CN222562008U - Computer machine case heat abstractor with water-cooling function - Google Patents
Computer machine case heat abstractor with water-cooling function Download PDFInfo
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- CN222562008U CN222562008U CN202421327985.4U CN202421327985U CN222562008U CN 222562008 U CN222562008 U CN 222562008U CN 202421327985 U CN202421327985 U CN 202421327985U CN 222562008 U CN222562008 U CN 222562008U
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Abstract
本实用新型涉及计算机技术领域，尤其涉及一种具有水冷功能的计算机机箱散热装置，解决了现有技术中风冷技术在面对高性能计算机产生的大量热量时，往往显得力不从心，散热效果有限。尤其是在密闭或高温环境下，风冷技术的散热效果更是大打折扣，难以满足现代高性能计算机的散热需求的问题。一种具有水冷功能的计算机机箱散热装置，包括机箱和安装板；机箱的一侧设有开口，安装板设置在开口位置，安装板的一侧与机箱的侧壁可拆卸连接；安装板的一侧开设有若干个安装槽，安装槽的内部连接有半导体制冷板。本实用新型结构合理，便于实现通过冷风对机箱的内部进行快速降温，解决了风冷的弊端，结合制冷，提高散热降温质量和效率。
The utility model relates to the field of computer technology, and in particular to a computer case heat dissipation device with a water cooling function, which solves the problem that the air cooling technology in the prior art is often powerless and has limited heat dissipation effect when facing a large amount of heat generated by high-performance computers. Especially in a closed or high-temperature environment, the heat dissipation effect of the air cooling technology is greatly reduced, and it is difficult to meet the heat dissipation needs of modern high-performance computers. A computer case heat dissipation device with a water cooling function includes a case and a mounting plate; an opening is provided on one side of the case, and the mounting plate is arranged at the opening position, and one side of the mounting plate is detachably connected to the side wall of the case; a plurality of mounting grooves are provided on one side of the mounting plate, and a semiconductor refrigeration plate is connected to the inside of the mounting groove. The utility model has a reasonable structure, and is convenient for realizing rapid cooling of the interior of the case by cold air, which solves the disadvantages of air cooling, and combines refrigeration to improve the quality and efficiency of heat dissipation and cooling.
Description
Technical Field
The present utility model relates to the field of computer technology, and in particular, to a heat dissipation device for a computer case with a water cooling function.
Background
With the rapid development of computer technology, the performance of computers is continuously improved, but the problems of heat generation are also accompanied. Particularly in high load operation, computer internal components such as Central Processing Units (CPUs), graphics Processing Units (GPUs), and the like, can generate significant amounts of heat. If the heat cannot be timely and effectively dissipated, the performance of the computer is reduced, even hardware is damaged, and the stability and the service life of the computer are seriously affected.
Conventional computer cabinets typically rely on air cooling to dissipate heat, i.e., to remove heat from the cabinet by a fan. However, the air cooling technology tends to be unsound in the face of the large amount of heat generated by high-performance computers, and the heat dissipation effect is limited. Especially, in a closed or high-temperature environment, the heat dissipation effect of the air cooling technology is more compromised, and the heat dissipation requirement of a modern high-performance computer is difficult to meet.
Disclosure of utility model
The utility model aims to provide a computer case heat dissipation device with a water cooling function, which solves the problems that the air cooling technology in the prior art often looks at a great deal of heat generated by a high-performance computer, and the heat dissipation effect is limited. Especially in a closed or high-temperature environment, the heat dissipation effect of the air cooling technology is more compromised, and the heat dissipation requirement of a modern high-performance computer is difficult to meet.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
A computer case heat abstractor with water cooling function comprises a case and a mounting plate;
An opening is formed in one side of the case, the mounting plate is arranged at the opening position, and one side of the mounting plate is detachably connected with the side wall of the case;
A plurality of mounting grooves are formed in one side of the mounting plate, a semiconductor refrigeration plate is connected in the mounting grooves, an inner frame is connected to one side, close to the case, of the mounting plate, and an outer frame is connected to the other side of the mounting plate;
A plurality of air supply fans are installed on one side of the inner frame, a plurality of cooling fans are installed on one side of the outer frame, and a plurality of air inlet grooves are formed in the top of one side and the bottom of one side of the mounting plate.
Preferably, the outer frame has a smaller size than the inner frame.
Preferably, the length of the outer frame is smaller than the interval between the two air inlet grooves, and the length of the inner frame is larger than the interval between the two air inlet grooves.
Preferably, the two sides of the inner frame are fixedly connected with positioning plates, and a plurality of positioning holes are formed in one side of each positioning plate.
Preferably, the top of one side and one side bottom of mounting panel all are connected with the magnet board, one side of air inlet tank is provided with the dust guard, one side of dust guard is connected with the magnet piece, the dust guard is inhaled through magnet piece and magnet board magnetism and is connected.
Preferably, four corners on one side of the mounting plate are respectively provided with a round rod, one end of each round rod penetrates through the mounting plate through the shaft sleeve to be connected with a positioning screw rod, the other end of each round rod is connected with a handle, and one end of each positioning screw rod is fixedly connected with a side wall bolt of the case.
The utility model has at least the following beneficial effects:
Through the setting of mounting groove, be convenient for install the semiconductor refrigeration board, the refrigeration end of semiconductor refrigeration board refrigerates, send into the inside of quick-witted case with the air conditioning through the fan, cool down quick-witted incasement portion through cold wind, can dispel the heat to the heating end of semiconductor refrigeration board through radiator fan, avoid the heat to enter into quick-witted incasement portion, rational in infrastructure, be convenient for realize carrying out quick cooling to the inside of quick-witted case through cold wind, solved the drawback of forced air cooling, combine the refrigeration, improve heat dissipation cooling quality and efficiency.
The utility model also has the following beneficial effects:
The setting of external frame and internal frame is convenient for realize the connection and the installation of air supply fan and radiator fan, the length through external frame is less than the setting of interval between two air inlet grooves, avoid the heat that the semiconductor refrigeration board generates heat the end to get into to the inside of quick-witted case through the air inlet groove, through setting up of locating plate and locating hole, be convenient for realize that internal frame is connected with the mounting panel, through setting up of dust guard and magnet board, can set up the dust guard fast, avoid the dust to enter into the inside of machine case, through the setting of round bar and handle, rotate handle and drive round bar and positioning screw and rotate, be connected the positioning screw with the machine case and can realize the one side with mounting panel lug connection at the machine case.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the internal frame structure of the present utility model;
FIG. 3 is a schematic view of a positioning plate structure according to the present utility model;
FIG. 4 is a schematic view of the structure of the positioning screw of the present utility model;
FIG. 5 is a schematic view of the mounting plate of the present utility model.
The device comprises a chassis 1, a mounting plate 2, a cooling fan 3, a peripheral frame 4, a peripheral frame 5, an internal frame 6, a blowing fan 7, an air inlet groove 8, a positioning screw 9, a semiconductor refrigerating plate 10, a positioning hole 11, a positioning plate 12, a round rod 13, a handle 14, a mounting groove 15, a magnet plate 16 and a dust-proof plate.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and examples, in order to make the objects, technical solutions and advantages of the present utility model more apparent. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Referring to fig. 1 to 5, a computer case heat dissipating device with a water cooling function includes a case 1 and a mounting plate 2;
An opening is formed in one side of the case 1, the mounting plate 2 is arranged at the opening position, and one side of the mounting plate 2 is detachably connected with the side wall of the case 1;
One side of the mounting plate 2 is provided with a plurality of mounting grooves 14, the inside of the mounting grooves 14 is connected with a semiconductor refrigeration plate 9, one side of the mounting plate 2, which is close to the case 1, is connected with an inner frame 5, and the other side is connected with an outer frame 4;
A plurality of air supply fan 6 is installed to one side of internal frame 5, a plurality of radiator fan 3 is installed to one side of external frame 4, a plurality of air inlet groove 7 has all been seted up to one side top and one side bottom of mounting panel 2, specifically, through the setting of mounting groove 14, be convenient for install semiconductor refrigeration board 9, the refrigeration end of semiconductor refrigeration board 9 refrigerates, send the air conditioning into the inside of quick-witted case 1 through air supply fan 6, cool down the inside of machine case 1 through the air-cooling, can dispel the heat to the heating end of semiconductor refrigeration board 9 through radiator fan 3, avoid the heat to enter into the inside of machine case 1, and is rational in infrastructure, be convenient for realize carrying out quick cooling to the inside of machine case 1 through the air-cooling, the drawback of forced air cooling has been solved, combine refrigeration, heat dissipation cooling quality and efficiency are improved.
Further, the outer frame 4 has a smaller size than the inner frame 5.
Further, the length of the outer frame 4 is smaller than the interval between the two air inlet grooves 7, and the length of the inner frame 5 is larger than the interval between the two air inlet grooves 7.
Further, two sides of the inner frame 5 are fixedly connected with positioning plates 11, and a plurality of positioning holes 10 are formed in one side of each positioning plate 11.
Further, the top of one side and one side bottom of mounting panel 2 all are connected with magnet board 15, and one side of air inlet 7 is provided with dust guard 16, and one side of dust guard 16 is connected with the magnet piece, and dust guard 16 is inhaled through magnet piece and magnet board 15 magnetism and is connected.
Further, four corners on one side of the mounting plate 2 are provided with round rods 12, one end of each round rod 12 penetrates through the mounting plate 2 through the shaft sleeve to be connected with a positioning screw rod 8, the other end of each round rod is connected with a handle 13, and one end of each positioning screw rod 8 is fixedly connected with a side wall bolt of the case 1.
In summary, the arrangement of the outer frame 4 and the inner frame 5 is convenient for realizing the connection and installation of the air supply fan 6 and the heat dissipation fan 3, the arrangement that the length of the outer frame 4 is smaller than the distance between the two air inlet grooves 7 prevents the heat of the heating end of the semiconductor refrigeration plate 9 from entering into the case 1 through the air inlet grooves 7, the arrangement of the positioning plate 11 and the positioning holes 10 is convenient for realizing the connection of the inner frame 5 and the mounting plate 2, the arrangement of the dust-proof plate 16 and the magnet plate 15 can quickly set up the dust-proof plate 16, dust is prevented from entering into the case 1, the round rod 12 and the handle 13 are arranged, the handle 13 is rotated to drive the round rod 12 and the positioning screw 8 to rotate, and the positioning screw 8 is connected with the case 1, so that the quick connection of the mounting plate 2 on one side of the case 1 can be realized.
The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the embodiments described above, and that the above embodiments and descriptions are merely illustrative of the principles of the present utility model, and various changes and modifications may be made therein without departing from the spirit and scope of the utility model, which is defined by the appended claims. The scope of the utility model is defined by the appended claims and equivalents thereof.
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421327985.4U CN222562008U (en) | 2024-06-12 | 2024-06-12 | Computer machine case heat abstractor with water-cooling function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421327985.4U CN222562008U (en) | 2024-06-12 | 2024-06-12 | Computer machine case heat abstractor with water-cooling function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222562008U true CN222562008U (en) | 2025-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421327985.4U Active CN222562008U (en) | 2024-06-12 | 2024-06-12 | Computer machine case heat abstractor with water-cooling function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222562008U (en) |
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2024
- 2024-06-12 CN CN202421327985.4U patent/CN222562008U/en active Active
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