CN222339827U

CN222339827U - Electronic devices

Info

Publication number: CN222339827U
Application number: CN202420647156.8U
Authority: CN
Inventors: 魏世民; 黄彭发; 李辉; 汪晓刚; 李振升
Original assignee: Sungrow Power Supply Co Ltd
Current assignee: Sungrow Power Supply Co Ltd
Priority date: 2024-03-29
Filing date: 2024-03-29
Publication date: 2025-01-10
Anticipated expiration: 2034-03-29

Abstract

The utility model belongs to the technical field of equipment heat dissipation, and discloses electronic equipment. The electronic equipment comprises a cabinet body, an electronic module, a capacitor pool module and a heat radiating device, wherein the electronic module comprises an electronic cavity and an electronic device, and the electronic device is arranged in the electronic cavity. The capacitor cell module comprises a capacitor cavity and a plurality of capacitors, the capacitors are arranged in the capacitor cavity, the capacitor cavity is communicated with the electronic cavity to form a first heat dissipation channel, an internal circulation fan is arranged in the first heat dissipation channel, so that air flow in the first heat dissipation channel circularly flows between the electronic cavity and the capacitor cavity, the first heat dissipation channel is not communicated with an external flow path of the cabinet body, and the heat dissipation device is configured to dissipate heat and cool air flow in the first heat dissipation channel. The electronic equipment utilizes the heat dissipation device for the electronic device to realize heat dissipation of the capacitor, improves the heat dissipation efficiency of the capacitor, is not communicated with the outside of the cabinet body, and can prevent the pollution of the external environment to the electronic device in the cabinet body, thereby forming a high protection effect.

Description

Electronic equipment

Technical Field

The utility model relates to the technical field of equipment heat dissipation, in particular to electronic equipment.

Background

A current transformer is an electronic device that changes the voltage, frequency, number of phases, and other power or characteristics of a power supply system. Along with the rapid development of new energy industry, the application of the converter in complex and severe environments is gradually increased, and the application environments such as sand wind, salt fog and the like are increasingly normalized, so that the protection requirement on the converter is also higher. The power module is a core device of the converter, and along with the increase of power, the reliability of the power module directly determines whether the converter can normally operate.

In the prior art, the power component is provided with a radiator to realize heat dissipation through direct heat exchange with cooling liquid. The capacitor assembly comprises a plurality of independent capacitors, a heat dissipation channel is required to be arranged for the capacitors, and the heat dissipation structure is complex. In addition, in the heat dissipation process, air flow in the external environment enters the cabinet body, so that pollution and even corrosion are caused to electronic devices in the cabinet body, and the converter is difficult to work normally in a severe environment.

Accordingly, there is a need for an improvement in electronic devices to solve the above problems.

Disclosure of utility model

The utility model aims to provide electronic equipment, wherein a plurality of capacitors are integrated into a capacitor cavity, and a heat dissipation air duct of the capacitor is communicated with a heat dissipation air duct of an electronic device to form a circulating air duct, so that heat dissipation of the capacitor is realized by using a heat dissipation device of the electronic device, the heat dissipation efficiency of the capacitor is improved, and the heat dissipation device is not required to be additionally arranged, so that the manufacturing cost is reduced. Meanwhile, the first heat dissipation channel is isolated from the external environment of the cabinet body, so that pollution and corrosion of the external environment to the capacitor and the electronic device are avoided, and the protection performance is improved.

To achieve the purpose, the utility model adopts the following technical scheme:

An electronic device, comprising:

A cabinet body;

The electronic module is arranged in the cabinet body and comprises an electronic cavity and an electronic device, and the electronic device is arranged in the electronic cavity;

The capacitor Chi Mozu is arranged in the cabinet body, the capacitor pool module comprises a capacitor cavity and a plurality of capacitors, the capacitors are arranged in the capacitor cavity, the capacitor cavity is communicated with the electronic cavity to form a first heat dissipation channel, an internal circulating fan is arranged in the first heat dissipation channel, so that air flow in the first heat dissipation channel circularly flows between the electronic cavity and the capacitor cavity, and the first heat dissipation channel is not communicated with an external flow path of the cabinet body;

The heat dissipation device is arranged on the outer side of the cabinet body and is configured to dissipate heat and cool air flow in the first heat dissipation channel.

As an alternative scheme, the capacitor cavity is formed by enclosing an air duct coaming and a capacitor busbar, and a plurality of capacitors in the capacitor cavity are electrically connected with the capacitor busbar.

Alternatively, the electronic device further includes at least one power module electrically connected to the capacitor cell module, and when the power module is provided with a plurality of power modules, the plurality of power modules are connected to one capacitor cell module.

As an alternative, an air passing gap is arranged between the capacitor and the inner wall of the capacitor cavity and/or between adjacent capacitors, and the air flow in the first heat dissipation channel can pass through the air passing gap.

As an alternative, the heat dissipation device includes:

The air-to-air radiator is arranged on the airflow flowing path in the first radiating channel, and the inner wall surface of the air-to-air radiator exchanges heat with the airflow in the first radiating channel and transfers heat to the outer wall surface of the air-to-air radiator for dissipation.

As an alternative, the heat dissipation device further includes:

The external circulation fan is arranged outside the air-air radiator and used for driving external air to flow to the outer wall surface of the air-air radiator for heat exchange.

As an alternative, a connection channel is provided between the electronic cavity and the capacitor cavity, so as to communicate the electronic cavity with the capacitor cavity.

As an alternative, the electronic device further includes:

the power module comprises a power assembly, a heat radiation assembly and a heat radiation cavity, wherein the power assembly is arranged on the outer side of the heat radiation cavity, a second heat radiation channel is formed in the heat radiation cavity and communicated to the outside of the cabinet, the heat radiation assembly is used for radiating heat of the power assembly, and a heat radiation end of the heat radiation assembly is arranged in the second heat radiation channel.

As an alternative, the second heat dissipation channel is provided with a module air inlet and a module air outlet which are communicated to the outside of the electronic device, and the power module further comprises a module heat exchange fan, and the module heat exchange fan is configured to drive the air flow in the second heat dissipation channel to flow from the module air inlet to the module air outlet.

As an alternative, the power module further includes:

The wind collecting cavity is communicated with the second heat dissipation channels, and when a plurality of power modules are arranged, the second heat dissipation channels of the power modules are communicated to the same wind collecting cavity, and the wind collecting cavity is communicated to the outside of the electronic equipment.

The beneficial effects are that:

According to the electronic equipment provided by the utility model, the plurality of capacitors are integrated into the capacitor cavity to form the capacitor pool module, so that the installation, maintenance and repair are facilitated. Through communicating electric capacity cavity and electron cavity and forming first heat dissipation passageway to set up the inner loop fan in first heat dissipation passageway, make the air current in electron cavity and the electric capacity cavity form circulation flow, the air current takes place the heat transfer with electronic device and electric capacity after cooling through heat abstractor heat dissipation, thereby realizes the cooling to electronic device and electric capacity, for the natural radiating mode of electric capacity in the prior art, has improved electric capacity radiating efficiency. Meanwhile, the capacitor and the electronic device share one heat dissipation channel and one heat dissipation device, and the heat dissipation device is not required to be additionally arranged, so that the manufacturing cost can be reduced. Furthermore, the first heat dissipation channel is not communicated with the external flow path of the cabinet body, air flows circularly in the first heat dissipation channel, is not contacted with external air, has good protection, can prevent electronic devices and capacitors from being polluted by air, and realizes high protection.

Drawings

Fig. 1 is a front view of an electronic device according to a first embodiment of the present utility model;

fig. 2 is a schematic diagram of an internal structure of an electronic device according to a first embodiment of the present utility model;

FIG. 3 is a schematic diagram of a capacitor cell module according to an embodiment of the present utility model;

FIG. 4 is a schematic diagram of a partial structure of a power module according to an embodiment of the utility model;

FIG. 5 is a diagram of a first airflow trace in a second heat dissipation channel according to a first embodiment of the present utility model;

Fig. 6 is a schematic diagram of an internal structure of an electronic device according to a first embodiment of the present utility model;

FIG. 7 is a second flow trace in a second heat dissipation channel according to the first embodiment of the present utility model;

Fig. 8 is a front view of an electronic device according to a second embodiment of the present utility model;

Fig. 9 is a schematic structural diagram of a capacitor pool module according to a second embodiment of the present utility model;

fig. 10 is a schematic diagram of an internal structure of an electronic device according to a second embodiment of the present utility model.

In the figure:

1. The electronic module comprises an electronic cavity, 12 electronic devices, 13 internal circulation fans, 14 heat dissipation devices, 141 air-to-air radiators, 142 external circulation fans;

2. Capacitor Chi Mozu, 20, a first heat dissipation channel, 21, a capacitor cavity, 211, an air duct coaming, 212, a capacitor busbar, 213, a capacitor air inlet, 214, a capacitor air outlet, 22, a capacitor, 220 and an air passing gap;

3. 30, connecting channels;

4. The power module comprises a power module body 41, a power module body 42, a heat dissipation module body 421, a heat dissipation end 43, a heat dissipation cavity body 430, a second heat dissipation channel 431, a module air inlet 432, a module air outlet 44, a connecting busbar 45, a module heat exchange fan 46 and an air collection cavity.

Detailed Description

The utility model is described in further detail below with reference to the drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the utility model and are not limiting thereof. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present utility model are shown in the drawings.

In the description of the present utility model, unless explicitly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, and may, for example, be fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected through an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are orientation or positional relationships based on those shown in the drawings, merely for convenience of description and simplicity of operation, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the utility model. Furthermore, the terms "first," "second," and the like, are used merely for distinguishing between descriptions and not for distinguishing between them.

Embodiment one:

As shown in fig. 1, the embodiment provides an electronic device, which includes a cabinet body 3, and an electronic module 1, a capacitor cell module 2 and a power module 4 which are disposed in the cabinet body 3, wherein the electronic module 1, the capacitor cell module 2 and the power module 4 are sequentially arranged in the cabinet body 3 from top to bottom. The power module 4 is provided with at least one, the power module 4 is electrically connected with the capacitor cell module 2, and when the power module 4 is provided with a plurality of power modules 4, the plurality of power modules 4 are connected to one capacitor cell module 2. In this embodiment, six power modules 4 are provided, and the six power modules 4 are sequentially arranged from left to right. Six power modules 4 are connected with same electric capacity pond module 2 electricity, through setting up electric capacity 22 collection into the electric capacity pond, can realize being connected with power module 4 through setting up a electric capacity busbar, connect the operation more convenient. In this embodiment, the electronic device is a current transformer, and in other embodiments, other electronic devices with heat dissipation requirements may also be used.

Specifically, as shown in fig. 2 and 3, the electronic module 1 includes an electronic cavity 11 and an electronic device 12, and the electronic device 12 is disposed in the electronic cavity 11. The capacitor pool module 2 comprises a capacitor cavity 21 and a plurality of capacitors 22, the capacitors 22 are arranged in the capacitor cavity 21, the capacitor cavity 21 is communicated with the electronic cavity 11 to form a first heat dissipation channel 20, an internal circulation fan 13 is arranged in the first heat dissipation channel 20, so that air flow in the first heat dissipation channel 20 circularly flows between the electronic cavity 11 and the capacitor cavity 21, and the first heat dissipation channel 20 is not communicated with an external flow path of the cabinet 3. The cabinet body 3 is provided with a heat dissipation device 14 outside, and the heat dissipation device 14 is used for cooling the air flow in the first heat dissipation channel 20.

The electronic device provided in this embodiment is beneficial to installation, maintenance and repair by integrating the plurality of capacitors 22 into the capacitor cavity 21 to form the capacitor cell module 2. Through carrying out the intercommunication with electric capacity cavity 21 and electron cavity 11 and forming first heat dissipation passageway 20 to set up inner loop fan 13 in first heat dissipation passageway 20, make the air current in electron cavity 11 and the electric capacity cavity 21 form circulation flow, the air current takes place the heat transfer with electronic device 12 and electric capacity 22 after cooling down through heat abstractor 14, thereby realizes cooling down electronic device 12 and electric capacity 22, compared with the mode of electric capacity 22 natural heat dissipation among the prior art, has improved electric capacity 22 radiating efficiency. Meanwhile, the capacitor 22 and the electronic device 12 share one heat dissipation channel and the heat dissipation device 14, and the heat dissipation device 14 is not required to be additionally arranged, so that the manufacturing cost can be reduced. Furthermore, the first heat dissipation channel 20 is not communicated with the external flow path of the cabinet body 3, the air flow circularly flows in the first heat dissipation channel 20, the air flow does not contact with the outside air, the protection is good, the electronic device 12 and the capacitor 22 can be prevented from being polluted by the air, and the high protection is realized.

Optionally, as shown in fig. 2 and 3, a connection channel 30 is provided between the electronic cavity 11 and the capacitor cavity 21 to communicate the electronic cavity 11 and the capacitor cavity 21. A capacitor air inlet 213 and a capacitor air outlet 214 are formed on the front side and the rear side of the capacitor cavity 21, an electronic air inlet and an electronic air outlet are formed on the front side and the rear side of the electronic cavity 11, two connecting channels 30 are arranged, one connecting channel 30 is connected with the capacitor air inlet 213 and the electronic air outlet, and the other connecting channel 30 is connected with the capacitor air outlet 214 and the electronic air inlet, so that the closed loop of the first heat dissipation channel 20 is realized. As shown in the airflow trace a in fig. 2, an airflow flowing counterclockwise is formed in the first heat dissipation channel 20, however, in other embodiments, the inner circulation fan 13 may also be used to drive the airflow flowing clockwise in the first heat dissipation channel 20.

Specifically, as shown in fig. 2, the heat dissipating device 14 includes an air-to-air radiator 141, the air-to-air radiator 141 being disposed on an airflow path in the first heat dissipating channel 20, the airflow in the first heat dissipating channel 20 flowing through the inside of the air-to-air radiator 141, an inner wall surface of the air-to-air radiator 141 exchanging heat with the airflow in the first heat dissipating channel 20, and transferring the heat to an outer wall surface of the air-to-air radiator 141 for dissipation. The inside of the air-to-air radiator 141 is isolated from the external environment, and the first heat dissipation channel 20 and the air-to-air radiator 141 form a closed flow path to contact with the external air, so that a good protection effect can be achieved. After the first heat dissipation channel 20 enters the air-air radiator 141 for heat exchange, the heat absorbed by the air-air radiator 141 will be dissipated into the external air through the outer wall surface of the air-air radiator 141, so that the air-air radiator 141 can continuously play a role of heat dissipation. The air-to-air radiator 141 is a conventional heat exchanging device in the prior art, and the specific structure, connection relationship, working principle, etc. thereof will not be described in detail herein.

As shown in fig. 2, in order to increase the heat dissipation speed of the outer wall surface of the air-to-air radiator 141, the heat dissipation device 14 further includes an external circulation fan 142, where the external circulation fan 142 is disposed outside the air-to-air radiator 141 and is used for driving external air to flow to the outer wall surface of the air-to-air radiator 141 to exchange heat, so as to accelerate the air flow at the outer wall surface of the air-to-air radiator 141, thereby increasing the heat dissipation speed of the outer wall surface of the air-to-air radiator 141 and ensuring that the air-to-air radiator 141 maintains higher heat exchange efficiency.

Optionally, as shown in fig. 3, the capacitor cavity 21 is enclosed by the air duct coaming 211 and the capacitor busbar 212, and at least one capacitor 22 in the capacitor cavity 21 is electrically connected with the capacitor busbar 212. The air duct coaming 211 and the capacitor busbar 212 are in sealing connection, so that air flow in the capacitor cavity 21 is prevented from leaking from the connection part of the air duct coaming 211 and the capacitor busbar 212, and the air flow is ensured to flow out of the capacitor cavity 21 only through the air outlet of the capacitor 22.

Optionally, an air-passing gap 220 is provided between the capacitor 22 and the inner wall of the capacitor cavity 21 and/or between adjacent capacitors 22, and the air flow in the first heat dissipation channel 20 can pass through the air-passing gap 220. Through reserving the air passing gap 220, smooth air flow in the capacitor cavity 21 can be ensured, and meanwhile, the air passing gap 220 between adjacent capacitors 22 is beneficial to increasing the contact area between the air flow and the capacitors 22, so that the heat dissipation effect on the capacitors 22 is improved.

Alternatively, as shown in fig. 2 and 4, the power module 4 includes a connection busbar 44, a power component 41, a heat dissipation component 42 and a heat dissipation cavity 43, where the power component 41 is disposed outside the heat dissipation cavity 43 and electrically connected to the capacitor busbar 212 through the connection busbar 44. The second heat dissipation channel 430 is formed inside the heat dissipation cavity 43, the second heat dissipation channel 430 is communicated to the outside of the cabinet 3, the heat dissipation component 42 is used for dissipating heat of the power component 41, the heat dissipation end 421 of the heat dissipation component 42 is disposed in the second heat dissipation channel 430, and the heat dissipation end 421 of the heat dissipation component 42 is generally configured as a heat dissipation fin. The heat dissipation assembly 42 exchanges heat with the power assembly 41, the temperature of the heat dissipation assembly 42 rises, and the heat dissipation assembly 42 dissipates heat and cools down through heat dissipation fins and air in the second heat dissipation channel 430, so that the heat dissipation assembly 42 can continuously dissipate heat and cool down the power assembly 41. Since the power component 41 is disposed outside the second heat dissipation channel 430 and is not in contact with the air in the second heat dissipation channel 430, the power component is not affected by the air in the second heat dissipation channel 430, which is helpful for improving the protection performance.

Specifically, the second heat dissipation channel 430 is provided with a module air inlet 431 and a module air outlet 432 that are communicated to the outside of the electronic device, the power module 4 further includes a module heat exchange fan 45, and the module heat exchange fan 45 is configured to drive the air flow in the second heat dissipation channel 430 to flow from the module air inlet 431 to the module air outlet 432, so as to accelerate the air flow in the second heat dissipation channel 430, and facilitate improving the heat dissipation effect of the heat dissipation component 42.

As for the arrangement positions of the module air inlet 431 and the module air outlet 432, as shown in fig. 2, in one embodiment, the module air inlet 431 is disposed on the lower side of the heat dissipation cavity 43, the module air outlet 432 is disposed on the rear side of the heat dissipation cavity 43, and the airflow direction in the heat dissipation cavity 43 is shown as the airflow trace b in fig. 2, and the airflow flows into the heat dissipation cavity 43 from the lower side of the heat dissipation cavity 43 and flows out from the rear side. Of course, as shown in fig. 5, the module air outlet 432 may also be disposed on the front side of the heat dissipation cavity 43, and the air flow will flow out from the front side of the heat dissipation cavity 43.

In another embodiment, as shown in fig. 6, the module air inlet 431 is disposed on the front side of the heat dissipation cavity 43, the module air outlet 432 is disposed on the lower side of the heat dissipation cavity 43, and the airflow direction in the heat dissipation cavity 43 is as shown by the airflow trace b in fig. 6, and the airflow flows out of the heat dissipation cavity 43 from the front side of the heat dissipation cavity 43. Of course, as shown in fig. 7, the module air inlet 431 may be disposed at the rear side of the heat dissipation cavity 43, and the air flow will enter the heat dissipation cavity 43 from the rear side of the heat dissipation cavity 43.

Optionally, as shown in fig. 1 and fig. 6, the power module 4 further includes a wind collecting cavity 46, where the wind collecting cavity 46 is in communication with the second heat dissipation channels 430, when the power module 4 is provided with a plurality of power modules, the second heat dissipation channels 430 of the plurality of power modules 4 are communicated to the same wind collecting cavity 46, and the wind collecting cavity 46 is communicated to the outside of the electronic device. Specifically, the wind collecting cavity 46 is disposed at the bottom side of the heat dissipating cavity 43, and the second heat dissipating channels 430 of the plurality of power modules 4 are communicated by disposing the wind collecting cavity 46, so as to realize centralized adjustment and control of the air flow in the second heat dissipating channels 430.

The module heat exchange fan 45 is disposed in the air collecting cavity 46, specifically disposed on the lower side of the air collecting cavity 46, and the module heat exchange fan 45 is configured to blow air into the air collecting cavity 46 or draw air flow in the air collecting cavity 46 out of the cabinet body 3, so that the air flow in the second heat dissipation channel 430 flows from the module air inlet 431 to the module air outlet 432, thereby accelerating the air flow in the second heat dissipation channel 430.

Embodiment two:

As shown in fig. 8-10, this embodiment proposes an electronic device, which is basically the same as the first embodiment, except that:

The capacitor cell module 2 is vertically disposed at the rear side of the power module 4, and the capacitor air outlet 214 and the capacitor air inlet 213 are respectively disposed at the upper side and the lower side of the capacitor cavity 21. As shown in fig. 10, in an embodiment, the capacitor air inlet 213 is disposed on the upper side of the capacitor cavity 21, the capacitor air outlet 214 is disposed on the lower side of the capacitor cavity 21, and a counterclockwise air flow is formed in the first heat dissipation channel 20, and the air flow direction is shown as an air flow trace a in fig. 10. In another embodiment, the capacitor air inlet 213 may be disposed on the lower side of the capacitor cavity 21, the capacitor air outlet 214 may be disposed on the upper side of the capacitor cavity 21, and the first heat dissipation channel 20 may be configured with clockwise air flow.

It is to be understood that the above examples of the present utility model are provided for clarity of illustration only and are not limiting of the embodiments of the present utility model. Various obvious changes, rearrangements and substitutions can be made by those skilled in the art without departing from the scope of the utility model. It is not necessary here nor is it exhaustive of all embodiments. Any modification, equivalent replacement, improvement, etc. which come within the spirit and principles of the utility model are desired to be protected by the following claims.

Claims

1. An electronic device, comprising:

Cabinet (3);

An electronic module (1) is arranged in the cabinet (3), wherein the electronic module (1) comprises an electronic cavity (11) and an electronic device (12), wherein the electronic device (12) is arranged in the electronic cavity (11);

A capacitor pool module (2) is arranged in the cabinet (3), the capacitor pool module (2) comprises a capacitor cavity (21) and a plurality of capacitors (22), the plurality of capacitors (22) are arranged in the capacitor cavity (21), the capacitor cavity (21) is connected with the electronic cavity (11) to form a first heat dissipation channel (20), an internal circulation fan (13) is arranged in the first heat dissipation channel (20), so that the airflow in the first heat dissipation channel (20) circulates between the electronic cavity (11) and the capacitor cavity (21), and the first heat dissipation channel (20) is not connected to the external flow path of the cabinet (3);

A heat dissipation device (14) is arranged outside the cabinet (3), and the heat dissipation device (14) is configured to dissipate heat and cool the airflow in the first heat dissipation channel (20).

2. The electronic device according to claim 1 is characterized in that the capacitor cavity (21) is surrounded by a duct enclosure (211) and a capacitor busbar (212), and the plurality of capacitors (22) in the capacitor cavity (21) are electrically connected to the capacitor busbar (212).

3. The electronic device according to claim 2 is characterized in that the electronic device also includes at least one power module (4), the power module (4) is electrically connected to the capacitor pool module (2), and when there are multiple power modules (4), multiple power modules (4) are connected to one capacitor pool module (2).

4. The electronic device according to claim 1 is characterized in that a wind gap (220) is provided between the capacitor (22) and the inner wall of the capacitor cavity (21), and/or between adjacent capacitors (22), and the airflow in the first heat dissipation channel (20) can pass through the wind gap (220).

5. The electronic device according to claim 1, characterized in that the heat dissipation device (14) comprises:

The air-to-air heat sink (141) is arranged on the air flow path in the first heat dissipation channel (20); the inner wall surface of the air-to-air heat sink (141) exchanges heat with the air flow in the first heat dissipation channel (20), and transfers heat to the outer wall surface of the air-to-air heat sink (141) for dissipation.

6. The electronic device according to claim 5, characterized in that the heat dissipation device (14) further comprises:

An external circulation fan (142) is arranged outside the air-to-air radiator (141) and is used to drive external air to flow to the outer wall surface of the air-to-air radiator (141) for heat exchange.

7. The electronic device according to claim 1, characterized in that a connecting channel (30) is provided between the electronic cavity (11) and the capacitor cavity (21) to connect the electronic cavity (11) and the capacitor cavity (21).

8. The electronic device according to any one of claims 1 to 7, characterized in that the electronic device further comprises:

A power module (4) comprises a power component (41), a heat dissipation component (42) and a heat dissipation cavity (43); the power component (41) is arranged outside the heat dissipation cavity (43); a second heat dissipation channel (430) is formed inside the heat dissipation cavity (43); the second heat dissipation channel (430) is connected to the outside of the cabinet (3); the heat dissipation component (42) is used to dissipate heat from the power component (41); and a heat dissipation end (421) of the heat dissipation component (42) is arranged inside the second heat dissipation channel (430).

9. The electronic device according to claim 8 is characterized in that the second heat dissipation channel (430) is provided with a module air inlet (431) and a module air outlet (432) connected to the outside of the electronic device, and the power module (4) further includes a module heat exchange fan (45), and the module heat exchange fan (45) is configured to drive the air flow in the second heat dissipation channel (430) to flow from the module air inlet (431) to the module air outlet (432).

10. The electronic device according to claim 8, characterized in that the power module (4) further comprises:

An air collecting cavity (46), the air collecting cavity (46) being connected to the second heat dissipation channel (430); when a plurality of the power modules (4) are provided, the second heat dissipation channels (430) of the plurality of the power modules (4) are connected to the same air collecting cavity (46), and the air collecting cavity (46) is connected to the outside of the electronic device.