CN222235265U - Heat dissipation protection structure for vehicle-mounted equipment - Google Patents
Heat dissipation protection structure for vehicle-mounted equipment Download PDFInfo
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- CN222235265U CN222235265U CN202420945170.6U CN202420945170U CN222235265U CN 222235265 U CN222235265 U CN 222235265U CN 202420945170 U CN202420945170 U CN 202420945170U CN 222235265 U CN222235265 U CN 222235265U
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 184
- 238000009413 insulation Methods 0.000 claims abstract description 25
- 238000005034 decoration Methods 0.000 claims description 53
- 230000005855 radiation Effects 0.000 claims description 37
- 238000010438 heat treatment Methods 0.000 claims description 26
- 239000004964 aerogel Substances 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 8
- 238000003475 lamination Methods 0.000 claims description 5
- 238000010586 diagram Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 4
- 230000008569 process Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 230000006872 improvement Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005457 optimization Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920001296 polysiloxane Polymers 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 239000010425 asbestos Substances 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 230000003796 beauty Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000006260 foam Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- 229910052895 riebeckite Inorganic materials 0.000 description 1
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Abstract
本申请提供了一种车载设备散热保护结构，车载设备散热保护结构包括电路板组件及散热组件；散热组件包括散热件、散热装饰件及隔热层；散热件与电路板组件层叠设置，散热件用于对电路板组件进行散热；散热装饰件设置于散热件背向电路板组件的一侧，且散热装饰件具有沿电路板组件与散热件的层叠方向设置的散热通孔；隔热层设置于散热件与散热装饰件之间，隔热层用于在散热件和散热装饰件之间进行隔热。本申请提供的车载设备散热保护结构，能够减少使用者接触而烫伤的风险。
The present application provides a heat dissipation protection structure for vehicle-mounted equipment, which includes a circuit board assembly and a heat dissipation assembly; the heat dissipation assembly includes a heat sink, a heat dissipation decorative member and a heat insulation layer; the heat sink and the circuit board assembly are stacked, and the heat sink is used to dissipate heat from the circuit board assembly; the heat dissipation decorative member is arranged on the side of the heat sink facing away from the circuit board assembly, and the heat dissipation decorative member has a heat dissipation through hole arranged along the stacking direction of the circuit board assembly and the heat sink; the heat insulation layer is arranged between the heat sink and the heat dissipation decorative member, and the heat insulation layer is used to insulate between the heat sink and the heat dissipation decorative member. The heat dissipation protection structure for vehicle-mounted equipment provided by the present application can reduce the risk of burns caused by contact by users.
Description
Technical Field
The application belongs to the technical field of vehicle-mounted heat radiation protection, and particularly relates to a heat radiation protection structure of vehicle-mounted equipment.
Background
With the improvement of consumer demands and the continuous development and optimization of agricultural machinery, agricultural machinery vehicle-mounted products are generated. However, in the agricultural machine vehicle-mounted product provided by the prior art, the performance of the agricultural machine vehicle-mounted product used by the agricultural machine equipment is higher, so that the overall power consumption of the agricultural machine equipment is larger. As the CPU module and the 5G module in the agricultural machine vehicle-mounted product, the heat productivity is larger. Meanwhile, the agricultural machinery equipment needs to operate in an outdoor high-temperature environment, and the agricultural machinery vehicle-mounted product absorbs solar ultraviolet radiation, so that the surface temperature of the agricultural machinery equipment is too high, and a user can be scalded when contacting the agricultural machinery equipment.
Disclosure of utility model
For the defects existing in the prior art, the application provides the vehicle-mounted equipment heat dissipation protection structure, which can reduce the risk of scalding caused by contact of a user.
In one aspect, the present application provides a heat dissipation protection structure for a vehicle-mounted device, including:
Circuit board assembly, and
The heat dissipation assembly comprises a heat dissipation piece, a heat dissipation decoration piece and a heat insulation layer;
The heat dissipation part is arranged on the circuit board assembly in a lamination mode, the heat dissipation part is used for dissipating heat of the circuit board assembly, the heat dissipation decoration part is arranged on one side, facing away from the circuit board assembly, of the heat dissipation part, the heat dissipation decoration part is provided with a heat dissipation through hole arranged along the lamination direction of the circuit board assembly and the heat dissipation part, the heat insulation layer is arranged between the heat dissipation part and the heat dissipation decoration part, and the heat insulation layer is used for conducting heat insulation between the heat dissipation part and the heat dissipation decoration part.
In one possible embodiment, the insulating layer comprises a nanoporous structure or an aerogel.
In one possible embodiment, the number of the heat dissipation through holes is plural, and plural heat dissipation through holes are arranged in an array on the heat dissipation decoration piece.
In one possible embodiment, the heat dissipation decoration has a thermal conductivity less than or equal to 0.2W/(m×k).
In one possible embodiment, a side of the heat dissipation member facing away from the circuit board assembly has a recess, and the heat dissipation decoration and the heat insulation layer are both disposed in the recess.
In one possible embodiment, the vehicle-mounted device heat dissipation protection structure further comprises a shell structure and a display screen, wherein the shell structure is provided with a containing cavity, the display screen is arranged outside the containing cavity and is electrically connected with the circuit board assembly, the circuit board assembly is contained in the containing cavity, part of the heat dissipation assembly is arranged outside the containing cavity, and the other part of the heat dissipation assembly stretches into the containing cavity.
In one possible embodiment, the circuit board assembly comprises a circuit board and a heating element arranged on the circuit board, the heat dissipation element of the heat dissipation assembly comprises a heat dissipation step, the heat dissipation step protrudes towards the circuit board assembly, and the heat dissipation step stretches into the accommodating cavity and is in contact with the heating element
In one possible embodiment, the heating element comprises a first heating element and a second heating element which are arranged at intervals, the first heating element and the second heating element are arranged on the circuit board, the heat dissipation step comprises a first heat dissipation step and a second heat dissipation step which are arranged at intervals, the first heat dissipation step and the second heat dissipation step are arranged towards the circuit board component in a protruding mode, and the first heat dissipation step stretches into the accommodating cavity and is in contact with the first heating element, and the second heat dissipation step stretches into the accommodating cavity and is in contact with the second heating element.
In one possible embodiment, a heat conducting piece is arranged between the heating piece and the heat dissipation step and is used for conducting heat generated by the heating piece to the heat dissipation step, the heat conducting piece comprises a first heat conducting piece and a second heat conducting piece, the first heat conducting piece is arranged between the first heating piece and the first heat dissipation step, and the second heat conducting piece is arranged between the second heating piece and the second heat dissipation step.
In one possible embodiment, the housing structure includes a first housing, a second housing and a sealing ring, the first housing and the second housing are covered and form the accommodating cavity, the sealing ring is disposed between the first housing and the second housing, the display screen is disposed on a side of the first housing opposite to the second housing, the circuit board assembly is disposed between the first housing and the second housing, a part of the heat dissipation component is disposed on a side of the second housing opposite to the first housing, and the heat dissipation step of the heat dissipation component penetrates through the second housing and stretches into the accommodating cavity.
According to the vehicle-mounted equipment heat radiation protection structure, heat generated by heat generated in the working process of the circuit board assembly is conducted to the heat radiation piece, and the heat insulation layer is arranged between the heat radiation piece and the heat radiation decoration piece, so that on one hand, the heat conducted by the heat radiation piece to the heat radiation decoration piece can be reduced due to the heat insulation effect of the heat insulation layer, and a user can be prevented from being scalded due to the fact that the temperature of the heat radiation decoration piece is too high. And be provided with the heat dissipation through-hole on the heat dissipation decoration, be favorable to increasing the heat dissipation area of heat dissipation decoration, and then reduce the temperature of heat dissipation decoration. On the other hand, the heat insulation layer can reduce the conduction of external heat to the heat dissipation piece through the heat dissipation decoration piece, so that the conduction of external heat to the upper electronic component of the circuit board assembly can be reduced, and the damage of the electronic component of the circuit board assembly due to the overhigh ambient temperature can be prevented.
Drawings
In order to more clearly illustrate the technical solution of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described. It is obvious that the drawings in the following description are only some implementations provided by way of example of the present application, and that other drawings may be obtained from these drawings by those skilled in the art without the inventive effort.
Fig. 1 is an assembly structure diagram of a heat dissipation protection structure for a vehicle-mounted device according to an embodiment of the present application;
fig. 2 is an exploded view of a heat dissipation protection structure for a vehicle-mounted device according to an embodiment of the present application;
fig. 3 is a cross-sectional view of a heat dissipation protection structure for an in-vehicle apparatus according to an embodiment of the present application;
FIG. 4 is a block diagram of a circuit board assembly according to an embodiment of the present application;
fig. 5 is an exploded view of a heat dissipating assembly according to an embodiment of the present application.
Detailed Description
The technical solutions of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application. It will be apparent that the described embodiments are only some, but not all, of the embodiments of the application. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present application without making any inventive effort, are intended to fall within the scope of the present application.
The following description of the embodiments + references are made to the accompanying drawings that illustrate specific embodiments in which the application may be practiced. Directional terms, such as "upper", "lower", "front", "rear", "left", "right", "inner", "outer", "top", "side", "bottom", "top", "side wall", "bottom", "side wall", etc., in the description of the present application are merely directions referring to the attached drawings, and thus, directional terms are used for better, more clear explanation and understanding of the present application, rather than indicating or implying that the apparatus or element being referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as limiting the present application. In the description of the present application, references to "connected" and "coupled" are intended to include both direct connection (coupling) and indirect connection (coupling), unless otherwise indicated.
With the improvement of consumer demands and the continuous development and optimization of agricultural machinery, agricultural machinery vehicle-mounted products are generated. However, in the agricultural machine vehicle-mounted product provided by the prior art, the performance of the agricultural machine vehicle-mounted product used by the agricultural machine equipment is higher, so that the overall power consumption of the agricultural machine equipment is larger. As the CPU module and the 5G module in the agricultural machine vehicle-mounted product, the heat productivity is larger. Meanwhile, the agricultural machinery equipment needs to operate in an outdoor high-temperature environment, and the agricultural machinery vehicle-mounted product absorbs solar ultraviolet radiation, so that the surface temperature of the agricultural machinery equipment is too high, and a user can be scalded when contacting the agricultural machinery equipment.
In order to solve the technical problems generated by the prior art:
The application provides a vehicle-mounted equipment heat radiation protection structure, which is applied to agricultural equipment, engineering mechanical equipment, traffic equipment, transportation equipment, mineral equipment, industrial control equipment, medical equipment and the like, and is not limited by the application.
Referring to fig. 1, fig. 2 and fig. 3, fig. 1 is an assembly structure diagram of a heat dissipation protection structure for a vehicle device according to an embodiment of the application, fig. 2 is an exploded structure diagram of a heat dissipation protection structure for a vehicle device according to an embodiment of the application, and fig. 3 is a cross-sectional view of a heat dissipation protection structure for a vehicle device according to an embodiment of the application.
In one embodiment, taking the vehicle-mounted device heat dissipation protection structure 1000 as an example of a display device, the vehicle-mounted device heat dissipation protection structure 1000 includes a heat dissipation protection member 100, a housing structure 200, and a display screen 300. The housing structure 200 has a receiving cavity 201, a part of the heat dissipation protection member 100 is received in the receiving cavity 201, another part of the heat dissipation protection member 100 is disposed outside the receiving cavity 201, and the display screen 300 is disposed outside the receiving cavity 201.
The heat radiation protection component 100 of the vehicle-mounted device heat radiation protection structure 1000 comprises a circuit board assembly 10 and a heat radiation assembly 20, wherein the circuit board assembly 10 is electrically connected with the display screen 300, the heat radiation assembly 20 and the circuit board assembly 10 are stacked, and the heat radiation assembly 20 is used for radiating heat to the circuit board assembly 10 so as to reduce damage of electronic components on the circuit board assembly 10 due to overheating, and further ensure that the circuit board assembly 10 can work normally. Meanwhile, the heat dissipation assembly 20 is further used for isolating heat emitted by the circuit board assembly 10, so as to prevent the heat dissipation assembly 20 from being overheated and scalding a user.
The shell structure 200 comprises a first shell 202, a second shell 203 and a sealing element 204, wherein the first shell 202 and the second shell 203 are covered with each other to form a containing cavity 201, the sealing element 204 is clamped between the peripheral edge of one side of the first shell 202 facing the second shell 203 and the peripheral edge of one side of the second shell 203 facing the first shell 202, so that the containing cavity 201 formed after the first shell 202 and the second shell 203 are covered with each other has better sealing performance, and the display screen 300 has better waterproof performance.
The circuit board assembly 10 is disposed in a containing cavity 201 formed by the first housing 202 and the second housing 203, a part of the heat dissipation assembly 20 is disposed on one side of the second housing 203 opposite to the first housing 202, another part of the heat dissipation assembly 20 penetrates through the second housing 203 and extends into the containing cavity 201 formed by the first housing 202 and the second housing 203, the display screen 300 is disposed on one side of the first housing 202 opposite to the second housing 203, and the display screen 300 is adhered and fixed on the first housing 202 through foam glue.
It should be understood that the assembly process of the vehicle-mounted device heat dissipation protection structure 1000 is as follows:
First, the display screen 300 is mounted to a side of the first housing 202 facing away from the second housing 203, and is held by a holding jig for 15 seconds.
Then, the heat sink assembly 20 is mounted to the side of the second housing 203 facing away from the first housing 202, and the heat sink assembly 20 is locked to the second housing 203 by screws.
Then, the seal 204 is provided on the side of the second housing 203 facing the first housing 202.
Then, the circuit board assembly 10 is mounted to the side of the second housing 203 facing the first housing 202, and the circuit board assembly 10 is locked to the second housing 203 by screws.
Finally, the first housing 202 mounted with the display 300 and the second housing 203 mounted with the heat sink assembly 20, the sealing member 204 and the circuit board assembly 10 are fastened, and the first housing 202 and the second housing 203 are fastened by a screw-fastening process.
Referring to fig. 2 to 5, fig. 4 is a block diagram of a circuit board assembly according to an embodiment of the application, and fig. 5 is an exploded block diagram of a heat dissipating assembly according to an embodiment of the application.
In the vehicle-mounted device heat radiation protection structure 1000 provided in the present embodiment, the heat radiation protection member 100 includes the circuit board assembly 10 and the heat radiation assembly 20. The heat dissipation assembly 20 includes a heat dissipation member 21, a heat dissipation decoration member 22, and a heat insulation layer 23, wherein the heat dissipation member 21 and the circuit board assembly 10 are stacked, and the heat dissipation member 21 is used for dissipating heat from the circuit board assembly 10. The heat dissipation decoration 22 is disposed on a side of the heat dissipation member 21 facing away from the circuit board assembly 10, and the heat dissipation decoration 22 has a heat dissipation through hole 221 disposed along a lamination direction of the circuit board assembly 10 and the heat dissipation member 21. The heat insulating layer 23 is disposed between the heat sink 21 and the heat sink decoration 22, and the heat insulating layer 23 is used for insulating heat between the heat sink 21 and the heat sink decoration 22.
According to the vehicle-mounted equipment heat radiation protection structure 1000 provided by the application, heat generated by heat generated in the working process of the circuit board assembly 10 can be conducted to the heat radiation member 21, and the heat insulation layer 23 is arranged between the heat radiation member 21 and the heat radiation decoration member 22, so that on one hand, the heat conducted by the heat radiation member 21 to the heat radiation decoration member 22 can be reduced due to the heat insulation effect of the heat insulation layer 23, and a user can be prevented from being scalded due to the fact that the temperature of the heat radiation decoration member 22 is too high. In addition, the heat dissipation through hole 221 is arranged on the heat dissipation decoration piece 22, and the heat dissipation through hole 221 is directly contacted with air, so that a heat propagation path can be reduced, the heat dissipation area of the heat dissipation decoration piece 22 is increased, and the temperature of the heat dissipation decoration piece 22 is reduced. On the other hand, the heat insulating layer 23 can reduce the conduction of external heat to the heat sink 21 through the heat sink decoration 22, so as to reduce the conduction of external heat to the upper electronic component of the circuit board assembly 10, and prevent the damage of the electronic component of the circuit board assembly 10 due to the over-high ambient temperature.
Referring to fig. 2 to 5, in one embodiment, a circuit board assembly 10 of a heat dissipation protection member 100 includes a circuit board 11 and a heat generating element 12 disposed on the circuit board 11. The heat dissipation member 21 of the heat dissipation assembly 20 includes a heat dissipation step 211, the heat dissipation step 211 protrudes toward the circuit board assembly 10, and the heat dissipation step 211 penetrates through the second housing 203 of the housing structure 200 and extends into the accommodating cavity 201. The heat generating element 12 and the heat dissipation step 211 are opposite and arranged at intervals, a heat conducting element 24 is arranged between the heat generating element 12 and the heat dissipation step 211, and the heat conducting element 24 is used for conducting heat generated by the heat generating element 12 to the heat dissipation step 211. On the one hand, the distance between the heat generating element 12 and the heat radiating element 21 is reduced by the sum of the heat radiating steps 211 so that the heat generated by the heat generating element 12 is conducted to the heat radiating steps 211 of the heat radiating element 21. On the other hand, by the arrangement of the heat conducting member 24, the speed of conducting the heat generated by the heat generating member 12 to the heat dissipating member 21 can be increased, so that the heat generating member 12 on the circuit board 11 can dissipate heat in time.
In a specific embodiment, the heat generating component 12 includes a first heat generating component 121 and a second heat generating component 122 disposed at intervals, and the first heat generating component 121 and the second heat generating component 122 are disposed on the circuit board 11. Taking the application of the heat dissipation protection member 100 to a display device as an example, the first heat generating component 121 of the circuit board assembly 10 is a CPU module, and the second heat generating component 122 of the circuit board assembly 10 is a 5G module. It should be understood that the first heat generating element 121 and the second heat generating element 122 may be other electronic components or electronic modules, which is not limited in the present application. The heat dissipation steps 211 include a first heat dissipation step 2111 and a second heat dissipation step 2112 that are disposed at intervals, the first heat dissipation step 2111 and the second heat dissipation step 2112 are all disposed towards the circuit board assembly 10 in a protruding manner, and the first heat dissipation step 2111 and the second heat dissipation step 2112 are all disposed through the second housing 203 of the housing structure 200 and extend into the accommodating cavity 201. The heat conductive member 24 includes a first heat conductive member 241 and a second heat conductive member 242, the first heat conductive member 241 is disposed between the first heat generating member 121 and the first heat dissipation step 2111, and the second heat conductive member 242 is disposed between the second heat generating member 122 and the second heat dissipation step 2112.
In this embodiment, the first heat conducting member 241 and the second heat conducting member 242 are both made of heat conducting gel, and the air between the first heat generating member 121 and the first heat dissipation step 2111 and the air between the second heat generating member 122 and the second heat dissipation step 2112 are discharged through the heat conducting gel, so that the heat conduction barrier of the air to the first heat generating member 121 and the second heat generating member 122 can be reduced, and the heat dissipation efficiency and the heat dissipation speed of the first heat generating member 121 and the second heat generating member 122 can be improved.
It will be appreciated that in some other embodiments, the first and second heat conductive members 241 and 242 may be a heat conductive silicone, a heat conductive silicone grease, copper, etc., which the present application is not limited to.
It will be appreciated that in some other embodiments, the first heat conducting member 241 and the second heat conducting member 242 may be omitted, the first heat dissipating member 21 is closely attached to the surface of the first heat dissipating step 2111, and the second heat dissipating member 21 is closely attached to the surface of the second heat dissipating step 2112, which is not limited in this respect.
Referring to fig. 2 to 5, in one embodiment, the heat insulation layer 23 is aerogel, the density of the aerogel is only 3.55kg/m 3, the density of the aerogel is only 2.75 times of the air density, the heat insulation effect is achieved through the nano porous net structure in the aerogel, and the heat insulation effect of the aerogel can reduce the heat conducted by the heat dissipation element 21 to the heat dissipation decoration 22 by arranging the aerogel between the heat dissipation element 21 and the heat dissipation decoration 22, so that the user can be prevented from being scalded due to the overhigh temperature of the heat dissipation decoration 22. In addition, the heat dissipation through hole 221 is formed on the heat dissipation decoration 22, which is beneficial to increasing the heat dissipation area of the heat dissipation decoration 22, thereby reducing the temperature of the heat dissipation decoration 22. On the other hand, the aerogel can reduce the conduction of external heat to the heat dissipation member 21 through the heat dissipation decoration member 22, so that the conduction of external heat to the upper electronic component of the circuit board assembly 10 can be reduced, and the damage of the electronic component of the circuit board assembly 10 due to the excessively high ambient temperature can be prevented.
It should be appreciated that in some other embodiments, the insulating layer 23 may be a nanoporous structure of other materials, as the application is not limited in this regard.
Referring to fig. 2 to 5, in one embodiment, the number of heat dissipation through holes 221 on the heat dissipation decoration 22 in the heat dissipation protection member 100 is plural, and the plurality of heat dissipation through holes 221 are arranged in an array on the heat dissipation decoration 22. The plurality of heat dissipation through holes 221 are arranged in an array, so that the heat dissipation area of the heat dissipation assembly 20 can be increased, and the beauty of the heat dissipation protection member 100 can be improved.
Referring to fig. 2 to 5, in one embodiment, the thermal conductivity of the heat dissipating decoration 22 in the heat dissipating protection member 100 is less than or equal to 0.2W/(m×k), and by limiting the thermal conductivity of the heat dissipating decoration 22 to be less than or equal to 0.2W/(m×k), the heat dissipating decoration 22 is reduced to be conducted onto the heat dissipating decoration 22 by the heat dissipating part 21, so that the heat dissipating decoration 22 is not overheated, and the risk of a user being scalded due to touching the heat dissipating decoration 22 is reduced. It is understood that the heat dissipating decoration 22 according to the present embodiment includes, but is not limited to, plastic, asbestos, silicate, etc.
Referring to fig. 2 to 5, in one embodiment, a side of the heat dissipation element 21 of the heat dissipation protection member 100 facing away from the circuit board assembly 10 has a recess 212, and the heat dissipation decoration 22 and the heat insulation layer 23 are disposed in the recess 212, so that a surface of the side of the heat dissipation decoration 22 facing away from the heat dissipation element 21 does not expose the recess 212 of the heat dissipation element 21, which can make the overall volume of the heat dissipation protection member 100 smaller and is beneficial to assembling the heat dissipation protection member 100.
While the foregoing is directed to embodiments of the present application, it will be appreciated by those skilled in the art that changes and modifications may be made without departing from the principles of the application, and such changes and modifications are intended to be included within the scope of the application.
Claims (10)
1. The utility model provides a vehicle-mounted equipment heat dissipation protection structure which characterized in that includes:
Circuit board assembly, and
The heat dissipation assembly comprises a heat dissipation piece, a heat dissipation decoration piece and a heat insulation layer;
The heat dissipation part is arranged on the circuit board assembly in a lamination mode, the heat dissipation part is used for dissipating heat of the circuit board assembly, the heat dissipation decoration part is arranged on one side, facing away from the circuit board assembly, of the heat dissipation part, the heat dissipation decoration part is provided with a heat dissipation through hole arranged along the lamination direction of the circuit board assembly and the heat dissipation part, the heat insulation layer is arranged between the heat dissipation part and the heat dissipation decoration part, and the heat insulation layer is used for conducting heat insulation between the heat dissipation part and the heat dissipation decoration part.
2. The heat radiation protection structure for an in-vehicle apparatus according to claim 1, wherein,
The insulating layer comprises a nanoporous structure or an aerogel.
3. The heat radiation protection structure for an in-vehicle apparatus according to claim 1, wherein,
The number of the heat dissipation through holes is multiple, and the heat dissipation through holes are arranged in an array on the heat dissipation decoration.
4. The heat radiation protection structure for an in-vehicle apparatus according to claim 1, wherein,
The heat conductivity coefficient of the heat dissipation decoration is less than or equal to 0.2W/(M.times.K).
5. The heat radiation protection structure for an in-vehicle apparatus according to claim 1, wherein,
The side of the heat dissipation piece, which is opposite to the circuit board assembly, is provided with a recess, and the heat dissipation decoration piece and the heat insulation layer are arranged in the recess.
6. The heat radiation protection structure for an in-vehicle apparatus according to claim 1, wherein,
The vehicle-mounted equipment heat dissipation protection structure further comprises a shell structure and a display screen, wherein the shell structure is provided with a containing cavity, the display screen is arranged outside the containing cavity and is electrically connected with the circuit board assembly, the circuit board assembly is contained in the containing cavity, part of the heat dissipation assembly is arranged outside the containing cavity, and the other part of the heat dissipation assembly extends into the containing cavity.
7. The heat radiation protection structure for an in-vehicle apparatus according to claim 6, wherein,
The circuit board assembly comprises a circuit board and a heating element arranged on the circuit board;
The heat dissipation component comprises a heat dissipation step, the heat dissipation step protrudes towards the circuit board component, and the heat dissipation step stretches into the accommodating cavity and contacts with the heating component.
8. The heat radiation protection structure for an in-vehicle apparatus according to claim 7, wherein,
The heating element comprises a first heating element and a second heating element which are arranged at intervals, and the first heating element and the second heating element are arranged on the circuit board;
The heat dissipation steps comprise first heat dissipation steps and second heat dissipation steps which are arranged at intervals, the first heat dissipation steps and the second heat dissipation steps are arranged towards the circuit board assembly in a protruding mode, the first heat dissipation steps extend into the accommodating cavity and are in contact with the first heating piece, and the second heat dissipation steps extend into the accommodating cavity and are in contact with the second heating piece.
9. The heat radiation protection structure for an in-vehicle apparatus according to claim 8, wherein,
The heat-conducting piece is arranged between the heating piece and the heat-radiating step and used for conducting heat generated by the heating piece to the heat-radiating step, and comprises a first heat-conducting piece and a second heat-conducting piece, wherein the first heat-conducting piece is arranged between the first heating piece and the first heat-radiating step, and the second heat-conducting piece is arranged between the second heating piece and the second heat-radiating step.
10. The heat radiation protection structure for an in-vehicle apparatus according to claim 7, wherein,
The shell structure comprises a first shell, a second shell and a sealing ring, wherein the first shell and the second shell are covered and form the accommodating cavity, and the sealing ring is arranged between the first shell and the second shell;
The display screen is arranged on one side of the first shell, which is opposite to the second shell;
the circuit board assembly is arranged between the first shell and the second shell;
The heat dissipation component is arranged on one side, opposite to the first shell, of the second shell, and the heat dissipation step of the heat dissipation component penetrates through the second shell and stretches into the accommodating cavity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420945170.6U CN222235265U (en) | 2024-04-30 | 2024-04-30 | Heat dissipation protection structure for vehicle-mounted equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420945170.6U CN222235265U (en) | 2024-04-30 | 2024-04-30 | Heat dissipation protection structure for vehicle-mounted equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222235265U true CN222235265U (en) | 2024-12-24 |
Family
ID=93911317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420945170.6U Active CN222235265U (en) | 2024-04-30 | 2024-04-30 | Heat dissipation protection structure for vehicle-mounted equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222235265U (en) |
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2024
- 2024-04-30 CN CN202420945170.6U patent/CN222235265U/en active Active
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