CN222570322U - Double-sided synchronous polishing device for semiconductor silicon wafer - Google Patents
Double-sided synchronous polishing device for semiconductor silicon wafer Download PDFInfo
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- CN222570322U CN222570322U CN202420435543.5U CN202420435543U CN222570322U CN 222570322 U CN222570322 U CN 222570322U CN 202420435543 U CN202420435543 U CN 202420435543U CN 222570322 U CN222570322 U CN 222570322U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
本实用新型涉及半导体硅片抛光工具技术领域，具体地说，涉及半导体硅片双面同步抛光装置，包括U形架，U形架的左右两侧板体上均设置有夹持组件，U形架的后侧板体顶面上固定安装有顶部支撑架，顶部支撑架上设置有抛光组件，抛光组件包括固定安装在顶部支撑架顶部板体上的驱动电机，驱动电机的输出轴上设置有导轨，导轨的末端固定安装有第二伺服电机，第二伺服电机的输出轴末端固定安装有水平丝杆，水平丝杆上螺纹连接有第二滑块，第二滑块的底端固定安装有支撑座，支撑座的上下两侧板体上均固定安装有气缸，气缸的伸缩轴上设置有高速电机，高速电机的输出轴上设置有抛光垫。本实用新型便于进行双面同步抛光操作，方便使用。
The utility model relates to the technical field of semiconductor silicon wafer polishing tools, specifically, to a semiconductor silicon wafer double-sided synchronous polishing device, comprising a U-shaped frame, a clamping assembly is arranged on both the left and right side plates of the U-shaped frame, a top support frame is fixedly installed on the top surface of the rear side plate of the U-shaped frame, a polishing assembly is arranged on the top support frame, the polishing assembly comprises a driving motor fixedly installed on the top plate of the top support frame, a guide rail is arranged on the output shaft of the driving motor, a second servo motor is fixedly installed at the end of the guide rail, a horizontal screw rod is fixedly installed at the end of the output shaft of the second servo motor, a second slider is threadedly connected on the horizontal screw rod, a support seat is fixedly installed at the bottom end of the second slider, a cylinder is fixedly installed on both the upper and lower side plates of the support seat, a high-speed motor is arranged on the telescopic shaft of the cylinder, and a polishing pad is arranged on the output shaft of the high-speed motor. The utility model facilitates the double-sided synchronous polishing operation and is convenient to use.
Description
Technical Field
The utility model relates to the technical field of semiconductor silicon wafer polishing tools, in particular to a double-sided synchronous polishing device for a semiconductor silicon wafer.
Background
The semiconductor silicon wafer is the most core basic material for manufacturing chips, when the production, processing and preparation operations of the semiconductor silicon wafer are carried out, as the surface of the semiconductor silicon wafer which is just prepared is not smooth enough, in order to enable the prepared semiconductor silicon wafer to meet the subsequent processing requirements, polishing and grinding operations are usually needed after the preliminary preparation of the semiconductor silicon wafer is finished, polishing can enable the surface of the semiconductor silicon wafer to be smoother, when the polishing operations are carried out, corresponding polishing devices are usually needed, the types of the polishing devices on the market are more, most of the polishing devices work by utilizing motors and drive the corresponding polishing pads to rotate, so that the polishing operations are realized, and at present, the polishing pads which are high-temperature resistant and hydrolysis-resistant for the semiconductor silicon wafer are usually adopted, and the polishing pads which are high-temperature resistant and hydrolysis-resistant for the microcrystalline glass have the advantages of being capable of prolonging the service life, being not easy to damage and the like.
However, when the conventional polishing device is used, polishing operation can only be carried out on one side surface of a semiconductor silicon wafer at a time, polishing can not be carried out on two side surfaces simultaneously, polishing progress can be delayed only by polishing one side surface at a time, polishing efficiency is not improved, yield is affected, and inconvenience is brought to a user. In view of this, we propose a double-sided synchronous polishing apparatus for semiconductor wafers.
Disclosure of utility model
The utility model aims to provide a double-sided synchronous polishing device for a semiconductor silicon wafer, which aims to solve the defects in the prior art.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The utility model provides a two-sided synchronous burnishing device of semiconductor silicon chip, includes the U-shaped frame, all be provided with the clamping assembly who is used for carrying out the centre gripping operation to the semiconductor silicon chip on the left and right sides board body of U-shaped frame, fixed mounting has the top support frame on the rear side board body top surface of U-shaped frame, be provided with the polishing subassembly on the top support frame, the polishing subassembly is including fixed mounting be in driving motor on the top support frame top board body, be provided with the guide rail on driving motor's the output shaft, the terminal fixed mounting of guide rail has second servo motor, second servo motor's output shaft end fixed mounting has horizontal lead screw, threaded connection has the second slider on the horizontal lead screw, the second slider with sliding connection between the guide rail, the bottom fixed mounting of second slider has the supporting seat, all fixed mounting has the cylinder on the upper and lower both sides board body of supporting seat, be provided with high-speed motor on the telescopic shaft of cylinder, be provided with the polishing pad on high-speed motor's the output shaft.
Preferably, two polishing pads are positioned between the two high-speed motors and used for synchronously polishing the two sides of the semiconductor silicon wafer.
Preferably, a fixed plate is fixedly arranged at the tail end of the output shaft of the driving motor, and the guide rail is fixedly arranged on the bottom surface of the fixed plate through a plurality of fastening bolts, so that the guide rail is convenient to fixedly install.
Preferably, the end of the telescopic shaft of the air cylinder is fixedly provided with an end plate, and the high-speed motor is fixedly arranged on the end plate, so that the assembly operation of the high-speed motor is facilitated.
Preferably, the clamping assembly comprises a vertical sliding rail fixedly installed on the U-shaped frame, a first servo motor is fixedly installed at the end part of the sliding rail, a forward screw rod is fixedly installed at the tail end of an output shaft of the first servo motor, a reverse screw rod is fixedly installed at the tail end of the forward screw rod, a first sliding block is connected to the forward screw rod and the reverse screw rod in a threaded manner, and a clamping plate is fixedly installed at the end part of the first sliding block so as to facilitate clamping operation.
Preferably, the clamping plates are horizontally arranged, and the upper clamping plate and the lower clamping plate are used for clamping the semiconductor silicon wafer.
Preferably, the size of the first sliding block is matched with the size of the sliding rail, and the size of the second sliding block is matched with the size of the sliding rail, so that the first sliding block and the second sliding block can slide smoothly.
Preferably, the forward screw rod and the reverse screw rod have opposite external spiral directions, and are used for driving the two first sliding blocks to move towards opposite directions.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, the clamping operation of the semiconductor silicon wafer can be realized through the arranged clamping assembly, the polishing operation can be performed by utilizing the rotation of the upper polishing pad and the lower polishing pad through the arranged polishing assembly, and in addition, the two clamping assemblies are utilized to be matched and operated separately, so that the polishing position is not blocked, the comprehensive polishing operation is facilitated, and the effect of double-sided synchronous polishing can be achieved.
2. According to the polishing device, the polishing pad can be driven to circularly rotate through the driving motor, and the left and right positions of the polishing pad can be adjusted through the guide rail, the second servo motor, the horizontal screw rod and other components, so that comprehensive polishing operation is facilitated.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a schematic view of the structure of the polishing assembly of the present utility model;
FIG. 3 is a schematic view of an exploded view of the polishing assembly of the present utility model;
FIG. 4 is a second schematic exploded view of the polishing assembly of the present utility model;
Fig. 5 is an exploded view of the clamping assembly of the present utility model.
The meaning of each reference numeral in the figures is:
1. 10, a top support frame;
2. a clamping assembly; 20 parts of slide rails, 21 parts of first servo motors, 22 parts of forward lead screws, 23 parts of reverse lead screws, 24 parts of first sliding blocks, 25 parts of clamping plates;
3. The polishing device comprises a polishing component, a driving motor, a fixing plate, a guide rail, a second servo motor, a horizontal screw rod, a second sliding block, a supporting seat, a cylinder, 371, an end plate, 38, a high-speed motor, 39 and a polishing pad, wherein the polishing component, the driving motor, the fixing plate, the guide rail, the second servo motor, the horizontal screw rod, the second sliding block, the supporting seat, the cylinder, the 371 and the end plate are sequentially arranged.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-5, the utility model provides a technical scheme that the double-sided synchronous polishing device for semiconductor silicon wafers comprises a U-shaped frame 1, wherein clamping assemblies 2 for clamping the semiconductor silicon wafers are arranged on left and right side plate bodies of the U-shaped frame 1, the clamping assemblies 2 comprise sliding rails 20 which are fixedly arranged on the U-shaped frame 1 in a vertical mode, a first servo motor 21 is fixedly arranged at the end parts of the sliding rails 20, a forward screw rod 22 is fixedly arranged at the tail end of an output shaft of the first servo motor 21, a reverse screw rod 23 is fixedly arranged at the tail end of the forward screw rod 22, a first sliding block 24 is connected to the forward screw rod 22 and the reverse screw rod 23 in a threaded mode, and a clamping plate 25 is fixedly arranged at the end parts of the first sliding block 24 and the sliding rails 20 so as to facilitate clamping and fixing the semiconductor silicon wafers;
Specifically, a top support frame 10 is fixedly installed on the top surface of the rear side plate body of the U-shaped frame 1, a polishing component 3 is arranged on the top support frame 10, the polishing component 3 comprises a driving motor 30 fixedly installed on the top plate body of the top support frame 10, a horizontally arranged guide rail 32 is arranged on an output shaft of the driving motor 30, a second servo motor 33 is fixedly installed at the tail end of the guide rail 32, a horizontal screw rod 34 is fixedly installed at the tail end of an output shaft of the second servo motor 33, a second sliding block 35 is connected to the horizontal screw rod 34 in a threaded manner, the second sliding block 35 is in sliding connection with the guide rail 32, a supporting seat 36 is fixedly installed at the bottom end of the second sliding block 35, air cylinders 37 are fixedly installed on the upper side plate body and the lower side plate body of the supporting seat 36, a high-speed motor 38 is arranged on a telescopic shaft of the air cylinder 37, and polishing pads 39 are arranged on an output shaft of the high-speed motor 38, so that double-sided synchronous polishing operation of a semiconductor silicon wafer can be conveniently achieved by using the upper polishing pad 39 and the lower polishing pads 39.
In this embodiment, two polishing pads 39 are positioned between the two high speed motors 38 for synchronous polishing of both sides of the semiconductor wafer.
Specifically, the fixed plate 31 is fixedly mounted at the end of the output shaft of the driving motor 30, and the guide rail 32 is fixedly mounted on the bottom surface of the fixed plate 31 through a plurality of fastening bolts, so that the guide rail 32 is convenient to perform fixed mounting operation.
Further, an end plate 371 is fixedly mounted at the end of the telescopic shaft of the air cylinder 37, and the high-speed motor 38 is fixedly mounted on the end plate 371 through a plurality of fastening bolts, so that assembly operation of the high-speed motor 38 is facilitated.
In addition, the clamping plates 25 are horizontally arranged, and the upper and lower clamping plates 25 are used for clamping the semiconductor silicon wafer.
It should be noted that, the size of the first slider 24 is matched with the size of the sliding rail 20, and the size of the second slider 35 is matched with the size of the guiding rail 32, so that the first slider 24 and the second slider 35 are smooth during sliding.
It is noted that the external spirals of the surfaces of the forward screw 22 and the reverse screw 23 have opposite directions for driving the two first sliders 24 to move in opposite directions.
When the double-sided synchronous polishing device for the semiconductor silicon wafer is used, the semiconductor silicon wafer is placed between the upper clamping plate 25 and the lower clamping plate 25, then one of the first servo motors 21 is started and enabled to work, the first servo motor 21 works, and an output shaft on the first servo motor rotates to drive the forward screw rod 22 and the reverse screw rod 23 to rotate, so that the two clamping plates 25 are further driven to move, and the clamping operation of the semiconductor silicon wafer by the two clamping plates 25 on one side is realized;
then, starting the air cylinder 37 and enabling the air cylinder 37 to work, wherein a telescopic shaft on the air cylinder stretches to drive the polishing pad 39 to move and prop against the semiconductor silicon wafer, then switching on an external power supply to enable the high-speed motor 38 to work, enabling an output shaft on the high-speed motor 38 to rotate to drive the polishing pad 39 to rotate for polishing, in addition, switching on the external power supply to enable the second servo motor 33 to work, enabling the output shaft on the second servo motor 33 to rotate to drive the horizontal screw 34 to rotate, enabling the horizontal screw 34 to rotate to drive the second sliding block 35 and the polishing pad 39 to move left and right, realizing position adjustment for polishing, in addition, enabling the driving motor 30 to switch on the external power supply to work, enabling the driving motor 30 to work, enabling the output shaft on the driving motor 32 and the polishing pad 39 to rotate in a ring shape, and realizing polishing operation on the ring-shaped part of the semiconductor silicon wafer;
When the polishing of other parts is finished, the upper and lower clamping plates 25 on one side are used for clamping the semiconductor silicon wafer, the two clamping plates 25 on the previous clamping part are loosened, and at the moment, the polishing pad 39 is used for continuously polishing the previous clamping part, so that the overall polishing operation is finished.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (8)
1. The double-sided synchronous polishing device for the semiconductor silicon wafer comprises a U-shaped frame (1) and is characterized in that clamping assemblies (2) used for clamping the semiconductor silicon wafer are arranged on the left side plate body and the right side plate body of the U-shaped frame (1), a top supporting frame (10) is fixedly arranged on the top surface of the rear side plate body of the U-shaped frame (1), a polishing assembly (3) is arranged on the top supporting frame (10), the polishing assembly (3) comprises a driving motor (30) fixedly arranged on the top plate body of the top supporting frame (10), a guide rail (32) is arranged on an output shaft of the driving motor (30), a horizontal screw rod (34) is fixedly arranged at the tail end of the output shaft of the guide rail (32), a second sliding block (35) is connected onto the horizontal screw rod (34) in a threaded mode, a supporting seat (36) is fixedly arranged at the bottom end of the second sliding block (35), a high-speed air cylinder (37) is arranged on the upper end of the supporting seat (36), and a high-speed telescopic motor (38) is fixedly arranged on the lower side plate (37).
2. The double-sided synchronous polishing device for semiconductor wafers as set forth in claim 1, wherein two of said polishing pads (39) are located between two of said high-speed motors (38) for synchronous polishing operation of both sides of the semiconductor wafer.
3. The device for double-sided synchronous polishing of a semiconductor silicon wafer according to claim 1, wherein a fixing plate (31) is fixedly arranged at the tail end of an output shaft of the driving motor (30), and the guide rail (32) is fixedly arranged on the bottom surface of the fixing plate (31) through a plurality of fastening bolts.
4. The device for double-sided synchronous polishing of a semiconductor silicon wafer according to claim 1, wherein an end plate (371) is fixedly mounted at the tail end of a telescopic shaft of the air cylinder (37), and the high-speed motor (38) is fixedly mounted on the end plate (371).
5. The double-sided synchronous polishing device of a semiconductor silicon wafer according to claim 1, wherein the clamping assembly (2) comprises a sliding rail (20) which is vertically and fixedly arranged on the U-shaped frame (1), a first servo motor (21) is fixedly arranged at the end part of the sliding rail (20), a forward screw rod (22) is fixedly arranged at the tail end of an output shaft of the first servo motor (21), a reverse screw rod (23) is fixedly arranged at the tail end of the forward screw rod (22), first sliding blocks (24) are connected to the forward screw rod (22) and the reverse screw rod (23) in a threaded mode, and clamping plates (25) are fixedly arranged at the end parts of the first sliding blocks (24).
6. The double-sided synchronous polishing device for semiconductor wafers as set forth in claim 5, wherein the holding plates (25) are disposed horizontally, and the upper and lower holding plates (25) are used for holding the semiconductor wafers.
7. The device of claim 5, wherein the first slider (24) has a size matching the size of the slide rail (20), and the second slider (35) has a size matching the size of the guide rail (32).
8. The device for double-sided synchronous polishing of a semiconductor silicon wafer according to claim 5, wherein the forward screw (22) and the reverse screw (23) have opposite external spiral directions, and are used for driving the two first sliding blocks (24) to move in opposite directions.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420435543.5U CN222570322U (en) | 2024-03-07 | 2024-03-07 | Double-sided synchronous polishing device for semiconductor silicon wafer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420435543.5U CN222570322U (en) | 2024-03-07 | 2024-03-07 | Double-sided synchronous polishing device for semiconductor silicon wafer |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222570322U true CN222570322U (en) | 2025-03-07 |
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ID=94784562
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420435543.5U Active CN222570322U (en) | 2024-03-07 | 2024-03-07 | Double-sided synchronous polishing device for semiconductor silicon wafer |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222570322U (en) |
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2024
- 2024-03-07 CN CN202420435543.5U patent/CN222570322U/en active Active
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