CN222339797U - Metal super-thick heat dissipation circuit board - Google Patents
Metal super-thick heat dissipation circuit board Download PDFInfo
- Publication number
- CN222339797U CN222339797U CN202420975194.6U CN202420975194U CN222339797U CN 222339797 U CN222339797 U CN 222339797U CN 202420975194 U CN202420975194 U CN 202420975194U CN 222339797 U CN222339797 U CN 222339797U
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- circuit board
- mounting
- radiating
- board body
- groups
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 44
- 239000002184 metal Substances 0.000 title claims abstract description 15
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 15
- 241000237983 Trochidae Species 0.000 claims abstract description 35
- 230000001681 protective effect Effects 0.000 claims abstract description 17
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 58
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 23
- 229910052802 copper Inorganic materials 0.000 claims description 23
- 239000010949 copper Substances 0.000 claims description 23
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 5
- 239000000741 silica gel Substances 0.000 claims description 5
- 229910002027 silica gel Inorganic materials 0.000 claims description 5
- 238000009434 installation Methods 0.000 description 28
- 230000005855 radiation Effects 0.000 description 12
- 238000013461 design Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000001816 cooling Methods 0.000 description 2
- 239000003651 drinking water Substances 0.000 description 2
- 235000020188 drinking water Nutrition 0.000 description 2
- 230000006978 adaptation Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to the technical field of circuit boards, in particular to a metal super-thick heat-dissipation circuit board which comprises a mounting base and a circuit board body mounted in the mounting base, wherein a top shell is mounted at the top of the mounting base, a heat-dissipation assembly is mounted in the top shell and above the circuit board body, a protective cover is mounted at the top of the top shell, mounting shells are arranged at the left side and the right side of the inside of the mounting base, mounting grooves are formed in the inner side walls of the two groups of mounting shells, the circuit board body is embedded in the inner sides of the mounting grooves, and bearing blocks are fixedly connected at the front end and the rear end of the inner sides of the mounting shells and at the bottom of the circuit board body.
Description
Technical Field
The utility model relates to the technical field of circuit boards, in particular to a metal ultra-thick heat dissipation circuit board.
Background
Copper printed circuit boards with larger thickness are needed to be used on control terminals of large-scale machines, heat conduction capacity and firmness are guaranteed, the traditional ultrathin circuit boards can not meet the use requirements, and the traditional ultrathin circuit boards are easy to damage in the welding process of large-scale elements.
Along with the continuous development of science and technology, the ultra-thin circuit board has been replaced gradually to thick copper printed circuit board, but current thick copper printed circuit board can't guarantee the support ability to large-scale electronic component, does not have protective structure for traditional circuit board causes the condition that the face damaged in use easily, thereby influences the use, and because printed circuit board thickness is thicker, so the heat dispersion ability is poor, and the heat is piled up on the circuit board easily, and electronic component on the circuit board burns out easily.
Therefore, it is important to design a metal ultra-thick heat dissipation circuit board to solve the above-mentioned drawbacks.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model designs the metal super-thick heat dissipation circuit board, which aims to solve the technical problems that the thick copper printed circuit board cannot guarantee the supporting capability of a large-scale electronic element in the prior art, has no protective structure, is easy to cause the condition of board surface damage in use, has poor heat dissipation capability and is easy to burn out the electronic element on the circuit board.
In order to achieve the above purpose, the present utility model provides the following technical solutions:
The metal ultra-thick heat dissipation circuit board comprises a mounting base and a circuit board body mounted in the mounting base, wherein a top shell is mounted at the top of the mounting base, a heat dissipation assembly is mounted in the top shell and above the circuit board body, and a protective cover is mounted at the top of the top shell;
The circuit board is characterized in that mounting shells are arranged on the left side and the right side of the inside of the mounting base, mounting grooves are formed in the inner side walls of the mounting shells, the circuit board body is embedded in the inner sides of the mounting grooves, the two groups of the circuit board body are fixedly connected with bearing blocks at the front end and the rear end of the inner sides of the mounting shells and located at the bottoms of the circuit board body, and four corners of the circuit board body are connected with the bearing blocks through mounting screws.
As a preferable scheme of the utility model, the front ends of the inner sides of the two groups of mounting shells are provided with the air inlet covers, the inner sides of the air inlet covers are provided with a plurality of groups of air inlets, and the inner sides of the two groups of mounting shells are positioned below the circuit board body to form the heat dissipation air channel.
As a preferable scheme of the utility model, the outer side of the mounting screw is sleeved with the spring, the outer side of the mounting screw and the bottom of the spring are provided with the protection gasket, and the protection gasket is a silica gel gasket.
As a preferable scheme of the utility model, four corners of the mounting base are provided with fixing holes, the left side and the right side of the mounting base are provided with a plurality of groups of joints, and the plurality of groups of joints are matched with the circuit board body.
As a preferable scheme of the utility model, the heat radiation component comprises a heat radiation fan, a heat radiation fin, a heat radiation copper pipe, a water tank and a miniature water pump, wherein the heat radiation fan is arranged at the top of the top shell and positioned at the inner side of the protective cover, the heat radiation fin is arranged at the bottom of the heat radiation fan, the heat radiation copper pipe is arranged in the heat radiation fin, the water tank is arranged at the right end of the front surface of the top shell, and the miniature water pump is arranged at the left end of the front surface of the top shell.
As a preferable scheme of the utility model, one end of the heat dissipation copper pipe is connected with the inside of the water tank, a water filling port is formed in the top of the water tank, a cover is arranged on the outer side of the water filling port, the other end of the heat dissipation copper pipe is connected with the output end of the miniature water pump, and the input end of the miniature water pump is connected with the inside of the water tank through a water suction pipe.
As the preferable scheme of the utility model, four corners of the top shell are all connected with the mounting base through screws, a plurality of groups of mounting blocks are fixedly connected to the outer side of the protective cover, a plurality of groups of mounting blocks are all connected with the top shell through screws, and an air outlet is formed in the top of the protective cover.
Compared with the prior art, the utility model has the beneficial effects that:
1. According to the utility model, through the matching design of the mounting base and the top shell, the circuit board body is embedded in the mounting grooves on the inner sides of the two groups of mounting shells, the mounting base and the top shell are utilized to provide external protection for the circuit board body, the matching mounting shells can further protect the circuit board body, meanwhile, the circuit board body is positioned on the inner side of the mounting grooves, and is connected and mounted with the bearing blocks through the mounting screws, so that the circuit board body is fixedly mounted on the inner side of the mounting grooves, the supporting force of large-scale electronic components can be ensured, the condition that the board surface is damaged due to various factors in use is avoided, when the mounting screws are utilized to mount and fix the circuit board body, the spring on the outer side of the mounting screws can avoid damaging the board surface due to overtightening during screwing, and meanwhile, the silicon rubber protection gasket is matched to avoid damaging the board surface on the bottom of the spring, so that the protection effect on the circuit board body is further improved.
2. According to the utility model, through the matching design of the mounting base and the radiating component, when the circuit board body is used, the radiating fan is started, external air is sucked into the radiating air duct from a plurality of groups of air inlets in the air inlet cover in an external exhaust mode, finally, heat in the mounting base is exhausted through the radiating fan, meanwhile, the miniature water pump is started to input water in the water tank into the radiating copper pipe by utilizing the water suction pipe, and the water in the radiating copper pipe is returned into the water tank, so that a circulating water path is formed, and the radiating fin is continuously used for radiating heat, so that when the radiating fan is used for exhausting heat in the mounting base, the hot air is used for radiating, the temperature of the outer side of the mounting base is increased after the hot air is exhausted, the exhausted hot air is prevented from flowing back into the mounting base, and the radiating effect of the circuit board body is further improved.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic diagram of the structure of the present utility model;
FIG. 3 is a schematic diagram of the structure of the present utility model;
FIG. 4 is a schematic diagram of the structure of the present utility model;
Fig. 5 is a schematic structural view of the present utility model.
1, A mounting base; 101, a mounting shell, 102, a mounting groove, 103, a bearing block, 104, a mounting screw, 105, an air inlet cover, 106, an air inlet, 107, a heat dissipation air duct, 108, a spring, 109, a protection gasket, 110, a fixing hole, 111, a connector, 2, a circuit board body, 3, a top shell, 4, a heat dissipation assembly, 401, a heat dissipation fan, 402, a heat dissipation fin, 403, a heat dissipation copper pipe, 404, a water tank, 405, a miniature water pump, 406, a cover, 407, a water suction pipe, 5, a protection cover, 501, a mounting block, 502 and an air outlet.
Detailed Description
The technical solutions of the embodiments of the present utility model will be clearly and completely described below in conjunction with the embodiments of the present utility model, and it is apparent that the described embodiments are only some embodiments of the present utility model, but not all embodiments, and all other embodiments obtained by those skilled in the art without making any inventive effort based on the embodiments of the present utility model are within the scope of protection of the present utility model.
Examples:
Referring to fig. 1-5, the present utility model provides a technical solution:
The utility model provides a metal super thick heat dissipation circuit board, includes mounting base 1 and installs at the inside circuit board body 2 of mounting base 1, and top shell 3 is installed at the top of mounting base 1, and heat radiation assembly 4 is installed to the inside of top shell 3 and the top that is located circuit board body 2, and protection casing 5 is installed at the top of top shell 3.
Firstly, the left and right sides inside the installation base 1 are respectively provided with an installation shell 101, the inner side walls of the two groups of installation shells 101 are respectively provided with an installation groove 102, the circuit board body 2 is embedded in the inner side of the installation grooves 102, the front and rear ends of the inner sides of the two groups of installation shells 101 are respectively fixedly connected with a bearing block 103 at the bottom of the circuit board body 2, four corners of the circuit board body 2 are respectively connected with the bearing blocks 103 through installation screws 104, the circuit board body 2 is embedded in the installation grooves 102 on the inner sides of the two groups of installation shells 101, the installation base 1 and the top shell 3 are utilized to provide external protection for the circuit board body 2, the installation shells 101 are matched to further protect the circuit board body 2, meanwhile, the circuit board body 2 is positioned on the inner side of the installation grooves 102, the circuit board body 2 is fixedly installed on the inner side of the installation grooves 102 through the installation screws 104 and the bearing blocks 103, and the supporting force of a large-sized electronic component can be ensured, and the situation that the board surface is damaged due to various factors in use is avoided.
Further, the front ends of the inner sides of the two groups of mounting shells 101 are provided with the air inlet cover 105, the inner sides of the air inlet covers 105 are provided with a plurality of groups of air inlets 106, the inner sides of the two groups of mounting shells 101 are positioned below the circuit board body 2 to form the heat dissipation air duct 107, and when the circuit board body 2 is used, the air inlet covers 105 are matched with the heat dissipation assembly 4 to form a heat dissipation system of the circuit board body 2.
Then, the outside cover of installation screw 104 is equipped with spring 108, and the outside of installation screw 104 just is located the bottom of spring 108 and installs protection washer 109, and protection washer 109 is the silica gel packing ring, utilizes installation screw 104 to install fixedly to circuit board body 2, and spring 108 in the installation screw 104 outside can avoid too tightly causing the damage to the face when screwing up, cooperates silica gel protection washer 109 simultaneously and avoids spring 108 bottom to cause the damage to the face, has further improved the protective effect to circuit board body 2.
Still further, fixed orifices 110 have all been seted up at four corners of mounting base 1, multiunit joint 111 has all been installed to the left and right sides of mounting base 1, multiunit joint 111 all uses after circuit board body 2 installs the inside at mounting base 1 with circuit board body 2 looks adaptation, can carry out fixed mounting to mounting base 1 through fixed orifices 110, simultaneously through multiunit joint 111 and circuit board body 2 electric connection, is convenient for use with external equipment through multiunit joint 111.
In this embodiment, the specific structure of the heat dissipation assembly 4 is as follows:
The heat dissipation assembly 4 comprises a heat dissipation fan 401, heat dissipation fins 402, heat dissipation copper pipes 403, a water tank 404 and a miniature water pump 405, wherein the heat dissipation fan 401 is installed at the top of the top shell 3 and is located at the inner side of the protective cover 5, the heat dissipation fins 402 are installed at the bottom of the heat dissipation fan 401, the heat dissipation copper pipes 403 are installed in the heat dissipation fins 402, the water tank 404 is installed at the right end of the front face of the top shell 3, and the miniature water pump 405 is installed at the left end of the front face of the top shell 3.
Secondly, the one end of heat dissipation copper pipe 403 is connected with the inside of water tank 404, the water filling mouth has been seted up at the top of water tank 404, flap 406 is installed to the outside of water filling mouth, the other end of heat dissipation copper pipe 403 is connected with the output of miniature water pump 405, the input of miniature water pump 405 is connected with the inside of water tank 404 through drinking-water pipe 407, when circuit board body 2 uses, start radiator fan 401, through the mode of outer exhaust, inhale the heat of outside air from the multiunit air intake 106 of air inlet cover 105 inside into in the heat dissipation wind channel 107, finally discharge the heat of inside of installation base 1 through radiator fan 401, start miniature water pump 405 and utilize drinking-water pipe 407 to input the water in the water tank 404 into radiator copper pipe 403, the water that enters into radiator copper pipe 403 flows back into in water tank 404 again, thereby constitute the circulation water route, continuously dispel the heat for radiator fin 402, thereby when radiator fan 401 discharges the heat of inside of installation base 1, thereby avoid the outside of the hot air to be located in installation base 1 after the hot air discharge, the outside of installation base 1 improves the temperature, simultaneously, avoid the hot air to flow back to the inside of installation base 1, further improve the radiating effect of board 2.
Finally, four corners of the top shell 3 are all connected with the mounting base 1 through screws, a plurality of groups of mounting blocks 501 are fixedly connected to the outer side of the protective cover 5, the plurality of groups of mounting blocks 501 are all connected with the top shell 3 through screws, an air outlet 502 is formed in the top of the protective cover 5, the top shell 3 is mounted on the top of the mounting base 1, external protection is provided for the upper side of the circuit board body 2, the protective cover 5 is mounted on the top of the top shell 3 through the mounting blocks 501 to provide external protection for the cooling fan 401, and when the cooling fan 401 discharges hot air, the hot air is discharged through the air outlet 502.
In this embodiment, the implementation scenario specifically includes: the circuit board body 2 is embedded in the mounting grooves 102 on the inner sides of the two groups of mounting shells 101, the mounting base 1 and the top shell 3 are utilized to provide external protection for the circuit board body 2, the matching mounting shells 101 can further protect the circuit board body 2, meanwhile, the circuit board body 2 is positioned on the inner sides of the mounting grooves 102, the circuit board body 2 is fixedly arranged on the inner sides of the mounting grooves 102 through the connection and mounting of the mounting screws 104 and the bearing blocks 103, the supporting force on large-scale electronic components can be ensured, the condition that the board surface is damaged due to various factors in use is avoided, when the mounting screws 104 are utilized to mount and fix the circuit board body 2, the spring 108 on the outer sides of the mounting screws 104 can avoid the damage to the board surface due to overtightening when the mounting screws 104 are utilized, meanwhile, the matching of the silica gel protection gasket 109 avoids the damage to the board surface due to the bottom of the spring 108, the protection effect on the circuit board body 2 is further improved, when the circuit board body 2 is used, the heat dissipation fan 401 is started, external air is sucked into the heat dissipation air duct 107 from the plurality of groups of air inlets 106 in the air inlet cover 105 in an external exhaust mode, finally, heat in the installation base 1 is exhausted through the heat dissipation fan 401, meanwhile, the miniature water pump 405 is started to input water in the water tank 404 into the heat dissipation copper pipe 403 by utilizing the water suction pipe 407, the water in the heat dissipation copper pipe 403 flows back into the water tank 404 again, thereby forming a circulating water path, and continuously dissipating heat for the heat dissipation fins 402, so that when the heat dissipation fan 401 exhausts the heat in the installation base 1, the heat is dissipated for the hot air, the temperature of the outer side of the installation base 1 is increased after the hot air is exhausted, the exhausted hot air is prevented from flowing back into the installation base 1 again, the heat radiation effect of the circuit board body 2 is further improved, the protective cover 5 is installed at the top of the top shell 3 through the installation block 501 to provide external protection for the heat radiation fan 401, when the heat radiation fan 401 discharges hot air, the hot air is discharged through the air outlet 502, and the whole operation flow is simple and convenient.
Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (7)
1. The metal ultra-thick heat dissipation circuit board comprises a mounting base (1) and a circuit board body (2) mounted in the mounting base (1), and is characterized in that a top shell (3) is mounted at the top of the mounting base (1), a heat dissipation component (4) is mounted in the top shell (3) and above the circuit board body (2), and a protective cover (5) is mounted at the top of the top shell (3);
The mounting base is characterized in that mounting shells (101) are arranged on the left side and the right side of the inside of the mounting base (1), mounting grooves (102) are formed in the inner side walls of the mounting shells (101), the circuit board body (2) is embedded in the inner sides of the mounting grooves (102), two groups of mounting shells (101) are fixedly connected with bearing blocks (103) at the front end and the rear end of the inner sides of the circuit board body (2) and are located at the bottoms of the circuit board body (2), and four corners of the circuit board body (2) are connected with the bearing blocks (103) through mounting screws (104).
2. The metal ultra-thick radiating circuit board of claim 1, wherein the front ends of the inner sides of the two groups of mounting shells (101) are provided with air inlet covers (105), the inner sides of the air inlet covers (105) are provided with a plurality of groups of air inlets (106), and the inner sides of the two groups of mounting shells (101) are positioned below the circuit board body (2) to form radiating air channels (107).
3. The metal ultra-thick radiating circuit board of claim 1, wherein a spring (108) is sleeved on the outer side of the mounting screw (104), a protection washer (109) is mounted on the outer side of the mounting screw (104) and positioned at the bottom of the spring (108), and the protection washer (109) is a silica gel washer.
4. The metal ultra-thick radiating circuit board of claim 1, wherein the four corners of the mounting base (1) are provided with fixing holes (110), the left side and the right side of the mounting base (1) are provided with a plurality of groups of connectors (111), and the plurality of groups of connectors (111) are matched with the circuit board body (2).
5. The metal ultra-thick radiating circuit board of claim 1, wherein the radiating component (4) comprises a radiating fan (401), radiating fins (402), radiating copper pipes (403), a water tank (404) and a miniature water pump (405), the radiating fan (401) is installed at the top of the top shell (3) and is located at the inner side of the protective cover (5), the radiating fins (402) are installed at the bottom of the radiating fan (401), the radiating copper pipes (403) are installed in the radiating fins (402), the water tank (404) is installed at the right end of the front face of the top shell (3), and the miniature water pump (405) is installed at the left end of the front face of the top shell (3).
6. The metal ultra-thick radiating circuit board of claim 5, wherein one end of the radiating copper pipe (403) is connected with the inside of the water tank (404), a water filling port is formed in the top of the water tank (404), a cover (406) is arranged on the outer side of the water filling port, the other end of the radiating copper pipe (403) is connected with the output end of the micro water pump (405), and the input end of the micro water pump (405) is connected with the inside of the water tank (404) through a water suction pipe (407).
7. The metal ultra-thick radiating circuit board of claim 1, wherein four corners of the top shell (3) are connected with the mounting base (1) through screws, a plurality of groups of mounting blocks (501) are fixedly connected to the outer side of the protective cover (5), a plurality of groups of mounting blocks (501) are connected with the top shell (3) through screws, and an air outlet (502) is formed in the top of the protective cover (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420975194.6U CN222339797U (en) | 2024-05-07 | 2024-05-07 | Metal super-thick heat dissipation circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420975194.6U CN222339797U (en) | 2024-05-07 | 2024-05-07 | Metal super-thick heat dissipation circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222339797U true CN222339797U (en) | 2025-01-10 |
Family
ID=94140109
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420975194.6U Active CN222339797U (en) | 2024-05-07 | 2024-05-07 | Metal super-thick heat dissipation circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222339797U (en) |
-
2024
- 2024-05-07 CN CN202420975194.6U patent/CN222339797U/en active Active
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