CN222233628U - Chip packaging structure with high thermal conductivity - Google Patents

Abstract

The utility model discloses a chip packaging structure with high thermal conductivity, including: a main body component, the main body component includes a substrate; a heat conduction component, including a limit frame fixed on the upper surface of the four corners of the substrate, a movable groove opened inside the limit frame on one side, a mobile groove opened inside the limit frame on the other side, a movable block slidably connected to the inside of the movable groove, and a limit plate fixed on the outer surface of the movable block; a guide component, the guide component includes a guide tube fixed on the upper surface of the limit frame, a mobile frame is fixed on the outer surfaces of both sides of the limit plate, and one side of the mobile frame is slidably connected to the inside of the mobile groove. In order to solve the problem that when the existing chip is subjected to heat conduction treatment, the heat is transferred to the heat dissipation metal shell by using a heat conduction plate, but the existing heat conduction plate is fixed on the substrate by adhesive. When the heat conduction plate needs to be replaced, this method causes a large damage surface to the inside of the chip, so that the parts inside the chip cannot be reused.

Description

Chip packaging structure with high thermal conductivity

Technical Field

The utility model relates to the technical field of packaging structures, in particular to a chip packaging structure with high thermal conductivity.

Background

The chip packaging structure with high thermal conductivity is a packaging scheme designed according to the heat dissipation requirement of the chip, and has the main effects of effectively conducting and dissipating heat generated by the chip so as to keep the chip in a normal working temperature range and improve the performance and stability of an electronic product.

However, the following drawbacks still exist in practical use:

When the existing chip is subjected to heat conduction treatment, heat is transmitted to the heat dissipation metal shell through the heat conduction plate, but the existing heat conduction plate is fixed on the substrate in a viscose mode, and when the heat conduction plate needs to be replaced, the damage surface of the inside of the chip is large, so that parts inside the chip cannot be reused.

Disclosure of Invention

The utility model aims to provide a chip packaging structure with high heat conduction performance, which is used for solving the problems that when the prior chip is subjected to heat conduction treatment, heat is transmitted to a heat dissipation metal shell by adopting a heat conduction plate, but the prior heat conduction plate is fixed on a substrate by adopting an adhesive mode, and when the heat conduction plate needs to be replaced, the damage surface in the chip is large, so that parts in the chip cannot be reused.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

The utility model relates to a chip packaging structure with high thermal conductivity, which comprises:

a body assembly including a substrate;

The heat conduction assembly comprises limiting frames fixed on the upper surfaces of four corners of the substrate, a movable groove formed in one side of the limiting frames, a movable groove formed in the other side of the limiting frames, a movable block connected in the movable groove in a sliding manner and a limiting plate fixed on the outer surface of the movable block;

The guide assembly comprises a guide tube fixed on the upper surface of the limiting frame.

Further, the limiting plate both sides surface is fixed with the movable frame, and one side sliding connection of movable frame is in the inside of removing the groove.

Further, the middle part surface fixation in base plate both ends has the fixed column, and fixed column top inside swing joint has the push plate, and fixed column top surface fixation has the connecting plate.

Further, a silica gel pad is fixed inside the top end of the guide tube, and connecting holes are formed in the silica gel pad in a circumferential array.

Further, the middle part swing joint of silica gel pad has the spliced pole, and spliced pole lower surface is fixed with the spliced ball.

Further, a heat conducting plate is fixed on the upper surface of the limiting plate;

Wherein, the upper surface of the heat-conducting plate is attached to the pressing plate.

Further, a bottom plate is fixed on the lower surface of the substrate, pins are fixed in the top end of the bottom plate at equal intervals, and a heat dissipation metal shell is fixed on the upper surface of the bottom plate;

wherein, heat dissipation metal casing lower surface is laminated with the stand pipe upper surface mutually.

Compared with the prior art, the utility model has the advantages that:

According to the utility model, through the limiting frame and the limiting plate, when the heat-conducting plate is taken out, the movable block connected to one side of the limiting frame is enabled to move to the top end of the limiting frame by applying upward force to the limiting plate, so that the heat-conducting plate can be easily taken down from the limiting plate.

Based on beneficial effect one, under the cooperation use of stand pipe and spliced pole, when fixed heat dissipation metal casing, firstly through inserting the spliced pole inside the stand pipe, can place the top of bottom plate fast with the heat dissipation metal casing, put into the heat dissipation metal casing inside with the screw, when fixed to the bottom plate, in the installation, the heat dissipation metal casing is placed more stably, and the efficiency when installing the heat dissipation metal casing is higher.

Of course, it is not necessary for any one product to practice the utility model to achieve all of the advantages set forth above at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are needed for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a block diagram of a base plate of the present utility model;

FIG. 3 is an enlarged view of the utility model at A of FIG. 2;

FIG. 4 is a block diagram of a substrate of the present utility model;

FIG. 5 is an enlarged view of the utility model at B of FIG. 4;

fig. 6 is a cross-sectional view of a guide tube of the present utility model.

In the drawings, the list of components represented by the various numbers is as follows:

11. 12 parts of a bottom plate, 12 parts of pins, 13 parts of a heat dissipation metal shell, 14 parts of a base plate, 15 parts of a heat conduction plate;

21. The device comprises a limiting frame, a movable groove, a movable block, a limiting plate, a 25, a movable groove, a 26, a movable frame, a 27, a fixed column, a 28, a connecting plate, a 29 and a pressing plate, wherein the limiting frame is arranged on the limiting plate;

31. guide pipe 32, silica gel pad 33, connecting hole 34, connecting column 35 and connecting ball.

Detailed Description

In order that the above objects, features and advantages of the utility model will be readily understood, a more particular description of the utility model will be rendered by reference to the appended drawings.

In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present utility model, but the present utility model may be practiced in other ways other than those described herein, and persons skilled in the art will readily appreciate that the present utility model is not limited to the specific embodiments disclosed below.

For the purpose of making the objects, technical solutions and advantages of the present utility model more apparent, embodiments of the present utility model will be described in further detail below with reference to the accompanying drawings.

Referring to fig. 1-5, the present embodiment is a chip package structure with high thermal conductivity, comprising:

A body assembly including a substrate 14;

The heat conduction assembly comprises a limit frame 21 fixed on the upper surfaces of four corners of the substrate 14, a movable groove 22 formed in one side of the limit frame 21, a movable groove 25 formed in the other side of the limit frame 21, a movable block 23 connected in the movable groove 22 in a sliding manner and a limit plate 24 fixed on the outer surface of the movable block 23;

The guide assembly comprises a guide tube 31 fixed on the upper surface of the limiting frame 21;

The outer surfaces of the two sides of the limiting plate 24 are fixedly provided with a moving frame 26, and one side of the moving frame 26 is connected with the inside of the moving groove 25 in a sliding manner;

The movable frame 26 is arranged to facilitate the application of force for moving up and down to the limiting plate 24;

The middle surfaces of the two ends of the base plate 14 are fixedly provided with fixing columns 27, the inside of the top ends of the fixing columns 27 are movably connected with pressing plates 29, and the outer surfaces of the top ends of the fixing columns 27 are fixedly provided with connecting plates 28;

The fixing column 27 is used for carrying and installing the connecting plate 28, and the heat conducting plate 15 can be fixed on the limiting plate 24 by pulling the pressing plate 29 in the fixing column 27;

The upper surface of the limiting plate 24 is fixed with a heat conducting plate 15;

wherein the upper surface of the heat conducting plate 15 is attached to the pressing plate 29;

The heat conducting plate 15 is provided for transferring heat to the heat dissipating metal case 13 to dissipate heat inside the chip

A bottom plate 11 is fixed on the lower surface of the substrate 14, pins 12 are fixed in the top end of the bottom plate 11 at equal intervals, and a heat dissipation metal shell 13 is fixed on the upper surface of the bottom plate 11;

Wherein, the lower surface of the heat dissipation metal shell 13 is attached to the upper surface of the guide tube 31;

The arranged base plate 11 carries and mounts the base plate 14 and the pins 12, the pins 12 are used for electrically connecting the chip and the circuit board together, and the heat dissipation metal shell 13 is used for conveying out heat in the chip;

When the heat-conducting plate 15 is taken out;

After the screws fixed in the connecting plate 28 and the pressing plate 29 are taken out, an outward dragging force is applied to the pressing plate 29, so that after the pressing plate 29 is taken out from the inside of the fixed column 27, an upward force is applied to the movable frame 26, so that the movable frame 26 moves in the inside of the movable groove 25, the limiting plate 24 can be driven to synchronously move upwards, and when the limiting plate 24 moves upwards, the movable block 23 synchronously moves in the inside of the limiting frame 21, so that the heat conducting plate 15 is higher than the height of the limiting frame 21, and the heat conducting plate 15 can be quickly taken out from the inside of the limiting frame 21;

The step can not only rapidly take down the heat conducting plate 15 from the limiting plate 24, but also has simple structure and easy operation when fixing the heat conducting plate 15;

referring to fig. 1 and 6, this embodiment is based on embodiment 1, and further includes:

a silica gel pad 32 is fixed in the top end of the guide tube 31, and connecting holes 33 are formed in the silica gel pad 32 in a circumferential array;

The silica gel pad 32 is configured to limit the connection ball 35, and under the setting of the connection hole 33, the silica gel pad 32 can be deformed, so that the connection ball 35 can conveniently pass through the inside of the silica gel pad 32;

The middle part of the silica gel pad 32 is movably connected with a connecting column 34, and a connecting ball 35 is fixed on the lower surface of the connecting column 34;

the connecting column 34 carries out bearing installation on the heat dissipation metal shell 13, and then carries out bearing installation on the connecting ball 35;

when the heat dissipation metal shell 13 is fixed;

After the connecting ball 35 is aligned with the middle part of the guide tube 31, downward force is applied to the heat dissipation metal shell 13, the connecting ball 35 penetrates through the middle part of the silica gel pad 32, and under the auxiliary effect of the connecting hole 33, the silica gel pad 32 deforms, so that the connecting ball 35 penetrates through the middle part of the silica gel pad 32, and the heat dissipation metal shell 13 can be limited and fixed to the top of the bottom plate 11;

This step makes the heat dissipation metal shell 13 more stable to be placed, and the efficiency in mounting the heat dissipation metal shell 13 is higher.

In the description of the present utility model, it should also be noted that, unless explicitly specified and limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, integrally connected, mechanically connected, electrically connected, directly connected, indirectly connected through an intermediary, or in communication between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

It should be noted that the above-mentioned embodiments are merely preferred embodiments of the present utility model, and the present utility model is not limited thereto, but may be modified or substituted for some of the technical features thereof by those skilled in the art. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (7)

1. Chip packaging structure with high thermal conductivity, characterized by comprising:

a body assembly comprising a substrate (14);

The heat conduction assembly comprises limit frames (21) fixed on the upper surfaces of four corners of the substrate (14), movable grooves (22) formed in one side of the limit frames (21), movable grooves (25) formed in the other side of the limit frames (21), movable blocks (23) connected in the movable grooves (22) in a sliding mode, and limit plates (24) fixed on the outer surfaces of the movable blocks (23);

The guide assembly comprises a guide tube (31) fixed on the upper surface of the limiting frame (21).

2. The chip package structure with high thermal conductivity according to claim 1, wherein the outer surfaces of both sides of the limiting plate (24) are fixed with a moving frame (26), and one side of the moving frame (26) is slidably connected to the inside of the moving slot (25).

3. The chip packaging structure with high thermal conductivity according to claim 1, wherein fixing columns (27) are fixed on the surfaces of the middle parts of the two ends of the substrate (14), pressing plates (29) are movably connected inside the top ends of the fixing columns (27), and connecting plates (28) are fixed on the outer surfaces of the top ends of the fixing columns (27).

4. The chip package structure with high thermal conductivity according to claim 1, wherein a silica gel pad (32) is fixed inside the top end of the guide tube (31), and connecting holes (33) are formed in the silica gel pad (32) in a circumferential array.

5. The chip packaging structure with high thermal conductivity according to claim 4, wherein a connecting column (34) is movably connected to the middle of the silica gel pad (32), and a connecting ball (35) is fixed to the lower surface of the connecting column (34).

6. The chip packaging structure with high thermal conductivity according to claim 1, wherein a thermal conductive plate (15) is fixed on the upper surface of the limiting plate (24);

wherein, the upper surface of the heat conducting plate (15) is attached to the pressing plate (29).

7. The chip packaging structure with high thermal conductivity according to claim 1, wherein a bottom plate (11) is fixed on the lower surface of the substrate (14), pins (12) are fixed inside the top end of the bottom plate (11) at equal intervals, and a heat dissipation metal shell (13) is fixed on the upper surface of the bottom plate (11);

wherein, the lower surface of the heat dissipation metal shell (13) is attached to the upper surface of the guide tube (31).