CN222353145U - Silicon chip multipoint thickness measuring device - Google Patents

Abstract

The utility model discloses a silicon wafer multipoint thickness measuring device which comprises a workbench, wherein supporting seats are symmetrically arranged at two sides of the upper end of the workbench, a top plate is fixedly connected to the upper ends of the supporting seats, a driving device is arranged on the top plate, an upper meter pen mounting plate is arranged between the two supporting seats in a vertically penetrating mode, a first meter pen is vertically arranged in the middle of the upper meter pen mounting plate in a penetrating mode, a lower meter pen mounting plate is horizontally arranged above the workbench and between the two supporting seats, second meter pens which are in one-to-one correspondence with the first meter pens are arranged on the lower meter pen mounting plate, and a plurality of ejector rods used for bearing a silicon wafer to be measured are vertically arranged at the front end and the rear end of the lower meter pen mounting plate. The utility model can solve the problems that the existing silicon wafer thickness measuring device can only usually carry out single-point measurement and can not acquire thickness information of a plurality of positions of the silicon wafer at the same time, so that the measuring efficiency is low, the accuracy is not enough and the like.

Description

Silicon chip multipoint thickness measuring device

Technical Field

The utility model relates to the field of silicon wafer testing, in particular to a silicon wafer multipoint thickness measuring device.

Background

In the field of semiconductor manufacturing, thickness measurement of a silicon wafer is a crucial link. In the prior art, a silicon wafer thickness gauge usually adopts a single-point measurement mode, and only the thickness of a single-point position of a silicon wafer can be tested each time, and an operator needs to test for multiple times to calculate the thickness of the silicon wafer, so that the efficiency and the accuracy of a measurement result are affected. Therefore, it is necessary to design a device capable of performing multipoint measurement on a silicon wafer to improve measurement efficiency and accuracy.

Disclosure of utility model

The utility model provides a silicon wafer multipoint thickness measuring device which can solve the problems that the existing silicon wafer multipoint thickness measuring device can only perform single-point measurement generally and cannot acquire thickness information of a plurality of positions of a silicon wafer at the same time, so that the measuring efficiency is low, the accuracy is insufficient and the like.

The silicon wafer multipoint thickness measuring device comprises a workbench, supporting seats are symmetrically arranged on two sides of the upper end of the workbench, a top plate is fixedly connected to the upper ends of the supporting seats, a driving device is arranged on the top plate, an upper meter pen mounting plate is connected with the movable end of the driving device and can be vertically arranged between the two supporting seats in a moving mode, three first meter pens which are arranged in a triangular mode are vertically penetrating through the middle of the upper meter pen mounting plate, a lower meter pen mounting plate is horizontally arranged above the workbench and between the two supporting seats, second meter pens which are in one-to-one correspondence with the first meter pens are arranged on the lower meter pen mounting plate, a plurality of ejector rods which are used for bearing the silicon wafers to be measured are vertically arranged on the front end and the rear end of the lower meter pen mounting plate, and multipoint measurement is achieved through the first meter pens and the second meter pens which are arranged in a triangular mode.

Preferably, silicon wafer positioning blocks are vertically arranged at four corners of the upper side of the lower pointer mounting plate, the silicon wafer to be tested can move left and right to the position of the silicon wafer positioning blocks, and the thickness of 6 different positions can be measured by performing 2 times of testing.

Preferably, a plurality of support rods connected with the workbench are vertically arranged at the front end and the rear end of the bottom of the lower meter pen mounting plate along the length direction, and the lower meter pen mounting plate is simple in structure and convenient to mount.

Preferably, the supporting seat comprises two upright posts which are arranged side by side from front to back, the upper side and the lower side of each upright post are provided with connecting seats relatively, and the upright posts are fixedly connected with the connecting seats, so that the processing is convenient.

Preferably, a guide rail is vertically arranged on the side wall of the upright post, a connecting plate connected with the upper pointer mounting plate is arranged on a sliding block of the guide rail, and the upper pointer mounting plate can slide up and down along the guide rail.

Preferably, a limiting block is arranged on the periphery of the guide rail in the middle of the upright post to limit the downward moving distance of the upper pointer mounting plate.

Preferably, profile struts are arranged on two sides of the front end between the workbench and the top plate, and the installation is convenient.

Compared with the prior art, the utility model has the beneficial effects that:

The device has the advantages of simple structure, convenient operation, high automation degree, reduced complexity of manual repeated operation, automatic calculation of the data processing system, report export and storage of the test result, and convenience for user analysis and use, and realizes the multi-point rapid measurement of the silicon wafer. The thickness measuring device can solve the problems that the existing silicon wafer thickness measuring device can only usually carry out single-point measurement and cannot acquire thickness information of a plurality of positions of the silicon wafer at the same time, so that the measuring efficiency is low, the accuracy is insufficient and the like.

Drawings

FIG. 1 is a perspective view of the present utility model;

FIG. 2 is a perspective view of a test state of the present utility model;

Fig. 3 is a perspective view of a supporting seat according to the present utility model.

Reference numerals:

1. The device comprises a workbench, 2, a supporting seat, 21, upright posts, 22, a connecting seat, 3, a top plate, 4, a driving device, 5, an upper meter pen mounting plate, 6, a first meter pen, 7, a top rod, 8, a top rod, 9, a top rod, 10, a silicon wafer positioning block, 11, a supporting rod, 12, a guide rail, 13, a limiting block, 14, a section bar pillar, 15, a silicon wafer to be tested, 16 and a connecting plate.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model.

As shown in figures 1-3, in order to solve the problems that the existing silicon wafer thickness measuring device can only perform single-point measurement generally and cannot acquire thickness information of a plurality of positions of a silicon wafer at the same time, and therefore low measuring efficiency, low accuracy and the like exist, the utility model provides the technical scheme that the silicon wafer multi-point thickness measuring device comprises a workbench 1, supporting seats 2 are symmetrically arranged on two sides of the upper end of the workbench 1, a top plate 3 is fixedly connected to the upper end of the supporting seat 2, a driving device 4 is arranged on the top plate 3, the driving device 4 can be a device capable of achieving linear reciprocating motion, such as an electric cylinder, an air cylinder or a hydraulic cylinder, and the like, an upper meter pen mounting plate 5 is connected with movable ends of the driving device 4, the upper meter pen mounting plate 5 can be vertically arranged between the two supporting seats 2, three first meter pens 6 which are arranged in a triangular shape are vertically penetrated in the middle of the upper meter mounting plate 5 and are used for being contacted with the upper surface of a measured silicon wafer 15, the lower meter 7 is horizontally arranged above the workbench 1, the driving device 4 is arranged on the upper end of the workbench 3, the upper meter mounting plate 4 can be in a linear reciprocating motion can be achieved, the upper meter mounting plate is arranged between the two meter pens 7 and the two meter pens 8 are arranged on the two ends of the second meter mounting plates which are in a triangular meter mounting plate 8 and the second meter 8 which are correspondingly arranged between the two meter pens 8 and the two meter pens 8 are arranged, and the upper meter pen pens 8 are respectively, and the two meter mounting plates are arranged at the two meter ends of the two meter pens 8 are correspondingly arranged.

In this embodiment, as shown in fig. 2, silicon wafer positioning blocks 10 are vertically disposed at four corners of the upper side of the lower stylus mounting plate 7, and the silicon wafer 15 to be tested can move left and right to the position of the silicon wafer positioning blocks 10, so that the thickness of 6 different positions can be measured by performing 2 tests.

In this embodiment, as shown in fig. 1, a plurality of support rods 11 connected with the workbench 1 are vertically disposed at the front and rear ends of the bottom of the lower stylus mounting plate 7 along the length direction, so that the structure is simple and the installation is convenient.

In this embodiment, as shown in fig. 3, the supporting seat 2 includes two upright posts 21 disposed side by side in front and back, the upper and lower sides of the upright posts 21 are provided with connecting seats 22 relatively, and the upright posts 21 are fixedly connected with the connecting seats 22, so that the processing is convenient.

In this embodiment, as shown in fig. 1, a guide rail 12 is vertically disposed on a side wall of the upright post 21, a connecting plate 16 connected to the upper stylus mounting plate 5 is disposed on a slider of the guide rail 12, and the upper stylus mounting plate 5 can slide up and down along the guide rail 12.

In this embodiment, as shown in fig. 1, a limiting block 13 is disposed at the middle of the upright post 21 and located at the outer periphery of the guide rail 12, so as to limit the downward movement distance of the upper stylus mounting plate 5.

In this embodiment, as shown in fig. 1, profile struts 14 are disposed on two sides of the front end between the workbench 1 and the top plate 3, so that the installation is convenient.

In this embodiment, as shown in fig. 1, during standby, the driving device 4 lifts the upper stylus mounting plate 5 to the top position, the silicon wafer 15 to be measured is conveniently placed, the silicon wafer 15 to be measured is placed on the ejector rod 9, the silicon wafer 15 to be measured contacts with the silicon wafer positioning block 10 on one side, the start button is pressed, the driving device 4 leaks air, the upper stylus mounting plate 5 slowly descends by means of dead weight until the connecting plate 16 contacts with the limiting block 13, the first stylus 6 and the second stylus 8 are both contacted with the silicon wafer 15 to be measured, thickness information of the silicon wafer can be obtained through the change of the telescopic distance of the first stylus 6 and the second stylus 8, after three-point measurement is completed, the driving device 4 lifts the upper stylus mounting plate 5, an operator continuously translates the silicon wafer 15 to be measured until contacting with the silicon wafer positioning block 10 on the other side, the start button is pressed, three-point thickness of the silicon wafer is measured, the measurement result can be transmitted to the industrial personal computer through a communication line, the customized display software displays the measurement result, and records the result, and the result can be traced back to an excel file, and convenience is achieved.

It should be noted that all directional indicators (such as up, down, left, right, front, and rear are used in the embodiments of the present utility model) are merely for explaining the relative positional relationship, movement conditions, and the like between the components in a certain specific posture (as shown in the drawings), and if the specific posture is changed, the directional indicators are changed accordingly.

Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present utility model, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "connected," "fixed," and the like are to be construed broadly, and for example, "fixed" may be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements, unless otherwise explicitly specified. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In addition, the technical solutions of the embodiments of the present utility model may be combined with each other, but it is necessary to be based on the fact that those skilled in the art can implement the technical solutions, and when the technical solutions are contradictory or cannot be implemented, the combination of the technical solutions should be considered as not existing, and not falling within the scope of protection claimed by the present utility model.

Claims (7)

1. A multi-point thickness measuring device for a silicon wafer, comprising:

The workbench (1), wherein supporting seats (2) are symmetrically arranged on two sides of the upper end of the workbench (1), a top plate (3) is fixedly connected to the upper end of each supporting seat (2), and a driving device (4) is arranged on each top plate (3);

the upper meter pen mounting plate (5), the upper meter pen mounting plate (5) is connected with the movable end of the driving device (4), the upper meter pen mounting plate can be arranged between the two supporting seats (2) in an up-down moving way, and three first meter pens (6) which are arranged in a triangular shape vertically penetrate through the middle of the upper meter pen mounting plate (5);

The lower meter pen mounting plate (7), lower meter pen mounting plate (7) level set up in the top of workstation (1) two between supporting seat (2), be provided with on lower meter pen mounting plate (7) with second meter pen (8) of first meter pen (6) one-to-one, the front and back both ends of lower meter pen mounting plate (7) are vertical to be provided with a plurality of ejector pins (9) that are used for bearing to be surveyed silicon chip (15).

2. The silicon wafer multipoint thickness measuring device according to claim 1, wherein silicon wafer positioning blocks (10) are vertically arranged at four corners of the upper side of the lower stylus mounting plate (7).

3. The silicon wafer multipoint thickness measuring device according to claim 1, wherein a plurality of supporting rods (11) connected with the workbench (1) are vertically arranged at the front end and the rear end of the bottom of the lower pen mounting plate (7) along the length direction.

4. The multipoint thickness measuring device for silicon wafers according to claim 1, wherein the supporting seat (2) comprises two upright posts (21) which are arranged in parallel front and back, connecting seats (22) are arranged on the upper side and the lower side of the upright posts (21) relatively, and the upright posts (21) are fixedly connected with the connecting seats (22).

5. The silicon wafer multipoint thickness measuring device according to claim 4, wherein a guide rail (12) is vertically arranged on the side wall of the upright post (21), and a connecting plate (16) connected with the upper stylus mounting plate (5) is arranged on a sliding block of the guide rail (12).

6. The silicon wafer multipoint thickness measuring device according to claim 5, wherein a limiting block (13) is arranged on the periphery of the guide rail (12) at the middle part of the upright post (21).

7. The silicon wafer multipoint thickness measuring device according to claim 1, wherein profile struts (14) are arranged on two sides of the front end between the workbench (1) and the top plate (3).