CN222234660U - A power module - Google Patents
A power module Download PDFInfo
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- CN222234660U CN222234660U CN202420712064.3U CN202420712064U CN222234660U CN 222234660 U CN222234660 U CN 222234660U CN 202420712064 U CN202420712064 U CN 202420712064U CN 222234660 U CN222234660 U CN 222234660U
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- power module
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- heat dissipation
- power
- cooling plate
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- 238000001816 cooling Methods 0.000 claims abstract description 69
- 230000017525 heat dissipation Effects 0.000 claims abstract description 54
- 230000003247 decreasing effect Effects 0.000 claims abstract description 4
- 239000000758 substrate Substances 0.000 claims description 43
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 36
- 239000003990 capacitor Substances 0.000 claims description 15
- 239000004020 conductor Substances 0.000 claims description 14
- 239000000853 adhesive Substances 0.000 claims description 7
- 230000001070 adhesive effect Effects 0.000 claims description 7
- 229910052751 metal Inorganic materials 0.000 claims description 6
- 239000002184 metal Substances 0.000 claims description 6
- 239000000919 ceramic Substances 0.000 claims description 5
- 230000005855 radiation Effects 0.000 description 15
- 238000000034 method Methods 0.000 description 6
- 230000005540 biological transmission Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000002349 favourable effect Effects 0.000 description 2
- 230000005669 field effect Effects 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 238000002955 isolation Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004519 grease Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本实用新型提供了一种电源模块，涉及电力电子技术领域，为解决现有技术提供的散热冷却方案，无法满足大功率电源模块在有限体积下的散热需求的问题而设计。该电源模块包括散热需求依次递减的第一器件和第二器件，以及沿高度方向排布的电源外壳和水冷板，电源外壳具有敞口和对外接口，水冷板设置于敞口并与电源外壳连接形成容纳腔；容纳腔具有沿高度方向排布的第一空间和第二空间，其中，第一空间邻近水冷板，第一空间固定设置有散热鳍片，第一器件安装于散热鳍片；第二器件位于第二空间。本实用新型能够满足大功率电源模块在有限体积下的散热需求。
The utility model provides a power module, which relates to the field of power electronics technology, and is designed to solve the problem that the heat dissipation and cooling solutions provided by the prior art cannot meet the heat dissipation requirements of high-power power modules under limited volume. The power module includes a first component and a second component with decreasing heat dissipation requirements, and a power housing and a water-cooling plate arranged along the height direction, the power housing has an opening and an external interface, the water-cooling plate is arranged at the opening and connected to the power housing to form a receiving cavity; the receiving cavity has a first space and a second space arranged along the height direction, wherein the first space is adjacent to the water-cooling plate, the first space is fixedly provided with heat dissipation fins, the first component is installed on the heat dissipation fins; the second component is located in the second space. The utility model can meet the heat dissipation requirements of high-power power modules under limited volume.
Description
Technical Field
The utility model relates to the technical field of power electronics, in particular to a power supply module.
Background
The rapid growth of the semiconductor industry is increasingly demanding high power supplies with stable and fast output. The power supply has large heating value and has higher requirements for heat dissipation and cooling. However, due to the limited volume of such power supplies, the heat dissipation and cooling scheme provided by the prior art cannot meet the heat dissipation requirement of such high-power supply modules under the limited volume.
Disclosure of utility model
The utility model aims to provide a power module to solve the technical problem that the heat dissipation and cooling scheme provided by the prior art cannot meet the heat dissipation requirement of a high-power module under a limited volume.
The power module provided by the utility model is provided with a first device and a second device with successively decreasing heat dissipation requirements. The power module comprises a power shell and a water cooling plate, wherein the power shell and the water cooling plate are arranged along the height direction of the power shell, the power shell is provided with an opening and an external interface, the water cooling plate is arranged on the opening and is connected with the power shell to form a containing cavity, the containing cavity is provided with a first space and a second space, the first space is arranged along the height direction, the first space is adjacent to the water cooling plate, radiating fins are fixedly arranged in the first space, the first device is mounted on the radiating fins, and the second device is located in the second space.
Further, the power module further comprises a substrate, the substrate is fixedly arranged in the accommodating cavity and is spaced from the water cooling plate, the accommodating cavity is divided into a first space and a second space by the substrate, and the second device is mounted on the substrate.
Further, one end of each radiating fin is arranged on the water cooling plate, and the other end of each radiating fin is fixedly connected with the base plate.
Further, the first device comprises a MOS tube (Metal Oxide Semiconductor FIELD EFFECT Transistor, metal oxide semiconductor type field effect tube), a ceramic plate for separating the MOS tube and the radiating fins is arranged between the MOS tube and the radiating fins, and the surface of the radiating fins is coated with a heat conducting material.
Further, the second device comprises a plurality of circuit boards, wherein the circuit boards comprise a first circuit board and a second circuit board, the first circuit board is vertically connected to the substrate, and the second circuit board is parallel to the substrate.
The power module comprises a plurality of substrates, wherein the plurality of substrates are distributed in a dispersed manner, a heat dissipation space is formed between at least two substrates, a transformer of the power module is arranged in the heat dissipation space, and the power module further comprises heat conduction structural adhesive, wherein the transformer is arranged on the water cooling plate, and the heat conduction structural adhesive wraps the transformer.
Further, the power module further comprises a cooling fan, the cooling fan is installed in the cooling space, and the cooling fan is located above the transformer.
Further, the heat dissipation fans are mounted on the first circuit board, and/or the number of the heat dissipation fans is a plurality.
Further, the second device further comprises a capacitor, wherein the capacitor is of a cylindrical structure, and the axis of the capacitor is perpendicular to the substrate.
Further, the power resistor of the power supply module is arranged in the second space and is arranged on the side wall of the power supply shell, and/or the water cooling plate is made of metal, and/or one surface of the water cooling plate, which faces away from the accommodating cavity, is coated with a heat conducting material, and/or the power supply shell is made of metal, and/or at least one of the inner surface and the outer surface of the power supply shell is coated with a heat conducting material.
The power module has the beneficial effects that:
When the power module is used, electric energy and communication transmission are realized by using the external interface. The accommodating cavity of the power module is divided into the first space and the second space which are distributed along the height direction of the accommodating cavity, the first device with higher heat dissipation requirement is arranged in the first space adjacent to the water cooling plate, the second device with lower heat dissipation requirement is arranged in the second space far away from the water cooling plate, and therefore, not only can the timely heat dissipation and cooling of the first device with high heat dissipation requirement be achieved, the normal work of the power module is prevented from being influenced due to overlarge heat productivity of the first device, but also the effective utilization of the space of the power module in the height direction can be achieved, the waste of the inner space of the power module is reduced, and the heat dissipation requirement of the high-power module under a limited volume is well met.
In addition, through setting up the second device in the second space that is far away from the water-cooling board, still realized effective isolation of second device and water-cooling board, avoid the second device directly to receive the influence of the comdenstion water of water-cooling board.
Drawings
In order to more clearly illustrate the embodiments of the present utility model or the technical solutions in the prior art, the drawings that are required to be used in the embodiments or the description of the prior art will be briefly described below, and it is obvious that the drawings in the following description are only embodiments of the present utility model, and that other drawings can be obtained according to the provided drawings without inventive effort for a person skilled in the art.
Fig. 1 is a schematic diagram of an internal structure of a power module according to an embodiment of the present utility model.
Reference numerals illustrate:
011-MOS tube, 021-first circuit board, 022-second circuit board, 023-capacitor, 031-transformer, 041-power resistor;
100-power supply shell, 110-external interface, 200-water cooling plate, 300-holding cavity, 310-first space, 320-second space, 330-heat dissipation space, 400-heat dissipation fins, 500-base plate, 600-heat dissipation fan and 700-support column.
Detailed Description
In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
Fig. 1 is a schematic diagram of an internal structure of a power module according to the present embodiment. As shown in fig. 1, the present embodiment provides a power module, which is provided with a first device and a second device with heat dissipation requirements decreasing in sequence, specifically, the power module includes a power housing 100 and a water cooling plate 200 arranged along a height direction thereof, the power housing 100 has an opening and an external interface 110, the water cooling plate 200 is disposed at the opening and is connected with the power housing 100 to form a receiving cavity 300, the receiving cavity 300 has a first space 310 and a second space 320 arranged along the height direction, wherein the first space 310 is adjacent to the water cooling plate 200, the first space 310 is fixedly provided with heat dissipation fins 400, the first device is mounted on the heat dissipation fins 400, and the second device is disposed in the second space 320.
It should be noted that, the height direction of the power module is the up-down direction in the view angle of fig. 1.
When the power module is in use, the external interface 110 is utilized to realize electric energy and communication transmission. Through dividing the accommodating cavity 300 of the power module into a first space 310 and a second space 320 which are distributed along the height direction of the accommodating cavity, and arranging a first device with higher heat dissipation requirements in the first space 310 adjacent to the water cooling plate 200, arranging a second device with lower heat dissipation requirements in the second space 320 far away from the water cooling plate 200, not only can timely heat dissipation and cooling of the first device with high heat dissipation requirements be realized, the normal work of the power module is prevented from being influenced due to overlarge heat productivity of the first device, but also the effective utilization of the space of the power module in the height direction can be realized, the waste of the internal space of the power module is reduced, and therefore the heat dissipation requirements of the high-power module, especially the heat dissipation of the high-power density power module, are well met under the limited volume.
In addition, by disposing the second device in the second space 320 farther from the water-cooling plate 200, effective isolation of the second device from the water-cooling plate 200 is also achieved, avoiding the second device from being directly affected by the condensed water of the water-cooling plate 200.
Referring to fig. 1, in this embodiment, the power module may further include a substrate 500, specifically, the substrate 500 is fixedly disposed in the accommodating cavity 300 and spaced from the water cooling plate 200, the substrate 500 divides the accommodating cavity 300 into a first space 310 and a second space 320, and the second device is mounted on the substrate 500.
By providing the above-mentioned substrate 500, on the one hand, effective separation of the accommodating chamber 300 can be achieved to obtain the first space 310 and the second space 320 arranged along the height direction thereof inside the power module, and on the other hand, the provision of the substrate 500 also provides a mounting foundation for the second device, and while facilitating arrangement of the second device, mounting stability of the second device is also improved.
Referring to fig. 1, in the present embodiment, a substrate 500 is fixedly connected to a water cooling plate 200 through a plurality of support columns 700, and the support columns 700 are used to support the substrate 500. This arrangement not only ensures the mounting stability of the substrate 500, but also reduces the weight of the power module as a whole.
It should be noted that, in other embodiments, the heat dissipation fins 400 may also be used to support the second device, and this arrangement makes the heat generated by the second device be dissipated through the heat dissipation fins 400, which is beneficial to improving the heat dissipation efficiency.
Referring to fig. 1, in the present embodiment, one end of the heat sink fin 400 is mounted on the water cooling plate 200, and the other end of the heat sink fin 400 is fixedly connected to the substrate 500. Specifically, the heat dissipation fin 400 includes a connection column and fins disposed at the outer periphery of the connection column, wherein the connection column is connected to the water cooling plate 200, and the fins are parallel to the water cooling plate 200.
This connection of the heat radiation fins 400 can also play a certain supporting role on the substrate 500 while ensuring heat radiation efficiency.
Specifically, the heat sink fins 400 are vertically installed to the water-cooling plate, that is, the connection columns of the heat sink fins 400 are vertically connected to the water-cooling plate 200.
With continued reference to fig. 1, in this embodiment, the first device includes a MOS tube 011, a ceramic plate (not shown in the figure) for separating the MOS tube 011 and the heat sink fin 400 is disposed between the MOS tube 011 and the heat sink fin 400, and a surface of the heat sink fin 400 is coated with a heat conductive material.
By arranging the ceramic plates between the MOS tube 011 and the radiating fins 400, insulation between the MOS tube 011 and the power supply housing 100 can be realized, and by coating the surface of the radiating fins 400 with a heat conducting material, heat emitted by the MOS tube 011 can be rapidly led out to the radiating fins 400, so that the radiating efficiency is improved, and the radiating effect is ensured.
Specifically, the material of the ceramic sheet may be alumina.
With continued reference to fig. 1, in the present embodiment, the second device includes a plurality of circuit boards, the plurality of circuit boards includes a first circuit board 021 and a second circuit board 022, wherein the first circuit board 021 is vertically connected to the substrate 500, and the second circuit board 022 is parallel to the substrate 500.
Through setting up a plurality of circuit boards of power module to erect and put + the form of arranging transversely, on the one hand, erect the first circuit board 021 of arranging and can realize the effective utilization to power module upper portion space, be favorable to reducing power module's volume, on the other hand, the purpose of outputting the signal through external interface 110 can be satisfied to horizontal second circuit board 022 to guarantee power module's service function.
In this embodiment, the first circuit board 021 and the second circuit board 022 may be PCBs (Printed Circuit Board, printed circuit boards).
Referring to fig. 1, in the embodiment, the number of the substrates 500 is plural, the substrates 500 are distributed and arranged, and a heat dissipation space 330 is formed between at least two substrates 500, and a transformer 031 of the power module is disposed in the heat dissipation space 330, and the power module further includes a heat-conducting structural adhesive, wherein the transformer 031 is mounted on the water-cooling plate 200, and the heat-conducting structural adhesive wraps the transformer 031. In particular, in the present embodiment, the number of the substrates 500 is two, the two substrates 500 are arranged in the left-right direction (under the view of fig. 1), and the heat dissipation space 330 is formed between the two substrates 500.
Through setting up a plurality of base plates 500 interval for can form heat dissipation space 330 between base plate 500, thereby can realize the arrangement to the great transformer 031 of power module in, and, wrap up transformer 031 through utilizing heat conduction structure to glue, make the heat that produces in the transformer 031 course of working can be through heat conduction structure glue to heat dissipation space 330 and water-cooling plate 200 transmission, improved the radiating efficiency of transformer 031, guaranteed the operating temperature when high-power output in the safe range.
In this embodiment, when the transformer 031 is wrapped with the heat conductive adhesive, the input and output lines of the transformer 031 need to be led out.
With continued reference to fig. 1, in the present embodiment, the power module may further include a cooling fan 600, specifically, the cooling fan 600 is installed in the cooling space 330, and the cooling fan 600 is located at a side of the transformer 031 away from the water-cooling plate 200. That is, in the view of fig. 1, the heat radiation fan 600 is located above the transformer 031.
By arranging the heat radiation fan 600 above the transformer 031 in the heat radiation space 330, the work of the heat radiation fan 600 can be utilized to increase the gas fluidity of the heat radiation space 330, so that the hot gas is discharged as soon as possible, thereby further improving the heat radiation efficiency of the power module of this embodiment.
With continued reference to fig. 1, in the present embodiment, the heat dissipation fan 600 is mounted on the first circuit board 021.
This setting utilizes first circuit board 021 as the installation basis of radiator fan 600, need not to additionally set up the mounting structure who is used for installing radiator fan 600, on the one hand, can reduce the occupation to power module inner space, is favorable to reducing power module's volume, on the other hand, can also reduce power module's cost.
With continued reference to fig. 1, in the present embodiment, the number of the heat dissipation fans 600 is plural. In particular, in the present embodiment, the number of the heat radiation fans 600 is two, and the two heat radiation fans 600 are arranged side by side in the left-right direction (under the view of fig. 1).
By increasing the number of the heat radiation fans 600, the gas fluidity of the heat radiation space 330 can be improved, thereby further improving the heat radiation efficiency.
With continued reference to fig. 1, in this embodiment, the second device further includes a capacitor 023, where the capacitor 023 has a cylindrical structure, the capacitor 023 is mounted on the substrate 500 through one end surface, and an axis of the capacitor 023 is perpendicular to the substrate 500.
That is, the device with lower heat dissipation requirements in the power module further includes a capacitor 023. By mounting the capacitor 023 to the substrate 500 in a posture with its axis perpendicular to the substrate 500, the capacitor 023 is also in a vertical state, and also effective utilization of the upper space of the power module can be achieved, thereby being advantageous in reducing the volume of the power module.
With continued reference to fig. 1, in the present embodiment, the power resistor 041 of the power module is disposed in the second space 320, and the power resistor 041 is mounted on a side wall of the power housing 100. The power resistor 041 may be an ultra-thin resistor.
During use of the power module, the power resistor 041 consumes energy stored in the capacitor 023 and also has heat dissipation requirements. By mounting the power resistor 041 on the side wall of the power supply housing 100, heat generated by the power resistor 041 can be dissipated by using the power supply housing 100, on one hand, the mounting base of the power resistor 041 is formed by using the power supply housing 100, so that the mounting reliability of the power resistor 041 is ensured, and on the other hand, the lower heat dissipation requirement of the power resistor 041 can be met.
In this embodiment, the water cooling plate 200 is made of metal. This arrangement can ensure the heat radiation reliability of the water cooling plate 200.
In actual use, the power module can directly contact the water cooling device through the water cooling plate 200, and dissipate heat through heat conduction.
Specifically, the water cooling plate 200 may be made of aluminum alloy.
In this embodiment, the side of the water-cooled plate 200 facing away from the receiving chamber 300 is coated with a thermally conductive material. This arrangement can accelerate the heat conduction rate of the water cooling plate 200 to the water cooling apparatus, thereby improving the heat radiation efficiency.
In particular, in view of fig. 1, the lower surface of the water-cooled plate 200 is coated with a heat conductive material.
In this embodiment, the power supply housing 100 is made of metal. This arrangement not only ensures the structural strength of the power supply housing 100, but also can increase the electromagnetic compatibility of the power supply module.
In this embodiment, at least one of the inner surface and the outer surface of the power supply housing 100 is coated with a thermally conductive material. This arrangement can improve the heat dissipation efficiency of the power supply housing 100.
In this embodiment, the heat conducting material coated by the heat dissipating fins 400, the heat conducting material coated by the water cooling plate 200, and the heat conducting material coated by the power supply housing 100 may be heat conducting silicone grease.
Although the present utility model is disclosed above, the present utility model is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the utility model, and the scope of the utility model should be assessed accordingly to that of the appended claims.
Finally, it is further noted that relational terms such as first and second, and the like are used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising one does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises an element.
In the above embodiments, descriptions of orientations such as "upper", "lower", "left", "right", "side", and the like are shown based on the drawings.
The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present utility model. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present utility model is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420712064.3U CN222234660U (en) | 2024-04-08 | 2024-04-08 | A power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420712064.3U CN222234660U (en) | 2024-04-08 | 2024-04-08 | A power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222234660U true CN222234660U (en) | 2024-12-24 |
Family
ID=93919081
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420712064.3U Active CN222234660U (en) | 2024-04-08 | 2024-04-08 | A power module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222234660U (en) |
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2024
- 2024-04-08 CN CN202420712064.3U patent/CN222234660U/en active Active
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