CN222281983U

CN222281983U - Inside heat radiation structure of IGBT module

Info

Publication number: CN222281983U
Application number: CN202421059360.4U
Authority: CN
Inventors: 赵清; 唐斌; 徐普
Original assignee: Changzhou Baoyun Electronic Technology Co ltd
Current assignee: Changzhou Baoyun Electronic Technology Co ltd
Priority date: 2024-05-15
Filing date: 2024-05-15
Publication date: 2024-12-31
Anticipated expiration: 2034-05-15

Abstract

The utility model is applicable to the technical field of IGBT modules, and provides an internal heat dissipation structure of an IGBT module, comprising a base plate, a shell is fixedly mounted on the base plate, a PCB board is fixedly mounted on the base plate, a plurality of chips are arranged on the PCB board, a plurality of heat sinks are fixedly mounted on the outer side of the shell, the plurality of heat sinks are arranged on the outer side of the shell in a vertically parallel manner, one side of the plurality of heat sinks penetrates into the shell, a plurality of heat sinks are located in the shell, one end of the plurality of heat sinks is fixedly connected with a built-in heat conducting plate, a plurality of chips are provided with a mounted heat conducting plate, a heat conducting strip is fixedly mounted on the mounted heat conducting plate, and the other end of the heat conducting strip is fixedly connected with the built-in heat conducting plate. The device avoids the problem that the heat cannot be dissipated due to the chip being in a closed shell, and further ensures the service life of the chip. At the same time, the arrangement of the above structure will not cause any influence on the protective effect of the shell.

Description

Inside heat radiation structure of IGBT module

Technical Field

The utility model relates to the technical field of IGBT modules, in particular to an internal heat dissipation structure of an IGBT module.

Background

The IGBT module has the advantages of high switching speed, small loss, low on-state voltage, high input impedance, pulse current impact resistance and the like, and is widely applied to the fields of industrial frequency conversion, smart grids, photovoltaics, electric automobiles and the like.

Along with the development of electronic technology, electronic devices are increasingly developed towards high frequency, high speed and modularization, the heat generated by high-power 6 inch components and high-power IGBT modules is always increased by the wide application of the high-power IGBT modules, data show that 55% of errors in operation of electronic equipment are caused by overheat, a heat dissipation device is often required to be used for dissipating heat, the heat dissipation quality directly influences the cost, reliability and working performance of electronic products, most of the current IGBT modules commonly use copper plates or aluminum plates for sharing heat dissipation, and the heat dissipation sharing mode is too simple in structure and poor in heat dissipation effect, cannot timely discharge the heat generated by the IGBT modules to the outside, and easily causes the overhigh internal environment temperature of the IGBT modules.

Disclosure of utility model

Aiming at the defects existing in the prior art, the utility model aims to provide the internal heat dissipation structure of the IGBT module, which avoids the problem that heat cannot be dissipated due to the fact that a chip is positioned in a closed shell as much as possible, and further ensures the service life of the chip.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The utility model provides an inside heat radiation structure of IGBT module, includes the bottom plate, fixed mounting has the casing on the bottom plate, fixed mounting has the PCB board on the bottom plate, is equipped with a plurality of chips on the PCB board, the outside fixed mounting of casing has a plurality of heat radiation fins, and the outside of casing is located to a plurality of heat radiation fins's mode about being parallel, and in a plurality of heat radiation fins's one side all penetrated into the casing, a plurality of heat radiation fins lie in the one end fixedly connected with built-in heat-conducting plate of casing, all be equipped with the installation heat-conducting plate on a plurality of chips, fixed mounting has the heat conduction strip on the installation heat-conducting plate, the other end and the built-in heat-conducting plate fixed connection of heat conduction strip.

The utility model is further arranged that the shell is wrapped on the outer side of the PCB.

The utility model is further characterized in that heat-conducting glue is arranged between the mounting heat-conducting plate and the chip, and the mounting heat-conducting plate and the chip are fixed through the heat-conducting glue.

The utility model further provides that the radiating fins are wavy in shape.

The utility model is further provided with an external plate fixedly arranged on one side of the plurality of radiating fins outside the shell, and an airflow flowing cavity is formed between every two radiating fins.

The utility model is further provided with a plurality of radiating fins, wherein a mounting plate is fixedly arranged on the front surface of one side of the radiating fins, which is positioned outside the shell, and a miniature radiating fan is arranged on the front surface of the mounting plate.

The utility model is further arranged that the air outlet of the miniature heat radiation fan extends out of the rear side surface of the mounting plate.

The utility model is further provided with a plurality of radiating fins, and a filter screen is fixedly arranged at the rear side of the radiating fins outside the shell.

The heat conducting plate has the advantages that the heat on the chip is conducted to the mounting heat conducting plate and finally conducted to the built-in heat conducting plate through the heat conducting strip, as the heat radiating fins are mostly located on the outer side of the shell, according to the heat conduction principle, the heat on the built-in heat conducting plate can be conducted to the outer side of the heat radiating fins, so that the purpose of radiating the chip is achieved, the problem that the heat cannot be radiated due to the fact that the chip is located in the airtight shell is avoided as much as possible, the service life of the chip is further guaranteed, meanwhile, the protection effect of the shell is not affected due to the arrangement of the structure, and the protection effect of the shell on the chip is guaranteed under the condition that the internal heat radiating efficiency of the IGBT module is guaranteed.

Drawings

Fig. 1 is a schematic diagram of an internal heat dissipation structure of an IGBT module according to the present utility model;

FIG. 2 is a schematic cross-sectional view of a housing of the present utility model;

fig. 3 is a schematic view of a heat sink fin according to the present utility model.

In the figure, 1, a bottom plate, 2, a shell, 3, a PCB, 4, a chip, 5, radiating fins, 6, an internal heat conducting plate, 7, an installation heat conducting plate, 8, a heat conducting strip, 9, an external plate, 10, an installation plate, 11, a miniature radiating fan, 12 and a filter screen.

Detailed Description

It should be noted that, without conflict, the embodiments of the present utility model and features of the embodiments may be combined with each other. The utility model will be described in detail below with reference to the drawings in connection with embodiments.

It is noted that all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs unless otherwise indicated.

In the present utility model, unless otherwise indicated, the terms "upper" and "lower" are used generally in the directions shown in the drawings or in the vertical, vertical or gravitational directions, and similarly, for convenience of understanding and description, the terms "left" and "right" are used generally in the directions shown in the drawings, and the terms "inner" and "outer" are used to refer to the inner and outer sides with respect to the outline of each component itself, but the terms of orientation are not intended to limit the present utility model.

Referring to fig. 1-3, the present utility model provides the following technical solutions:

Specifically, refer to an inside heat radiation structure of IGBT module, including bottom plate 1, fixed mounting has casing 2 on the bottom plate 1, and fixed mounting has PCB board 3 on the bottom plate 1, and casing 2 parcel is in the outside of PCB board 3 for protect PCB board 3, can avoid this IGBT module to be contacted by outside dust and steam when using, influenced its life's problem.

The PCB 3 is provided with a plurality of chips 4, the chips 4 can be IGBT chips or FRD chips respectively, a plurality of heat radiation fins 5 are fixedly arranged on the outer side of the shell 2, the heat radiation fins 5 are arranged on the outer side of the shell 2 in an up-down parallel mode, one sides of the heat radiation fins 5 penetrate into the shell 2, one ends of the heat radiation fins 5 in the shell 2 are fixedly connected with a built-in heat conducting plate 6, the chips 4 are provided with mounting heat conducting plates 7, heat conducting glue is arranged between the mounting heat conducting plates 7 and the chips 4, the heat conducting glue can be arranged to enable the mounting heat conducting plates 7 to be fixed with the chips 4, heat emitted by the chips 4 during operation can be conducted to the mounting heat conducting plates 7, heat conducting strips 8 are fixedly arranged on the mounting heat conducting plates 7, and the other ends of the heat conducting strips 8 are fixedly connected with the built-in heat conducting plates 6;

When the IGBT runs for a long time, the chip 4 inevitably generates heat, the heat on the chip 4 is conducted to the installation heat conducting plate 7 and finally is conducted to the built-in heat conducting plate 6 through the heat conducting strip 8, as the heat radiating fins 5 are mostly located on the outer side of the shell 2, the heat on the built-in heat conducting fin 6 can be conducted to the outer side of the heat radiating fins 5 according to the heat conduction principle, thereby achieving the purpose of radiating the chip 4, avoiding the problem that the heat cannot be radiated due to the fact that the chip 4 is located in the airtight shell 2 as much as possible, further guaranteeing the service life of the chip 4, avoiding any influence on the protection effect of the shell 2 due to the arrangement of the structure, and guaranteeing the protection effect of the shell 2 on the chip 4 under the condition of guaranteeing the internal heat radiating efficiency of the IGBT module.

More preferably, the area of the mounting heat-conducting plate 7 is smaller than the area of the chip 4, and in actual use, the top of the chip 4 is connected with other electronic components through bonding wires, so that the mounting heat-conducting plate 7 is prevented from blocking the bonding position on the chip 4 as much as possible, and the normal use of the IGBT module is affected.

More preferably, the heat dissipation fins 5, the built-in heat conduction plate 6, the mounting heat conduction plate 7 and the heat conduction strips 8 are made of materials with high heat conduction efficiency, such as copper, so that the heat conduction efficiency of the chip 4 is ensured.

More preferably, the shape of the heat dissipation fins 5 is wavy, so that the heat dissipation area of the heat dissipation fins 5 is increased, and the heat dissipation efficiency of the IGBT chip or the FRD chip is further improved.

An external plate 9 is fixedly arranged on one side of the plurality of radiating fins 5 outside the shell 2, so that the radiating fins 5 form an airflow cavity between every two radiating fins 5 under the blocking of the external plate 9, a mounting plate 10 is fixedly arranged on the front surface of one side of the plurality of radiating fins 5 outside the shell 2, a miniature radiating fan 11 is arranged on the front surface of the mounting plate 10, and an air outlet of the miniature radiating fan 11 extends out of the rear surface of the mounting plate 10;

When the IGBT module is used, the miniature cooling fan 11 operates and extracts air in the airflow flowing cavity, at the moment, heat conducted to the outer side of the cooling fins 5 is extracted under the drive of airflow, and meanwhile, because the air pressure in the airflow flowing cavity is reduced, external cold air enters the airflow flowing cavity through the rear side, so that the purpose of rapidly cooling the cooling fins 5 is achieved, and the heat conduction efficiency of the chip 4 is further improved.

The rear side of the plurality of radiating fins 5 outside the shell 2 is fixedly provided with the filter screen 12, so that the cold air entering the airflow flowing cavity can be filtered, dust carried by the external cold air entering the airflow flowing cavity is avoided as much as possible, the dust is attached to the outer surfaces of the radiating fins 5, and the radiating efficiency of the radiating fins 5 is affected.

The working principle of the internal heat dissipation structure of the IGBT module provided by the utility model is that when the IGBT runs for a long time, the chip 4 inevitably generates heat, the heat on the chip 4 is conducted to the installation heat conducting plate 7 and finally is conducted to the built-in heat conducting plate 6 through the heat conducting strip 8, and as the heat dissipation fins 5 are mostly positioned on the outer side of the shell 2, the heat on the built-in heat conducting plate 6 can be conducted to the outer side of the heat dissipation fins 5 according to the heat conduction principle;

Simultaneously, the micro cooling fan 11 operates and extracts air in the airflow flowing cavity, at the moment, heat conducted to the outer sides of the cooling fins 5 is extracted under the drive of airflow, and meanwhile, because the air pressure in the airflow flowing cavity is reduced, external cold air enters the airflow flowing cavity through the rear side, and therefore the purpose of rapidly cooling the cooling fins 5 is achieved.

It will be apparent that the embodiments described above are merely some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of exemplary embodiments according to the present application. As used herein, the singular is also intended to include the plural unless the context clearly indicates otherwise, and furthermore, it is to be understood that the terms "comprises" and/or "comprising" when used in this specification are taken to specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof.

It should be noted that the terms "first," "second," and the like in the description and the claims of the present application and the above figures are used for distinguishing between similar objects and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged where appropriate such that embodiments of the application described herein may be implemented in sequences other than those illustrated or otherwise described herein.

The above description is only of the preferred embodiments of the present utility model and is not intended to limit the present utility model, but various modifications and variations can be made to the present utility model by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims

1. The utility model provides an inside heat radiation structure of IGBT module, includes bottom plate (1), fixedly mounted has casing (2) on bottom plate (1), fixedly mounted has PCB board (3) on bottom plate (1), is equipped with a plurality of chips (4) on PCB board (3), wherein, the outside fixed mounting of casing (2) has a plurality of heat radiation fins (5), the outside of casing (2) is located in parallel from top to bottom to a plurality of heat radiation fins (5), in the one side of a plurality of heat radiation fins (5) all runs through casing (2), the one end fixedly connected with built-in heat-conducting plate (6) that a plurality of heat radiation fins (5) are located casing (2), all be equipped with on a plurality of chips (4) and install heat-conducting plate (7), fixedly mounted has heat conduction strip (8) on the heat-conducting plate (7), the other end and the built-in heat-conducting plate (6) of heat conduction strip (8) fixed connection.

2. The IGBT module internal heat dissipation structure as set forth in claim 1, wherein said housing (2) is wrapped outside of the PCB (3).

3. The IGBT module internal heat dissipation structure as set forth in claim 2, wherein a heat conducting glue is disposed between the mounting heat conducting plate (7) and the chip (4), and the mounting heat conducting plate (7) and the chip (4) are fixed by the heat conducting glue.

4. The internal heat dissipation structure of an IGBT module as set forth in claim 3, wherein said heat dissipation fins (5) are wavy in shape.

5. The internal heat dissipation structure of an IGBT module as set forth in claim 4, wherein an external plate (9) is fixedly installed on one side of the plurality of heat dissipation fins (5) outside the shell (2), and an airflow cavity is formed between every two heat dissipation fins (5).

6. The internal heat dissipation structure of an IGBT module as set forth in claim 5, wherein a mounting plate (10) is fixedly mounted on the front surface of one side of the plurality of heat dissipation fins (5) outside the housing (2), and a micro heat dissipation fan (11) is mounted on the front surface of the mounting plate (10).

7. The internal heat dissipation structure of an IGBT module as set forth in claim 6, wherein an air outlet of said micro heat dissipation fan (11) extends out of a rear side surface of said mounting plate (10).

8. The internal heat dissipation structure of an IGBT module as set forth in claim 7, wherein a plurality of said heat dissipation fins (5) are fixedly mounted with a filter screen (12) at the rear side outside the housing (2).