CN222424343U - A single chip controller - Google Patents
A single chip controller Download PDFInfo
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- CN222424343U CN222424343U CN202421136321.XU CN202421136321U CN222424343U CN 222424343 U CN222424343 U CN 222424343U CN 202421136321 U CN202421136321 U CN 202421136321U CN 222424343 U CN222424343 U CN 222424343U
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- controller
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Abstract
The utility model provides a single-chip microcomputer controller, which comprises a shell component and a modularized mechanism, wherein the shell component comprises a controller shell, a cover plate and a through groove, the cover plate is arranged on the upper surface of the controller shell, the through groove is formed in one side of the controller shell, the modularized mechanism is arranged in the controller shell, the modularized mechanism comprises an interface integrated module, a single-chip microcomputer controller module, a heat dissipation module and a temperature control module, the modularized mechanism cools and cools media in a water supply mechanism through a refrigerating mechanism, the cooled media are then conveyed into a heat exchange mechanism through the water supply mechanism, the heat in the controller is absorbed through the media through the heat exchange mechanism, the heat absorbed media are led back into the water supply mechanism, and the heat is directly discharged to the outside of the controller through the refrigerating mechanism, so that dust particles are prevented from entering the controller, and the heat dissipation efficiency is improved.
Description
Technical Field
The utility model relates to a controller, in particular to a single-chip microcomputer controller, and belongs to the technical field of controllers.
Background
A single-chip controller is an integrated circuit that integrates the core functions of a microprocessor, and typically includes a Central Processing Unit (CPU), memory, and programmable input/output ports (I/O). Such devices are commonly used in embedded systems to control the operation of various electronic devices or machines. The singlechip controller has the characteristics of high integration level, cost effectiveness, low power consumption, flexible programming, good stability and the like;
The patent document CN219042367U discloses a single-chip microcomputer controller, which comprises a box body and a single-chip microcomputer controller body, wherein a connecting frame is arranged on one side of the box body, and a cooling fan is arranged on the other side of the box body. The surface of the single-chip microcomputer controller body is increased to blow and contact with electric parts on part of the single-chip microcomputer controller body, and the hairbrush on the hairbrush plate is utilized to adsorb floating matters near the single-chip microcomputer controller body, so that the single-chip microcomputer controller can improve the ventilation effect when in use, and meanwhile, under the condition that the floating matters are overweight, the blowing effect is increased and the hairbrush is utilized to adsorb the floating matters near the single-chip microcomputer controller body.
However, although the single-chip controller has increased the function of blowing, prevent the floater from entering its inside, but its heat dissipation mode is the same with traditional controller, and tiny granule still can pass filter screen and get into its inside, and its radiating efficiency is lower, and its inner structure is too dispersed, is unfavorable for production equipment and later maintenance, for this reason, proposes a single-chip controller.
Disclosure of utility model
In view of the above, the present utility model provides a single chip controller to solve or alleviate the technical problems existing in the prior art, and at least provides a beneficial choice.
The technical scheme of the embodiment of the utility model is realized in that the single-chip microcomputer controller comprises a shell component and a modularized mechanism, wherein the shell component comprises a controller shell, a cover plate and a through groove;
The cover plate is arranged on the upper surface of the controller shell, the through groove is formed in one side of the controller shell, the modularized mechanism is arranged in the controller shell and comprises an interface integrated module, a singlechip controller module, a heat dissipation module and a temperature control module, the interface integrated module is arranged on the inner side wall of the through groove, the singlechip controller module is arranged at the bottom of the inner side wall of the controller shell, the heat dissipation module is arranged on one side of the inner side wall of the controller shell, and the temperature control module is arranged on the upper surface of the singlechip controller module;
The heat exchange mechanism is fixedly connected to one side of the water supply mechanism and is arranged above the singlechip controller module, and the refrigerating mechanism is arranged on one side of the water supply mechanism;
The refrigerating mechanism is used for cooling the medium in the water supply mechanism;
The water supply mechanism is used for conveying the medium into the heat exchange mechanism for circulating flow;
The heat exchange mechanism is used for absorbing heat in the controller shell by utilizing a medium.
Further preferably, the heat exchange mechanism comprises a heat conduction silica gel block and a heat exchange tube;
wherein, the heat exchange tube is fixedly connected to the inside of the heat conduction silica gel block.
Further preferably, the water supply mechanism comprises a storage box, a water collecting bin, a micro circulating pump and a water supply pipe;
The storage box is arranged on one side of the inner side wall of the controller shell, the heat-conducting silica gel block is fixedly connected to one side of the storage box, the water collecting bin is fixedly connected to one side of the inner side wall of the storage box, the micro circulating pump is arranged on the other side of the inner side wall of the storage box, and the water inlet of the micro circulating pump is communicated with the bottom of the outer side wall of the water collecting bin.
Further preferably, one end of the water supply pipe is communicated with a water outlet of the micro circulating pump, the other end of the micro circulating pump penetrates through the storage box and is communicated with one end of the heat exchange pipe, and the other end of the heat exchange pipe penetrates through the storage box and is communicated with the inside of the water collecting bin.
Further preferably, the refrigerating mechanism comprises a heat exchange plate, two pipe sleeves, two semiconductor refrigerating sheets, two heat conducting blocks and two fans;
The heat exchange plate is fixedly connected to one side of the inner side wall of the water collection bin, the two pipe sleeves penetrate through the storage box and are fixedly connected to one side of the heat exchange plate, the two semiconductor refrigerating sheets are respectively arranged on one side of the inner side wall of the two pipe sleeves, the two heat conducting blocks are respectively fixedly connected to the middle parts of the inner side walls of the two pipe sleeves, the two fans are respectively arranged at one ends of the two pipe sleeves, the cold ends of the two semiconductor refrigerating sheets are respectively adhered to one side of the heat exchange plate, and the hot ends of the two semiconductor refrigerating sheets are respectively adhered to one side of the heat conducting blocks.
Further preferably, a filter plate is fixedly connected to one side of the inner side wall of the controller shell.
Further preferably, a plurality of first flat cables are connected between the interface integration module and the singlechip controller module, and a second flat cable is connected between the storage box and the temperature control module.
Further preferably, the electrical output end of the temperature control module is electrically connected to the electrical input ends of the semiconductor refrigeration sheet, the fan and the micro circulating pump through a second flat cable.
By adopting the technical scheme, the embodiment of the utility model has the following advantages:
1. According to the utility model, the internal structure of the singlechip controller is modularized, so that different modules can be directly assembled when the singlechip controller is produced, the production efficiency is improved, and the singlechip controller is convenient for later maintenance.
2. According to the utility model, the medium in the water supply mechanism is cooled by the refrigeration mechanism, then the cooled medium is conveyed into the heat exchange mechanism by the water supply mechanism, so that the heat in the controller is absorbed by the medium through the heat exchange mechanism, and the heat absorbed medium is led back into the water supply mechanism, so that the heat is directly discharged to the outside of the controller by the refrigeration mechanism, thereby preventing dust particles from entering the inside of the controller, and improving the heat dissipation efficiency.
The foregoing summary is provided merely for the purpose of the specification and is not intended to be limiting in any way. In addition to the illustrative aspects, embodiments, and features described above, further aspects, embodiments, and features of the present utility model will become apparent by reference to the drawings and the following detailed description.
Drawings
In order to more clearly illustrate the embodiments of the application or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of the present utility model;
FIG. 2 is a schematic view of the internal structure of the controller housing of the present utility model;
FIG. 3 is a schematic cross-sectional view of the present utility model;
FIG. 4 is a schematic cross-sectional view of a thermally conductive silicone block of the present utility model;
FIG. 5 is an enlarged schematic view of the structure of the area A of FIG. 4 according to the present utility model;
FIG. 6 is a schematic cross-sectional view of the controller housing of the present utility model.
Reference numeral 1, a housing assembly; 2, a modularized mechanism, 3, a heat exchange mechanism, 4, a water supply mechanism, 5, a refrigeration mechanism, 101, a controller shell, 102, a cover plate, 103, a through groove, 201, an interface integrated module, 202, a singlechip controller module, 203, a heat dissipation module, 204, a temperature control module, 301, a heat conduction silica gel block, 302, a heat exchange tube, 401, a storage box, 402, a water collecting bin, 403, a micro circulating pump, 404, a water supply tube, 501, a heat exchange plate, 502, a pipe sleeve, 503, a semiconductor refrigerating sheet, 504, a heat conduction block, 505, a fan, 61, a filter plate, 62, a first flat cable, 63 and a second flat cable.
Detailed Description
Hereinafter, only certain exemplary embodiments are briefly described. As will be recognized by those of skill in the pertinent art, the described embodiments may be modified in various different ways without departing from the spirit or scope of the present utility model. Accordingly, the drawings and description are to be regarded as illustrative in nature and not as restrictive.
It should be noted that the terms "first," "second," "symmetric," "array," and the like are used merely for distinguishing between description and location descriptions, and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of features indicated. Thus, a feature defining a "first", "symmetry", etc., may explicitly or implicitly include one or more such feature, and as such, where some feature is not literally limited to "two", "three", etc., it should be noted that the feature likewise explicitly or implicitly includes one or more feature quantities.
Embodiments of the present utility model will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1-6, an embodiment of the present utility model provides a single-chip microcomputer controller, which includes a housing assembly 1 and a modularized mechanism 2, wherein the housing assembly 1 includes a controller housing 101, a cover plate 102 and a through slot 103;
The cover plate 102 is arranged on the upper surface of the controller housing 101, the through groove 103 is formed in one side of the controller housing 101, the modularized mechanism 2 is arranged in the controller housing 101, the modularized mechanism 2 comprises an interface integrated module 201, a single-chip microcomputer controller module 202, a heat dissipation module 203 and a temperature control module 204, the interface integrated module 201 is arranged on the inner side wall of the through groove 103, the single-chip microcomputer controller module 202 is arranged at the bottom of the inner side wall of the controller housing 101, the heat dissipation module 203 is arranged on one side of the inner side wall of the controller housing 101, the temperature control module 204 is arranged on the upper surface of the single-chip microcomputer controller module 202, and one side of the inner side wall of the controller housing 101 is fixedly connected with the filter plate 61;
The heat dissipation module 203 further comprises a heat exchange mechanism 3, a water supply mechanism 4 and a refrigeration mechanism 5, wherein the heat exchange mechanism 3 is fixedly connected to one side of the water supply mechanism 4 and is arranged above the singlechip controller module 202, and the refrigeration mechanism 5 is arranged on one side of the water supply mechanism 4;
the refrigeration mechanism 5 is used for cooling the medium in the water supply mechanism 4;
wherein, the water supply mechanism 4 is used for conveying the medium into the heat exchange mechanism 3 for circulating flow;
Wherein the heat exchange mechanism 3 is used for absorbing heat inside the controller housing 101 by means of a medium.
In one embodiment, the heat exchange mechanism 3 comprises a thermally conductive silicone block 301 and a heat exchange tube 302;
wherein, the heat exchange tube 302 is fixedly connected to the inside of the heat conduction silica gel block 301;
The heat in the controller housing 101 is absorbed by the medium through the heat exchange tube 302 in combination with the heat conducting silicone block 301.
In one embodiment, the water supply mechanism 4 comprises a storage box 401, a water collection bin 402, a micro circulating pump 403 and a water supply pipe 404;
The storage box 401 is mounted on one side of the inner side wall of the controller shell 101, the heat-conducting silica gel block 301 is fixedly connected to one side of the storage box 401, the water collecting bin 402 is fixedly connected to one side of the inner side wall of the storage box 401, the micro circulating pump 403 is mounted on the other side of the inner side wall of the storage box 401, a water inlet of the micro circulating pump 403 is communicated with the bottom of the outer side wall of the water collecting bin 402, one end of the water supply pipe 404 is communicated with a water outlet of the micro circulating pump 403, the other end of the micro circulating pump 403 penetrates through the storage box 401 and is communicated with one end of the heat exchange tube 302, and the other end of the heat exchange tube 302 penetrates through the storage box 401 and is communicated with the inside of the water collecting bin 402;
The medium in the sump 402 is pumped out by the micro circulation pump 403 and discharged into the heat exchange tube 302 through the water supply tube 404.
In one embodiment, the refrigeration mechanism 5 includes a heat exchange plate 501, two jackets 502, two semiconductor refrigeration sheets 503, two heat conducting blocks 504, and two fans 505;
The heat exchange plate 501 is fixedly connected to one side of the inner side wall of the water collection bin 402, the two tube sleeves 502 penetrate through the storage box 401 and are fixedly connected to one side of the heat exchange plate 501, the two semiconductor refrigerating sheets 503 are respectively installed on one side of the inner side wall of the two tube sleeves 502, the two heat conducting blocks 504 are respectively fixedly connected to the middle parts of the inner side walls of the two tube sleeves 502, the two fans 505 are respectively installed at one ends of the two tube sleeves 502, the cold ends of the two semiconductor refrigerating sheets 503 are adhered to one side of the heat exchange plate 501, and the hot ends of the two semiconductor refrigerating sheets 503 are adhered to one side of the heat conducting blocks 504;
The heat of the medium is absorbed by the cold end of the semiconductor refrigerating sheet 503 through the heat exchange plate 501 so as to absorb heat and cool the medium, then the heat of the hot end of the semiconductor refrigerating sheet 503 is absorbed by the heat conducting block 504, and then the heat of the heat conducting block 504 is dissipated by the fan 505.
In one embodiment, a plurality of first flat cables 62 are connected between the interface integrated module 201 and the single-chip microcomputer controller module 202, a second flat cable 63 is connected between the storage box 401 and the temperature control module 204, and an electrical output end of the temperature control module 204 is electrically connected to an electrical input end of the semiconductor refrigeration sheet 503, the fan 505 and the micro circulation pump 403 through the second flat cable 63;
The temperature control module 204 is connected with the semiconductor refrigeration sheet 503, the blower fan 505 and the micro circulating pump 403 by using the second flat cable 63, so that the semiconductor refrigeration sheet 503, the blower fan 505 and the micro circulating pump 403 are controlled by using the temperature control module 204.
When the single-chip controller is required to be assembled, the through groove 103 is inserted and fixed through the mobile interface integrated module 201, then the single-chip controller module 202 is installed and fixed at the bottom of the inner side wall of the controller shell 101, then wiring is carried out between the first bus 62-degree interface integrated module 201 and the single-chip controller module 202, then the heat dissipation module 203 is installed on one side of the inner side wall of the controller shell 101 and fixed, then the heat dissipation module 203 and the temperature control module 204 on the single-chip controller module 202 are wired through the second bus 63, and then the cover plate 102 is fixed on the controller shell 101, so that the assembly operation can be finished, and the inner structure of the single-chip controller is modularized, so that the single-chip controller is more convenient to assemble and produce and later overhaul.
When the single-chip microcomputer controller is used, the temperature in the controller shell 101 is detected through the temperature control module 204, when temperature data detected by the temperature control module 204 reach a threshold value, the semiconductor refrigerating sheet 503, the fan 505 and the micro circulating pump 403 are started to work through the relay and the second flat cable 63 arranged on the temperature control module 204, the medium in the water collecting bin 402 is pumped out through the working micro circulating pump 403 and is discharged to the inside of the heat exchange tube 302 through the water supply tube 404, then the heat in the controller shell 101 is absorbed through the medium by the heat exchange tube 302 matched with the heat conducting silica gel block 301, then the medium after absorbing heat is discharged to the inside of the water collecting bin 402 through the heat exchange tube 302, so that the medium can be recycled, then the heat of the medium is absorbed through the cold end of the semiconductor refrigerating sheet 503, the heat of the semiconductor refrigerating sheet 503 is absorbed through the heat exchange plate 501, then the heat of the heat conducting block 504 is absorbed through the heat conducting block 504, the heat of the heat conducting block 505 is discharged to the outside of the single-chip microcomputer controller, and dust particles can be effectively prevented from entering the controller shell and the inside of the controller shell 202, the heat dissipation efficiency is improved, and the heat dissipation efficiency of the single-chip microcomputer controller is improved.
When the temperature data detected by the temperature control module 204 is lower than the threshold value, the semiconductor refrigeration sheet 503, the fan 505 and the micro circulation pump 403 are turned off by the temperature control module 204 using the relay and the second flat cable 63.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that various modifications and substitutions are possible within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421136321.XU CN222424343U (en) | 2024-05-23 | 2024-05-23 | A single chip controller |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421136321.XU CN222424343U (en) | 2024-05-23 | 2024-05-23 | A single chip controller |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222424343U true CN222424343U (en) | 2025-01-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421136321.XU Active CN222424343U (en) | 2024-05-23 | 2024-05-23 | A single chip controller |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222424343U (en) |
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- 2024-05-23 CN CN202421136321.XU patent/CN222424343U/en active Active
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