CN222420308U - Clamping mechanism for chip aging test socket - Google Patents

Abstract

The utility model relates to a clamping mechanism for a chip aging test socket, which comprises a chip connecting seat, wherein a plurality of ball clamping hole assemblies which are orderly arranged are arranged at the center of the chip connecting seat, a metal probe is inserted into the ball clamping hole assemblies, a left clamping piece and a right clamping piece are arranged at the upper part of the metal probe, the left clamping piece and the right clamping piece enable the metal probe to be of a Y-shaped structure, a chip placing plate for placing chips is connected at the center of the chip connecting seat, contact holes which are in one-to-one correspondence with the ball clamping hole assemblies are formed in the chip placing plate, and the top ends of the metal probes penetrate through the ball clamping hole assemblies to extend into the contact holes and contact with welding points of products. The utility model can improve the detection quality.

Description

Clamping mechanism for chip aging test socket

Technical Field

The utility model relates to the technical field of semiconductor testing, in particular to a clamping mechanism for a chip burn-in test socket.

Background

With the development of science and technology, electronic chips have been widely used in various electronic products. After the mass production of the chips is completed, the qualification of the chips needs to be detected, so that unqualified chips are selected, and qualified chips are reserved. However, in the current semiconductor chip testing field, the test socket mainly includes a lower test socket body, a test probe and a lower test socket probe holding board, so as to complete the testing of the single-sided pin array chip. And the function of the test socket is to test the chips of the single-sided pin array, and the test socket does not have the function of testing the upper surface and the lower surface of the chips at different times aiming at the novel packaging technology chips of the double-sided pin array, especially the main chip surface of the laminated semiconductor chip.

Through retrieval, the aging test socket (CN 202222685037.5) capable of assisting chip heat dissipation comprises an upper needle hole plate, an upper metal clamping plate, a lower needle hole plate and probes, wherein the upper surface of the upper needle hole plate is provided with a test groove, the middle part of the upper needle hole plate is provided with four insulating plates, the middle part of the test groove is provided with a first mounting groove, the upper metal clamping plate is fixedly mounted in the first mounting groove, the upper surfaces of the upper metal clamping plate and the lower metal clamping plate are respectively provided with a plurality of probe holes, the upper surface of the lower needle hole plate is provided with a second mounting groove, and the lower metal clamping plate is fixedly mounted in the second mounting groove. The probes can achieve contact with the product, but cannot ensure the stability of contact, resulting in inaccurate final detection results.

In view of the above-mentioned drawbacks, the present inventors have actively studied and innovated to create a novel structure of a clamping mechanism for a socket for chip burn-in test, which has a more industrial utility value.

Disclosure of utility model

In order to solve the technical problems, the utility model aims to provide a clamping mechanism for a chip burn-in test socket.

In order to achieve the above purpose, the utility model adopts the following technical scheme:

The clamping mechanism for the chip aging test socket comprises a chip connecting seat, wherein a plurality of regularly arranged ball clamping hole assemblies are formed in the center of the chip connecting seat, metal probes are inserted into the ball clamping hole assemblies, a left clamping piece and a right clamping piece are arranged on the upper portion of each metal probe, the left clamping piece and the right clamping piece enable the metal probes to be of a Y-shaped structure, a chip placing plate for placing chips is connected to the center of the chip connecting seat, contact holes corresponding to the ball clamping hole assemblies one by one are formed in the chip placing plate, and the top ends of the metal probes penetrate through the ball clamping hole assemblies, extend into the contact holes and are in contact with welding points of products;

The ball clamping hole assembly comprises a ball clamping hole body, the ball clamping hole body is arranged on a chip connecting seat, a supporting guide post is connected in the ball clamping hole body, a through hole for allowing a left clamping piece and a right clamping piece to pass through is formed between the supporting guide post and the ball clamping hole body, and the supporting guide post is arranged in the middle of the left clamping piece and the right clamping piece.

Preferably, the clamping mechanism for the chip burn-in test socket is characterized in that a clamping groove is formed in the chip connecting seat, and the chip placing plate is clamped on the clamping groove.

Preferably, the clamping mechanism for the chip burn-in test socket comprises a left clamping piece and a right clamping piece, wherein the left clamping piece and the right clamping piece are elastic clamping pieces.

Preferably, in the clamping mechanism for the chip burn-in test socket, the top ends of the left clamping piece and the right clamping piece are connected with clamping heads for contacting with the welding points.

Preferably, in the clamping mechanism for the chip burn-in test socket, the clamping piece of the clamping head is integrally formed.

Preferably, in the clamping mechanism for the chip burn-in test socket, the diameter of the contact hole is larger than that of the ball clamping hole body.

By means of the scheme, the utility model has at least the following advantages:

the utility model can clamp and contact the welding point of the product (chip), ensures the stability of contact and also ensures the quality of later detection.

The foregoing description is only an overview of the present utility model, and is intended to provide a better understanding of the present utility model, as it is embodied in the following description, with reference to the preferred embodiments of the present utility model and the accompanying drawings.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some embodiments of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic diagram of the structure of the present utility model;

FIG. 2 is a schematic view of the structure of the ball clamping hole assembly of the present utility model;

FIG. 3 is a schematic view of the metal probe of the present utility model gripping a product;

FIG. 4 is a schematic view of the metal probe of the present utility model with the product released.

Detailed Description

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the technical solutions of the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, and it is apparent that the described embodiments are some embodiments of the present application, but not all embodiments of the present application. The components of the embodiments of the present application generally described and illustrated in the figures herein may be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the application, as presented in the figures, is not intended to limit the scope of the application, as claimed, but is merely representative of selected embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.

Examples

As shown in fig. 1 and fig. 2, a clamping mechanism for a chip burn-in test socket comprises a chip connecting seat 1, wherein a plurality of regularly arranged ball clamping hole assemblies 3 are formed in the center of the chip connecting seat 1, metal probes 2 are inserted into the ball clamping hole assemblies 3, a left clamping piece 21 and a right clamping piece 22 are arranged on the upper part of each metal probe 2, each metal probe 2 is in a Y-shaped structure due to the left clamping piece 21 and the right clamping piece 22, a chip placing plate 4 for placing chips is connected to the center of the chip connecting seat 1, contact holes 5 which are in one-to-one correspondence with the ball clamping hole assemblies 3 are formed in the chip placing plate 4, and the top ends of the metal probes 2 penetrate through the ball clamping hole assemblies 3 to extend into the contact holes 5 and contact with welding points of products;

The ball clamping hole assembly 3 comprises a ball clamping hole body 31, the ball clamping hole body 31 is arranged on the chip connecting seat 1, a supporting guide post 32 is connected in the ball clamping hole body 31, a through hole for the left clamping piece 21 and the right clamping piece 22 to penetrate through is formed between the supporting guide post 32 and the ball clamping hole body 31, and the supporting guide post 32 is arranged in the middle of the left clamping piece 21 and the right clamping piece 22.

In the utility model, the chip connecting seat 1 is provided with a clamping groove, and the chip placing plate 4 is clamped on the clamping groove.

In the utility model, the left clamping piece 21 and the right clamping piece 22 are elastic clamping pieces, the top ends of the left clamping piece 21 and the right clamping piece 22 are connected with a clamping head 23 used for contacting with a welding point, and the clamping pieces of the clamping head 23 are integrally formed.

The diameter of the contact hole 5 is larger than that of the ball clamping hole body 31, so that the left clamping piece 21 and the right clamping piece 22 have a movable space in the contact hole.

The working principle of the utility model is as follows:

as shown in fig. 3, in a specific operation, the product is placed on the chip placement board, and the soldering points of the product (chip) correspond to the contact holes, and the left clamping piece and the right clamping piece of the metal probe at this time will hold the soldering points in a left and right direction, thereby ensuring contact with the product and ensuring detection in a later stage.

As shown in fig. 4, if the product is to be removed, only the chip connecting seat is required to be pressed downwards, meanwhile, the chip connecting seat is connected to the base, a movable distance is reserved between the chip connecting seat and the base through a spring, in the process of pressing down the chip connecting seat, the opening guide pillar moves downwards together, so that the left clamping piece and the right clamping piece are forced to be opened, the clamping head is separated from the welding point, the welding point of the product is ensured not to be scratched, and meanwhile, the stability of contact is ensured.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.

In the description of the present application, it should be noted that the azimuth or positional relationship indicated by the terms "vertical", "horizontal", "inner", "outer", etc. are based on the azimuth or positional relationship shown in the drawings, or the azimuth or positional relationship that is conventionally put in use of the product of this application, are merely for convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element to be referred to must have a specific azimuth, be configured and operated in a specific azimuth, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like, are used merely to distinguish between descriptions and should not be construed as indicating or implying relative importance.

Furthermore, the terms "horizontal," "vertical," and the like do not denote a requirement that the component be absolutely horizontal or vertical, but rather may be slightly inclined. As "horizontal" merely means that its direction is more horizontal than "vertical", and does not mean that the structure must be perfectly horizontal, but may be slightly inclined.

In the description of the present application, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, and it should be noted that it is possible for those skilled in the art to make several improvements and modifications without departing from the technical principle of the present utility model, and these improvements and modifications should also be regarded as the protection scope of the present utility model.

Claims (6)

1. The clamping mechanism for the chip aging test socket is characterized by comprising a chip connecting seat (1), wherein a plurality of regularly arranged ball clamping hole assemblies (3) are arranged at the center of the chip connecting seat (1), metal probes (2) are inserted into the ball clamping hole assemblies (3), a left clamping piece (21) and a right clamping piece (22) are arranged at the upper part of each metal probe (2), the left clamping piece (21) and the right clamping piece (22) enable each metal probe (2) to be in a Y-shaped structure, a chip placing plate (4) for placing chips is connected at the center of the chip connecting seat (1), contact holes (5) which correspond to the ball clamping hole assemblies (3) one by one are formed in the chip placing plate (4), and the top ends of the metal probes (2) penetrate through the ball clamping hole assemblies (3) to extend into the contact holes (5) and contact with welding points of products;

The ball clamping hole assembly (3) comprises a ball clamping hole body (31), the ball clamping hole body (31) is arranged on the chip connecting seat (1), a supporting guide pillar (32) is connected in the ball clamping hole body (31), a through hole for allowing the left clamping piece (21) and the right clamping piece (22) to pass through is formed between the supporting guide pillar (32) and the ball clamping hole body (31), and the supporting guide pillar (32) is arranged between the left clamping piece (21) and the right clamping piece (22).

2. The clamping mechanism for the chip burn-in test socket of claim 1, wherein the chip connecting seat (1) is provided with a clamping groove, and the chip placing plate (4) is clamped on the clamping groove.

3. The clamping mechanism for a chip burn-in socket as set forth in claim 1, wherein said left clamping piece (21) and said right clamping piece (22) are elastic clamping pieces.

4. A clamping mechanism for a die burn-in socket according to claim 1 or 3, wherein the tips of the left clamping piece (21) and the right clamping piece (22) are connected with clamping heads (23) for contacting with the soldering points.

5. The clamping mechanism for a chip burn-in socket as recited in claim 4, wherein the clamping piece of said clamping head (23) is integrally formed.

6. The clamping mechanism for a chip burn-in socket as set forth in claim 1, wherein the diameter of said contact hole (5) is larger than the diameter of said ball-clamping hole body (31).