CN222215772U

CN222215772U - An electronic device

Info

Publication number: CN222215772U
Application number: CN202420643480.2U
Authority: CN
Inventors: 高翔
Original assignee: Lenovo Beijing Ltd
Current assignee: Lenovo Beijing Ltd
Priority date: 2024-03-29
Filing date: 2024-03-29
Publication date: 2024-12-20
Anticipated expiration: 2034-03-29

Abstract

The application provides electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment comprises a shell, a circuit board and a heat conducting medium, wherein the circuit board is fixed in the shell, the shell comprises a sealing cavity, the sealing cavity at least shields a part of a heating element of the circuit board, and the heat conducting medium is positioned in the sealing cavity and exchanges heat with the part of the heating element.

Description

Electronic equipment

Technical Field

The application relates to the technical field of electronic equipment, in particular to electronic equipment.

Background

Current mobile phones mainly rely on heat-conducting materials to dissipate heat, such as graphite, heat-conducting silicone grease, and metal middle frames. However, along with the increase of power consumption of CPU, various applications and game software, current mobile phones only rely on the heat conduction materials to meet the heat dissipation requirement, so that heat emitted by a main board area cannot be timely transferred to other cold areas to complete heat dissipation.

Accordingly, there is a need for an electronic device to address at least the above-mentioned problems.

Disclosure of utility model

The application mainly aims to provide electronic equipment so as to solve the problem that the heat source area on the traditional mobile phone main board is poor in heat dissipation effect.

In order to solve the technical problems, the embodiment of the application provides the following technical scheme:

The application provides electronic equipment, which comprises a shell, a circuit board and a heat conducting medium, wherein the circuit board is fixed in the shell, the shell comprises a sealing cavity, the sealing cavity at least shields a part of a heating element of the circuit board, and the heat conducting medium is positioned in the sealing cavity and exchanges heat with the part of the heating element.

In some embodiments, the circuit board is arranged on the first surface of the shell, and a plurality of electronic components are arranged on the second surface of the circuit board facing the first surface, wherein the electronic components belong to the heating components.

In some embodiments, the sealed cavity is in contact or non-contact with the electronic component.

In some embodiments, the thickness of the plurality of electronic components is different, the sealing cavity is a plurality of sealing cavities, and the plurality of sealing cavities are matched with the plurality of electronic components with different thicknesses.

In some embodiments, a plurality of the sealed cavities are communicated sequentially.

In some embodiments, the housing is a plate-type structure, the sealing cavity is embedded in the housing, and the cross section of the sealing cavity is rectangular.

In some embodiments, the electronic device further comprises a heat sink disposed between the sealed cavity and the circuit board and covering at least a portion of the electronic component, the heat sink, and the sealed cavity forming a heat dissipation channel.

In some embodiments, the housing is made of a plastic material and the heat sink is made of metal.

In some embodiments, at least one of the plurality of sealed cavities is disposed at a side of the electronic component and protrudes toward the circuit board to be close to the main body of the circuit board.

In some embodiments, the thermally conductive medium is a cooling liquid or a phase change material.

Drawings

The above, as well as additional purposes, features, and advantages of exemplary embodiments of the present application will become readily apparent from the following detailed description when read in conjunction with the accompanying drawings. In the drawings, wherein like or corresponding reference numerals indicate like or corresponding parts, there are shown by way of illustration, and not limitation, several embodiments of the application, in which:

Fig. 1 schematically shows a schematic cross-sectional structure of an electronic device of the present application;

fig. 2 schematically shows an internal structure of the electronic device of the present application.

Reference numerals illustrate:

1. The heat-conducting device comprises a shell, a sealing cavity, 102, a heat-conducting medium, 2, a circuit board, 201, a first area, 202, an electronic element, 3, a heat dissipation piece and 4, and a second area.

Detailed Description

Exemplary embodiments of the present disclosure will be described in more detail below with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be embodied in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

It is noted that unless otherwise indicated, technical or scientific terms used herein should be given the ordinary meaning as understood by one of ordinary skill in the art to which this application belongs.

Example 1

In order to solve the problems in the prior art, as shown in fig. 1, an embodiment of the application provides an electronic device, which comprises a housing 1, a circuit board 2 fixed in the housing 1, wherein the housing 1 comprises a sealing cavity 101, a heat conducting medium 102 and a heat conducting medium 102, the sealing cavity 101 is used for shielding at least a part of a heating element of the circuit board 2, and the heat conducting medium 102 is positioned in the sealing cavity 101 and exchanges heat with the part of the heating element.

The electronic equipment provided by the application can be mobile terminals such as mobile phones and notebook computers, and also can be processing equipment, display equipment and other equipment. The circuit board 2 is disposed inside the housing 1, the housing 1 covers the circuit board 2 entirely, and a heating element is mounted on the circuit board 2, and the heating element is disposed in a first area 201 of the circuit board 2 as shown in fig. 2 and generates heat during operation. The sealed cavity 101 is arranged in the shell 1, the heat conducting medium 102 is filled in the sealed cavity 101, and the part of the heating element on the circuit board 2 can be at least shielded through the sealed cavity 101, so that the heat conducting medium 102 and the heating element are accurately corresponding, the heat conducting medium 102 absorbs the heat emitted by the heating element in a heat conduction or heat convection mode, the heat of the heating element can be rapidly conducted to other parts of the shell 1 or an external heat dissipation structure through the heat conducting medium 102, and the heat can be rapidly and effectively absorbed and transferred.

According to the electronic equipment provided by the application, the sealing cavity 101 filled with the heat conducting medium 102 on the shell 1 can at least shield the part of the heating element on the circuit board 2, so that the heat conducting medium 102 and the heating element are accurately corresponding, the heat of the heating element can be rapidly conducted to other parts of the shell 1 or an external heat dissipation structure through the heat conducting medium 102, and the heat dissipation efficiency is improved.

In some embodiments, the circuit board 2 is disposed on the first surface of the housing 1, and the second surface of the circuit board 2 facing the first surface is provided with a plurality of electronic components 202, wherein the plurality of electronic components 202 belong to a heating element.

The electronic components 202 may include, but are not limited to, various basic electronic devices such as memories, capacitors, resistors, transistors, etc., as well as high power, high heat generating core components such as CPUs, GPUs, power management chips, etc.

The first surface of the housing 1 is disposed opposite the second surface of the circuit board 2, and the plurality of electronic components 202 are disposed on the second surface of the circuit board 2 such that the plurality of electronic components 202 are in opposing relation to the first surface of the housing 1. The plurality of electronic components 202 serve as a part of the heating element, and the sealing cavity 101 can shield at least the part of the heating element, so that the heat conducting medium 102 is arranged in the opposite direction of the plurality of electronic components 202 on the circuit board 2, and the heat conducting medium 102 can closely contact the electronic components 202, thereby realizing close-range and rapid heat conduction, greatly improving the heat dissipation efficiency, reducing the working temperature of the heating element, and guaranteeing the long-time stable operation of the electronic equipment.

In some embodiments, the sealing cavity 101 can cover the range of the heating element of the circuit board 2, and by covering the range of the heating element of the sealing cavity 101, the maximum contact area between the heating element and the heat conducting medium 102 in the sealing cavity 101 can be ensured, so that the heat conduction efficiency is greatly improved.

In some embodiments, the sealed cavity 101 is in contact or non-contact with the electronic component 202.

The outer wall surface of the sealing cavity 101 can be abutted against one side surface of the electronic component 202 facing the first surface of the housing 1, when the electronic component 202 works to generate heat, the sealing cavity 101 can be directly contacted with the surface of the electronic component 202, no obvious gap exists between the sealing cavity and the surface, and a good thermal contact interface is formed. By eliminating the air gap therebetween, thermal resistance is substantially reduced, so that heat generated by the electronic component 202 can be more quickly and directly transferred to the heat-conducting medium 102, and overall heat dissipation efficiency is improved.

Or the outer wall surface of the sealing cavity 101 may leave a small gap with the first surface of the electronic component 202 facing the housing 1. The extremely limited clearance still effectively reduces the thermal resistance effects of gaseous media such as air during heat transfer. Meanwhile, the non-contact arrangement may also combine the gas flow or natural convection principle, and utilize the rising flow of the hot air formed in the gap to indirectly transfer the heat generated by the electronic component 202 to the sealing cavity 101 and the surrounding heat dissipation structure, so as to realize the effective dissipation of the heat.

In some embodiments, the plurality of electronic components 202 have different thicknesses, the sealed cavity 101 is a plurality, and the plurality of sealed cavities 101 are adapted to the plurality of electronic components 202 having different thicknesses.

Since the plurality of electronic components 202 on the circuit board 2 have different thickness characteristics, the sealing cavities 101 are arranged in a plurality, and the size and shape of each sealing cavity 101 are customized according to the thickness of the corresponding electronic component 202, so that each sealing cavity 101 can be closely attached to and completely cover the corresponding electronic component 202, the contact area between the sealing cavity 101 and each electronic component 202 is maximized, the heat conduction path is short and the resistance is small, and therefore the heat generated by each heating element can be quickly and effectively transferred, and the heat dissipation efficiency is remarkably improved.

In some embodiments, the plurality of sealed cavities 101 are in communication with one another in sequence.

The plurality of sealed cavities 101 adapted to the electronic components 202 of different thicknesses do not exist independently but are in communication with each other. The adjacent sealed cavities 101 may form a continuous heat dissipation path through internal channels, slits, or an integrated design, so that heat may be continuously conducted between the various cavities.

For example, micro-holes, pipes or connecting parts made of heat conducting materials may be designed at the bottom or the side wall of each sealed cavity 101, so that the heat conducting medium 102 can flow between the sealed cavities 101, and integrated heat transfer in the whole sealed cavity 101 system is realized. Or it is also possible to provide an integrated large cavity structure with a sectional design inside the housing 1, each section corresponding to an electronic component 202 with a different thickness, but forming a communicating heat dissipation channel as a whole. Through the communication design of the plurality of sealed cavities 101, the heat generated by each electronic element 202 can be more uniformly spread inside the shell 1, so that the heat dissipation area is effectively enlarged, and the heat dissipation speed and efficiency are improved.

In some embodiments, the housing 1 is a plate-type structure, the sealing cavity 101 is embedded in the housing 1, and the cross section of the sealing cavity 101 is rectangular.

The shell 1 of the plate-type framework can be detachably connected with the circuit board 2, so that maintenance and replacement are more convenient. The sealed cavity 101 included in the housing 1 is not independent of the housing 1, but forms part of the structure of the housing 1, and is embedded in the housing 1 by a manufacturing process to form a fixed structural unit integrally formed with the housing 1. By embedding the sealing cavity 101 into the housing 1, the wall thickness of the sealing cavity 101 near the electronic component 202 is thinned, and the design greatly improves the heat conduction efficiency, so that the heat generated by the electronic component 202 can be quickly and effectively transferred to the heat conducting medium 102 in the sealing cavity 101 and further discharged to the outside through the housing 1. And by embedding the sealing cavity 101 into the casing 1, additional assembly steps and space requirements are reduced, miniaturization and compact design of the electronic equipment are facilitated, the sealing cavity 101 with the rectangular cross section can contact the electronic element 202 in a larger area, and heat conduction efficiency is improved.

In some embodiments, the housing 1 is made of a plastic material.

The shell 1 is used as an integral frame and is formed by processing plastic materials through injection molding, blow molding or other molding processes, an embedded sealing cavity 101 structure is designed in the plastic shell 1, the plastic shell can be accurately embedded in a proper position of the wall of the shell 1 according to the layout and heat dissipation requirements of heating elements, and in order to ensure tight combination between the sealing cavity 101 and the shell 1, the sealing is performed by adopting the technology such as ultrasonic welding, so that the heat conducting medium 102 in the sealing cavity 101 is ensured not to leak. The plastic shell 1 can provide good electrical insulation performance, effectively isolate an internal circuit from an external environment, and improve the safety of electronic equipment. And plastic materials are adopted as main components of the shell 1, so that the weight of the electronic equipment can be greatly reduced, and the portability and energy-saving effect of the product are facilitated.

In some embodiments, the casing 1 may directly adopt an existing structure, such as a plastic casing bracket for fixing an antenna above an existing mobile phone motherboard, on the basis of which at least one sealed cavity 101 is dug inside the casing 1, and then the heat-conducting medium 102 is filled inside the sealed cavity 101. At least one sealing cavity 101 is dug in the plastic shell support above the original mobile phone main board, so that a shell structure which is only used for supporting and fixing originally has a new heat management function. The sealed cavity 101 precisely conforms to the layout of the heating element, ensuring that the key heating areas of the heating element can be effectively wrapped and contacted to absorb and conduct heat to the greatest extent.

In some embodiments, the side of the sealed cavity 101 in contact with the heat generating element is provided with a coating or structure that enhances thermal conductivity, including but not limited to a graphene layer, a metal foil, or the like, of a thermally conductive material. Because the plastic material has good insulating property and a certain degree of thermal insulating capability, a heat conducting material may be added between the housing 1 and the heating element or plastic with good heat conducting property may be adopted to promote effective heat transfer.

In some embodiments, at least one of the plurality of sealed cavities 101 is disposed on a side of the electronic component 202 and protrudes toward the circuit board 2 to be close to the main body of the circuit board 2.

The plurality of sealed cavities 101 are not all concentrated at the bottom or top of the circuit board 2, but at least one of the sealed cavities 101 is designed at a side position of the electronic component 202. The sealed cavity 101 extends along the side of the electronic component 202 and extends in the direction of the circuit board 2 until it is close to the main part of the circuit board 2, exploiting the second area 4 free from the periphery of the electronic component 202. By filling the heat conducting medium 102 in the sealing cavity 101, heat is dissipated to the edge of the circuit board 2, and especially for those electronic components 202 with larger side heat generation, the heat generated by the electronic components 202 can be more directly contacted and absorbed, so that the heat dissipation efficiency is remarkably improved.

When the second area 4 free from the periphery of the electronic component 202 has no other significant heating element, the sealed cavities 101 can be used as a cold area in the heat exchange process, and the absorbed heat is conducted to the cold area through the communication and the flow of the heat conducting medium 102 among the sealed cavities 101, so that the effective dispersion and the discharge of the heat are realized.

In addition, although the graphite material has excellent heat conduction performance, the graphite material cannot be used for heat dissipation in these areas because the conductivity of the graphite material may interfere with sensitive components such as antennas near the frame of the electronic device. The housing 1 made of plastic material provides good insulation performance, and by the design that the sealing cavity 101 extends along the side edge of the electronic element 202, not only parts such as an antenna can be avoided, but also support can be provided for heat dissipation in the special areas, so that the rationality and the safety of internal thermal management of the electronic equipment are ensured.

In some embodiments, the thermally conductive medium 102 is a cooling liquid or a phase change material.

When the heat conducting medium 102 is cooling liquid, the cooling liquid can circulate in the shell 1 through a pipeline network or an open cavity, the cooling liquid has higher heat capacity and good heat conductivity, and the heat of the heating element can be rapidly taken away through the circulation flow, so that high-efficiency heat dissipation is realized.

When the heat transfer medium 102 is a phase change material, the phase change material has the ability to change from a solid state to a liquid state or vice versa in a specific temperature range, and is capable of absorbing and storing a large amount of latent heat. In the heating process of the heating element, the phase-change material can melt and absorb heat to effectively reduce the temperature of the element, and in the cooling process of the element, the phase-change material can be re-solidified and release the absorbed heat, so that the heat management is continuously carried out.

Example 2

Embodiment 2 of the present application provides an electronic device differing from embodiment 1 in that the sealed cavity 101 is in indirect contact with the electronic component 202.

In some embodiments, the electronic device further comprises a heat sink 3, the heat sink 3 being disposed between the sealed cavity 101 and the circuit board 2 and covering a portion of the at least one electronic component 202, the heat sink 3 and the sealed cavity 101 forming a heat dissipation channel.

The heat sink 3 is disposed between the sealed cavity 101 and the circuit board 2, and is intended to cover a portion of at least one electronic component 202, thereby forming an effective heat dissipation path, enabling heat generated by the electronic component 202 to be concentrated and transferred to the sealed cavity 101 through the heat sink 3, and the heat sink 3 also protects the electronic component 202.

The heat sink 3 may be a fin, a heat sink, a heat pipe, or a heat sink frame, etc. having excellent heat conduction properties. For example, the heat dissipation frame is detachably connected with the circuit board 2 and is disposed at the periphery of the electronic component 202, a side surface of the heat dissipation frame facing away from the electronic component 202 can be abutted against the sealed cavity 101, and the electronic component 202 rapidly conducts heat to the heat conducting medium 102 in the sealed cavity 101 through the heat dissipation frame. The surface of the heat sink 3 in contact with the electronic component 202 and/or the sealed cavity 101 may be coated with a thermal interface material with a high thermal conductivity to reduce contact resistance and improve heat transfer efficiency.

In some embodiments, the heat sink 3 is made of metal. For example, metals with high thermal conductivity such as aluminum, copper, aluminum alloy or copper alloy, the metal materials can rapidly conduct out the heat of the heating element due to the excellent thermal conductivity, so that the working temperature of the electronic element 202 is remarkably reduced, and the service life of the electronic element is prolonged.

According to the electronic equipment provided by the application, the heat dissipation piece 3 is arranged between the sealing cavity 101 and the circuit board 2, so that the heat dissipation piece 3 can protect the electronic element 202 and simultaneously can transfer heat generated by the electronic element 202 to the heat conducting medium 102 in the sealing cavity 101 through the heat dissipation piece 3, and high-efficiency heat dissipation is realized.

It will be appreciated that the relevant features of the apparatus described above may be referred to with respect to each other. In addition, the "first", "second", and the like in the above embodiments are for distinguishing the embodiments, and do not represent the merits and merits of the embodiments.

In the description provided herein, numerous specific details are set forth. However, it is understood that embodiments of the application may be practiced without these specific details. In some instances, well-known structures and techniques have not been shown in detail in order not to obscure an understanding of this description.

The foregoing is merely illustrative of the present application, and the present application is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims.

Claims

1. An electronic device, comprising:

case;

A circuit board is fixed in the housing;

Wherein, the housing comprises:

A sealed cavity, the sealed cavity at least shielding a portion of the heating element of the circuit board;

A heat-conducting medium is located in the sealed cavity, and the heat-conducting medium exchanges heat with a portion of the heating element.

2. The electronic device according to claim 1, characterized in that:

The circuit board is arranged on the first surface of the housing;

A second surface of the circuit board facing the first surface is provided with a plurality of electronic components, and the plurality of electronic components belong to the heating elements.

3. The electronic device according to claim 2, characterized in that:

The sealed cavity is in contact connection or non-contact connection with the electronic component.

4. The electronic device according to claim 2, characterized in that:

The thicknesses of the plurality of electronic components are different, and there are a plurality of sealed cavities, and the plurality of sealed cavities are adapted to the plurality of electronic components of different thicknesses.

5. The electronic device according to claim 4, characterized in that:

The plurality of sealed cavities are connected in sequence.

6. The electronic device according to claim 1, characterized in that:

The shell is a plate-type structure, the sealed cavity is embedded in the shell, and the cross section of the sealed cavity is a rectangle.

7. The electronic device according to claim 2, further comprising:

A heat sink is disposed between the sealed cavity and the circuit board and covers a portion of at least one of the electronic components. The electronic component, the heat sink and the sealed cavity form a heat dissipation channel.

8. The electronic device according to claim 7, characterized in that:

The shell is made of plastic material, and the heat sink is made of metal.

9. The electronic device according to claim 2, characterized in that:

At least one of the plurality of sealed cavities is disposed on a side of the electronic component and extends toward the circuit board to a body close to the circuit board.

10. The electronic device according to any one of claims 1 to 9, characterized in that:

The heat transfer medium is cooling liquid or phase change material.