CN222339853U - Electronic device - Google Patents

Abstract

The utility model relates to the technical field of servers, and discloses an electronic device which comprises a shell, wherein a main board and a fan group are arranged in the shell, the fan group is arranged on one side of the main board, the electronic device further comprises a first frame, a first air guide cover and a high-heat electronic component, the first frame is arranged on the main board, the first air guide cover is arranged between the first frame and the fan group and is connected with the first frame, the high-heat electronic component is arranged on the main board, the high-heat electronic component is arranged between the first air guide cover and the fan group, the first air guide cover comprises a first baffle, one surface of the first baffle faces the high-heat electronic component, the other surface of the first baffle faces the first frame, a plurality of first air guide openings are arranged on the first baffle, the first inclined plate is connected with the first baffle and extends in the direction away from the first baffle, and an included angle formed between the first inclined plate and the first baffle is an obtuse angle. In this way, the heat dissipation effect inside the electronic device is improved.

Description

Electronic device

Technical Field

The present disclosure relates to servers, and particularly to an electronic device.

Background

In recent years, with rapid development of technology, the operation speed of electronic devices is continuously improved. In addition, as the performance of the electronic device increases, the heat generating power of the electronic components of the electronic device also increases. In order to prevent the electronic component from overheating and causing temporary or permanent failure, the electronic device must provide sufficient heat dissipation performance for the electronic component.

In the case of a Server (Server), the Server must have sufficient stability and reliability to avoid interruption of the service provided. Therefore, a diversion structure for assisting heat dissipation is also generally configured in the casing of the server, so as to increase the efficiency of heat convection. In general, a fan is disposed on one side of a motherboard in a conventional server, and the heat generated by electronic components on the motherboard is dissipated out of a housing by an air flow blown by the fan, so as to reduce the temperature of the server, thereby avoiding system failure caused by overheating of the server and stabilizing the operation of the server.

Currently, more and more servers will have multiple different modules disposed on the same side in the server chassis, for example, PCIE card modules, power supply modules, hard disk modules, and so on. However, the heat dissipation requirements of these modules are different, and the fans of the servers on the market in the prior art all generate air flows which are fixed in the same direction, and once the air flow direction has modules with different heat dissipation requirements, it is obvious that the conventional heat dissipation design cannot effectively meet the heat dissipation requirements of different modules. In addition, along with the design requirement, the position that thereby the module in some servers can change the setting along with the difference of demand, traditional wind scooper structure is fixed installation in a position usually, inconvenient use and dismantlement to be difficult to adapt to the adjustment after the position change of different modules in the server, the flexibility is relatively poor.

Disclosure of Invention

The utility model aims to provide an electronic device.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The electronic device comprises a shell, a first frame, a first air guide cover and a high-heat electronic component, wherein the shell is internally provided with a main board and a fan group, the fan group is arranged on one side of the main board, the electronic device further comprises a first frame, the first frame is arranged on the main board, the first air guide cover is arranged between the first frame and the fan group and is connected with the first frame, the high-heat electronic component is arranged on the main board, the high-heat electronic component is arranged between the first air guide cover and the fan group, the first air guide cover comprises a first baffle plate, one surface of the first baffle plate faces the high-heat electronic component, the other surface of the first baffle plate faces the first frame, a plurality of first air guide openings are formed in the first baffle plate, the first inclined plate is connected with the first baffle plate and extends in a direction far away from the first baffle plate, an included angle formed between the first inclined plate and the first baffle plate is an obtuse angle, the first air guide cover is arranged between the high-heat electronic component and the main board, the high-heat electronic component is arranged between the first air guide cover and the fan group, the high-heat electronic component is driven by the first air guide cover and the high-heat electronic component flows to the first air guide device through the first air guide cover and the first air guide device through the first frame and the high-heat electronic component.

Preferably, the fan comprises a main board, a first baffle plate and a second baffle plate, and is characterized by further comprising a second frame, wherein the second frame is adjacent to the first frame and is arranged on the main board, a second protruding portion is arranged on the second frame, a first buckling portion is arranged at one end, far away from the first baffle plate, of the first inclined plate, and the first buckling portion is in clamping connection with the second protruding portion so that the first air guide cover is connected with the second frame.

Preferably, the first air guide cover further comprises a first top plate, the first top plate is covered on the first baffle and the first inclined plate, a first assembly hole is formed in the first top plate, a first assembly column is arranged on the first frame, and the first assembly column is installed in a matched mode with the first assembly hole, so that the first air guide cover is connected with the first frame.

Preferably, a first extension plate is provided on the first frame, and the first assembly post is provided on the first extension plate.

Preferably, the air guide device further comprises a third frame and a third air guide cover, wherein the third frame is adjacent to the first frame and is installed on the main board, a third assembly column is arranged on the third frame, a third top plate is arranged on the third air guide cover, and the third assembly column is installed in a matched mode with a third assembly hole on the third top plate so that the third air guide cover is connected with the third frame.

Preferably, a first protruding portion is arranged on the first frame, a third inclined plate is arranged on the third air guiding cover, and the first protruding portion and a third buckling portion on the third inclined plate are installed in a matched mode, so that the third air guiding cover is connected with the first frame.

Preferably, a third extension plate is provided on the third frame, and the third assembly post is provided on the third extension plate.

Preferably, the first frame is used for combining with an electronic module, and the electronic module includes a power module, a PCIE module or a motherboard module.

Preferably, a wire rod placing groove body used for placing the wire rods in the casing is formed in the top end of the first inclined plate.

Preferably, the bottom of the first inclined plate is provided with a plurality of component mounting ports for fitting component mounting on the main board.

Compared with the prior art, the utility model has the beneficial effects that through the arrangement mode, the first wind scooper can effectively guide the heat generated by the high-heat electronic component to flow in the direction away from the first frame carrying the important electronic module, so that the influence of the heat on the important electronic module is greatly reduced, and meanwhile, the installation and the disassembly are very convenient, the application range is wide, and the defects in the background art are well solved.

Drawings

FIG. 1 is a diagram illustrating the connection among a first air guiding cover, a first frame and a second frame in a housing and mounted on a motherboard;

FIG. 2 is a schematic view of the structure of FIG. 1 from another perspective;

FIG. 3 is a schematic view of the structure of FIG. 1 at A;

FIG. 4 is a schematic view of the structure of FIG. 1 at B;

FIG. 5 is a schematic view of a first air guiding cover;

FIG. 6 is a schematic view of the structure of the first frame;

FIG. 7 is a schematic diagram of an electronic device illustrating a connection relationship among a first air guiding cover, a second air guiding cover, a first frame, a second frame and a third frame in a housing and mounted on a motherboard;

FIG. 8 is a schematic view of the structure of FIG. 7 at another view angle;

FIG. 9 is a schematic view of the structure of FIG. 7 at C;

Fig. 10 is a schematic diagram of the structure at D in fig. 7.

The reference numerals in the figures illustrate:

1. a first air guide cover;

101. 1011, the first guide port;

102. First inclined plate 1021, wire rod placing groove body 1022, element mounting port 1023, air inlet;

103. 1031, first assembly holes;

104. A first fastening part;

2. 3, a main board;

4. First frame, 401, first boss, 402, first assembly post, 403, first extension plate;

5. A second frame 501, a second boss;

6. A third air guide cover;

601. 6011, third buckle part;

602. 6021, third assembly hole;

7. 8, PCIE module;

9. A third frame 901, a third assembly post 902, a third extension plate;

10. A high thermal electron component;

11. A fan set.

Detailed Description

In order to make the technical problems, technical schemes and beneficial effects to be solved more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.

It will be understood that when an element is referred to as being "mounted" or "disposed" on another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

It is to be understood that the terms "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are merely for convenience in describing and simplifying the description based on the orientation or positional relationship shown in the drawings, and do not indicate or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus are not to be construed as limiting the utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

Referring to fig. 1-5, an electronic device according to the present utility model may be a server, a host, or another type of electronic device. The electronic device comprises a shell 2, a main board 3, a fan group 11 and a high-thermal electronic component 10 which are arranged in the shell 2.

The fan set 11 is disposed on one side of the main board 3 to drive the airflow in the electronic device, such as the hot airflow generated by the CPU during high-speed operation, to flow in the housing 2.

The high thermal electronic component 10 is mounted on the main board 3, the high thermal electronic component 10 is disposed between the first air guide cover 1 and the fan group 11, and the high thermal electronic component 10 is an electronic component such as a microprocessor capable of generating a large amount of heat.

The electronic device is also provided with a first frame 4 arranged on the main board 3, the first frame 4 is used for being combined with an electronic module, the electronic module comprises a power module 7 or a PCIE module 8 or a main board module, and the electronic module is arranged on the first frame 4 to be connected with the main board 3 in a communication way.

The electronic device further comprises a first air guide cover 1 which is arranged on the main board 3, wherein the first air guide cover 1 is arranged between the first frame 4 and the fan group 11 and is connected with the first frame 4, the first air guide cover 1 comprises a first baffle plate 101, one surface of the first baffle plate 101 faces the high-temperature electronic component 10, the other surface of the first baffle plate faces the first frame 4, a plurality of first air guide openings 1011 are formed in the first baffle plate 101, and a first inclined plate 102 is connected with the first baffle plate 101 and extends in a direction away from the first baffle plate 101, and an included angle formed between the first inclined plate 102 and the first baffle plate 101 is an obtuse angle. The first air guiding cover 1 may improve the heat dissipation environment inside the electronic device, specifically, the first air guiding cover 1 is located between the high thermal electronic component 10 and the first frame 4, so that a part of air flow driven by the fan set 11 passes through the high thermal electronic component 10, and after passing through the high thermal electronic component 10, a part of air flow forms a high-temperature air flow, and the part of air flow flows to a direction far away from the first frame 4 through the first inclined plate 102 on the first air guiding cover 1, so that most of air flow with heat is blocked outside the first frame 4, and the electronic module in the first frame 4 is protected from being affected by high temperature, so that the working stability of the electronic module is improved, thereby meeting the requirement of the electronic module on heat dissipation, and overcoming the defects existing in the background art. By providing the first inclined plate 102, most of the air flow with heat can be blocked outside the first frame 4 and guided to other areas along the inclined direction of the first inclined plate 102.

It should be noted that, the fan assembly 11 is generally mounted on the periphery of the high thermal electronic component 10, and when the blades of the fan assembly 11 rotate in a counterclockwise direction, the heat flow generated by the high thermal electronic component 10 flows along the first inclined plate 102.

In addition, the fan set 11 drives another part of the air flow which does not pass through the high-heat electronic component 10 to flow into the first frame 4 through the first diversion opening 1011 of the first baffle 101 on the first air guiding cover 1. The part of the air flow is far away from the high-temperature electronic component 10, so that the temperature is not high, and the part of the air flow is suitable for flowing into the first frame 4 to meet the requirement of the electronic module in the first frame 4 on the air flow. Wherein the first diversion port 1011 functions to direct the above-mentioned air flow into the first frame 4.

In addition, the flow rate of the air flow flowing into the first frame 4 can be controlled by controlling the number of the first diversion openings 1011 arranged on the first baffle 101, so that the number of the first diversion openings 1011 can be more in some use occasions requiring high-flow air flow, and the number of the first diversion openings 1011 can be less in some use occasions requiring low-flow air flow, thereby meeting different heat dissipation requirements corresponding to different electronic modules and overcoming the defects in the background art. In addition, the shape of the first diversion port 1011 may be square, round or rectangular, etc. Next, if the first baffle 101 can also meet the requirement of the electronic module in the first frame 4 for the wind flow without providing the first diversion port 1011, the first diversion port 1011 may not be provided on the first baffle 101.

The electronic device further comprises a second frame 5, the second frame 5 is adjacent to the first frame 4 and is mounted on the main board 3, a second protruding portion 501 is arranged on the second frame 5, a first fastening portion 104 is arranged on one end, far away from the first baffle 101, of the first inclined plate 102, and the first fastening portion 104 is mounted in a clamping manner with the second protruding portion 501, so that the first air guide cover 1 is connected with the second frame 5. Specifically, the second frame 5 is mounted on the main board 3 and located beside the first frame 4, and then the first air guiding cover 1 is directly buckled on the second protruding part 501 through the first buckling part 104 on the first inclined plate 102, so that the connection between the first air guiding cover 1 and the second frame 5 is completed.

Next, the first air guiding cover 1 further includes a first top plate 103, the first top plate 103 is covered on the first baffle 101 and the first inclined plate 102, a first assembling hole 1031 is formed in the first top plate 103, a first assembling column 402 is formed in the first frame 4, and the first assembling column 402 is mounted in a matching manner with the first assembling hole 1031, so that the first air guiding cover 1 is connected with the first frame 4. Specifically, the first air guiding cover 1 is installed on the main board 3, and the first top plate 103 is covered above the first baffle 101 through the first assembly holes 1031, so that the first assembly posts 402 are installed in the first assembly holes 1031 in a matching manner, and then the connection between the first air guiding cover 1 and the first frame 4 is completed. Next, a first extension plate 403 having a plate shape is disposed on the first frame 4, and the first assembly post 402 is disposed on the first extension plate 403, so that the first assembly post 402 is mounted on the first assembly hole 1031 more smoothly. In addition, the first assembly hole 1031 may have various shapes, and may be square, circular, rectangular, or the like.

Referring to fig. 1-5, when the first frame 4 and the second frame 5 are disposed in the electronic device at the same time, the first frame 4 is located beside the second frame 5, and the first wind scooper 1 is mounted by first directly fastening the first wind scooper 1 to the second protruding portion 501 through the first fastening portion 104 on the first inclined plate 102, so that the end of the first wind scooper 1 is connected to the second frame 5, and simultaneously, the first wind scooper 1 is also directly fastened to the first assembly post 402 through the first assembly hole 1031 on the first top plate 103, so that the other end of the first wind scooper 1 is connected to the first frame 4, and finally, the connection of the first wind scooper 1 between the first frame 4 and the second frame 5 is achieved. When the above-mentioned installation process is completed, the first wind scooper 1 is disposed in front of the first frame 4 to block the hot air flow and guide the hot air flow to the direction in which the first inclined plate 102 is inclined. The electronic module set on the first frame 4 may be a PCIE module 8, and since the PCIE module 8 has a very high requirement for the working temperature, most of the hot air flows can be blocked outside the first frame 4 through the setting of the first air guiding cover 1, so that the requirement of the PCIE module 8 can be met. In addition, an electronic module, such as a power module 7, may be disposed on the second frame 5. Through such a mode, make quick and the convenient installation on the mainboard of first wind scooper, the mounting means is very nimble, can dismantle and install according to actual need, and is very convenient, and application scope is wide, has overcome the not enough that exists among the background art.

Referring to fig. 6-10, the electronic device further includes a third frame 9 and a third air guiding cover 6, the third air guiding cover 6 has the same structure as the first air guiding cover 2, the third frame 9 is adjacent to the first frame 4 and is mounted on the main board 3, a third assembling post 901 is disposed on the third frame 9, a third top board 602 is disposed on the third air guiding cover 6, and the third assembling post 901 is mounted in a matching manner with a third assembling hole 6021 on the third top board 602, so that the third air guiding cover 6 is connected with the third frame 9. Specifically, a third frame 9 may be further disposed inside the electronic device to meet practical use requirements, and the electronic module carried on the third frame 9 also has requirements for temperature, so that a third air guiding cover 6 needs to be disposed, and the third air guiding cover 6 is connected to the third frame 9, and the connection between the third frame 9 and the third assembly hole 6021 can be completed only after the third assembly column is matched with the third assembly hole.

Next, a first protruding portion 401 is disposed on the first frame 4, a third inclined plate 601 is disposed on the third air guiding cover 6, and the first protruding portion 401 is mounted in a matching manner with a third fastening portion 6011 on the third inclined plate 601, so that the third air guiding cover 6 is connected with the first frame 4. And the connection mode between the third air guide cover 6 and the third frame 9 is combined, so that the connection of the third air guide cover 6 between the first frame 4 and the third frame 9 is realized. The third air guide cover 6 is disposed in front of the third frame 9 to block the hot air flow from the high thermal electronic component 10 and to flow the part of the hot air flow in the inclined direction of the first inclined plate 102 of the third air guide cover 6. Second, a third extension plate 902 is disposed on the third frame 9, and the third assembly post 901 is disposed on the third extension plate 902, so that the third assembly post 901 is mounted on the third assembly hole 6021 more smoothly.

When the first frame 4 and the third frame 9 are simultaneously disposed in the electronic device, the first frame 4 is located beside the third frame 9, and the third air guiding cover 6 is mounted by directly fastening the third air guiding cover 6 to the third protruding portion through the third fastening portion 6011 on the third inclined plate 601, so that the end of the third air guiding cover 6 is connected to the third frame 9, and meanwhile, the third air guiding cover 6 is also directly fastened to the first assembly post 402 through the third assembly hole 6021 on the third top plate 602, so that the other end of the third air guiding cover 6 is connected to the first frame 4, and finally, the connection between the first frame 4 and the third frame 9 of the third air guiding cover 6 is realized. When the above-described installation process is completed, the third wind scooper 6 is disposed in front of the third frame 9 to block the hot air flow while guiding the hot air flow to the direction in which the third inclined plate 601 is inclined. The electronic module set on the third frame 9 may be a PCIE module 8, and since the PCIE module 8 has a very high requirement for the working temperature, the setting of the third air guiding cover 6 may satisfy the requirement of the PCIE module 8. In addition, an electronic module such as a power module 7 can also be arranged on the second frame 5

Referring to fig. 6-7, when the first frame 4, the second frame 5 and the third frame 9 are simultaneously disposed in the electronic device, as an alternative arrangement, the second frame 5, the first frame 4 and the third frame 9 are sequentially disposed from left to right, a first air guiding cover 1 is disposed between the high thermal electronic device 10 and the first frame 4, a third air guiding cover 6 is disposed between the high thermal electronic device 10 and the third frame 9, the first air guiding cover 1 is connected between the first frame 4 and the second frame 5, and the third air guiding cover 6 is connected between the first frame 4 and the third frame 9, which are all mentioned above, and the specific connection manner is not repeated herein.

As another preferred embodiment, referring to fig. 5, the first inclined plate 102 and the third inclined plate 601 are each provided with a plurality of air inlets 1023. Because different electronic modules have different requirements of wind flow, such as PCIE modules 8, when different PCIE modules 8 are installed on the first frame 4, the number of the air inlets 1023 will be different, and meanwhile, because the first baffle 101 is provided with the first diversion openings 1011, the first diversion openings 1011 can be mutually matched with the air inlets 1023 to ensure that the wind flow meets the requirements of the PCIE modules 8. In addition, as an alternative embodiment, if the first inclined board 102 or the third inclined board 601 can meet the requirement of the PCIE module 8 for the wind flow without providing the air inlet 1023, the first inclined board 102 or the third inclined board 601 may not be provided with the air inlet 1023, so as to simplify the structure of the first inclined board 102 or the third inclined board 601.

Further, the bottom of the first inclined plate 102 or the third inclined plate 601 is provided with a plurality of element mounting holes 1022 for fitting element mounting on the main plate 3. The shape of the element mounting opening 1022 is a notch shape, so as to avoid the element on the main board 3, prevent the first inclined plate 102 or the third inclined plate 601 from damaging the structure of the element on the main board 3, and when the first inclined plate 102 or the third inclined plate 601 is mounted on the main board 3, the element mounting opening 1022 can avoid the element so that the mounting of the inclined plate will not affect the element on the main board 3, and avoid affecting the working state of the main board 3.

Further, a wire rod placing groove 1021 is provided at the top end of the first inclined plate 102 or the third inclined plate 601. The wire rod standing groove body 1021 on the top end of the first inclined plate 102 or the third inclined plate 601 provides an orderly storage space for wires on the inner main board 3, thereby being beneficial to reducing wire rod disorder and interference and improving the neatness and maintenance efficiency of the inside of the electronic device.

In summary, through the above arrangement, the air flow with higher temperature can be guided to the direction far away from the first frame through the first air guide cover, and meanwhile, the balloon with lower temperature is guided to flow into the first frame so as to meet different heat dissipation requirements corresponding to different electronic modules, and the mounting mode of the first air guide cover on the main board is very flexible, can be disassembled and mounted according to actual requirements, and is very convenient and wide in application range.

Variations and modifications to the above would be obvious to persons skilled in the art to which the utility model pertains from the foregoing description and teachings. Therefore, the utility model is not limited to the specific embodiments disclosed and described above, but some modifications and changes of the utility model should be also included in the scope of the claims of the utility model. In addition, although specific terms are used in the present specification, these terms are for convenience of description only and do not limit the present utility model in any way.

Claims (10)

1. An electronic device, includes a casing, be equipped with a mainboard and a fan group in the casing, the fan group sets up one side of mainboard, its characterized in that, electronic device still includes:

a first frame mounted on the main board;

A first air guide cover arranged on the main board and arranged between the first frame and the fan group and connected with the first frame, and

A high-thermal electronic component mounted on the main board and arranged between the first air guide cover and the fan set,

Wherein, first wind scooper includes:

A first baffle plate with one surface facing the high-temperature electronic component and the other surface facing the first frame, a plurality of first flow guide openings arranged on the first baffle plate, and

The first inclined plate is connected with the first baffle plate and extends in a direction away from the first baffle plate, and an included angle formed between the first inclined plate and the first baffle plate is an obtuse angle;

The first air guide cover is positioned between the high-heat electronic component and the first frame, so that a part of air flow which is driven by the fan group and passes through the high-heat electronic component, flows to a direction away from the first frame through the first inclined plate on the first air guide cover, and flows into the first frame through the first air guide opening of the first baffle plate on the first air guide cover, wherein the other part of air flow which is driven by the fan group and does not pass through the high-heat electronic component.

2. The electronic device of claim 1, further comprising a second frame, wherein the second frame is adjacent to the first frame and is mounted on the main board, a second protruding portion is disposed on the second frame, a first fastening portion is disposed on an end, away from the first baffle, of the first inclined plate, and the first fastening portion is fastened to the second protruding portion, so that the first air guiding cover is connected to the second frame.

3. The electronic device of claim 1, wherein the first air guiding cover further comprises a first top plate, the first top plate covers the first baffle and the first inclined plate, a first assembly hole is formed in the first top plate,

The first frame is provided with a first assembling column, and the first assembling column is installed in a matched mode with the first assembling hole so that the first air guide cover is connected with the first frame.

4. The electronic device of claim 3, wherein a first extension board is disposed on the first frame, and the first assembly post is disposed on the first extension board.

5. The electronic device of claim 1, further comprising a third frame and a third air guiding cover, wherein the third frame is adjacent to the first frame and mounted on the main board, a third assembly post is disposed on the third frame, a third top plate is disposed on the third air guiding cover, and the third assembly post is mounted in a matching manner with a third assembly hole on the third top plate, so that the third air guiding cover is connected with the third frame.

6. The electronic device of claim 5, wherein a first protrusion is disposed on the first frame, a third inclined plate is disposed on the third air guiding cover, and the first protrusion is mounted in a matching manner with a third fastening portion on the third inclined plate, so that the third air guiding cover is connected with the first frame.

7. The electronic device of claim 5, wherein a third extension board is disposed on the third frame, and the third assembly post is disposed on the third extension board.

8. The electronic device of claim 1, wherein the first frame is configured to be combined with an electronic module, and the electronic module comprises a power module, a PCIE module, or a motherboard module.

9. The electronic device of claim 1, wherein the first bevel board top end is provided with a wire placement groove for wire placement inside the housing.

10. The electronic device according to claim 1, wherein a bottom portion of the first inclined plate is provided with a plurality of component mounting ports for fitting component mounting on the main board.