension and does not take place the structure with other parts to interfere, increase the size of first pad 210 and second pad 310 as far as possible, and then increase the bonding area between terminal and the chip to in being convenient for with the chip equipment to braced frame 100, improve bonding quality, and then improve IGBT module's performance and reliability.

Further, the power blocking wall 400 protrudes from the first pad 210 and the second pad 310 in the first direction, and the power blocking wall 400 protrudes from the first pad 210 and the second pad 310 in the second direction, so as to further increase the anti-creepage effect. Specifically, in some embodiments, the size of the power blocking wall 400 in the first direction is 7mm, the size of the power blocking wall in the second direction is 3.2mm, the size of the power blocking wall in the third direction is 1.1mm, the size of the first pads 210 and the second pads 310 in the third direction is 16mm, the size of the power blocking wall in the first direction may be equal to 7mm or less than 7mm, and the center distance l=22 mm between the first terminals 200 and the second terminals 300. Wherein the first direction, the second direction and the third direction are as shown in fig. 1 and 2. Further, the electricity blocking wall 400 is made of an insulating material, and the electricity blocking wall 400 may be integrally formed with the support frame 100 by injection molding.

Further, the side wall of the accommodating groove 110 is connected with a clamping structure 120, which can be used for clamping a surface cover to realize the packaging protection of the IGBT module. For some existing IGBT structural members, the clamping structure 120 of the face cover is disposed between two terminal pads, so that the size of the terminal pads is limited, and the clamping structure 120 is a cylindrical structure, so that the anti-creepage effect between the terminal pads is reduced. The IGBT structure has the clamping structure 120 of the cover disposed on the side wall of the accommodating groove 110, and the clamping structure 120 and the first pad 210/second pad 310 are disposed on different side walls, so that structural interference with the clamping structure 120 is avoided when the area of the first pad 210 and the second pad 310 is increased, and the structure of the power blocking wall 400 is increased, and the power blocking wall 400 is of a sheet structure, so that the purpose of preventing creepage is achieved, the thickness of the power blocking wall 400 is reduced as much as possible, the area of the first pad 210 and the area of the second pad 310 are increased, and the pad area of the terminal is maximized. Specifically, the fastening structure 120 may be a buckle or the like.

The embodiment of the utility model also provides an IGBT module, which comprises the IGBT structural member, and at least has all the beneficial effects brought by the IGBT structural member because the IGBT structural member is adopted by the IGBT module.

It should be noted that, in the description of the present utility model, if an azimuth or positional relationship is referred to, for example, upper, lower, front, rear, left, right, etc., the azimuth or positional relationship is based on the azimuth or positional relationship shown in the drawings, it is merely for convenience of describing the present utility model and simplifying the description, and it is not indicated or implied that the referred device or element must have a specific azimuth, be configured or operated in a specific azimuth, and should not be construed as limiting the present utility model.

In the description of the present utility model, a plurality means one or more, and a plurality means two or more, and it is understood that greater than, less than, exceeding, etc. does not include the present number, and it is understood that greater than, less than, within, etc. include the present number. If any, first or second, etc. are described for the purpose of distinguishing between technical features only and not for the purpose of indicating or implying a relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present utility model, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present utility model can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

The above embodiments are only preferred embodiments of the present utility model, and the scope of the present utility model is not limited thereto, but any insubstantial changes and substitutions made by those skilled in the art on the basis of the present utility model are intended to be within the scope of the present utility model as claimed.

Claims (8)

1. An IGBT structural component, characterized in that it comprises a support frame (100), wherein a first terminal (200) and a second terminal (300) are provided at the end of the support frame (100), a receiving groove (110) is provided in the support frame (100), a first welding pad (210) of the first terminal (200) and a second welding pad (310) of the second terminal (300) both extend into the receiving groove (110), and a current blocking wall (400) is provided between the first welding pad (210) and the second welding pad (310). 2. The IGBT structural component according to claim 1, characterized in that the current blocking wall (400) protrudes beyond the first soldering pad (210) and the second soldering pad (310) in a first direction. 3. The IGBT structural component according to claim 2, characterized in that the current blocking wall (400) protrudes beyond the first pad (210) and the second pad (310) in the second direction. 4. The IGBT structural component according to claim 3, characterized in that the size of the current retaining wall (400) in the first direction is 7 mm, the size in the second direction is 3.2 mm, and the size in the third direction is 1.1 mm. 5. The IGBT structure according to claim 1, characterized in that the size of the first soldering pad (210) and the second soldering pad (310) in the third direction is 16 mm. 6. The IGBT structure according to claim 1, characterized in that a center distance between the first terminal (200) and the second terminal (300) is 22 mm. 7. The IGBT structural component according to claim 1, characterized in that a side wall of the accommodating groove (110) is connected with a clamping structure (120). 8. An IGBT module, characterized by comprising the IGBT structural component according to any one of claims 1 to 7.