CN222574823U - Composite copper foil water electrolytic plating line plating solution purifying and pre-plating device - Google Patents

Abstract

The utility model discloses a plating solution purification and pre-plating device for a composite copper foil water electroplating line, belonging to the technical field of electroplating equipment. The key points of the technical solution are as follows: the device comprises a tank body, the tank body comprises a pre-plating tank and an electroplating tank, the tank body is provided with a guiding mechanism for guiding the copper foil, the guiding mechanism comprises a first guide roller, a first submerged roller, a second guide roller and a second submerged roller, the first submerged roller is located in the pre-plating tank, an anode plate is arranged near the side wall of the electroplating tank in the pre-plating tank, the second submerged roller is located in the electroplating tank, an upper electrode plate is arranged on one side of the electroplating tank near the second submerged roller, and a lower electrode plate is arranged on the other side. The device can improve the electroplating efficiency and the uniformity of metal ion implantation deposition, ensure the uniformity and consistency of the coating, and improve the electroplating effect.

Description

Composite copper foil water electrolytic plating line plating solution purifying and pre-plating device

Technical Field

The utility model relates to the technical field of electroplating equipment, in particular to a device for purifying and preplating a plating solution of a composite copper foil water electrolytic plating line.

Background

Along with the development of new energy, lithium batteries occupy important positions in new energy, more and more manufacturers are using composite copper foil as a material for manufacturing lithium batteries, and the manufacturing of the composite copper foil is also very important, so that the existing composite copper foil water plating line electroplating process is extremely easy to cause chemical corrosion to a seed film sputtering coating, thereby causing pollution of plating solution, causing damage to the sputtering coating, further causing accumulation of corrosion and falling particles of the seed film coating and individual copper absorption growth in the processing process of abnormal composite copper foil water plating lines such as concave-convex points on the foil surface, further causing defects such as dense concave-convex points on the foil surface, poor compactness and the like, and serious accidents such as incapability of timely and thorough purification of electroplating solution pollution are caused, and the device for purifying and pre-plating the plating solution of the composite copper foil water plating line is provided.

Disclosure of utility model

Aiming at the problems in the prior art, the utility model aims to provide a composite copper foil water and electricity plating line plating solution purifying and preplating device which can improve the electroplating efficiency and the uniformity of metal ion implantation deposition, ensure the uniformity and consistency of a plating layer and improve the electroplating effect.

The technical aim of the utility model is achieved by the following technical scheme that the plating solution purifying and preplating device of the composite copper foil water and electricity plating line comprises a tank body, wherein the tank body comprises a preplating tank and a plating tank, a guide mechanism for guiding copper foil is arranged in the tank body, the guide mechanism comprises a first guide roller, a first submerged roller, a second guide roller and a second submerged roller, the first submerged roller is positioned in the preplating tank, an anode plate is arranged on the side wall, close to the plating tank, in the preplating tank, of the preplating tank, an upper polar plate is arranged on one side, close to the second submerged roller, of the plating tank, and a lower polar plate is arranged on the other side of the plating tank.

In some embodiments, connecting rods are arranged on two sides of the first guide roller, the connecting rods are in rotary connection with the pre-plating tank, sliding rods are arranged on two sides of the second guide roller, and the sliding rods are in sliding connection with the tank body.

In some embodiments, a cam is disposed on the inner wall of the groove body below the two sliding rods, a transmission member is disposed between the connecting rod and the cam, and the rotating direction of the connecting rod is opposite to that of the cam.

In some embodiments, the transmission member is a splayed drive wheel.

In some embodiments, one side of the bottom of the pre-plating tank is provided with a liquid inlet pipe, the other side is provided with a liquid suction pipe, and the liquid inlet pipe and the liquid suction pipe are both connected with a pump.

In some embodiments, the second guide roller is provided with two.

In summary, the utility model has the following beneficial effects:

The utility model is provided with the pre-plating tank, and the seed film is thickened and reinforced in a short time by utilizing the pre-plating tank, so that the damage of the seed film coating and the pollution of liquid caused by particle shedding are reduced, the electroplating efficiency and the uniformity of metal ion implantation deposition are improved, the uniformity and consistency of the coating are ensured, and the electroplating effect is improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a cross-sectional view of a partial structure of the present utility model;

fig. 3 is a schematic view showing an operation state of the partial structure of the present utility model.

The device comprises a tank body 1, a pre-plating tank 11, a plating tank 12, a plating tank 2, a guiding mechanism 21, a first guide roller 211, a connecting rod 212, a transmission part 22, a first submerged roller 23, a second guide roller 231, a sliding rod 232, a cam 233, a gear 24, a second submerged roller 3, an upper polar plate 4, a lower polar plate 5, a liquid inlet pipe 6, a liquid suction pipe 7 and copper foil.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-3, a plating solution purifying and preplating device of a composite copper foil water and electricity plating line comprises a tank body 1, wherein the tank body 1 comprises a preplating tank 11 and a plating tank 12, a guide mechanism 2 for guiding a copper foil 7 is arranged in the tank body 1, the guide mechanism 2 comprises a first guide roller 21, a first submerged roller 22, a second guide roller 23 and a second submerged roller 24, the first submerged roller 22 is positioned in the preplating tank 11, an anode plate is arranged on the side wall, close to the plating tank 12, of the preplating tank 11, the second submerged roller 24 is positioned in the plating tank 12, an upper polar plate 3 is arranged on one side, close to the second submerged roller 24, of the plating tank 12, a lower polar plate 4 is arranged on the other side, when the plating operation is required, the operating personnel moves the first guide roller 21 and the second guide roller 23 in the guide mechanism 2 to the outside of the tank body 1 in advance, then the copper foil 7 is guided by the guide mechanism 2, the copper foil 7 is preplating in the preplating tank 11 through the anode plate of the side wall, thickening and reinforcing can be carried out in a short time after the seed film enters the preplating tank 11, damage to the seed film coating and pollution liquid caused by particle falling are reduced, the electroplating efficiency and uniformity of metal ion implantation deposition are improved, the uniformity and consistency of the coating are ensured, and finally the copper foil enters the electroplating tank 12 to be completely electroplated through the upper polar plate 3 and the lower polar plate 4, so that the compactness of the coating can be improved, the occurrence of the conditions of plating leakage pinholes and concave-convex points is reduced, the quality is improved, and the comprehensive cost is reduced.

In some embodiments, the connecting rods 211 are disposed on two sides of the first guide roller 21, the connecting rods 211 are rotationally connected with the pre-plating tank 11, one slide bar 231 is disposed on two sides of the second guide roller 23, the two slide bars 231 are slidably connected with the tank 1, a cam 232 is disposed on the inner wall of the tank 1 below the two slide bars 231, a transmission member 212 is disposed between the connecting rods 211 and the cam 232, and the connecting rods 211 and the cam 232 rotate in opposite directions, the transmission member 212 is a splayed transmission wheel, before the device is used, an operator turns over the connecting rods 211 and is fixedly clamped with the tank 1, the clamping is the prior art, so that the first guide roller 21 moves from the tank 1 to the outside of the tank 1, then the rotation of the connecting rod 211 drives the transmission piece 212 to carry out transmission work, then the transmission piece 212 drives the cam 232 to rotate, the cam 232 jacks up the sliding rod 231 to enable the second guide roller 23 to move upwards from the inside of the tank body 1 to the outside of the tank body 1, finally the first guide roller 21, the first submerged roller 22, the second guide roller 23 and the second submerged roller 24 guide the copper foil 7, electroplating operation can be started, the operation is very convenient and fast, after the use is finished, the first guide roller 21 can be overturned into the tank body 1, the cam 232 is driven to reset, finally the second guide roller 23 is influenced by gravity to fall to the initial position, namely, reset is finished, operators can cover a cover plate on the surface of the tank body 1, dust is prevented from entering the tank body 1, internal pollution is reduced, and electroplating effect is ensured.

In some embodiments, one side of the bottom of the pre-plating tank 11 is provided with a liquid inlet pipe 5, the other side is provided with a liquid suction pipe 6, the liquid inlet pipe 5 and the liquid suction pipe 6 are both connected with a pump, so that high-precision filtration and purification can be fully performed on liquid in the pre-plating tank 11, the further pollution of the plating tank 12 after the liquid in the pre-plating tank 11 is polluted is avoided, the liquid suction and the transfusion operations are all assisted by the pump, and the two operations are all supported by the prior art, and are not repeated herein.

In some embodiments, two second guide rollers 23 are provided, two sliding rods 231 are welded on two sides of each second guide roller 23, a cam 232 is disposed below each sliding rod 231, a gear 233 is fixedly connected to each cam 232, the gears 233 on the same side are meshed with each other, when an operator needs to perform electroplating, for example, when the operator turns the first guide roller 21 out of the groove body 1, the first guide roller 21 immediately drives the connecting rod 211 to rotate, the connecting rod 211 drives the driving member 212 to drive, the driving member 212 drives the cam 232 to rotate, the cam 232 drives the corresponding gear 233 to rotate, because the two gears 233 on the same side are meshed with each other, and the rotation directions are opposite, namely, the rotation directions of the two cams 232 are opposite, so that the two cams 232 respectively push the sliding rods 231 corresponding to the positions of the two cams to move upwards, the two second guide rollers 23 lift up from the tank body 1, then the copper foil 7 is guided by the first guide roller 21, the first submerged roller 22, the second guide roller 23 and the second submerged roller 24, electroplating operation can be performed, the spanning distance of the copper foil 7 from the pre-plating tank 11 to the electroplating tank 12 can be increased by the guiding of the two second guide rollers 23, the copper foil 7 is prevented from contacting the tank body 1, the electroplating effect is influenced, if the electroplating operation is completed, the device is required to be reset, the first guide roller 21 is only required to be folded and then is put into the tank body 1, the components are driven to rotate and reset, and the device reset can be realized, so that the operation is simple and quick.

The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and modifications to the present embodiment, which may not creatively contribute to the present utility model as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present utility model.

Claims (6)

1. The utility model provides a compound copper foil water and electricity plating line plating solution purifies and preplating device, includes cell body (1), its characterized in that cell body (1) is including preplating tank (11) and plating bath (12), be provided with guiding mechanism (2) that are used for guiding copper foil (7) in cell body (1), guiding mechanism (2) are including first deflector roll (21), first submerged roller (22), second deflector roll (23) and second submerged roller (24), first submerged roller (22) are located in preplating tank (11), be close to in preplating tank (11) the lateral wall of plating bath (12) is provided with the anode plate, second submerged roller (24) are located in plating bath (12), one side that is close to in plating bath (12) is provided with polar plate (3), and the opposite side is provided with polar plate (4).

2. The device for purifying and preplating the plating solution of the composite copper foil water and electricity plating line according to claim 1, wherein the connecting rods (211) are arranged on two sides of the first guide roller (21), the connecting rods (211) are rotationally connected with the preplating tank (11), the sliding rods (231) are arranged on two sides of the second guide roller (23), and the sliding rods (231) are in sliding connection with the tank body (1).

3. The device for purifying and preplating the plating solution of the composite copper foil water and electricity plating line according to claim 2, wherein a cam (232) is arranged on the inner wall of the tank body (1) and below the two sliding bars (231), a transmission piece (212) is arranged between the connecting rod (211) and the cam (232), and the rotating directions of the connecting rod (211) and the cam (232) are opposite.

4. The device for purifying and preplating a plating solution of a composite copper foil electroplating line according to claim 3, wherein the transmission member (212) is a splayed transmission wheel.

5. The device for purifying and preplating the plating solution of the composite copper foil water and electricity plating line according to claim 1, wherein one side of the bottom of the preplating tank (11) is provided with a liquid inlet pipe (5), the other side is provided with a liquid suction pipe (6), and the liquid inlet pipe (5) and the liquid suction pipe (6) are both connected with a pump.

6. The device for purifying and preplating a plating solution of a composite copper foil electroplating line according to claim 1, wherein two second guide rollers (23) are arranged.