CN222291235U - A glue removal tool for AME multi-layer board lamination - Google Patents

Abstract

The utility model discloses an AME multilayer board lamination glue removal tool, including a base, a pressing plate, and a pressure regulating assembly; the pressing plate is arranged parallel to the top of the base, a space for placing the AME multilayer board flat is arranged between the base and the pressing plate, a first middle hole is arranged on the base, a second middle hole is arranged on the pressing plate, the first middle hole and the second middle hole are arranged coaxially, and the space is located between the first middle hole and the second middle hole. The coaxial arrangement of the first middle hole and the second middle hole in the tool design enables the overflow to be effectively controlled and removed during the process of applying pressure, thereby maintaining the neatness of the AME multilayer board and the stability of the circuit. Through the pressure regulating assembly, the utility model can evenly apply pressure to the AME multilayer board, ensuring the uniform distribution and bonding of the silver glue between the board layers, thereby significantly improving the quality and reliability of bonding.

Description

AME multiply wood stromatolite clear frock of gluing

Technical Field

The utility model belongs to the field of electronic manufacturing, and relates to a tool for laminating and cleaning an AME (advanced manufacturing equipment) multi-layer board.

Background

In the field of electronic manufacturing, and in particular, the development of additive manufacturing electronic circuits (ADDITIVELY MANUFACTURED ELECTRONIC, AME) technology, revolutionized changes have been made to the design and manufacture of electronic devices. The AME technology can realize the rapid printing of complex electronic circuits in a layer-by-layer stacking mode, so that the production efficiency is greatly improved and the cost is reduced.

However, board-to-board bonding is a critical technical link in the manufacture of AME multilayer boards. Conventional bonding methods typically use silver paste as a conductive adhesive to tightly bond the multi-layer boards together by applying pressure to ensure stability and reliability of the electrical connection.

However, in the process of implementing the present utility model, the inventor finds that at least one of the following technical problems exists in the prior art:

1) In the process of applying pressure, the silver colloid has certain fluidity, so that the silver colloid is easy to overflow from the inner hole gap of the multilayer board. This not only affects the aesthetics of the product, but may also adversely affect the performance of the circuit.

2) The uniformity and consistency of pressure are difficult to ensure by manual operation, so that the bonding quality is unstable, and the reject ratio of products is increased.

3) The traditional bonding and adhesive removing processes mostly rely on manual operation, have low efficiency and are difficult to meet the requirement of mass production.

4) Because the silver paste has a certain viscosity before curing, the wiping action may generate unnecessary external force on the ready-placed AME multilayer board, resulting in dislocation or offset of the AME multilayer board. This small movement may not be immediately noticeable, but may cause problems in connection between the AME multi-layer boards in subsequent use.

Disclosure of utility model

Aiming at the defects in the prior art, the utility model aims to provide the AME multilayer board laminating adhesive cleaning tool which has the advantages of simple structure, convenient operation and low cost and can effectively solve the problem of overflow of silver adhesive. The tool can uniformly pressurize the multi-layer board, and simultaneously provides a simple glue cleaning mechanism to improve the bonding quality, reduce the reject ratio and improve the operation efficiency.

The inventor continuously reforms and innovates through long-term exploration and trial and repeated experiments and efforts, and in order to solve the technical problems, the utility model provides a technical scheme that an AME multi-layer board lamination adhesive cleaning tool comprises the following components:

a base for supporting the AME multi-layer board,

A pressing plate for pressing the AME multilayer board,

A pressure regulating assembly for regulating pressure applied to the AME multilayer board;

The clamp plate parallel arrangement is in the base top, is equipped with the space that is used for keeping flat the AME multiply wood between base and the clamp plate, is provided with first mesopore on the base, is provided with the second mesopore on the clamp plate, and first mesopore and the coaxial setting of second mesopore, the space is located in the middle of first mesopore and the second mesopore.

According to one embodiment of the AME multilayer board lamination adhesive cleaning tool, the pressure regulating assembly comprises a screw and a nut which are matched.

According to one embodiment of the AME multi-layer board laminated glue cleaning tool, the base is provided with a plurality of base arms used for connecting the screw rods, each base arm extends from the base and is arranged in a spoke shape, and each base arm is connected with one screw rod.

According to one embodiment of the AME multilayer board lamination adhesive cleaning tool, a plurality of pressing arms used for being connected with screw rods in a sliding mode are arranged on the pressing plate, each pressing arm extends from the pressing plate and is arranged in a spoke mode, each pressing arm is connected with one screw rod, and the nut is located above the pressing arm.

According to one embodiment of the AME multilayer board lamination adhesive cleaning tool, the pressing arm is provided with a sliding hole, and the sliding hole is in sliding fit with the screw rod.

According to one embodiment of the AME multilayer board lamination adhesive cleaning tool, the distance between two adjacent screws is larger than the outer diameter of the AME multilayer board.

According to one embodiment of the AME multilayer board lamination glue cleaning tool, the aperture of the first mesopore is not smaller than the aperture of the inner hole on the AME multilayer board.

According to one embodiment of the AME multilayer board lamination glue cleaning tool, the aperture of the second mesopore is not smaller than the aperture of the inner hole on the AME multilayer board.

According to one embodiment of the AME multilayer board lamination adhesive cleaning tool, the utility model further comprises an adhesive wiping tool.

According to one embodiment of the AME multilayer board lamination adhesive cleaning tool, the wiping tool is a dust-free cloth cotton swab.

Compared with the prior art, the AME multilayer board lamination adhesive cleaning tool has the advantages that by means of the unique design and structure, one of the technical schemes realizes the following remarkable technical effects:

a) The first middle hole and the second middle hole in the tooling design are arranged coaxially, so that the first middle hole and the second middle hole can be effectively controlled and cleared when overflow occurs in the process of applying pressure, and the cleanliness of the AME multilayer board and the stability of a circuit are maintained.

B) Through the cooperation of the pressure regulating assembly including the screw and the nut, the utility model can uniformly apply pressure to the AME multilayer board, ensure the uniform distribution and bonding of the silver colloid between the boards, thereby obviously improving the bonding quality and reliability.

C) The tool disclosed by the utility model has a simple and visual structure, an operator can quickly master the using method to perform lamination and glue cleaning of the AME multi-layer board, the operation flow is greatly simplified, and the operation difficulty is reduced.

D) Compared with the traditional manual operation, the tooling provided by the utility model has the advantages that the production efficiency is obviously improved, the production period is reduced, and the requirement of large-scale production is met by an automatic pressure adjustment and glue cleaning mechanism.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed in the embodiments will be briefly described below, it being understood that the following drawings only illustrate some examples of the present utility model and therefore should not be considered as limiting the scope, and other related drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic diagram of a front view structure of a laminated adhesive removing tool for an AME multi-layer board according to a preferred embodiment of the present utility model.

Fig. 2 is a right-side view of the structure of fig. 1.

Fig. 3 is a schematic rear view of the structure of fig. 1.

Fig. 4 is a schematic top view of fig. 1.

Fig. 5 is a schematic perspective view of fig. 1.

FIG. 6 is a schematic cross-sectional view of A-A in FIG. 4.

The marks in the figure are respectively:

A 100-base, the base is provided with a base plate,

110 A first one of the intermediate holes is provided,

A 120-seat arm, a base arm and a base arm,

A 200-degree pressure plate is arranged on the upper surface of the base plate,

210 A second one of the plurality of intermediate holes,

220 The arm is pressed down,

221 Of the slide-in holes are provided,

A 300-degree pressure regulating assembly, which comprises a pressure regulating component,

The screw rod is provided with a 310 screw rod,

A 320-nut is provided with a nut,

A 400AME multi-layer board is provided,

410.

Detailed Description

The following description is of one embodiment with reference to the accompanying drawings.

For the purpose of making the objects, technical solutions and advantages of the embodiments of the present utility model more apparent, the technical solutions of the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model, and it is apparent that the described embodiments are some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, are intended to fall within the scope of the present utility model. Thus, the following detailed description of the embodiments of the utility model, as presented in the figures, is not intended to limit the scope of the utility model, as claimed, but is merely representative of selected embodiments of the utility model.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, it may not be further defined and explained in subsequent figures.

See fig. 1-6. The AME multi-layer board lamination adhesive removing tool comprises a base 100, a pressing plate 200 and a pressing device 300.

The base 100 is designed as a planar structure, and a support ring is provided on the upper surface thereof for stably supporting the AME multi-layer board 400. The material of the base 100 may be metal or engineering plastic, with appropriate strength and stability being selected as desired. In use, the base 100 is placed on a horizontal table.

The platen 200 is designed as a planar structure that is sized to fit the base 100 and is capable of covering the entire AME multi-layer board 400. The material of the platen 200 may also be selected to be metal or engineering plastic to ensure sufficient rigidity when pressure is applied.

The primary function of the pressure regulating assembly 300 is to regulate the pressure applied to the AME multi-layer board 400 to ensure that the silver paste is uniformly distributed and a stable bond is formed. The pressure regulating assembly 300 may be any pressure applicator capable of precise pressure adjustment.

For example:

Hydraulic cylinder pressure regulating assembly 300 may be a hydraulic cylinder that regulates the pressure applied to platen 200 by controlling the hydraulic pressure in the hydraulic system. The hydraulic cylinder has the advantages of stable pressure output and good controllability, and is suitable for occasions needing accurate pressure control.

Cylinder in some applications, the pressure regulating assembly 300 may also be a cylinder that uses compressed air as a power source to push the platen 200. The cylinder has the characteristics of simple structure and high response speed, and is suitable for a production line with certain requirements on speed.

Mechanical pressure regulating device the pressure regulating assembly 300 may also mechanically regulate and maintain the pressure applied to the AME multi-layer board 400 using mechanical pressure regulating devices, such as coil springs, weights, etc.

Servo motor drive system in order to achieve automated and intelligent production, the pressure regulating assembly 300 may be a servo motor drive system, and the pressure is regulated by precisely controlling the rotation speed and torque of the motor, so as to achieve automated control and data recording.

In a preferred embodiment of the present utility model, the pressure regulating assembly 300 includes a screw 310 and a nut 320 in order to simplify the results and reduce tooling costs. The screw 310 is vertically fixed to the base 100, and the nut 320 is installed above the pressing plate 200. Adjustment of the pressure applied to the AME multi-layer board 400 is achieved by rotating the nuts 320 to move up and down along the screws 310 with the platen 200.

In the preferred embodiment of the present utility model, a combination of screw and nut is used, but any of the above-described pressing devices may be replaced or integrated into the tooling of the present utility model according to specific production conditions and requirements without departing from the scope of the present utility model. The clamp plate 200 parallel arrangement is in base 100 top, is equipped with the space that is used for keeping flat the AME multiply wood 400 between base 100 and the clamp plate 200, is provided with first mesopore 110 on the base 100, is provided with second mesopore 210 on the clamp plate 200, and first mesopore 110 and the coaxial heart setting of second mesopore 210, the space is located in the middle of first mesopore 110 and the second mesopore 210.

In a further embodiment, the base 100 is provided with a plurality of arms 120, and the arms 120 extend outwardly from the base 100 and are arranged in a spoke shape. One end of each arm 120 is fixed to the base 100, and the other end is connected to a screw 310. The design of the seat arm 120 not only enhances the structural strength of the base, but also provides multiple connection points through the spoke-like arrangement, resulting in a more uniform pressure applied to the platen 200.

The base 100 is provided with a plurality of arms 120, and the arms 120 extend outwards from the base 100 and are arranged in a spoke shape. One end of each arm 120 is fixed to the base 100, and the other end is connected to a screw 310. The design of the seat arm 120 not only enhances the structural strength of the base, but also provides multiple connection points through the spoke-like arrangement, resulting in a more uniform pressure applied to the platen 200.

In order to achieve smooth movement of the pressing plate 200, each pressing arm 220 is provided with a sliding hole 221. The sliding hole 221 is slidably engaged with the screw 310, so that the pressure plate 200 can smoothly and stably apply pressure, and the pressure can be conveniently adjusted.

The distance between two adjacent screws 310 is designed to be larger than the outer diameter of the AME multiwall sheet 400, and the layout ensures that no matter where the AME multiwall sheet 400 is placed on the tooling, the screws 310 will not interfere, and meanwhile, enough space is provided for an operator to operate, so that the AME multiwall sheet 400 can be conveniently put into/taken out of the space of the flat-placed AME multiwall sheet 400 between the base 100 and the pressing plate 200.

To facilitate the paste removal operation, the apertures of the first middle hole 110 on the base 100 and the second middle hole 210 on the pressing plate 200 are designed to be not smaller than the aperture of the inner hole 410 on the AME multi-layer board 400. Thus, the glue cleaning tool can conveniently reach the inner hole of the AME multilayer board 400 through the middle holes, and effective glue cleaning is performed. Fig. 4 and 6 show the case where the first and second mesopores 110 and 210 have the same pore size and are significantly larger than the inner pore 410.

In a further embodiment, a silver colloid wiping tool is also included, and the wiping tool is a dust-free cotton swab (not shown in the figure). The paste wiping tool is used to clean the paste that overflows the inner holes 410 of the AME multi-layer board 400 after the bonding and compaction process. The dust-free cotton swab is made of dust-free paper or non-woven fabric, the head of the cotton swab is a fluffy cotton ball, and the tail of the cotton swab is an elongated stick handle. The design of the dust-free cotton swab ensures that no extra dust or impurities are introduced in the wiping process, and ensures the cleanliness requirement of the electronic manufacturing process. In use, an operator may hold a dust cloth swab inserted into the inner bore 410 of the AME multi-layer board 400 through the first middle aperture 110 on the base 100 or the second middle aperture 210 on the platen 200. Because the diameters of the first and second middle holes 110 and 210 are designed to be not smaller than the diameter of the inner hole 410, the dust-free cotton swab can easily reach the place to be cleaned. The fluffy cotton ball of the dust-free cotton swab can effectively adsorb and remove overflowed silver colloid, and the length of the rod handle ensures that an operator does not need to directly contact the silver colloid, thereby protecting the safety of the operator and avoiding secondary pollution to the silver colloid.

The tool is used for precisely applying pressure to the silver paste and cleaning overflowed silver paste in the lamination process of the additive manufacturing electronic circuit (AME) multi-layer board so as to ensure firm adhesion and electrical connection between the multi-layer boards. The specific using steps are as follows:

The base 100, platen 200, and related components of the tool are cleaned with alcohol or other cleaning agents to ensure dust-free and contaminant-free.

The AME multi-layer board 400 is placed on the base 100 to ensure accurate positioning. A proper amount of silver paste is uniformly dispensed on the designated position of the AME multi-layer board 400 using a dispenser.

Another sheet of AME laminate 400 was placed in alignment over the dispensed laminate, and lightly pressed to make the silver paste initially bonded.

The pressure regulating assembly 300 is adjusted, the lowering of the pressure plate 200 is controlled by the screw 310 and the nut 320, and pressure is uniformly applied to the AME multi-layer board 400.

Under the action of pressure, if silver colloid overflows from the inner hole 410, a dust-free cotton swab is used for wiping and cleaning through the first middle hole 110 to the middle hole 410.

And (3) maintaining a certain pressure, and placing the tooling and the multilayer board 400 into an oven together for high-temperature curing.

After curing is completed, the screw 310 is rotated in a reverse direction to raise the platen 200 and relieve the pressure. And taking out the AME multilayer board 400, checking the bonding quality and the adhesive cleaning effect, and ensuring that no residual silver adhesive exists and the bonding is firm.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the apparatus or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, directly connected, indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The foregoing is merely a preferred embodiment of the present utility model, and it should be noted that the above-mentioned preferred embodiment should not be construed as limiting the utility model, and the scope of the utility model should be defined by the appended claims. It will be apparent to those skilled in the art that various modifications and adaptations can be made without departing from the spirit and scope of the utility model, and such modifications and adaptations are intended to be comprehended within the scope of the utility model.

Claims (10)

1. AME multiply wood stromatolite clear frock of gluing, its characterized in that includes:

a base for supporting the AME multi-layer board,

A pressing plate for pressing the AME multilayer board,

A pressure regulating assembly for regulating pressure applied to the AME multilayer board;

The clamp plate parallel arrangement is in the base top, is equipped with the space that is used for keeping flat the AME multiply wood between base and the clamp plate, is provided with first mesopore on the base, is provided with the second mesopore on the clamp plate, and first mesopore and the coaxial setting of second mesopore, the space is located in the middle of first mesopore and the second mesopore.

2. The AME multi-layer board lamination adhesive removing tool according to claim 1, wherein the pressure regulating assembly comprises a screw and a nut which are matched.

3. The AME multi-layer board lamination adhesive removing tool according to claim 2, wherein a plurality of seat arms for connecting screws are arranged on the base, each seat arm extends from the base and is arranged in a spoke shape, and each seat arm is connected with one screw.

4. The AME multi-layer board laminated glue cleaning tool according to claim 2 is characterized in that a plurality of pressing arms for sliding connection with screw rods are arranged on the pressing plate, each pressing arm extends from the pressing plate and is arranged in a spoke shape, each pressing arm is connected with one screw rod, and the nut is located above the pressing arm.

5. The AME multilayer board laminating adhesive removing tool according to claim 4, wherein the pressing arm is provided with a sliding hole, and the sliding hole is in sliding fit with the screw rod.

6. The AME multilayer board laminating adhesive removing tool according to claim 3, wherein a distance between two adjacent screws is larger than an outer diameter of the AME multilayer board.

7. The AME multilayer board laminating adhesive removing tool according to claim 1, wherein the aperture of the first mesopore is not smaller than the aperture of the inner hole on the AME multilayer board.

8. The AME multilayer board lamination adhesive removing tool according to claim 1, wherein the aperture of the second mesopore is not smaller than the aperture of the inner hole on the AME multilayer board.

9. The AME multi-layer board lamination adhesive cleaning tool according to claim 1, further comprising an adhesive wiping tool.

10. The AME multi-layer board lamination adhesive removing tool according to claim 9, wherein the wiping tool is a dust-free cloth cotton swab.