CN222484983U - High-temperature-resistant PCB (printed circuit board) - Google Patents

High-temperature-resistant PCB (printed circuit board) Download PDF

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CN222484983U
CN222484983U CN202421146510.5U CN202421146510U CN222484983U CN 222484983 U CN222484983 U CN 222484983U CN 202421146510 U CN202421146510 U CN 202421146510U CN 222484983 U CN222484983 U CN 222484983U
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circuit board
heat dissipation
high temperature
temperature resistant
layer
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张强
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Shenzhen Zhien Core Electronic Technology Co ltd
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Shenzhen Zhien Core Electronic Technology Co ltd
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Abstract

本实用新型公开了一种耐高温的PCB电路板,涉及耐高温电路板技术领域，包括印制电路板层、电路板主体结构和散热结构，所述印制电路板层的下端设置有电路板主体结构，电路板主体结构的下端设置有散热结构，通过耐高温层一和耐高温层二可以提高电路板主体结构整体的耐高温性能，通过散热孔可对印制电路板层的内部进行散热，有效减少印制电路板层表面上的电器元件运行而产生的热量作用在印制电路板层上，从而防止因高温效果导致印制电路板层的使用寿命降低，通过微型散热风扇一和微型散热风扇二对微型散热风扇一和微型散热风扇二上端的电路板主体结构进行吹风散热，增大电路板主体结构四周的空气的流通速度从而带走电路板主体结构内部的热量。

The utility model discloses a high temperature resistant PCB circuit board, which relates to the technical field of high temperature resistant circuit boards, and comprises a printed circuit board layer, a circuit board main structure and a heat dissipation structure. The lower end of the printed circuit board layer is provided with the circuit board main structure, and the lower end of the circuit board main structure is provided with the heat dissipation structure. The high temperature resistant layer 1 and the high temperature resistant layer 2 can improve the overall high temperature resistant performance of the circuit board main structure, and the heat dissipation holes can be used to dissipate heat inside the printed circuit board layer, effectively reducing the heat generated by the operation of electrical components on the surface of the printed circuit board layer acting on the printed circuit board layer, thereby preventing the service life of the printed circuit board layer from being reduced due to the high temperature effect, and blowing and dissipating the circuit board main structure on the upper ends of the micro-heat dissipation fans 1 and 2 to increase the circulation speed of air around the circuit board main structure, thereby taking away the heat inside the circuit board main structure.

Description

High-temperature-resistant PCB (printed circuit board)
Technical Field
The utility model relates to the technical field of high-temperature-resistant circuit boards, in particular to a high-temperature-resistant PCB.
Background
The PCB circuit board, the Chinese name printed circuit board, also called printed circuit board, is an important electronic component, is a support for electronic components, and is a provider for electrical connection of electronic components. It is called a "printed" circuit board because it is made using electronic printing. However, the traditional PCB has a single structure, the high temperature resistance of the traditional PCB is poor, various electrical components on the PCB are heated to a high temperature due to the electrical components and the heat generated by current transmission when corresponding equipment works for a long time, and the PCB is easily damaged in a high temperature environment, so that the service life of the PCB is possibly reduced. Accordingly, a PCB with high temperature resistance is provided by those skilled in the art to solve the above-mentioned problems.
Disclosure of utility model
The utility model aims to provide a high-temperature-resistant PCB (printed Circuit Board) to solve the problems in the background technology.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
A high-temperature-resistant PCB comprises a PCB layer, a PCB main body structure and a heat dissipation structure, wherein the lower end of the PCB layer is provided with the PCB main body structure, the lower end of the PCB main body structure is provided with the heat dissipation structure, the PCB main body structure comprises an electric element, a heat dissipation hole, a first high-temperature-resistant layer, a second high-temperature-resistant layer, a protection bottom plate, a heat dissipation through groove, a first support column, a second support column, a third support column, a fourth support column and a first connecting threaded hole, a plurality of groups of electric elements are arranged on the upper surface of the PCB layer, a plurality of groups of heat dissipation holes which are in linear arrangement are arranged on the front side surface of the PCB layer, the heat dissipation holes penetrate through the front side surface and the rear side surface of the PCB layer, a first high-temperature-resistant layer is fixedly arranged on the bottom surface of the PCB layer, a high Wen Cenger is fixedly arranged on the bottom surface of the first high-temperature-resistant layer, a protection bottom plate is fixedly arranged on the bottom surface of the second high-temperature-resistant layer, and a plurality of groups of heat dissipation through grooves are arranged on the bottom surface of the protection bottom plate.
Preferably, the first support column is fixedly arranged at the front end of the left side on the bottom surface of the protective bottom plate, and the second support column is fixedly arranged at the rear end of the left side on the bottom surface of the protective bottom plate.
Preferably, the support column III is fixedly arranged at the front end of the right side on the bottom surface of the protective bottom plate, and the support column IV is fixedly arranged at the rear end of the right side on the bottom surface of the protective bottom plate.
Preferably, the middle parts of the bottom surfaces of the first support column, the second support column, the third support column and the fourth support column are respectively provided with a first connecting threaded hole.
The heat radiation structure comprises a heat radiation bottom plate, a second connecting threaded hole, a mounting through hole, a drying layer, a first protection frame, a first micro heat radiation fan, a second protection frame and a second micro heat radiation fan, wherein the heat radiation bottom plate is arranged at the bottoms of the first support column, the second support column, the third support column and the fourth support column.
Preferably, a drying layer is fixedly arranged on the bottom surface of the heat dissipation bottom plate, and connection threaded holes II are formed in the periphery of the upper surface of the heat dissipation bottom plate in a penetrating manner.
Preferably, the number of the connecting threaded holes II is four, the four groups of connecting threaded holes II penetrate through the drying layer, the positions of the four groups of connecting threaded holes II respectively correspond to the positions of the connecting threaded holes I on the bottom surfaces of the first support column, the second support column, the third support column and the fourth support column, the four groups of connecting threaded holes II on the upper surface of the heat dissipation base plate are respectively connected with the connecting threaded holes I on the bottom surfaces of the first support column, the second support column, the third support column and the fourth support column through bolts, and therefore the main structure of the circuit board can be fixed on the upper surface of the heat dissipation base plate.
Preferably, the front end and the rear end on the upper surface of the radiating bottom plate are penetrated and symmetrically provided with two groups of mounting through holes, and the mounting through holes penetrate through the drying layer.
Preferably, a first protection frame is arranged on the left side of the upper surface of the radiating bottom plate, and a first miniature radiating fan is arranged in the first protection frame.
Preferably, a second protection frame is arranged on the right side of the upper surface of the radiating bottom plate, a second micro radiating fan is arranged in the second protection frame, and the first micro radiating fan and the second micro radiating fan are used for carrying out blowing and radiating on the main structure of the circuit board at the upper ends of the first micro radiating fan and the second micro radiating fan.
Compared with the prior art, the circuit board structure has the beneficial effects that the four groups of connecting threaded holes on the upper surface of the radiating bottom plate are respectively connected with the first supporting column, the second supporting column, the third supporting column and the first connecting threaded holes on the bottom surface of the fourth supporting column through bolts, so that the circuit board main body structure is fixed on the upper surface of the radiating bottom plate, then the whole structure is fixed on a proper position through the bolts and the mounting through holes on the radiating bottom plate, the high temperature resistance performance of the whole circuit board main body structure can be improved through the first high temperature resistant layer and the second high temperature resistant layer, the inside of the printed circuit board layer can be radiated through the radiating holes, the heat generated by the operation of electrical elements on the surface of the printed circuit board layer is effectively reduced, the service life of the printed circuit board layer is prevented from being reduced due to the high temperature effect, the first micro radiating fan and the second micro radiating fan are used for blowing the circuit board main body structure at the upper end of the micro radiating fan, the circulation speed of the air around the circuit board main body structure is increased, the heat inside the circuit board main body structure is taken away, the heat inside the circuit board main body structure is easily carried away, the traditional PCB can be damaged due to the fact that the heat elements on the PCB can be easily produced on the surface of the printed circuit board, and the PCB is poor in the condition that the corresponding electrical elements are relatively has high temperature resistance performance, and the PCB is easy to cause the heat of the electrical elements on the PCB is damaged, and the PCB is easy to cause the high temperature resistance to cause the service life of the electrical element.
Drawings
Fig. 1 is a schematic diagram of the overall structure of a high temperature resistant PCB.
Fig. 2 is a schematic diagram showing a part of the structure of a high temperature resistant PCB.
Fig. 3 is a schematic structural diagram of a main circuit board structure in a high temperature resistant PCB circuit board.
Fig. 4 is a schematic structural diagram of a bottom structure of a main circuit board structure in a high temperature resistant PCB circuit board.
Fig. 5 is a schematic structural diagram of a heat dissipating structure in a high temperature resistant PCB.
In the figure, the first heat radiation layer is 1-printed circuit board layer, the first heat radiation layer is 3-heat radiation layer, the second heat radiation layer is 4-heat radiation layer, the second protective bottom plate is 5-heat radiation groove is 501-heat radiation through groove, the first support column is 6-heat radiation layer, the second support column is 7-heat radiation layer, the third support column is 8-heat radiation layer is 9-support column, the first 10-connection threaded hole is 11-heat radiation bottom plate, the second 1101-connection threaded hole is 1102-installation through hole is 1103-drying layer, the first protective frame is 12-heat radiation layer, the first 1201-micro heat radiation fan is 13-protective frame and the second 1301-micro heat radiation fan is arranged.
Detailed Description
The utility model is further described in connection with the following detailed description, in order to make the technical means, the creation characteristics, the achievement of the purpose and the effect of the utility model easy to understand.
Referring to FIGS. 1-5, in an embodiment of the utility model, a high temperature resistant PCB circuit board comprises a PCB layer 1, a main circuit board structure and a heat dissipation structure, wherein the lower end of the PCB layer 1 is provided with the main circuit board structure, the lower end of the main circuit board structure is provided with the heat dissipation structure, and the main circuit board structure comprises an electrical element 101, a heat dissipation hole 2, a first high temperature resistant layer 3, a second high temperature resistant layer 4, a protective bottom plate 5, a heat dissipation through groove 501, a first support column 6, a second support column 7, a third support column 8, The upper surface of the printed circuit board layer 1 is provided with a plurality of groups of electrical components 101, the front side surface of the printed circuit board layer 1 is provided with a plurality of groups of heat dissipation holes 2 which are in linear arrangement, the heat dissipation holes 2 penetrate through the front side surface and the rear side surface of the printed circuit board layer 1, the bottom surface of the printed circuit board layer 1 is fixedly provided with a first high temperature resistant layer 3, the bottom surface of the first high temperature resistant layer 3 is fixedly provided with a second high temperature resistant layer 4, the bottom surface of the second high temperature resistant layer 4 is fixedly provided with a protective bottom plate 5, the bottom surface of the protective bottom plate 5 is penetrated and provided with a plurality of groups of heat dissipation through grooves 501, the left side front end on the bottom surface of the protective bottom plate 5 is fixedly provided with a first support column 6, the left side rear end on the bottom surface of the protective bottom plate 5 is fixedly provided with a second support column 7, the right side front end on the bottom surface of the protective bottom plate 5 is fixedly provided with a third support column 8, the right side rear end on the bottom surface of the protective bottom plate 5 is fixedly provided with a fourth support column 9, the bottom surface of the protective bottom plate 6, The middle parts of the bottom surfaces of the second support column 7, the third support column 8 and the fourth support column 9 are respectively provided with a first connecting threaded hole 10, the heat dissipation structure comprises a heat dissipation base plate 11, a second connecting threaded hole 1101, a mounting through hole 1102, a drying layer 1103, a first protective frame 12, a first micro heat dissipation fan 1201, a second protective frame 13 and a second micro heat dissipation fan 1301, the bottoms of the first support column 6, the second support column 7, the third support column 8 and the fourth support column 9 are jointly provided with the heat dissipation base plate 11, the drying layer 1103 is fixedly mounted on the bottom surface of the heat dissipation base plate 11, the periphery on the upper surface of the heat dissipation base plate 11 is penetrated with a second connecting threaded hole 1101, namely, the number of the second connecting threaded holes 1101 is four, the second connecting threaded holes 1101 of the four groups penetrate through the drying layer 1103, and the positions of the second connecting threaded holes 1101 of the four groups are respectively 6 times of the first support column, The positions of the first connecting threaded holes 10 on the bottom surfaces of the second supporting column 7, the third supporting column 8 and the fourth supporting column 9 correspond to each other, and the fourth group of connecting threaded holes 1101 are respectively connected with the first supporting column 6, the second supporting column 7, The support column III 8 is connected with the first 10 of connecting screw holes on the bottom surface of the support column IV 9 to fix the circuit board main body structure on the upper surface of the radiating bottom plate 11, the front and back both ends on the upper surface of the radiating bottom plate 11 are all penetrated and symmetrically provided with two groups of mounting through holes 1102, the mounting through holes 1102 penetrate the drying layer 1103, the left side on the upper surface of the radiating bottom plate 11 is provided with the first 12 of protective frames, the inside of the first 12 of protective frames is provided with the first 1201 of micro radiating fans, the right side on the upper surface of the radiating bottom plate 11 is provided with the second 13 of protective frames, and the inside of the second 13 of protective frames is provided with the second 1301 of micro radiating fans.
The working principle of the utility model is as follows:
The utility model relates to a high-temperature-resistant PCB (printed circuit board), which is characterized in that in a specific use process, four groups of connecting threaded holes 1101 on the upper surface of a radiating bottom plate 11 are respectively connected with connecting threaded holes 10 on the bottom surfaces of a first support column 6, a second support column 7, a third support column 8 and a fourth support column 9 through bolts, so that a main structure of the PCB is fixed on the upper surface of the radiating bottom plate 11, then the whole structure is fixed at a proper position through bolts and mounting through holes 1102 on the radiating bottom plate 11, the high-temperature resistance of the whole main structure of the PCB can be improved through a first high-temperature-resistant layer 3 and a second high-temperature-resistant layer 4, the interior of the PCB can be radiated through radiating holes 2, the heat generated by the operation of an electric element 101 on the surface of the PCB 1 is effectively reduced to the PCB 1, the service life of the PCB 1 is prevented from being reduced due to the high-temperature effect, the main structures of the PCB on the upper ends of the miniature radiator fan 1201 and the miniature radiator fan 1301 are fixed at a proper position through the mounting through the bolts and the mounting through holes 1102, the first miniature radiator fan 1301 and the second radiator fan 1301 are increased, and the heat of the main structure of the PCB can be circulated around the PCB is effectively removed, and the heat of the main structure of the PCB can be effectively removed.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.

Claims (10)

1.一种耐高温的PCB电路板，包括印制电路板层(1)、电路板主体结构和散热结构，其特征在于，所述印制电路板层(1)的下端设置有电路板主体结构，电路板主体结构的下端设置有散热结构，电路板主体结构包括：电器元件(101)、散热孔(2)、耐高温层一(3)、耐高温层二(4)、防护底板(5)、散热通槽(501)、支撑柱一(6)、支撑柱二(7)、支撑柱三(8)、支撑柱四(9)和连接螺纹孔一(10)，印制电路板层(1)的上表面上设置有若干组电器元件(101)，印制电路板层(1)的前侧表面上开设有若干组呈线性排列的散热孔(2)，散热孔(2)贯穿印制电路板层(1)的前后两侧表面，印制电路板层(1)的底部表面上固定安装有耐高温层一(3)，耐高温层一(3)的底部表面上固定安装有耐高温层二(4)，耐高温层二(4)的底部表面上固定安装有防护底板(5)，防护底板(5)的底部表面上贯穿开设有若干组散热通槽(501)。1. A high temperature resistant PCB circuit board, comprising a printed circuit board layer (1), a circuit board main structure and a heat dissipation structure, characterized in that the lower end of the printed circuit board layer (1) is provided with a circuit board main structure, the lower end of the circuit board main structure is provided with a heat dissipation structure, the circuit board main structure comprises: an electrical component (101), a heat dissipation hole (2), a high temperature resistant layer 1 (3), a high temperature resistant layer 2 (4), a protective bottom plate (5), a heat dissipation groove (501), a support column 1 (6), a support column 2 (7), a support column 3 (8), a support column 4 (9) and a connecting threaded hole 1 (10), the printed circuit A plurality of groups of electrical components (101) are arranged on the upper surface of the board layer (1); a plurality of groups of heat dissipation holes (2) arranged linearly are opened on the front side surface of the printed circuit board layer (1); the heat dissipation holes (2) penetrate the front and rear side surfaces of the printed circuit board layer (1); a high temperature resistant layer 1 (3) is fixedly installed on the bottom surface of the printed circuit board layer (1); a high temperature resistant layer 2 (4) is fixedly installed on the bottom surface of the high temperature resistant layer 1 (3); a protective bottom plate (5) is fixedly installed on the bottom surface of the high temperature resistant layer 2 (4); and a plurality of groups of heat dissipation grooves (501) are opened and penetrated on the bottom surface of the protective bottom plate (5). 2.根据权利要求1所述的一种耐高温的PCB电路板，其特征在于，所述防护底板(5)底部表面上的左侧前端固定安装有支撑柱一(6)，防护底板(5)底部表面上的左侧后端固定安装有支撑柱二(7)。2. A high temperature resistant PCB circuit board according to claim 1, characterized in that a support column 1 (6) is fixedly installed on the left front end of the bottom surface of the protective base plate (5), and a support column 2 (7) is fixedly installed on the left rear end of the bottom surface of the protective base plate (5). 3.根据权利要求1所述的一种耐高温的PCB电路板，其特征在于，所述防护底板(5)底部表面上的右侧前端固定安装有支撑柱三(8)，防护底板(5)底部表面上的右侧后端固定安装有支撑柱四(9)。3. A high temperature resistant PCB circuit board according to claim 1, characterized in that a support column three (8) is fixedly installed at the front right side of the bottom surface of the protective base plate (5), and a support column four (9) is fixedly installed at the rear right side of the bottom surface of the protective base plate (5). 4.根据权利要求1所述的一种耐高温的PCB电路板，其特征在于，所述支撑柱一(6)、支撑柱二(7)、支撑柱三(8)和支撑柱四(9)的底部表面上的中间均开设有连接螺纹孔一(10)。4. A high temperature resistant PCB circuit board according to claim 1, characterized in that a connecting threaded hole 1 (10) is provided in the middle of the bottom surface of each of the support pillars 1 (6), 2 (7), 3 (8) and 4 (9). 5.根据权利要求1所述的一种耐高温的PCB电路板，其特征在于，所述散热结构包括：散热底板(11)、连接螺纹孔二(1101)、安装通孔(1102)、干燥层(1103)、防护框架一(12)、微型散热风扇一(1201)、防护框架二(13)和微型散热风扇二(1301)，支撑柱一(6)、支撑柱二(7)、支撑柱三(8)和支撑柱四(9)的底部共同设置有散热底板(11)。5. A high temperature resistant PCB circuit board according to claim 1, characterized in that the heat dissipation structure comprises: a heat dissipation base plate (11), a second connecting threaded hole (1101), a mounting through hole (1102), a drying layer (1103), a protective frame 1 (12), a micro heat dissipation fan 1 (1201), a protective frame 2 (13) and a micro heat dissipation fan 2 (1301), and the bottoms of the support column 1 (6), the support column 2 (7), the support column 3 (8) and the support column 4 (9) are jointly provided with a heat dissipation base plate (11). 6.根据权利要求5所述的一种耐高温的PCB电路板，其特征在于，所述散热底板(11)的底部表面上固定安装有干燥层(1103)，散热底板(11)的上表面上的四周贯穿设置有连接螺纹孔二(1101)。6. A high temperature resistant PCB circuit board according to claim 5, characterized in that a drying layer (1103) is fixedly installed on the bottom surface of the heat dissipation base plate (11), and connecting threaded holes (1101) are provided through the four sides of the upper surface of the heat dissipation base plate (11). 7.根据权利要求5所述的一种耐高温的PCB电路板，其特征在于，所述连接螺纹孔二(1101)的数量为四组，四组连接螺纹孔二(1101)均贯穿干燥层(1103)，四组连接螺纹孔二(1101)的位置分别与支撑柱一(6)、支撑柱二(7)、支撑柱三(8)和支撑柱四(9)底部表面上的连接螺纹孔一(10)的位置相对应。7. A high temperature resistant PCB circuit board according to claim 5, characterized in that the number of the second connecting threaded holes (1101) is four groups, the four groups of second connecting threaded holes (1101) all penetrate the drying layer (1103), and the positions of the four groups of second connecting threaded holes (1101) respectively correspond to the positions of the first connecting threaded hole (10) on the bottom surface of the support column one (6), the second supporting column (7), the third supporting column (8) and the fourth supporting column (9). 8.根据权利要求5所述的一种耐高温的PCB电路板，其特征在于，所述散热底板(11)上表面上的前后两端均贯穿且对称设置有两组安装通孔(1102)，安装通孔(1102)贯穿干燥层(1103)。8. A high temperature resistant PCB circuit board according to claim 5, characterized in that two groups of mounting through holes (1102) are penetrated and symmetrically arranged at both the front and rear ends of the upper surface of the heat dissipation base plate (11), and the mounting through holes (1102) penetrate the drying layer (1103). 9.根据权利要求5所述的一种耐高温的PCB电路板，其特征在于，所述散热底板(11)上表面上的左侧设置有防护框架一(12)，防护框架一(12)的内部设置有微型散热风扇一(1201)。9. A high temperature resistant PCB circuit board according to claim 5, characterized in that a protective frame (12) is provided on the left side of the upper surface of the heat dissipation base plate (11), and a micro heat dissipation fan (1201) is provided inside the protective frame (12). 10.根据权利要求5所述的一种耐高温的PCB电路板，其特征在于，所述散热底板(11)上表面上的右侧设置有防护框架二(13)，防护框架二(13)的内部设置有微型散热风扇二(1301)。10. A high temperature resistant PCB circuit board according to claim 5, characterized in that a second protective frame (13) is provided on the right side of the upper surface of the heat dissipation base plate (11), and a second micro heat dissipation fan (1301) is provided inside the second protective frame (13).
CN202421146510.5U 2024-05-23 2024-05-23 High-temperature-resistant PCB (printed circuit board) Active CN222484983U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202421146510.5U CN222484983U (en) 2024-05-23 2024-05-23 High-temperature-resistant PCB (printed circuit board)

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Application Number Priority Date Filing Date Title
CN202421146510.5U CN222484983U (en) 2024-05-23 2024-05-23 High-temperature-resistant PCB (printed circuit board)

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CN222484983U true CN222484983U (en) 2025-02-14

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