CN222509818U - PCBA cooling module - Google Patents
PCBA cooling module Download PDFInfo
- Publication number
- CN222509818U CN222509818U CN202421120538.1U CN202421120538U CN222509818U CN 222509818 U CN222509818 U CN 222509818U CN 202421120538 U CN202421120538 U CN 202421120538U CN 222509818 U CN222509818 U CN 222509818U
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- Prior art keywords
- heat dissipation
- heat
- copper sheet
- pcba
- graphite
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- RVCKCEDKBVEEHL-UHFFFAOYSA-N 2,3,4,5,6-pentachlorobenzyl alcohol Chemical compound OCC1=C(Cl)C(Cl)=C(Cl)C(Cl)=C1Cl RVCKCEDKBVEEHL-UHFFFAOYSA-N 0.000 title claims abstract description 51
- 238000001816 cooling Methods 0.000 title claims abstract description 42
- 230000017525 heat dissipation Effects 0.000 claims abstract description 114
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 84
- 229910052802 copper Inorganic materials 0.000 claims abstract description 84
- 239000010949 copper Substances 0.000 claims abstract description 84
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 50
- 229910002804 graphite Inorganic materials 0.000 claims abstract description 50
- 239000010439 graphite Substances 0.000 claims abstract description 50
- 230000007246 mechanism Effects 0.000 claims abstract description 47
- 239000004519 grease Substances 0.000 claims description 13
- 229920001296 polysiloxane Polymers 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000010521 absorption reaction Methods 0.000 abstract description 3
- 239000006185 dispersion Substances 0.000 abstract 1
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 241000883990 Flabellum Species 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000013528 artificial neural network Methods 0.000 description 1
- 210000000078 claw Anatomy 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
本实用新型公开了一种PCBA散热组件，包括PCBA板，所述PCBA板上固定安装有散热机构；所述散热机构包括有第一散热铜片、支撑框和第二散热铜片，所述第一散热铜片和所述第二散热铜片之间设有第一石墨散热片、第二石墨散热片和超薄热管，所述第二散热铜片的上表面固定安装有风冷机构，本实用新型散热机构对PCBA板上产生的热量进行吸收和传导，采用了导热性良好的第一散热铜片和第二散热铜片，实现对热量进行吸收和传导，以及在第一散热铜片和第二散热铜片的内部设有第一石墨散热片、第二石墨散热片和超薄热管，实现对热量进行分散和传导，防止热量在散热机构中区域集中，以及在第二散热铜片上设有风冷机构，将热量进行散发出去。
The utility model discloses a PCBA heat dissipation component, comprising a PCBA board, on which a heat dissipation mechanism is fixedly installed; the heat dissipation mechanism comprises a first heat dissipation copper sheet, a support frame and a second heat dissipation copper sheet, a first graphite heat dissipation sheet, a second graphite heat dissipation sheet and an ultra-thin heat pipe are arranged between the first heat dissipation copper sheet and the second heat dissipation copper sheet, and an air cooling mechanism is fixedly installed on the upper surface of the second heat dissipation copper sheet. The heat dissipation mechanism of the utility model absorbs and conducts the heat generated on the PCBA board, adopts the first heat dissipation copper sheet and the second heat dissipation copper sheet with good thermal conductivity, realizes the absorption and conduction of heat, and the first graphite heat dissipation sheet, the second graphite heat dissipation sheet and the ultra-thin heat pipe are arranged inside the first heat dissipation copper sheet and the second heat dissipation copper sheet, realizes the dispersion and conduction of heat, prevents the heat from being concentrated in the heat dissipation mechanism, and the air cooling mechanism is arranged on the second heat dissipation copper sheet to dissipate the heat.
Description
Technical Field
The utility model relates to the field of PCBA, in particular to a PCBA heat dissipation assembly.
Background
PCBA is the most important component of all electronic product components, similar to the neural network of the human body. The CPU is installed on the PCBA. The service life, running speed, reliability and stability of common consumer electronic products have the most direct relation with PCBA. Therefore, the quality of PCBA is also the most direct determinant of the overall quality of electronic products. When the PCBA is used, the electronic components can generate heat, the heat generated by the electronic components is required to be dissipated, and the stable operation of the PCBA is maintained.
Referring to the prior art with publication number CN213818695U, the utility model discloses a PCBA heat dissipation assembly, which adopts a clamping block to fix a heat conduction metal plate, so that the heat conduction metal plate is attached to a circuit board, the heat conduction metal plate is convenient to absorb heat generated by the circuit board, meanwhile, a round hole is formed in the heat conduction metal plate and is connected with a circulating water pump and a refrigerating device through a pipeline, and cooling liquid is injected into a round hole channel, so that the heat dissipation rate can be accelerated.
However, the device still has some disadvantages, such as firstly, the fast absorption and conduction of the heat generated by the electronic components cannot be realized, and secondly, the dissipation of the absorbed and conducted heat cannot be realized, so that the heat collection of the heat dissipation device is easy to cause.
Disclosure of utility model
In view of the problems mentioned in the background art, an object of the present utility model is to provide a PCBA heat dissipation assembly to solve the problems mentioned in the background art.
The technical aim of the utility model is realized by the following technical scheme:
A PCBA heat dissipation assembly comprises a PCBA board, wherein a heat dissipation mechanism is fixedly arranged on the PCBA board;
The heat dissipation mechanism comprises a first heat dissipation copper sheet, a supporting frame and a second heat dissipation copper sheet, wherein a first graphite heat dissipation sheet, a second graphite heat dissipation sheet and an ultrathin heat pipe are arranged between the first heat dissipation copper sheet and the second heat dissipation copper sheet, the ultrathin heat pipe is arranged into an oval shape, the farthest ends of the oval are communicated, and an air cooling mechanism is fixedly arranged on the upper surface of the second heat dissipation copper sheet.
Through adopting above-mentioned technical scheme, when using, install cooling mechanism on PCBA board, and make cooling mechanism's bottom laminate with components and parts on the PCBA board, be convenient for realize absorbing and conducting the heat, effectual realization cooling heat dissipation handles, and adopted the good first heat dissipation copper sheet of thermal conductivity and second heat dissipation copper sheet in cooling mechanism, realize absorbing and conducting the heat, and be equipped with first graphite fin in the inside of first heat dissipation copper sheet and second heat dissipation copper sheet, second graphite fin and ultra-thin heat pipe, realize dispersing and conducting the heat, prevent that the heat from concentrating in a certain part of cooling mechanism, cause concentrated region temperature too high, influence the use, and be equipped with air cooling mechanism on the second heat dissipation copper sheet, realize giving off the heat on the cooling mechanism, effectual realization cooling treatment.
Preferably, the ultrathin heat pipe is arranged in the middle between the first graphite radiating fin and the second graphite radiating fin, and heat conduction silicone grease is filled in a gap between the first graphite radiating fin, the second graphite radiating fin and the ultrathin heat pipe.
Through adopting above-mentioned technical scheme, the setting of heat conduction silicone grease is convenient for support ultra-thin heat pipe, keeps ultra-thin heat pipe's stability to heat conduction silicone grease can also realize the heat conduction effect.
Preferably, the first graphite radiating fin, the second graphite radiating fin, the ultrathin heat pipe and the heat conduction silicone grease are arranged among the first radiating copper sheet, the supporting frame and the second radiating copper sheet.
Through adopting above-mentioned technical scheme, first graphite fin, second graphite fin, ultra-thin heat pipe and heat conduction silicone grease are in and are convenient for carry out the heat conduction between first heat dissipation copper sheet and the second heat dissipation copper sheet, realize carrying out the heat dissipation to PCBA board and handle.
Preferably, the first graphite radiating fin and the first radiating copper sheet are connected, and the second graphite radiating fin and the second radiating copper sheet are coated with heat conduction silica gel, and the first radiating copper sheet, the supporting frame and the second radiating copper sheet are connected in a welded mode.
Through adopting above-mentioned technical scheme, the setting of heat conduction silica gel can realize the effect of heat dissipation and heat conduction, also can realize the adhesion, keeps first graphite fin, second graphite fin and first heat dissipation copper sheet, the stability that the second heat dissipation copper sheet is connected, and welded connection between first heat dissipation copper sheet, carriage and the second heat dissipation copper sheet, can improve the wholeness.
Preferably, the second heat dissipation copper sheet is fixedly provided with a plurality of fins, and the air cooling mechanism is fixedly arranged on the second heat dissipation copper sheet and is positioned in the fins.
By adopting the technical scheme, the fin is set so as to improve the air fluidity of the heat dissipation mechanism and improve the heat dissipation performance.
Preferably, the air cooling mechanism comprises a fixed mounting sheet, an outer shell is fixedly arranged on the fixed mounting sheet, a net cover is fixedly arranged at the end part of the outer shell, a first mounting column is welded on the second radiating copper sheet, and the fixed mounting sheet is mounted on the first mounting column through a first locking nut.
Through adopting above-mentioned technical scheme, the settlement of fixed mounting piece is convenient for carry out fixed mounting with air-cooled mechanism, and is convenient for actuate the air current and flow, improves radiating efficiency.
Preferably, the four-claw fixing frame is welded in the outer shell, the servo motor is fixedly arranged in the four-claw fixing frame, and the fan blade is arranged on the output shaft of the servo motor.
Through adopting above-mentioned technical scheme, the settlement of four claw mount is convenient for realize carrying out fixed mounting to servo motor, and servo motor drives the flabellum and rotates, accomplishes the heat dissipation and handles.
Preferably, the bottom four corners of the first radiating copper sheet are respectively welded with a second mounting column, the second mounting columns penetrate through the PCBA board, and the second mounting columns are connected with second locking nuts attached to two sides of the PCBA board in a threaded manner.
Through adopting above-mentioned technical scheme, the settlement of second erection column is convenient for carry out the erection joint with cooling body, keeps the wholeness and the laminating nature with PCBA board, is convenient for absorb and conduct the heat on the PCBA board.
In summary, the utility model has the following advantages:
According to the utility model, the heat radiating mechanism is arranged on the PCBA board, the bottom of the heat radiating mechanism is attached to components on the PCBA board, so that heat is conveniently absorbed and conducted, cooling and heat radiating treatment is effectively realized, a first heat radiating copper sheet and a second heat radiating copper sheet with good heat conductivity are adopted in the heat radiating mechanism, heat is absorbed and conducted, a first graphite radiating fin, a second graphite radiating fin and an ultrathin heat pipe are arranged in the first heat radiating copper sheet and the second heat radiating copper sheet, heat is dispersed and conducted, heat is prevented from being concentrated in a certain part of the heat radiating mechanism, the temperature of a concentrated area is too high, the use is influenced, and an air cooling mechanism is arranged on the second heat radiating copper sheet, so that the heat on the heat radiating mechanism is radiated, and the cooling treatment is effectively realized.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of a portion of the structure of the present utility model;
FIG. 3 is a schematic view of the interior of the heat dissipating mechanism of the present utility model;
FIG. 4 is a schematic view of an ultra-thin heat pipe of the present utility model.
The heat dissipation device comprises the following components of 1, a PCBA board, 2, a heat dissipation mechanism, 201, a first heat dissipation copper sheet, 202, a supporting frame, 203, a second heat dissipation copper sheet, 204, an air cooling mechanism, 2041, a fixed mounting sheet, 2042, a first mounting column, 2043, a first locking nut, 2044, an outer shell, 2045, a mesh enclosure, 2046, a four-claw fixing frame, 2047, a servo motor, 2048, fan blades, 205, a first graphite heat dissipation sheet, 206, a second graphite heat dissipation sheet, 207, heat conduction silicone grease, 208, an ultrathin heat pipe, 209, a second mounting column, 210, a second locking nut, 211 and fins.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Examples
Referring to fig. 1-4, a PCBA heat dissipation assembly comprises a PCBA board 1, wherein a heat dissipation mechanism 2 is fixedly installed on the PCBA board 1;
The heat dissipation mechanism 2 comprises a first heat dissipation copper sheet 201, a supporting frame 202 and a second heat dissipation copper sheet 203, wherein a first graphite heat dissipation sheet 205, a second graphite heat dissipation sheet 206 and an ultrathin heat pipe 208 are arranged between the first heat dissipation copper sheet 201 and the second heat dissipation copper sheet 203, the ultrathin heat pipe 208 is arranged into an oval shape, the farthest two ends of the oval are communicated, and an air cooling mechanism 204 is fixedly arranged on the upper surface of the second heat dissipation copper sheet 203.
In this embodiment, preferably, the ultra-thin heat pipe 208 is disposed in the middle between the first graphite heat sink 205 and the second graphite heat sink 206, and the gaps between the first graphite heat sink 205, the second graphite heat sink 206 and the ultra-thin heat pipe 208 are filled with the heat-conducting silicone grease 207, the heat-conducting silicone grease 207 is set to support the ultra-thin heat pipe 208, so as to maintain the stability of the ultra-thin heat pipe 208, and the heat-conducting silicone grease 207 can also realize a heat-conducting effect.
In this embodiment, preferably, the first graphite heat sink 205, the second graphite heat sink 206, the ultra-thin heat pipe 208 and the heat-conducting silicone grease 207 are disposed between the first heat dissipation copper sheet 201, the support frame 202 and the second heat dissipation copper sheet 203, and the first graphite heat sink 205, the second graphite heat sink 206, the ultra-thin heat pipe 208 and the heat-conducting silicone grease 207 are disposed between the first heat dissipation copper sheet 201 and the second heat dissipation copper sheet 203 to facilitate heat conduction, so as to implement heat dissipation treatment on the PCBA board 1.
In this embodiment, preferably, the first graphite cooling fin 205 and the first cooling copper sheet 201 are disposed, and the second graphite cooling fin 206 and the second cooling copper sheet 203 are both coated with heat conducting silica gel, the first cooling copper sheet 201, the supporting frame 202 and the second cooling copper sheet 203 are welded, the heat conducting silica gel can achieve heat dissipation and heat conduction, and adhesion can be achieved, so that the stability of connection between the first graphite cooling fin 205 and the second graphite cooling fin 206 and the first cooling copper sheet 201 and the second cooling copper sheet 203 is maintained, and the first cooling copper sheet 201, the supporting frame 202 and the second cooling copper sheet 203 are welded, so that the integrity can be improved.
In this embodiment, preferably, the second heat dissipation copper sheet 203 is fixedly provided with a plurality of fins 211, the air cooling mechanism 204 is fixedly mounted on the second heat dissipation copper sheet 203 and is located in a plurality of fins 211, and the fins 211 are set so as to improve the air fluidity of the heat dissipation mechanism 2 and improve the heat dissipation performance.
In this embodiment, preferably, the air cooling mechanism 204 includes a fixed mounting plate 2041, an outer casing 2044 is fixedly disposed on the fixed mounting plate 2041, a mesh enclosure 2045 is fixedly disposed at an end portion of the outer casing 2044, a first mounting post 2042 is welded on the second heat dissipation copper sheet 203, the fixed mounting plate 2041 is mounted on the first mounting post 2042 through a first locking nut 2043, and the fixed mounting plate 2041 is set to facilitate the fixed mounting of the air cooling mechanism 204, and facilitate the activation of airflow to flow, thereby improving the heat dissipation efficiency.
In this embodiment, preferably, the inner portion of the outer housing 2044 is welded with a four-claw fixing frame 2046, a servo motor 2047 is fixedly installed in the four-claw fixing frame 2046, a fan blade 2048 is installed on an output shaft of the servo motor 2047, the setting of the four-claw fixing frame 2046 is convenient for realizing the fixed installation of the servo motor 2047, and the servo motor 2047 drives the fan blade 2048 to rotate, so that the heat dissipation treatment is completed.
In this embodiment, preferably, the bottom four corners of the first radiating copper sheet 201 are welded with second mounting posts 209 respectively, the second mounting posts 209 penetrate through the PCBA board 1, the second mounting posts 209 are connected with second locking nuts 210 attached to two sides of the PCBA board 1 in a threaded manner, the second mounting posts 209 are set to facilitate the installation and connection of the radiating mechanism 2, maintain the integrity and the attachment of the PCBA board 1, and facilitate the absorption and conduction of heat on the PCBA board 1.
The use principle and the advantages are that:
When in use, the heat dissipation mechanism 2 is mounted on the PCBA board 1 through the second mounting column 209 and the second lock nut 210, and the bottom of the heat dissipation mechanism 2 is attached to components on the PCBA board 1, so that when the PCBA board 1 operates, the heat is conveniently absorbed and conducted, the cooling heat dissipation treatment is effectively realized, the heat dissipation mechanism 2 adopts the first heat dissipation copper sheet 201 and the second heat dissipation copper sheet 203 with good heat conductivity, the heat is absorbed and conducted, the first graphite heat dissipation sheet 205, the second graphite heat dissipation sheet 206 and the ultrathin heat pipe 208 are arranged in the first heat dissipation copper sheet 201 and the second heat dissipation copper sheet 203, the heat is prevented from being dispersed and conducted in a certain part of the heat dissipation mechanism 2, the concentrated area is caused to have overhigh temperature, the use is influenced, and the air cooling mechanism 204 is arranged on the second heat dissipation copper sheet 203, the heat dissipation on the heat dissipation mechanism 2 is realized, and the cooling treatment is effectively realized.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. A PCBA heat dissipation assembly comprises a PCBA board (1) and is characterized in that a heat dissipation mechanism (2) is fixedly arranged on the PCBA board (1);
The heat dissipation mechanism (2) comprises a first heat dissipation copper sheet (201), a supporting frame (202) and a second heat dissipation copper sheet (203), wherein a first graphite heat dissipation sheet (205), a second graphite heat dissipation sheet (206) and an ultrathin heat pipe (208) are arranged between the first heat dissipation copper sheet (201) and the second heat dissipation copper sheet (203), the ultrathin heat pipe (208) is arranged into an oval shape, the farthest ends of the oval are communicated, and an air cooling mechanism (204) is fixedly arranged on the upper surface of the second heat dissipation copper sheet (203).
2. A PCBA heat sink assembly according to claim 1, characterized in that the ultra-thin heat pipe (208) is arranged in the middle between the first graphite heat sink (205) and the second graphite heat sink (206), and the gaps between the first graphite heat sink (205), the second graphite heat sink (206) and the ultra-thin heat pipe (208) are filled with thermally conductive silicone grease (207).
3. A PCBA heat sink assembly according to claim 2, characterized in that the first graphite heat sink (205), the second graphite heat sink (206), the ultra thin heat pipe (208) and the thermally conductive silicone grease (207) are between the first heat sink copper sheet (201), the support frame (202) and the second heat sink copper sheet (203).
4. The PCBA heat sink assembly as recited in claim 1, wherein a heat conductive silica gel is applied between the first graphite heat sink (205) and the first heat sink copper sheet (201), and between the second graphite heat sink (206) and the second heat sink copper sheet (203), and the first heat sink copper sheet (201), the support frame (202) and the second heat sink copper sheet (203) are welded together.
5. The PCBA heat dissipation assembly as recited in claim 1, wherein a plurality of fins (211) are fixedly arranged on the second heat dissipation copper sheet (203), and the air cooling mechanism (204) is fixedly arranged on the second heat dissipation copper sheet (203) and is positioned in the fins (211).
6. The PCBA heat dissipation assembly as recited in claim 1, wherein the air cooling mechanism (204) comprises a fixed mounting plate (2041), an outer shell (2044) is fixedly arranged on the fixed mounting plate (2041), a net cover (2045) is fixedly arranged at the end part of the outer shell (2044), a first mounting column (2042) is welded on the second heat dissipation copper sheet (203), and the fixed mounting plate (2041) is mounted on the first mounting column (2042) through a first locking nut (2043).
7. The PCBA heat dissipation assembly as recited in claim 6, wherein a four-claw fixing frame (2046) is welded inside the outer shell (2044), a servo motor (2047) is fixedly installed inside the four-claw fixing frame (2046), and a fan blade (2048) is installed on an output shaft of the servo motor (2047).
8. The PCBA heat dissipation assembly as recited in claim 1, wherein second mounting posts (209) are welded at four corners of the bottom of the first heat dissipation copper sheet (201), the second mounting posts (209) penetrate through the PCBA board (1), and second locking nuts (210) attached to two sides of the PCBA board (1) are connected to the second mounting posts (209) in a threaded mode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421120538.1U CN222509818U (en) | 2024-05-22 | 2024-05-22 | PCBA cooling module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421120538.1U CN222509818U (en) | 2024-05-22 | 2024-05-22 | PCBA cooling module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222509818U true CN222509818U (en) | 2025-02-18 |
Family
ID=94553545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421120538.1U Active CN222509818U (en) | 2024-05-22 | 2024-05-22 | PCBA cooling module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222509818U (en) |
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2024
- 2024-05-22 CN CN202421120538.1U patent/CN222509818U/en active Active
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