CN222259821U - A projector heat dissipation device combining TEC and flat heat pipe - Google Patents
A projector heat dissipation device combining TEC and flat heat pipe Download PDFInfo
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- CN222259821U CN222259821U CN202421038109.XU CN202421038109U CN222259821U CN 222259821 U CN222259821 U CN 222259821U CN 202421038109 U CN202421038109 U CN 202421038109U CN 222259821 U CN222259821 U CN 222259821U
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- tec
- heat pipe
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 55
- 239000004065 semiconductor Substances 0.000 claims abstract description 18
- 238000007664 blowing Methods 0.000 claims abstract description 5
- 230000005855 radiation Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000005516 engineering process Methods 0.000 description 4
- 239000007788 liquid Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000005679 Peltier effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
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Abstract
The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a projector heat dissipation device combining a TEC (thermoelectric cooler) and a flat heat pipe, which comprises a projector body and a TEC semiconductor radiator, wherein the cold end of the TEC semiconductor radiator is fixedly arranged on an LED lamp base of an LED on the projector body; the heat-dissipating device comprises a flat heat pipe fixedly arranged on the hot end of a TEC semiconductor radiator, a heat-dissipating fin arranged at the phase-change cold end of the flat heat pipe, and an electric fan arranged at one side of the heat-dissipating fin and used for blowing and dissipating heat for the heat-dissipating fin. The device not only can provide high-efficiency heat dissipation performance, but also can maintain portability of the projector without adding extra volume, and can provide enough heat dissipation performance in a limited space to cope with larger heat load caused by the improvement of brightness and power consumption of the household small portable projector. When the passive heat dissipation is carried out, the electric fan is not started, and noise and vibration generated when the heat dissipation system works are reduced.
Description
Technical Field
The utility model relates to the technical field of heat dissipation of electronic equipment, in particular to a projector heat dissipation device combining a TEC (thermoelectric cooler) with a flat heat pipe.
Background
In the internal structure of the home projector, the heat dissipation system usually adopts air cooling and water cooling, few schemes adopt a heat pipe structure, and heat pipe heat dissipation is the closest prior art with the scheme, and has high-efficiency heat dissipation performance, but because of the efficiency limitation and the size limitation of the liquid absorption core, the highest heat exchange efficiency cannot be exerted. In the future, the heat productivity of the projector will be increased by a multiple with the increase of the projection brightness and power consumption, so that the heat dissipation requirement in the future will be increased. The proposal is proposed.
The existing heat dissipation structure of the household projector basically adopts heat dissipation fins, and is matched with a fan to conduct heat, and few manufacturers can also add heat pipes to accelerate heat exchange.
In the current market, the heat dissipation technology of the household small portable projector mainly comprises the following steps:
Air-cooled heat dissipation, which is the most common heat dissipation mode, drives air flow through a built-in fan to conduct heat from the interior of the projector to the exterior. This method is simple, low cost, but relatively inefficient, and may produce noise when the fan speed is high.
Water cooling heat dissipation-in some high-end or professional grade projectors, water cooling systems may be used to remove heat by flowing water. The water cooling heat dissipation efficiency is high, but the system is complex, the cost is high, and the water cooling heat dissipation efficiency is less common in a household small portable projector.
And the heat pipe is used for radiating, namely the heat pipe is used as a heat conduction medium, and the phase change circulation of the working medium in the heat pipe is used for taking away the heat. The heat pipe has higher heat dissipation efficiency and small volume, is suitable for compact design, but has relatively higher cost, and the performance is limited by the efficiency and the body type of the liquid absorption core.
The above is a common heat dissipation technology for projectors on the market.
The existing heat dissipation technology (particularly, the heat pipe heat dissipation technology) is not good enough to solve the heat dissipation problem under the condition that the internal heat generation amount is increased due to the improvement of the brightness and the power consumption of the household small portable projector.
Therefore, the design of the heat dissipation system of the TEC semiconductor radiator and the planar heat pipe is integrated, so that better heat management is realized, the normal operation of the equipment is ensured, and the service life is prolonged.
Disclosure of utility model
The utility model aims to overcome the defects of the prior art, and provides a projector heat dissipation device with a TEC combined with a flat heat pipe, which can realize better heat management, ensure the normal operation of equipment and prolong the service life.
In order to solve the technical problems, the technical scheme adopted by the utility model is that the projector heat dissipation device combining the TEC and the flat heat pipe comprises:
the body of the projector is provided with a lens,
The cold end of the TEC semiconductor radiator is fixedly arranged on an LED lamp base of an LED on the projector body;
The flat heat pipe is fixedly arranged on the hot end of the TEC semiconductor radiator;
Radiating fins are fixedly arranged at the phase change cold end of the planar heat pipe;
And the electric fan is arranged at one side of the radiating fins and is used for blowing and radiating the radiating fins.
Further, an air inlet is formed in the shell of the projector body, an air inlet filter screen is arranged at the air inlet, an air outlet is formed in the shell of the projector body, an air outlet filter screen is arranged at the air outlet, and the radiating fins are close to the air outlet filter screen;
The LED lamp base, the TEC semiconductor radiator, the planar heat pipe and the radiating fins are arranged in the projector body.
Further comprises an auxiliary mounting plate, a rotating column is rotatably connected on the auxiliary mounting plate, an electric fan mounting plate is fixedly mounted on the rotating column, and the electric fan is mounted on the electric fan mounting plate;
The notch is offered on the casing of projector body, the pivoted post runs through the notch, supplementary mounting panel fixed mounting is on the projector body, and will the notch shutoff.
Further, the auxiliary mounting plate is provided with a through hole, the shell of the projector body is provided with a threaded hole, and the screw penetrates through the through hole and is threaded in the threaded hole, so that the auxiliary mounting plate is fixedly mounted on the shell of the projector body.
Further, the motor is fixedly arranged on the auxiliary mounting plate, and the power output end of the motor is connected with the rotating column.
Further, the equal fixedly connected with first connecting plate in both sides of electric fan mounting panel, two equal fixedly connected with second spliced pole on the first connecting plate, two one side fixedly connected with spacing sliding block of first connecting plate is kept away from to the second spliced pole, T type ring groove has been seted up to one side of supplementary mounting panel, spacing rotation of spacing sliding block is connected in T type ring groove, just the second spliced pole runs through the notch.
Compared with the prior art, the utility model has the beneficial effects that:
the device not only can provide high-efficiency heat dissipation performance, but also can maintain portability of the projector on the premise of not increasing extra volume;
Providing sufficient heat dissipation performance in a limited space to cope with a larger heat load caused by the increase of brightness and power consumption of a small portable projector for home use;
The long-term reliability of the heat radiation system can be ensured, and the equipment damage and the failure rate caused by insufficient heat radiation are reduced;
When the passive heat dissipation is performed, the electric fan is not started, so that noise and vibration generated during the operation of the heat dissipation system are reduced, and the comfort of a user during use is improved.
Drawings
The disclosure of the present utility model is described with reference to the accompanying drawings. It is to be understood that the drawings are designed solely for the purposes of illustration and not as a definition of the limits of the utility model. In the drawings, like reference numerals are used to refer to like parts. Wherein:
FIG. 1 schematically shows a schematic cross-sectional structure of a proposed device according to one embodiment of the present utility model;
Fig. 2 schematically shows an enlarged schematic view of the structure at a of the proposed device according to one embodiment of the utility model.
In the figure, the reference numeral 1, a projector body, 2, an air outlet filter screen, 3, an LED lamp base, 4, a TEC semiconductor radiator, 5, a planar heat pipe, 6, a radiating fin, 7, an electric fan, 8, an electric fan mounting plate, 9, a first connecting plate, 10, a rotating column, 11, a threaded hole, 12, a through hole, 13, a screw, 14, a second connecting column, 15, a notch, 16, an auxiliary mounting plate, 17, a T-shaped annular groove, 18, a limiting sliding block, 19, an air inlet filter screen, 20 and a motor.
Detailed Description
It is to be understood that, according to the technical solution of the present utility model, those skilled in the art may propose various alternative structural modes and implementation modes without changing the true spirit of the present utility model. Accordingly, the following detailed description and drawings are merely illustrative of the utility model and are not intended to be exhaustive or to limit the utility model to the precise form disclosed.
Examples:
As shown in fig. 1-2, the present apparatus is designed to improve the heat dissipation effect of the projector. The main heat source is found to be the heat emitted by the LED lamp base, for which we have devised improvements in this location.
A TEC semiconductor heat sink 4 is fixedly mounted on an LED lamp base 3 of an LED lamp in the projector body 1.
The projector body 1 is a device for realizing a temperature difference between both cold and hot ends by utilizing Pi Erte effect PELTIER EFFECT generated when a current passes through. In this design, the cold end of the projector body 1 is closely attached to the LED lamp base 3 to absorb heat, while the hot end of the TEC semiconductor heat sink 4 is connected to the planar heat pipe 5 to transfer heat away.
One end of the plane heat pipe 5, which is air-to-liquid, is provided with a heat radiation fin 6.
An air inlet and an air outlet are formed in the shell of the projector body 1, an air inlet filter screen 19 is fixedly installed on the air inlet, and an air outlet filter screen 2 is fixedly installed on the air outlet. The heat radiation fins 6 are close to the air outlet filter screen 2.
The LED lamp base 3, the TEC semiconductor radiator 4, the planar heat pipe 5, the radiating fins 6 and the electric fan 7 are all arranged in the projector body 1. And the electric fan 7 is in an initial state, facing the end of the heat radiation fin 6.
The housing of the projector body 1 is provided with a notch 15.
The auxiliary mounting plate 16 is rotatably connected with a rotating column 10, one side of the rotating column 10 away from the auxiliary mounting plate 16 is fixedly provided with an electric fan mounting plate 8, and the electric fan 7 is fixedly arranged on the electric fan mounting plate 8. The rotating post 10 extends through the slot 15. The motor 20 is fixedly installed at the outer side of the auxiliary installation plate 16, and a power output end of the motor 20 is connected with the rotating column 10.
The auxiliary mounting plate 16 is provided with a plurality of through holes 12, the projector body 1 is provided with threaded holes 11 matched with the through holes 12, and the screws 13 penetrate through the through holes 12 and are in threaded connection with the threaded holes 11, so that the auxiliary mounting plate 16 is fixedly mounted on the projector body 1.
The both sides of electric fan mounting panel 8 are all fixedly connected with first connecting plate 9, and the equal fixedly connected with second spliced pole 14 on two first connecting plates 9, and notch 15 is run through to two second spliced poles 14, and one side fixedly connected with spacing sliding block 18 that the second spliced pole 14 kept away from first connecting plate 9, T type ring groove 17 has been seted up to the inboard of auxiliary mounting panel 16, and spacing sliding block 18 spacing rotation is connected in T type ring groove 17.
In specific implementation, the device is divided into two modes, namely active heat dissipation and passive heat dissipation.
When in passive heat dissipation, the device starts the TEC semiconductor radiator 4, at the moment, heat on the LED lamp base 3 is thermally conducted onto the TEC semiconductor radiator 4 from the cold end of the TEC semiconductor radiator 4, then the heat is transferred onto the planar heat pipe 5, and the planar heat pipe 5 can transfer the heat of the TEC semiconductor radiator 4 through heat dissipation of the heat dissipation fins 6, so that the passive heat dissipation of the LED lamp base 3 is realized.
When the heat dissipation is active, the heat dissipation device not only comprises the heat dissipation of passive heat dissipation, but also comprises the heat dissipation of the electric fan 7, and the active heat dissipation also comprises two steps, namely rapid active heat dissipation and ultra-rapid active heat dissipation. When the heat is dissipated rapidly and actively, the electric fan 7 keeps still against the tail end of the air outlet filter screen 2 and blows and dissipates the heat of the heat dissipation fins 6. When the ultra-fast active heat dissipation is performed, the motor 20 is started, so that the electric fan 7 swings left and right while blowing, and the heat dissipation fins 6 swing left and right to dissipate heat through blowing.
The technical scope of the present utility model is not limited to the above description, and those skilled in the art may make various changes and modifications to the above-described embodiments without departing from the technical spirit of the present utility model, and these changes and modifications should be included in the scope of the present utility model.
Claims (6)
1. A projector heat sink with TEC in combination with a flat heat pipe, comprising:
A projector body (1),
The cold end of the TEC semiconductor radiator (4) is fixedly arranged on an LED lamp base (3) of an LED on the projector body (1);
the flat heat pipe (5) is fixedly arranged on the hot end of the TEC semiconductor radiator (4);
The phase change cold end of the planar heat pipe (5) is fixedly provided with a heat radiation fin (6);
And the electric fan (7) is arranged at one side of the radiating fins (6) and is used for blowing and radiating the radiating fins (6).
2. The projector heat dissipation device combining the TEC and the flat heat pipe according to claim 1 is characterized in that an air inlet is formed in a shell of the projector body (1), an air inlet filter screen (19) is arranged at the air inlet, an air outlet is formed in the shell of the projector body (1), an air outlet filter screen (2) is arranged at the air outlet, and the heat dissipation fins (6) are close to the air outlet filter screen (2);
the LED lamp base (3), the TEC semiconductor radiator (4), the planar heat pipe (5) and the radiating fins (6) are arranged in the projector body (1).
3. The projector heat dissipation device combining the TEC and the flat heat pipe according to claim 2, further comprising an auxiliary mounting plate (16), wherein a rotating column (10) is rotatably connected to the auxiliary mounting plate (16), an electric fan mounting plate (8) is fixedly mounted on the rotating column (10), and the electric fan (7) is mounted on the electric fan mounting plate (8);
The projector comprises a projector body (1), and is characterized in that a notch (15) is formed in a shell of the projector body (1), the rotating column (10) penetrates through the notch (15), and an auxiliary mounting plate (16) is fixedly mounted on the projector body (1) and seals the notch (15).
4. A projector heat dissipation device combining a TEC and a flat heat pipe according to claim 3, wherein the auxiliary mounting plate (16) is provided with a through hole (12), the shell of the projector body (1) is provided with a threaded hole (11), and the screw (13) penetrates through the through hole (12) and is threaded in the threaded hole (11), so that the auxiliary mounting plate (16) is fixedly mounted on the shell of the projector body (1).
5. The projector heat sink with TEC combined with flat heat pipe according to claim 4, further comprising a motor (20), wherein the motor (20) is fixedly mounted on the auxiliary mounting plate (16), and a power output end of the motor (20) is connected with the rotating column (10).
6. The projector heat dissipation device combining the TEC and the flat heat pipe according to claim 5, wherein the two sides of the electric fan mounting plate (8) are fixedly connected with first connecting plates (9), the two first connecting plates (9) are fixedly connected with second connecting columns (14), one side, away from the first connecting plates (9), of the two second connecting columns (14) is fixedly connected with a limit sliding block (18), one side of the auxiliary mounting plate (16) is provided with a T-shaped circular groove (17), the limit sliding block (18) is connected in the T-shaped circular groove (17) in a limiting rotating mode, and the second connecting columns (14) penetrate through the notch (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421038109.XU CN222259821U (en) | 2024-05-14 | 2024-05-14 | A projector heat dissipation device combining TEC and flat heat pipe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421038109.XU CN222259821U (en) | 2024-05-14 | 2024-05-14 | A projector heat dissipation device combining TEC and flat heat pipe |
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| Publication Number | Publication Date |
|---|---|
| CN222259821U true CN222259821U (en) | 2024-12-27 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421038109.XU Active CN222259821U (en) | 2024-05-14 | 2024-05-14 | A projector heat dissipation device combining TEC and flat heat pipe |
Country Status (1)
| Country | Link |
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| CN (1) | CN222259821U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119448645A (en) * | 2025-01-08 | 2025-02-14 | 常州市武起常乐电机有限公司 | Reluctance assisted permanent magnet synchronous motor and its components |
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2024
- 2024-05-14 CN CN202421038109.XU patent/CN222259821U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119448645A (en) * | 2025-01-08 | 2025-02-14 | 常州市武起常乐电机有限公司 | Reluctance assisted permanent magnet synchronous motor and its components |
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