CN222547895U

CN222547895U - Electronic equipment radiator

Info

Publication number: CN222547895U
Application number: CN202421263163.4U
Authority: CN
Inventors: 黄胜海; 袁黔云
Original assignee: Guangdong Maijie Micro New Materials Co ltd
Current assignee: Guangdong Maijie Micro New Materials Co ltd
Priority date: 2024-06-04
Filing date: 2024-06-04
Publication date: 2025-02-28
Anticipated expiration: 2034-06-04

Abstract

The utility model discloses an electronic device radiator, including a shell, a semiconductor radiator, a power supply assembly, a fan, a heat conductive sheet and a radiator. The semiconductor radiator, the power supply assembly, the fan, the heat conductive sheet and the radiator are all installed on the shell. A semiconductor radiator is arranged on the left side of the shell. The semiconductor radiator transfers the heat of the electronic device to the radiator through the heat conductive sheet. The power supply assembly is electrically connected to the fan. The power supply assembly is used to supply energy to the fan, and the fan is used to dissipate heat from the radiator. The utility model uses graphene as a thermal conductive material, which has good thermal conductivity and is cheaper than aluminum sheets and thermal conductive gels, thereby reducing the cost of the enterprise; a single shell greatly facilitates the wearing of the radiator and reduces the burden on the hands; the patent has a thin shell and can be used together with wireless charging when in use, which can address the problem of insufficient battery life of mobile phones and enhance the battery life of mobile phones.

Description

Radiator of electronic equipment

Technical Field

The utility model belongs to the field of electronic equipment accessories, and particularly relates to an electronic equipment radiator.

Background

The chip performance in the market is stronger, but the power supply component endurance and the electronic equipment heating become problems in the use of the electronic equipment while the performance is enhanced. The radiator is more and more popular, but the current radiator of electronic equipment is more and more bulky, if the radiator cannot be used at the same time, and when the radiator is clamped by the electronic equipment, the burden of hands is increased, the fingers are easy to deform, and the heat conducting fin of the current radiator is generally aluminum sheet or heat conducting gel, so that the heat conducting effect is poor, and the cost of enterprises is greatly improved, so that the radiator of the electronic equipment is invented.

Disclosure of utility model

The utility model aims to provide a radiator of electronic equipment, which aims to solve the problems in the background technology. In order to achieve the purpose, the utility model adopts the following technical scheme:

The utility model provides an electronic equipment radiator, which comprises a housin, the semiconductor radiator, power pack, the fan, conducting strip and radiator are all installed on the casing, the left side of casing is provided with the semiconductor radiator, the semiconductor radiator passes through the conducting strip with electronic equipment's heat and transmits the radiator on, power pack electric connection fan, power pack is used for supplying energy for the fan, the fan is used for giving the radiator heat dissipation, the semiconductor radiator, power pack, the fan, conducting strip and radiator put rationally according to the production of producer can.

Preferably, the semiconductor heatsink is a TEC semiconductor heatsink.

Preferably, the heat conducting sheet is made of a superconducting material, the superconducting material is aluminum, stainless steel, copper or graphene, and the heat conductivity coefficient of the superconducting material is 100-23000 w/(m.k).

Preferably, the housing is made of a heat dissipating material.

Preferably, the power supply component is a battery or a charging port.

The mobile phone shell has the beneficial effects that graphene is used as a heat conducting material, the heat conducting effect is good, the cost of enterprises is reduced compared with aluminum sheets and heat conducting gel, the single shell is extremely convenient for wearing of a radiator and the burden of hands is reduced, the shell is thin and can be used together with wireless charging when in use, the problem of insufficient duration of a mobile phone is solved, and the duration of the mobile phone is enhanced.

Drawings

FIG. 1 is a schematic view of an embodiment of the present utility model;

Fig. 2 is a schematic cross-sectional view of an overall structure according to an embodiment of the present utility model.

Wherein, each reference sign in the figure:

1. the heat radiator comprises a shell, a semiconductor radiator, a power supply assembly, a fan, a radiator, a heat conducting fin, a circuit board and a heat conducting fin.

Detailed Description

In order that the utility model may be readily understood, a more complete description of the utility model will be rendered by reference to the appended drawings. The drawings illustrate preferred embodiments of the utility model. This utility model may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

It will be understood that when an element is referred to as being "fixed to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" another element, there are no intervening elements present. The terms "vertical," "horizontal," "left," "right," and the like are used herein for illustrative purposes only and are not meant to be the only embodiments, and the terms "upper," "lower," "left," "right," "front," "back," and the like are used herein with reference to the positional relationship of the drawings.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this utility model belongs. The terminology used herein in the description of the utility model is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model. The term "and/or" as used herein includes any and all combinations of one or more of the associated listed items.

The technical scheme of the patent is further described in detail below with reference to the specific embodiments.

As shown in fig. 1-2, an embodiment of the present utility model provides a radiator for an electronic device, which includes a housing 1, a semiconductor radiator 2, a power module 3, a fan 4, a heat conducting fin 6 and a radiator 5, wherein the semiconductor radiator 2, the power module 3, the fan 4, the heat conducting fin 6 and the radiator 5 are all installed on the housing 1, the semiconductor radiator 2 is disposed on the left side of the housing 1, the semiconductor radiator 2 transmits heat of the electronic device to the radiator 5 through the heat conducting fin 6, the power module 3 is electrically connected with the fan 4, the power module 3 is used for supplying power to the fan 4, and the fan 4 is used for radiating heat of the radiator 5.

In an embodiment, the semiconductor heat spreader 2 is a TEC semiconductor heat spreader 2.

In the embodiment, the heat conducting fin 6 is made of a superconducting material, the superconducting material is aluminum, stainless steel, copper or graphene, and the heat conductivity coefficient of the superconducting material is 100-23000 w/(m.k).

In the embodiment, the housing 1 is made of a heat dissipation material.

In an embodiment, the power supply assembly 3 is a battery or a charging port.

The above embodiments are only for illustrating the present utility model, not for limiting the present utility model, and various changes and modifications may be made by one of ordinary skill in the relevant art without departing from the spirit and scope of the present utility model, and therefore, all equivalent technical solutions are also within the scope of the present utility model, and the scope of the present utility model is defined by the claims.

Claims

1. The radiator for the electronic equipment is characterized by comprising a shell, a semiconductor radiator, a power supply assembly, a fan, a heat conducting fin, a circuit board and a radiator, wherein the semiconductor radiator, the power supply assembly, the fan, the heat conducting fin, the circuit board and the radiator are all arranged on the shell, the semiconductor radiator is arranged on the left side of the shell, the semiconductor radiator transmits heat of the electronic equipment to the radiator through the heat conducting fin, the power supply assembly is electrically connected with the fan, the semiconductor radiator, the circuit board and the radiator, the power supply assembly is used for supplying energy to the fan, the semiconductor radiator, the circuit board and the radiator, the circuit board is used for controlling the fan, the semiconductor radiator and the radiator, and the fan is used for radiating the radiator.

2. The heat sink of claim 1, wherein the semiconductor heat sink is a TEC semiconductor heat sink.

3. The heat sink of claim 2, wherein the thermally conductive sheet is made of a superconducting material, the superconducting material is made of aluminum, stainless steel, copper or graphene, and the heat conductivity of the superconducting material is 100-23000 w/(m.k).

4. The heat sink of claim 3, wherein the housing is made of a heat dissipating material.

5. The heat sink of claim 3, wherein the power source assembly is a battery or a charging port.