CN222283767U - Heat dissipation structure of electronic equipment - Google Patents
Heat dissipation structure of electronic equipment Download PDFInfo
- Publication number
- CN222283767U CN222283767U CN202420562926.9U CN202420562926U CN222283767U CN 222283767 U CN222283767 U CN 222283767U CN 202420562926 U CN202420562926 U CN 202420562926U CN 222283767 U CN222283767 U CN 222283767U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- heat sink
- electronic device
- circuit board
- shaped
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 74
- 238000003466 welding Methods 0.000 claims description 22
- 229920001296 polysiloxane Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 4
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000000741 silica gel Substances 0.000 description 3
- 229910002027 silica gel Inorganic materials 0.000 description 3
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 230000001965 increasing effect Effects 0.000 description 2
- 238000007747 plating Methods 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- JRBRVDCKNXZZGH-UHFFFAOYSA-N alumane;copper Chemical compound [AlH3].[Cu] JRBRVDCKNXZZGH-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- FJMNNXLGOUYVHO-UHFFFAOYSA-N aluminum zinc Chemical compound [Al].[Zn] FJMNNXLGOUYVHO-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000000499 gel Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000001953 recrystallisation Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 239000000725 suspension Substances 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型公开一种电子设备散热结构，包括：电子设备盖板以及安装在所述电子设备盖板内且依次叠放的U形散热板、散热片、电路板；所述U形散热板倒置在所述电子设备盖板上，所述U形散热板与所述电子设备盖板之间形成导热空隙；所述散热片覆盖在所述U形散热板背离所述电子设备盖板的一侧；所述电路板设置在所述散热片背离所述U形散热板的一侧并通过所述散热片与所述U形散热板传热；其中，所述电子设备盖板和所述U形散热板均为冷轧板。本实用新型提供一种散热结构，通过U形散热板配合散热片，能够将电路板产生的热量有效的传递到外部环境中，省去了复杂的散热器结构，高效并且降低了成本。
The utility model discloses a heat dissipation structure of an electronic device, comprising: an electronic device cover plate and a U-shaped heat sink, a heat sink, and a circuit board installed in the electronic device cover plate and stacked in sequence; the U-shaped heat sink is inverted on the electronic device cover plate, and a heat-conducting gap is formed between the U-shaped heat sink and the electronic device cover plate; the heat sink covers the side of the U-shaped heat sink away from the electronic device cover plate; the circuit board is arranged on the side of the heat sink away from the U-shaped heat sink and transfers heat with the U-shaped heat sink through the heat sink; wherein the electronic device cover plate and the U-shaped heat sink are both cold-rolled plates. The utility model provides a heat dissipation structure, which can effectively transfer the heat generated by the circuit board to the external environment through the cooperation of the U-shaped heat sink and the heat sink, eliminating the complex radiator structure, being highly efficient and reducing the cost.
Description
Technical Field
The present disclosure relates to electronic devices, and particularly to a heat dissipation structure for an electronic device.
Background
A circuit board (PCB) is an important component in an electronic device, and it carries electronic components and provides functions of electrical connection and signal transmission, but as the accuracy of the circuit board increases, heat is generated when the electronic device operates, and the heat concentration affects the electrical characteristics of components on the circuit board, so that the service life of the circuit board is greatly reduced when the circuit board operates at a high temperature for a long time, and even the circuit board is directly burned.
Therefore, a plurality of heat dissipation modes are proposed on the conventional circuit board at present, one is improved in terms of materials, an aluminum or copper fin structure heat sink is used, and the other is used for heat dissipation through external air cooling equipment. The existing electronic equipment heat dissipation mode has the technical problems of complex structure and high cost.
Disclosure of utility model
The utility model mainly aims to provide a heat dissipation structure of electronic equipment, which aims to solve the problem of complex existing heat dissipation structure so as to reduce heat dissipation cost.
The utility model provides a radiating structure of electronic equipment, which comprises an electronic equipment cover plate, a U-shaped radiating plate, radiating fins and a circuit board, wherein the U-shaped radiating plate, the radiating fins and the circuit board are installed in the electronic equipment cover plate and are sequentially stacked, the U-shaped radiating plate is inverted on the electronic equipment cover plate, a heat conducting gap is formed between the U-shaped radiating plate and the electronic equipment cover plate, the radiating fins cover one side of the U-shaped radiating plate, which is away from the electronic equipment cover plate, the circuit board is arranged on one side of the radiating fins, which is away from the U-shaped radiating plate, and heat is transferred to the U-shaped radiating plate through the radiating fins, and the electronic equipment cover plate and the U-shaped radiating plate are cold-rolled plates.
Optionally, the heat sink is disposed parallel to the circuit board, and a surface area of the heat sink is smaller than a surface area of the circuit board.
Optionally, the electronic device heat dissipation structure further includes a plurality of support columns, and the circuit board is arranged at the end parts of the support columns.
Optionally, the end of the support column is provided with a threaded hole, and the circuit board is fixed on the end of the support column through a screw.
Optionally, a welding part for welding with the electronic device cover plate is arranged on the U-shaped radiating plate.
Optionally, the welding part is symmetrically arranged at two ends of the U-shaped heat dissipation plate, and the welding part is arranged to be of a rectangular structure extending along the length direction of the U-shaped heat dissipation plate.
Optionally, the U-shaped heat dissipation plate, the heat dissipation plate and the circuit board are connected through screws.
Optionally, the heat dissipation sheet is a heat conduction silica gel sheet.
The heat dissipation structure of the electronic equipment has the beneficial effects that the heat generated by the circuit board can be effectively transferred to the external environment through the U-shaped heat dissipation plate, so that a complex radiator is omitted, the efficiency is high, and the cost is reduced.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of an overall structure of a heat dissipation structure of an electronic device according to an embodiment of the utility model;
FIG. 2 is an exploded view of a heat dissipating structure of an electronic device according to an embodiment of the present utility model;
fig. 3 is a schematic cross-sectional view of a heat dissipation structure of an electronic device according to an embodiment of the utility model.
Reference numerals illustrate:
The electronic equipment cover plate 1;U is provided with a heat dissipation plate 2, a welding part 2a, a heat dissipation plate 3 and a circuit board 4;
a heat conduction gap 5, a support column 6;
The achievement of the objects, functional features and advantages of the present utility model will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
It should be noted that, if directional indications (such as up, down, left, right, front, and rear are referred to in the embodiments of the present utility model), the directional indications are merely used to explain the relative positional relationship, movement conditions, and the like between the components in a specific posture (as shown in the drawings), and if the specific posture is changed, the directional indications are correspondingly changed.
In addition, if there is a description of "first", "second", etc. in the embodiments of the present utility model, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In addition, if the meaning of "and/or" is presented throughout this document, it is intended to include three schemes in parallel, taking "a and/or B" as an example, including a scheme, or B scheme, or a scheme where a and B meet simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present utility model.
The utility model provides an electronic equipment heat dissipation structure which comprises an electronic equipment cover plate 1, a U-shaped heat dissipation plate, heat dissipation fins 3 and a circuit board 4, wherein the U-shaped heat dissipation plate, the heat dissipation fins 3 and the circuit board 4 are installed in the electronic equipment cover plate 1 and are sequentially stacked, the U-shaped heat dissipation plate is inverted on the electronic equipment cover plate 1, a heat conduction gap 5 is formed between the U-shaped heat dissipation plate and the electronic equipment cover plate 1, the heat dissipation fins 3 cover one side of the U-shaped heat dissipation plate, which is away from the electronic equipment cover plate 1, the circuit board 4 is arranged on one side of the heat dissipation fins 3, which is away from the U-shaped heat dissipation plate, and heat is transferred to the U-shaped heat dissipation plate through the heat dissipation fins 3, and the electronic equipment cover plate 1 and the U-shaped heat dissipation plate are cold-rolled plates.
Specifically, the electronic equipment cover plate 1 is a rectangular frame body with one side open, the electronic equipment is installed in the opening of the electronic equipment cover plate, a plurality of sockets can be further arranged on the electronic equipment cover plate 1 and used for being electrically connected with external equipment, the U-shaped heat dissipation plate 2 is a plate body with a U-shaped section, the electronic equipment cover plate 1 and the U-shaped heat dissipation plate 2 are both cold-rolled plates, and the cold-rolled plates are products formed by taking hot-rolled rolls as raw materials and rolling at room temperature below recrystallization temperature. The cold-rolled sheet material includes but is not limited to zinc plating and aluminum zinc plating.
Furthermore, the U-shaped heat dissipation plate 2 is adopted as a heat dissipation structure, and heat on the circuit board 4 is directly transferred to the surrounding environment through a simple insulating medium, so that the heat transfer path is short. The U-shaped heat dissipation plate structure is not limited to the U-shaped structure, and the U-shaped structure is used for pulling the gap between the front panel and the circuit board 4, so that the designed installation distance is ensured, and a certain heat conduction gap 5 is formed. The heat conduction gap 5 refers to a certain distance or space reserved between two adjacent components in the overall structure, so as to reduce heat transfer resistance in a heat conduction path and promote heat conduction and heat dissipation effects.
Furthermore, the heat sink 3 is used as a heat dissipation medium between the U-shaped heat dissipation plate 2 and the circuit board 4, and may be a metal heat sink 3 such as a copper-aluminum composite heat sink 3, or a graphite heat sink 3 with good heat conduction and corrosion resistance, and in some heat dissipation application scenarios of special electronic components, a ceramic heat sink 3 with high insulation and high temperature resistance may be used. In the present embodiment, a sheet-like heat conductive silicone sheet having a fixed shape in a normal state is employed as the heat sink 3.
In this embodiment, the heat sink 3 is disposed parallel to the circuit board 4, and the surface area of the heat sink 3 is smaller than the surface area of the circuit board 4.
Specifically, fin 3 and circuit board 4 parallel arrangement to guarantee the attached effect between fin 3 and the circuit board 4 to a certain extent, realize compact structure, heat dissipation contact surface closely laminating, and then make circuit board 4 quick, effectual in through components such as fin 3 conduction to casing and external environment, the radiating effect is splendid.
Further, the surface area of the heat sink 3 is smaller than that of the circuit board 4, which means that the circuit board 4 has a part of structure suspended on one side of the U-shaped heat sink 2 and the heat sink 3, and under the condition of limited space, the design can make the overall layout more compact, and meanwhile, since the part of the structure of the circuit board 4 is suspended on one side of the heat sink 3, the effective heat dissipation surface area can be increased, and the heat dissipation efficiency can be improved.
In this embodiment, the heat dissipation structure of an electronic device further includes a plurality of support columns 6, and the circuit board 4 is erected at the end portions of the support columns 6. The support column 6 is located on the suspension structure of the circuit board 4, and is used for enhancing the supporting strength of the circuit board 4, further increasing the stability and firmness of the whole structure, ensuring firm connection between the components, and avoiding loosening or damage of the circuit board 4 caused by vibration or other external forces.
In this embodiment, the end of the support column 6 is provided with a threaded hole, and the circuit board 4 is fixed to the end of the support column 6 by a screw.
In this embodiment, the U-shaped heat dissipation plate 2 is provided with a welding portion 2a for welding with the electronic device cover plate 1, and the welding portion 2a is formed by extending the U-shaped heat dissipation plate 2 along both sides. The area of the welding part 2a and the number of welding points can be set according to specific requirements, the area of the welding part 2a and the number of the welding points limit the speed and the quantity of heat transfer to a certain extent, and the time and the temperature for achieving heat balance are controlled. Specifically, the principle that the heat transfer efficiency can be affected by changing the number of welding points is to increase the overall contact heat dissipation area of the welded U-shaped plate and the front panel of the battery module so as to improve the heat dissipation effect.
In this embodiment, the welding parts 2a are symmetrically disposed at two ends of the U-shaped heat dissipation plate 2, and the welding parts 2a are configured as rectangular structures extending along the length direction of the U-shaped heat dissipation plate 2. The welding part 2a is formed by extending two side walls of the U-shaped heat dissipation plate 2 outwards along the horizontal direction respectively, and the joint part between the welding part 2a and the main body of the U-shaped heat dissipation plate 2 can be designed with a certain radian so as to improve the connection strength. The welding part 2a of the U-shaped heat dissipation plate is welded on the electronic equipment cover plate 1, so that an integrated structure of the electronic equipment cover plate 1 and the U-shaped heat dissipation plate is realized.
In this embodiment, the U-shaped heat dissipating plate 2, the heat dissipating fins 3 and the circuit board 4 are connected by screws.
In this embodiment, the heat sink 3 is a thermally conductive silicon sheet. The heat-conducting silica gel sheet is a polymer composite heat-conducting material which takes organic silicon resin as an adhesive base material and achieves the purpose of heat conduction through filling heat conducting powder, is a sheet-shaped heat-conducting gel with a fixed shape in a normal state, has natural viscosity on two sides, and strong operability and maintainability, is supplemented by the heat-conducting silica gel sheet, ensures reliable and tight and full contact between the U-shaped heat-radiating plate and the circuit board 4, truly achieves the face-to-face contact with the largest area, and can achieve the smallest temperature difference in temperature.
The foregoing description is only of the optional embodiments of the present utility model, and is not intended to limit the scope of the utility model, and all the equivalent structural changes made by the description of the present utility model and the accompanying drawings or the direct/indirect application in other related technical fields are included in the scope of the utility model.
Claims (8)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420562926.9U CN222283767U (en) | 2024-03-21 | 2024-03-21 | Heat dissipation structure of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420562926.9U CN222283767U (en) | 2024-03-21 | 2024-03-21 | Heat dissipation structure of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222283767U true CN222283767U (en) | 2024-12-31 |
Family
ID=93951702
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420562926.9U Active CN222283767U (en) | 2024-03-21 | 2024-03-21 | Heat dissipation structure of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222283767U (en) |
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2024
- 2024-03-21 CN CN202420562926.9U patent/CN222283767U/en active Active
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant |