CN222370634U - Processing system - Google Patents

Abstract

The present application discloses a processing system for processing ceramic sheets, including a moving part, at least two processing parts and at least two discharge parts. The moving part includes a manipulator, and the manipulator is used to clamp the ceramic sheet. The processing part includes a laser head and a processing station, and the laser head is used to process the ceramic sheet, and the processing station is used to place the ceramic sheet. At least two discharge parts include a sheet station, and the sheet station is used to place the ceramic sheet. Among them, the manipulator can move the ceramic sheet from the sheet station to the processing station, and move the ceramic sheet from the processing station to the sheet station. By setting up multiple discharge parts, the sheet stations of multiple discharge parts can realize the loading and unloading of ceramic sheets, the manipulator of the moving part moves the ceramic sheet to the processing station or the sheet station for unloading, and realizes the processing of the ceramic sheet through the laser head and multiple processing stations. Therefore, multiple ceramic sheets can be processed simultaneously through a moving part, which improves the processing efficiency and saves costs.

Description

Processing system

Technical Field

The application relates to the technical field of automatic equipment in the semiconductor industry, in particular to a processing system.

Background

In the ceramic wafer manufacturing industry, an apparatus is usually provided with a processing station, the ceramic wafer is manually placed on the station, and the ceramic wafer is manually removed from the processing station after laser processing, so that the process is repeated.

The utility model discloses a self-cleaning ceramic wafer automatic laser processing device, which comprises an adsorption jig, a loading pile, a discharging platform, a carrying assembly, a laser assembly, a cleaning assembly and a cleaning assembly, wherein the adsorption jig is assembled above the moving end of a Y-axis module, the loading pile and the discharging platform are respectively arranged on two sides of the Y-axis module, the waste collection box is independently arranged at the front end of the Y-axis module close to a base, the carrying assembly is bridged and fixed on the base and is positioned above the loading pile and the discharging platform, the laser assembly is arranged on a stand column frame body, the executing end of the laser assembly is arranged at the moving end of the Z-axis module, the cleaning assembly is arranged on the base and is positioned at a collecting disc position, a material disc fixing position and above the material disc pile. However, the device only has one processing system, and can only process one ceramic wafer at a time, so that the efficiency is low. Therefore, how to improve the processing efficiency of the ceramic sheet becomes a problem to be solved.

Disclosure of utility model

The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides a processing system which can improve the processing efficiency of the ceramic wafer.

According to the embodiment of the application, the processing system is used for processing the ceramic wafer and comprises a moving part, at least two processing parts and at least two discharging parts. The moving part comprises a manipulator, and the manipulator is used for clamping the ceramic wafer. The processing portion includes laser head and processing station, the laser head is used for processing the potsherd, processing station is used for placing the potsherd. The at least two discharging parts comprise a tablet station, and the tablet station is used for placing the ceramic tablet. Wherein the manipulator is capable of moving the ceramic sheet from the sheet station to the processing station and moving the ceramic sheet from the processing station to the sheet station.

The processing system is used for processing the ceramic wafers, a plurality of discharging parts are arranged, the feeding and the discharging of the ceramic wafers are realized through the material wafer stations of the plurality of discharging parts, the manipulator of the moving part moves the ceramic wafers to the processing stations or the material wafer stations for discharging, and the processing of the ceramic wafers is realized through the laser head and the plurality of processing stations. Therefore, the plurality of ceramic plates are simultaneously machined through one moving part, the machining efficiency is improved, and the cost is saved.

In some embodiments, the discharging portion further includes a lifting member extending in a vertical direction, the web station is movably disposed on the lifting member, and the web station is capable of moving along the extending direction of the lifting member.

In some embodiments, the blanking portion further includes a magnetic attraction member detachably connected to the web station for securing the web station.

In some embodiments, the web station is provided with a width adjustment button for adjusting the size of the web station.

In some embodiments, the web station is further provided with a position sensor for detecting the position of the web station.

In some embodiments, the robot includes a cylinder for providing suction to the suction cup and a suction cup for sucking the ceramic sheet.

In some embodiments, the moving part includes a moving shaft extending in a horizontal direction, and the manipulator is movably disposed on the moving shaft and is movable in an extending direction of the moving shaft.

In some embodiments, the processing station is provided with a positioning member for abutting against the peripheral surface of the ceramic sheet to fix the ceramic sheet.

In some embodiments, the processing station is further provided with a negative pressure port for adsorbing impurities.

In some embodiments, the processing section further comprises a positioning sensor for detecting the position of the laser head.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The application is further described with reference to the accompanying drawings and examples, in which:

FIG. 1 is a schematic diagram of a processing system according to an embodiment of the present application;

FIG. 2 is a schematic view of the manipulator of FIG. 1;

FIG. 3 is a schematic view of the processing portion of FIG. 1;

FIG. 4 is a schematic view of the processing section of FIG. 3 from another perspective;

Fig. 5 is a schematic structural view of the discharging part in fig. 1.

Reference numeral processing system 1, ceramic wafer 2;

The device comprises a moving part 10, a manipulator 11, an air cylinder 111, a suction cup 112, a moving shaft 12, a processing part 20, a laser head 21, a processing station 22, a positioning piece 221, a negative pressure port 222, a positioning sensor 23, a discharging part 30, a tablet station 31, a width adjusting button 311, a position sensor 312, a lifting piece 32, a magnetic attraction piece 33, a horizontal direction X and a vertical direction Y.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.

In the description of the present application, it should be understood that references to orientation descriptions such as upper, lower, front, rear, left, right, etc. are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the apparatus or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the present application.

In the description of the present application, the meaning of a number is one or more, the meaning of a number is two or more, and greater than, less than, exceeding, etc. are understood to exclude the present number, and the meaning of a number is understood to include the present number. The description of the first and second is for the purpose of distinguishing between technical features only and should not be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated or implicitly indicating the precedence of the technical features indicated.

In the description of the present application, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present application can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.

In the description of the present application, the descriptions of the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Fig. 1 is a schematic structural view of a processing system according to an embodiment of the present application, fig. 2 is a schematic structural view of a manipulator in fig. 1, fig. 3 is a schematic structural view of a processing portion in fig. 1, fig. 4 is a schematic structural view of another view of the processing portion in fig. 3, and fig. 5 is a schematic structural view of a discharging portion in fig. 1.

Please refer to fig. 1 to 5. The embodiment of the application provides a processing system 1 for processing a ceramic wafer 2, which comprises a moving part 10, at least two processing parts 20 and at least two discharging parts 30. The moving part 10 includes a robot arm 11, and the robot arm 11 is used for clamping the ceramic wafer 2. The processing section 20 includes a laser head 21 for processing the ceramic sheet 2 and a processing station 22 for placing the ceramic sheet 2. The at least two discharge portions 30 comprise a web station 31, the web station 31 being for placing the ceramic sheets 2. Wherein the robot 11 is capable of moving the ceramic sheet 2 from the sheet station 31 to the processing station 22 and moving the ceramic sheet 2 from the processing station 22 to the sheet station 31.

In some embodiments, the moving part 10 may include a robot arm 11, and the shape of the clamping jaw of the robot arm 11 may match the shape of the ceramic sheet 2 so as to clamp the ceramic sheet 2.

In some embodiments, the robot 11 may also move the ceramic wafer 2 by adsorption, not just clamping.

In some embodiments, the number of tooling sections 20 may be two. That is, the number of the laser heads 21 may be two, and the number of the processing stations 22 may be two, and the number of the laser heads 21 and the number of the processing stations 22 may be matched, so that the laser heads 21 can perform laser processing on the ceramic sheet 2 on the corresponding processing stations 22.

In some embodiments, the number of the discharging parts 30 may be two, and each discharging part 30 may include two web stations 31, one for feeding the ceramic sheet 2 and one for discharging the ceramic sheet 2.

In some embodiments, the processing system 1 may process multiple ceramic sheets 2 simultaneously, and the robot 11 may move the processed ceramic sheets 2 to the blanking sheet station 31 while moving the ceramic sheets 2 on the feeding sheet station 31 to the processing station 22.

In some embodiments, the number of moving parts 10 may be one, that is, the number of manipulators 11 is one, and the number of manipulators 11 is saved, that is, the cost is saved, by moving one manipulator 11 between the respective web stations 31.

The processing system 1 of the embodiment of the application is used for processing ceramic wafers 2, a plurality of discharging parts 30 are arranged, the feeding and discharging of the ceramic wafers 2 are realized through the material wafer stations 31 of the plurality of discharging parts 30, the manipulator 11 of the moving part 10 moves the ceramic wafers 2 to the processing stations 22 or the material wafer stations 31 for discharging, and the processing of the ceramic wafers 2 is realized through the laser head 21 and the plurality of processing stations 22. Therefore, the plurality of ceramic sheets 2 are simultaneously processed by one moving part 10, so that the processing efficiency is improved, and the cost is saved.

Please refer to fig. 1 to 5. In some embodiments, the discharging portion 30 further includes a lifting member 32, the lifting member 32 extends along the vertical direction Y, the web station 31 is movably disposed on the lifting member 32, and the web station 31 can move along the extending direction of the lifting member 32.

In some embodiments, the lifter 32 may extend in the vertical direction Y.

In some embodiments, the vertical direction Y may be represented by the direction indicated by the letter Y in the figure.

In some embodiments, the lifting member 32 may be a screw or a guide rail, and the web station 31 may be disposed on the lifting member 32 and lifted or lowered by a driving motor.

In some embodiments, a warehouse is disposed below the tablet station 31, when loading is required, the tablet station 31 is moved to the lower side by the lifter 32, and after loading is completed, the tablet station 31 is moved to a position for taking materials by the manipulator 11 by the lifter 32.

In some embodiments, a warehouse is provided below the tablet station 31, and after the robot 11 moves the processed ceramic tablet 2 to the tablet station 31, the tablet station 31 is moved to the position of the warehouse by the lifter 32, and then the blanking is completed.

Through with tablet station 31 activity set up in lifter 32, improved the convenience of material loading and unloading, improved efficiency, saved the manpower.

Please refer to fig. 1 to 5. In some embodiments, the discharge portion 30 further includes a magnetic attraction member 33, the magnetic attraction member 33 being detachably connected to the web station 31 for fixing the web station 31.

In some embodiments, the magnetic attraction member 33 may be an electromagnetic attraction device that, when energized, may attract the web station 31 to secure the web station 31. The magnetic attraction member 33 may be fixedly disposed at the uppermost end of the lifting member 32 or at other positions.

In some embodiments, the magnetic attraction 33 is activated to secure the web station 31 when the web station 31 is in the loading position, and the magnetic attraction 33 is deactivated when it is desired to move the web station 31, such as to load and unload or manually clean the web station 31.

Through the detachable connection of the magnetic attraction piece 33 and the tablet station 31, convenience is improved, and meanwhile, the accuracy of the position of the tablet station 31 is improved, so that the manipulator 11 is convenient to take materials.

Please refer to fig. 1 to 5. In some embodiments, the web station 31 is provided with a width adjustment button 311, the width adjustment button 311 being used to adjust the size of the web station 31.

In some embodiments, the tablet station 31 generally has a receiving bin adapted to the ceramic tablet 2, and by providing the width adjustment button 311, the size of the receiving bin is changed, that is, the distance between the peripheral walls of the receiving bin is changed, so as to realize the change of the size, so as to adapt to the ceramic tablet 2 with more sizes, thereby improving the practicability and applicability.

Please refer to fig. 1 to 5. In some embodiments, the web station 31 is further provided with a position sensor 312, the position sensor 312 being used to detect the position of the web station 31.

In some embodiments, the tablet station 31 is provided with a position sensor 312 for detecting the position of the tablet station 31 to determine whether the tablet station 31 is located at a correct position, so that the manipulator 11 is convenient for taking and discharging, the probability of errors occurring in the process of taking and discharging by the manipulator 11 is reduced, and the reliability is improved.

Please refer to fig. 1 to 5. In some embodiments, the robot 11 includes a cylinder 111 and a suction cup 112, the cylinder 111 for providing suction to the suction cup 112, the suction cup 112 for sucking the ceramic wafer 2.

In some embodiments, the cylinder 111 and suction cup 112 may be connected to each other such that the cylinder 111 is capable of providing suction to the suction cup 112.

In some embodiments, the ceramic wafer 2 is absorbed by the sucker 112, so that the process of moving the ceramic wafer 2 by the manipulator 11 is more stable, the falling probability of the ceramic wafer 2 is reduced, and the reliability is improved.

Please refer to fig. 1 to 5. In some embodiments, the moving part 10 includes a moving shaft 12, the moving shaft 12 extends in the horizontal direction X, and the robot 11 is movably disposed on the moving shaft 12 and is capable of moving in the extending direction of the moving shaft 12.

In some embodiments, the horizontal direction X may be represented by the direction indicated by the letter X in the figure.

In some embodiments, movable shaft 12 may be a lead screw or a guide rail.

In some embodiments, the movement shaft 12 may connect each processing station 22 and the web station 31 in the horizontal direction X such that the robot 11 may move the ceramic sheet 2 from the web station 31 to the processing station 22 and the ceramic sheet 2 from the processing station 22 to the web station 31.

In some embodiments, the moving part 10 may be further provided with a motor, and the robot 11 is moved on the moving shaft 12 by motor driving.

By providing the movement shaft 12, the movement of the manipulator 11 is guided, and the reliability of the movement of the manipulator 11 is improved.

Please refer to fig. 1 to 5. In some embodiments, the processing station 22 is provided with a positioning member 221, and the positioning member 221 is used to abut against the peripheral surface of the ceramic sheet 2 to fix the ceramic sheet 2.

In some embodiments, the positioning member 221 may be a metal rod or sheet, or other glass or plastic disposed on the surface of the processing station 22. The number of the positioning pieces 221 may be plural, and the plurality of positioning pieces 221 collectively abut against the peripheral surface of the ceramic sheet 2.

In some embodiments, the positioning member 221 may form a positioning slot protruding from the processing station 22, wherein the peripheral wall of the positioning slot is not completely closed, so as to facilitate the removal of the ceramic wafer 2 at the processing station 22 by the robot 11. The robot 11 may move the ceramic tile 2 from the tile station 31 into the detent of the processing station 22.

By arranging the positioning piece 221 to fix the ceramic wafer 2, the risk of machining errors caused by movement of the ceramic wafer 2 in the machining process is reduced, and the reliability is improved.

Please refer to fig. 1 to 5. In some embodiments, the processing station 22 is further provided with a negative pressure port 222, the negative pressure port 222 being for adsorbing impurities.

In some embodiments, the negative pressure port 222 may be disposed on the surface of the processing station 22 for placing the ceramic wafer 2, and when the laser head 21 processes the ceramic wafer 2, the negative pressure port 222 is opened, so that impurities generated during processing the ceramic wafer 2 are sucked away by negative pressure, which improves cleanliness and reduces risks of affecting the processing quality of the ceramic wafer 2 due to the impurities.

Please refer to fig. 1 and 3. In some embodiments, the processing section 20 further includes a positioning sensor 23, the positioning sensor 23 being configured to detect the position of the laser head 21.

In some embodiments, the processing portion 20 may be provided with a screw or a slide rail, and the laser head 21 may be provided on the screw or the slide rail, and may be driven by a motor to move the laser head 21 in the vertical direction Y.

In some embodiments, a blowing port may be provided beside the laser head 21, and the blowing port may be opened to blow away impurities generated during processing of the ceramic wafer.

In some embodiments, the positioning sensor 23 is used to detect the position of the laser head 21 to confirm that the laser head 21 is located at an accurate processing position, thereby improving the reliability of processing.

The embodiments of the present application have been described in detail with reference to the accompanying drawings, but the present application is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present application. Furthermore, embodiments of the application and features of the embodiments may be combined with each other without conflict.

Claims (8)

1. A processing system for processing ceramic wafers, comprising:

The moving part comprises a manipulator, and the manipulator is used for clamping the ceramic wafer;

The at least two processing parts comprise a laser head and a processing station, wherein the laser head is used for processing the ceramic sheet, and the processing station is used for placing the ceramic sheet;

The material discharging parts comprise material sheet stations, magnetic attraction pieces and lifting pieces, wherein the material sheet stations are used for placing the ceramic sheets, the lifting pieces extend in the vertical direction, the material sheet stations are movably arranged on the lifting pieces, the material sheet stations can move along the extending direction of the lifting pieces, and the magnetic attraction pieces are detachably connected with the material sheet stations and used for fixing the material sheet stations;

Wherein the manipulator is capable of moving the ceramic sheet from the sheet station to the processing station and moving the ceramic sheet from the processing station to the sheet station.

2. The processing system of claim 1, wherein the web station is provided with a width adjustment button for adjusting the size of the web station.

3. The processing system of claim 2, wherein the web station is further provided with a position sensor for detecting a position of the web station.

4. The processing system of claim 1, wherein the robot includes a cylinder for providing suction to the suction cup and a suction cup for sucking the ceramic wafer.

5. The processing system according to claim 4, wherein the moving portion includes a moving shaft extending in a horizontal direction, and the robot is movably provided to the moving shaft so as to be movable in an extending direction of the moving shaft.

6. The processing system of claim 1, wherein the processing station is provided with a positioning member for abutting against a peripheral surface of the ceramic sheet to fix the ceramic sheet.

7. The processing system of claim 6, wherein the processing station is further provided with a negative pressure port for adsorbing impurities.

8. The processing system of claim 7, wherein the processing section further comprises a positioning sensor for detecting a position of the laser head.