CN222245876U - Mould for electronic component injection molding - Google Patents
Mould for electronic component injection molding Download PDFInfo
- Publication number
- CN222245876U CN222245876U CN202421010191.5U CN202421010191U CN222245876U CN 222245876 U CN222245876 U CN 222245876U CN 202421010191 U CN202421010191 U CN 202421010191U CN 222245876 U CN222245876 U CN 222245876U
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- Prior art keywords
- injection molding
- ejection
- runner
- injection
- flow channel
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- 238000001746 injection moulding Methods 0.000 title claims abstract description 84
- 238000002347 injection Methods 0.000 claims abstract description 25
- 239000007924 injection Substances 0.000 claims abstract description 25
- 230000007246 mechanism Effects 0.000 claims abstract description 21
- 239000002994 raw material Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 5
- 230000008569 process Effects 0.000 abstract description 4
- 238000000465 moulding Methods 0.000 abstract description 3
- 239000004033 plastic Substances 0.000 description 3
- 229920003023 plastic Polymers 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
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- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
本实用新型提供一种电子元件注塑用模具，应用于注塑模具技术领域包括顶出机构，顶出机构嵌入连接于公模板的内部，公模板的内部还设置有公模仁，公模仁上设置有注塑凹槽，顶出机构包括顶出镶件，被配置于注塑凹槽的底部；注塑凹槽与流道连通，流道包括运输流道、环形流道和分流道，运输流道的一端与注入管连接，另一端通过连接件与环形流道连通，环形流道上连通有多个分流道，每个分流道与一个注塑凹槽连通。通过运输流道、环形流道和分流道的设置，将原料注入环形分布的注塑凹槽内，提高一次注塑的成型量，并通过注塑机的顶出块带动顶出镶件将注塑产品批量顶出，能够保障每个注塑产品的受力均匀，使顶出过程不易出现卡顿，提高注塑效率。
The utility model provides a mold for injection molding of electronic components, which is applied to the technical field of injection molds and includes an ejection mechanism, the ejection mechanism is embedded and connected to the inside of a male mold plate, the inside of the male mold plate is also provided with a male mold core, the male mold core is provided with an injection groove, and the ejection mechanism includes an ejection insert, which is arranged at the bottom of the injection groove; the injection groove is connected to a flow channel, the flow channel includes a transport flow channel, an annular flow channel and a branch flow channel, one end of the transport flow channel is connected to an injection pipe, and the other end is connected to the annular flow channel through a connector, and a plurality of branch flow channels are connected to the annular flow channel, and each branch flow channel is connected to an injection groove. Through the arrangement of the transport flow channel, the annular flow channel and the branch flow channel, the raw material is injected into the injection groove distributed in an annular manner, the molding amount of one injection is increased, and the ejection insert is driven by the ejection block of the injection molding machine to eject the injection products in batches, which can ensure that the force of each injection product is uniform, so that the ejection process is not prone to jamming, and the injection molding efficiency is improved.
Description
Technical Field
The utility model belongs to the technical field of injection molds, and particularly relates to a mold for injection molding of electronic elements.
Background
Injection molding is a method of producing shapes for industrial products, which are generally rubber injection molding and plastic injection molding. Injection molding machines are also known as injection molding machines or injection molding machines. It is a main forming equipment for making thermoplastic plastics or thermosetting plastics into various shaped plastic products by using plastic forming mould.
The application relates to an electronic product with smaller volume and smaller thickness, which is generally molded in batches by an injection molding machine, wherein in order to improve the injection molding efficiency of the electronic product, special layout is required for an injection molding runner, and in addition, a single ejector rod on the injection molding machine cannot realize batch ejection of the small-volume product and the product is required to be ejected by an ejection mechanism.
Disclosure of utility model
In view of the above problems in the prior art, the present utility model aims to provide a mold for injection molding of electronic components, wherein raw materials are injected into injection molding grooves distributed in an annular manner through the arrangement of a transportation runner, an annular runner and a sub runner, the molding amount of one injection molding is increased, and injection molding products are ejected in batches by driving an ejection insert through an ejection block of an injection molding machine, so that the stress of each injection molding product is ensured to be uniform, the ejection process is not easy to be blocked, and the injection molding efficiency is improved.
The injection molding die for the electronic component comprises an ejection mechanism which is driven by an ejection block of an injection molding machine to move up and down, wherein the ejection mechanism is embedded and connected in a male die plate, a male die core is further arranged in the male die plate, an injection molding groove is formed in the male die core, the ejection mechanism comprises an ejection insert which is arranged at the bottom of the injection molding groove, the injection molding groove is communicated with a runner, an injection molding product is formed in the injection molding groove after raw materials are injected into the runner, the runner comprises a conveying runner, an annular runner and a sub runner, one end of the conveying runner is connected with an injection pipe, the other end of the conveying runner is communicated with the annular runner through a connecting piece, a plurality of sub runners are communicated on the annular runner, and each sub runner is communicated with one injection molding groove.
Preferably, a plurality of sub-runners are arranged on two sides of the annular runner, the sub-runners on each side are distributed in an annular mode, and the sub-runners distributed in an annular mode on two sides form concentric rings.
Preferably, the injection pipe is positioned at the center of the annular flow channel, and the injection pipe uniformly injects the raw materials into the annular flow channel through a plurality of transport flow channels.
Preferably, the ejection mechanism further comprises a supporting block, one end of the ejection insert penetrates through the male die core to be in contact with the injection molding groove, the other end of the ejection insert is connected with the supporting block located in the male die plate, the bottom of the supporting block is connected with the ejection block, a spring is sleeved on the ejection block, and the spring is located between the supporting block and the ejection block.
Preferably, the ejection mechanism further comprises a fixed block, a clamping groove which is clamped with the ejection insert is formed in the fixed block, and the fixed block is located in the male die plate and located between the male die core and the supporting block.
The injection molding die for the electronic element has the beneficial effects that through the arrangement of the conveying runner, the annular runner and the sub-runners, raw materials are uniformly injected into the injection molding grooves distributed annularly, the molding quantity of one-time injection molding can be improved, and the injection molding efficiency is improved.
An ejection insert is arranged at the bottom of each injection molding groove, so that an ejection block of an injection molding machine drives the ejection inserts to eject injection molding products in batches, the stress of each injection molding product can be ensured to be uniform, the ejection process is not easy to be blocked, and the demolding efficiency is improved.
The fixing block is additionally arranged to clamp the ejection insert, so that a guiding effect is provided in the moving process of the ejection insert, and the moving stability of the ejection insert is improved.
Drawings
The accompanying drawings are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate the utility model and together with the embodiments of the utility model, serve to explain the utility model. In the drawings:
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the internal structure of the present utility model;
FIG. 3 is a schematic view of the structure of the ejector mechanism of the present utility model;
FIG. 4 is a front view of the ejection mechanism of the present utility model;
fig. 5 is an enlarged view at a in the structural schematic diagram 1 of the present utility model.
The drawing comprises a male mold plate 1, a male mold core 2, a male mold core 3, an ejection mechanism 4, an ejection block 5, a spring 6, a supporting block 7, a fixed block 8, an ejection insert 9, a runner 901, a conveying runner 902, a connecting piece 903, an annular runner 904, a split runner 10, an injection pipe 11, an injection product 12 and an injection groove.
Detailed Description
Example 1
As shown in fig. 1 to 5, a mold for injection molding of electronic components includes a male mold plate 1, a male mold core 2, an ejector mechanism 3, and a runner 9. Wherein, the male die core 2 is sleeved in the male die plate 1, the male die core 2 is provided with an injection molding groove 12, the injection molding groove 12 is communicated with the runner 9, and an injection molding product 11 is formed in the injection molding groove 12 after the runner 9 injects raw materials.
Specifically, as shown in fig. 2 to 4, the ejector mechanism 3 is driven by the ejector block 4 of the injection molding machine to move up and down, the ejector mechanism 3 is embedded and connected to the inside of the male mold plate 1, the ejector mechanism 3 includes a support block 6 and an ejector insert 8, and the ejector insert 8 is disposed at the bottom of the injection molding groove 12.
Further, one end of the ejection insert 8 passes through the male die core 2 to be in contact with the injection molding groove 12, the other end of the ejection insert is connected with the supporting block 6 positioned in the male die plate 1, the bottom of the supporting block 6 is connected with the ejection block 4, the ejection block 4 is sleeved with the spring 5, and the spring 5 is positioned between the supporting block 6 and the ejection block 4.
When the ejection block 4 of the injection molding machine moves upwards, the ejection insert 8 on the support block 6 is driven to move upwards, so that the ejection insert 8 can eject an injection molding product 11 formed in the injection molding groove 12, and at the moment, the spring 5 is compressed through elastic action, so that a certain movement stroke is provided for the ejection block 4.
In addition, since the ejector insert 8 is of an elongated long rod structure, in order to improve the stability during movement, the fixing block 7 is arranged in the male die plate 1, a clamping groove clamped with the ejector insert 8 is formed in the fixing block 7, the fixing block 7 is positioned between the male die core 2 and the supporting block 6, and the stability of movement of the ejector insert 8 is improved by the clamping structure between the fixing block 7 and the ejector insert 8.
On the other hand, in order to increase the amount of the product of one injection molding, the injection molding grooves 12 on the male mold core 2 are arranged in an annular distribution, as shown in fig. 1 and 5, the runner 9 comprises a transportation runner 901, an annular runner 903 and a split runner 904, one end of the transportation runner 901 is connected with the injection pipe 10, the other end of the transportation runner is communicated with the annular runner 903 through a connecting piece 902, a plurality of split runners 904 are communicated with the annular runner 903, and each split runner 904 is communicated with one injection molding groove 12.
Further, a plurality of sub-runners 904 are arranged on two sides of the annular runner 903, the sub-runners 904 on each side are distributed in an annular shape, the sub-runners 904 on the two sides are distributed in an annular shape to form concentric rings, the injection pipe 10 is positioned at the center of the annular runner 903, and the injection pipe 10 uniformly injects raw materials into the annular runner 903 through the plurality of conveying runners 901.
Injection molding raw materials are injected into the runner 9 through the injection pipe 10, and injection molding raw materials can be uniformly injected into the injection molding grooves 12 distributed in an annular mode by means of tracks formed by the conveying runner 901, the connecting piece 902, the annular runner 903 and the split runner 904, so that a plurality of injection molding grooves 12 can be simultaneously injected, and injection molding efficiency is improved.
Working principle when the mold for injection molding of the electronic component is used, injection molding raw materials are injected through the injection pipe 10, and the injection molding raw materials flow through the conveying runner 901, the connecting piece 902, the annular runner 903 and the shunt runner 904 and then enter the injection molding groove 12, so that injection molding of the injection molding product 11 is realized through the existing injection molding principle.
After the injection molding product 11 is molded, the supporting block 6 is driven to move upwards by the ejection block 4 of the injection molding machine in the prior art, so that the ejection insert 8 is driven to move upwards until the injection molding product 11 is ejected out of the injection molding groove 12, and batch demolding of the injection molding product 11 is realized.
The foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (5)
1. The injection molding die for the electronic component is characterized by comprising an ejection mechanism (3) which is driven by an ejection block (4) of an injection molding machine to move up and down, wherein the ejection mechanism (3) is embedded and connected in a male die plate (1), a male die core (2) is further arranged in the male die plate (1), an injection molding groove (12) is formed in the male die core (2), the ejection mechanism (3) comprises an ejection insert (8), and the ejection insert (8) is arranged at the bottom of the injection molding groove (12);
The injection molding groove (12) is communicated with the runner (9), and an injection molding product (11) is formed in the injection molding groove (12) after raw materials are injected into the runner (9);
The runner (9) comprises a transportation runner (901), an annular runner (903) and a split runner (904), one end of the transportation runner (901) is connected with the injection pipe (10), the other end of the transportation runner is communicated with the annular runner (903) through a connecting piece (902), a plurality of split runners (904) are communicated with the annular runner (903), and each split runner (904) is communicated with one injection molding groove (12).
2. The mold for injection molding of electronic components according to claim 1, wherein a plurality of sub-runners (904) are provided on both sides of the annular runner (903), the sub-runners (904) on each side are distributed in an annular shape, and the sub-runners (904) distributed in an annular shape on both sides form concentric rings.
3. The mold for injection molding of electronic components according to claim 1, wherein the injection pipe (10) is located at the center of the annular runner (903), and the injection pipe (10) uniformly injects the raw material into the annular runner (903) through a plurality of transport runners (901).
4. The mold for injection molding of electronic components according to claim 1, wherein the ejection mechanism (3) further comprises a supporting block (6), one end of the ejection insert (8) passes through the male mold core (2) to be in contact with the injection molding groove (12), the other end of the ejection insert is connected with the supporting block (6) positioned in the male mold plate (1), the bottom of the supporting block (6) is connected with the ejection block (4), a spring (5) is sleeved on the ejection block (4), and the spring (5) is positioned between the supporting block (6) and the ejection block (4).
5. The mold for injection molding of electronic components according to claim 4, wherein the ejection mechanism (3) further comprises a fixing block (7), a clamping groove clamped with the ejection insert (8) is formed in the fixing block (7), and the fixing block (7) is located in the male mold plate (1) and located between the male mold core (2) and the supporting block (6).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421010191.5U CN222245876U (en) | 2024-05-10 | 2024-05-10 | Mould for electronic component injection molding |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202421010191.5U CN222245876U (en) | 2024-05-10 | 2024-05-10 | Mould for electronic component injection molding |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222245876U true CN222245876U (en) | 2024-12-27 |
Family
ID=94011745
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202421010191.5U Active CN222245876U (en) | 2024-05-10 | 2024-05-10 | Mould for electronic component injection molding |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222245876U (en) |
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2024
- 2024-05-10 CN CN202421010191.5U patent/CN222245876U/en active Active
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