CN222512991U - Automatic chip filtering electroplating bath - Google Patents
Automatic chip filtering electroplating bath Download PDFInfo
- Publication number
- CN222512991U CN222512991U CN202421473802.XU CN202421473802U CN222512991U CN 222512991 U CN222512991 U CN 222512991U CN 202421473802 U CN202421473802 U CN 202421473802U CN 222512991 U CN222512991 U CN 222512991U
- Authority
- CN
- China
- Prior art keywords
- electroplating
- face
- cavity
- debris
- box body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/20—Recycling
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- Electroplating Methods And Accessories (AREA)
Abstract
本实用新型涉及电镀技术领域,尤其涉及一种自动滤屑电镀槽,内设有包括箱体,箱体上端面固定设有四处过滤箱,箱体左右两端面固定设有两处吹气架;本实用新型是通过通过吹气架和喷气口将外部高压空气吹至电镀腔下侧,使堆积于电镀腔下壁左右两侧的碎屑向同侧的聚屑槽内,同时中部搅拌棍转动产生的水流推力也会将电镀腔下壁中部的碎屑推至聚屑槽内,同时启动输送泵,带动聚屑槽内的碎屑连同电镀液通过内部进屑口进入输送泵,并在输送泵的启动下通过回流管进入至过滤腔内,并在过滤内板的过滤下,实现快速除屑工作,使得电镀腔内的碎屑大幅减少,从而能够有效提高电镀件成品质量。
The utility model relates to the technical field of electroplating, and in particular to an automatic debris filtering electroplating tank, which is provided with a box body, wherein four filter boxes are fixedly provided on the upper end surface of the box body, and two blowing racks are fixedly provided on the left and right end surfaces of the box body; the utility model blows external high-pressure air to the lower side of the electroplating chamber through the blowing rack and the air jet, so that the debris accumulated on the left and right sides of the lower wall of the electroplating chamber are moved into the debris collecting groove on the same side, and at the same time, the water flow thrust generated by the rotation of the middle stirring rod will also push the debris in the middle of the lower wall of the electroplating chamber into the debris collecting groove, and at the same time, start the conveying pump, drive the debris in the debris collecting groove together with the electroplating liquid into the conveying pump through the internal chip inlet, and enter the filter chamber through the reflux pipe under the start of the conveying pump, and realize the rapid debris removal work under the filtration of the filter inner plate, so that the debris in the electroplating chamber is greatly reduced, thereby effectively improving the quality of the finished electroplated parts.
Description
Claims (6)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421473802.XU CN222512991U (en) | 2024-06-26 | 2024-06-26 | Automatic chip filtering electroplating bath |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421473802.XU CN222512991U (en) | 2024-06-26 | 2024-06-26 | Automatic chip filtering electroplating bath |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222512991U true CN222512991U (en) | 2025-02-21 |
Family
ID=94616417
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421473802.XU Active CN222512991U (en) | 2024-06-26 | 2024-06-26 | Automatic chip filtering electroplating bath |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222512991U (en) |
-
2024
- 2024-06-26 CN CN202421473802.XU patent/CN222512991U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20250709 Address after: 518000 Guangdong Province Shenzhen City Bao'an District Shajing Street Buyong Community Tongyufu Industrial Zone Quanshengchang Electroplating Factory Building 3 Second Floor Patentee after: Shenzhen meixiangshun Tengyue Hardware Electronics Co.,Ltd. Country or region after: China Address before: 212316 Self built factory in Changxing Electroplating Park, Picheng, Danbei Town, Danyang City, Jiangsu Province Patentee before: Liqun Electroplating Factory, Yanling Town, Danyang City Country or region before: China |
|
| TR01 | Transfer of patent right |