Macromolecule covered release film with edge pressing adhesive
Technical Field
The utility model relates to the field of composite polymer films, in particular to a polymer covered release film with edge pressing adhesive.
Background
In the processing process of laminated plate-shaped products such as circuit boards and the like in the hot pressing process, a polymer coating release film is required to be used as an auxiliary processing tool for coating, buffering, heat conduction and release in the pressing process.
Because the high-polymer coating release film is a consumed material in the processing process and does not enter the next working procedure along with the circuit board body, the upper surface and the lower surface of the high-polymer coating release film are release layers, and the middle is provided with a coating layer and other functional layers.
The types of the circuit board products are more, and the types of the polymer coating release films matched with the lamination processing procedure of the specific circuit board are more, so that the method for laminating film bodies with different functions to form the film body with comprehensive performance is generally used for lamination processing of the circuit board with higher technological requirements, the film body with the comprehensive performance required by processing is provided, and the conventional comprehensive functional film body is processed in a mode of firstly cutting a release layer and a coating layer into the same size and then directly paving the release layer on the upper surface and the lower surface of the circuit board layer by layer when the conventional comprehensive functional film body is applied, so that the coating release effect is provided for the circuit board.
The structure and application mode of layer-by-layer laying at present are that the film layers are cut into equal large sizes, and the coating layers have larger gummosis in the pressing process, but the release layers on the upper and lower surfaces are not easy to gummosis, so that the problem that the coating layers flow outside the range of the release film layers in the pressing process to pollute the surface of a circuit board or pollute the pressing table surface is easily caused, if the area of the release film layers is increased to solve the problem, the processing flow and the processing cost are increased, and the problem of glue overflow cannot be completely solved.
Based on the background and the problems, a macromolecule covered release film with a blank pressing and glue blocking structure needs to be provided.
Disclosure of utility model
The utility model mainly aims to solve the problems that in the prior art, a plurality of layers of coating release films are paved layer by layer and are applied to a laminating process of a circuit board, the produced coating layers overflow glue to pollute a board surface, impurities are easy to carry on each layer, a laminating sliding plate of a circuit board body and interlayer deviation are easy to produce, and provides a macromolecule coating release film with edge pressing glue resistance, wherein the macromolecule coating release film is of a laminated structure formed by laminating a surface layer release layer, a coating layer and a bottom layer release layer in sequence, the macromolecule coating release film comprises a functional area and an edge pressing area in the plane direction, the edge pressing area is distributed on edges of more than or equal to two edges of the functional area, the thickness of the edge pressing area is smaller than that of the functional area, and the thickness of the thinnest position of the edge pressing area is 4/5 to 1/3 of the functional area.
Further, the edge pressing areas are uniformly distributed with grains, and the grains are net grains or strip grains or curve grains.
Further, the height of the surface of the texture protrusion to the edge pressing area is 3 micrometers to 15 micrometers.
Optionally, a single step structure is formed between the edge pressing area and the functional area.
Optionally, the edge pressing area and the functional area are in a plurality of continuous ladder structures which are more than or equal to two.
Optionally, an arc connection structure is formed between the edge pressing area and the functional area.
Further, the cambered surface of the arc-shaped connecting structure protrudes towards the covering layer.
Further, the surface release layer or the bottom release layer is a polytetrafluoroethylene layer or a polyimide layer or a TPX layer or an ETFE layer.
Further, the covering layer is a polyolefin layer or an epoxy resin layer or a polyimide layer or a PP layer or a PE layer.
Further, the covering layer is a multi-layer covering layer structure with more than or equal to two layers.
The utility model adopts the structure form of edge pressing glue blocking, so that the integral structure of the edge bonding state of the multilayer composite film body is formed, the glue blocking edge is formed, the edge sealing of the film body is realized, the middle position of the film body is provided with the combined film body with the coating release function, the problem that the generated coating layer overflows to the outside of the release layer range when the film body is applied in a layer-by-layer paving mode is effectively solved, the integral film body structure is convenient to clean, the problem of carrying impurities is reduced, the automatic processing application is easy to realize, the integral lamination quantity of the laminated structure of the circuit board when the film body is applied is reduced, the probability of generating a sliding plate and interlayer offset in the laminating process of the circuit board body is reduced, the grain is further arranged on the lamination edge, the direct impact of the coating layer overflows to the glue blocking edge in the laminating process can be effectively dispersed, the problem that the glue blocking edge bursts is prevented, the glue blocking edge of a plurality of continuous step structures or arc-shaped connection structures is further dispersed, and the coating release film with higher reliability and longer service life can be formed.
Drawings
FIG. 1 is a schematic cross-sectional structure of a polymer-coated release film with edge-pressing adhesive;
FIG. 2 is a schematic plan view of a polymer-coated release film with edge-pressing adhesive;
FIG. 3 is a schematic cross-sectional view of a polymer-coated release film with multiple continuous step-structured bead regions according to the present utility model;
Fig. 4 is a schematic cross-sectional structure of a polymer-coated release film with a bead region having an arc-shaped connection structure according to the present utility model.
Reference numerals illustrate:
| Reference numerals |
Name of the name |
Reference numerals |
Name of the name |
| 10 |
Coated release film |
130 |
Bottom release layer |
| 100 |
Functional area |
1100 |
Grain lines |
| 200 |
Edge pressing area |
10A |
Coating type release film with multiple continuous ladder structure edge pressing areas |
| 110 |
Surface release layer |
10B |
Covered release film of arc-shaped connection structure edge pressing area |
| 120 |
Coating layer |
/ |
/ |
The present utility model will be further described in the detailed description section with reference to the accompanying drawings.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by one of ordinary skill in the art without undue burden from the present disclosure, are within the scope of the embodiments of the present disclosure.
Referring to fig. 1, fig. 1 is a schematic cross-sectional structure of a polymer-coated release film with edge-pressing adhesive according to the present utility model.
The macromolecule covered release film 10 with the edge pressing and adhesive blocking provided by the embodiment has a laminated structure formed by laminating a surface release layer 110, a covered layer 120 and a bottom release layer 130 in sequence, wherein the macromolecule covered release film 10 comprises a functional area 100 and an edge pressing area 200 in the plane direction, the edge pressing area 200 is distributed at the edge of the functional area 100 which is more than or equal to two edges, the thickness of the edge pressing area 200 is smaller than that of the functional area 100, and the thickness of the thinnest position of the edge pressing area 200 is 4/5 to 1/3 of that of the functional area 100.
In this embodiment, the surface release layer 110, the cover layer 120, and the bottom release layer 130 are laminated in sequence to form a laminated structure, the laminated structure is pressed by using a step-type edge pressing roller to form an edge pressing area 200, and then edges are cut to form the cover release film 10, so that the laminated structure forms an integral structure through the edge pressing area 200, if the film body is continuously processed in the longitudinal direction and then is transversely cut, the formed single film body has the structure of the edge pressing areas 200 with two symmetrical edges, and if the single film body needs to be formed to have the structure with the edge pressing areas 200 on four sides, the pressing of the other two symmetrical edges is performed after the transverse cutting.
Because the thicknesses of the multi-layer composite film bodies with different structural properties are different, the thickness of the edge pressing area 200 formed by pressing is also different, the edge pressing area 200 ensures that the edge pressing area is pressed and firmly combined, namely, the edge pressing area 200 cannot have the phenomenon of secondary glue overflow in the subsequent application process.
Referring to fig. 2, fig. 2 is a schematic plan view of a polymer-coated release film with edge-pressing adhesive according to the present utility model.
In this embodiment, the edge pressing area 200 is uniformly distributed with the lines 1100, the lines 1100 are mesh lines, strip lines or curve lines, and the height from the line protrusions to the surface of the edge pressing area is 3 micrometers to 15 micrometers, that is, the lamination is performed by using a lamination roller with the lines, the lines 1100 are set to play a role in buffering and dispersing pressure of the adhesive flowing in the lamination layer 120 in the application process, so that the problem that the adhesive overflowing in the application process of the edge pressing area 200 bursts is prevented.
With continued reference to fig. 1, in this embodiment, the edge pressing area 200 and the functional area 100 have a single step structure, that is, a single step structure is formed by using a single step pressing roller, which is a common pressing structure.
Referring to fig. 3, fig. 3 is a schematic cross-sectional structure of a polymer-coated release film with a plurality of continuous step-structured edge pressing areas according to the present utility model.
In one embodiment, the edge pressing area 200 and the functional area 100 are in a plurality of continuous step structures greater than or equal to two, so as to integrally form the covered release film 10A of the edge pressing area with the continuous step structures, that is, the edge pressing area 200 with the continuous step structures is covered by using a plurality of covered rollers with the continuous step structures, so that the adhesive flowing and adhesive overflowing pressures of the covered layers can be buffered and dispersed better in the application process.
Referring to fig. 4, fig. 4 is a schematic cross-sectional structure of a polymer-coated release film with a bead region having an arc-shaped connection structure according to the present utility model.
The edge pressing area 200 and the functional area 100 are in an arc connection structure, the cambered surface of the arc connection structure protrudes towards the covering layer 120 to integrally form the covering release film 10B of the edge pressing area of the arc connection structure, namely, a pressing roller with a convex arc structure is adopted to press and cover the edge pressing area 200 forming the arc connection structure, and the adhesive flowing and adhesive overflowing pressures of the covering layer can be buffered and dispersed better in the application process.
In this embodiment, the surface release layer 110 or the bottom release layer 130 is a polytetrafluoroethylene layer or a polyimide layer or a TPX layer or an ETFE layer, and the cover layer 120 is a polyolefin layer or an epoxy layer or a polyimide layer or a PP layer or a PE layer.
The release layer and the cover layer can be selected and combined according to application requirements, material performance matching among film bodies is selected, and the formed integral film body can meet the combination form of circuit board processing.
In the present embodiment, the cover layer 120 has a multilayer cover layer structure having two or more layers.
The cover layer 120 may be selected from a cover layer, a reinforcing layer, a heat conducting layer, and other functional layers to form a laminated structure according to application requirements.
The foregoing description is only the preferred embodiments of the present utility model, and is not intended to limit the scope of the embodiments of the present utility model, and all the equivalent structural changes made by the descriptions of the embodiments of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the embodiments of the present utility model.