Disclosure of utility model
The utility model aims to provide a refrigeration mobile charging device capable of effectively cooling a mobile charging power supply and a handheld mobile electronic device.
In order to achieve the above purpose, the technical scheme provided by the utility model is that the refrigeration mobile charging device has the functions of cooling and charging the handheld electronic equipment and is characterized by comprising the following components:
the shell is provided with an air inlet area and an air outlet area, and a containing cavity is formed in the shell;
a rechargeable battery accommodated in the accommodation chamber;
The air duct component is fixed in the accommodating cavity, is provided with a bracket accommodating space, an air inlet duct and an air outlet duct which are communicated with the bracket accommodating space, the air inlet duct is also communicated with the air inlet area, and the air outlet duct is also communicated with the air outlet area;
The heat dissipation bracket is fixed in the accommodating cavity and comprises a heat absorption part and a heat dissipation part, and the heat dissipation part is accommodated in the bracket accommodating space;
The semiconductor refrigerating sheet is powered by the rechargeable battery, one heat-generating surface of the semiconductor refrigerating sheet is connected with the heat absorbing part in a heat conduction way, and one refrigerating surface of the semiconductor refrigerating sheet is used for conducting heat with the handheld electronic equipment;
And the fan is used for enabling the air flow to sequentially flow through the air inlet area, the air inlet duct, the bracket accommodating space, the air outlet duct and the air outlet area.
The heat absorption part is of a flat structure, the heat dissipation part is provided with a plurality of heat dissipation fins, heat dissipation channels are formed between two adjacent heat dissipation fins, the heat dissipation part is also provided with a fan groove, and the fan is arranged in the fan groove.
The shell comprises an upper cover and a bottom shell, wherein the upper part of the bottom shell is of an open structure and is communicated with the accommodating cavity formed in the bottom shell, and the upper cover is covered on the open structure.
The air inlet area is arranged at the side wall of the bottom shell, and the air outlet area is arranged at the bottom of the bottom shell.
The air duct component comprises a flat-plate-shaped air duct main body, a supporting part arranged on the lower side of the air duct main body, an air inlet duct formed by a partition plate and arranged on the upper side of the air duct main body, and an air outlet duct arranged on the upper side and the lower side of the air duct main body in a penetrating manner, wherein the air duct component is supported on the bottom of the bottom shell through the supporting part.
The number of the air inlet channels is two, the air inlet areas are arranged on two opposite sides of the bottom shell, and each air inlet channel is opposite to one air inlet area.
The air inlet area and the air outlet area are both arranged at the side wall of the bottom shell, and two ends of one side wall of the bottom shell are respectively provided with one air outlet area.
The upper side and the downside of upper cover have seted up first heat conduction groove and second heat conduction groove respectively, just the tank bottom of first heat conduction groove and second heat conduction groove still link up and form logical groove, set up first heat conduction sheetmetal in the first heat conduction groove, set up the second heat conduction sheetmetal in the second heat conduction groove, just set up the third heat conduction sheetmetal in the logical groove, just first heat conduction sheetmetal passes through third heat conduction sheetmetal and is connected with second heat conduction sheetmetal heat conduction, just the lower surface of second heat conduction sheetmetal with the refrigerated one side heat conduction of semiconductor refrigeration piece is connected, the upper surface of first heat conduction sheetmetal and electronic equipment heat conduction are connected.
The magnetic ring or the plurality of magnets distributed in the circumferential direction are connected to the inner wall of one side face of the shell.
The semiconductor refrigerating piece limiting block is made of heat insulation materials, the semiconductor refrigerating piece limiting block is arranged on the heat absorbing part, a limiting area is formed inside the semiconductor refrigerating piece limiting block, and the semiconductor refrigerating piece is arranged in the limiting area.
Compared with the prior art, the cooling and mobile charging device provided by the utility model has the advantages that the cooling support and the fan are arranged, so that heat can be dissipated on the heat generating surface of the semiconductor cooling plate in time, the cooling effect of the cooling surface of the semiconductor cooling plate is ensured, the handheld mobile electronic equipment can be effectively cooled, the user experience is improved, and the risk of spontaneous combustion can be reduced.
The utility model will become more apparent from the following description taken in conjunction with the accompanying drawings which illustrate embodiments of the utility model.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are some, but not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the present utility model without making any inventive effort, shall fall within the scope of the present utility model.
It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined in one figure, no further definition or explanation thereof is necessary in the following figures.
Referring to fig. 1, for more convenient explanation of the present utility model, a reference coordinate system X, Y, Z is established to assist in explanation of the mutual relationship of the layout directions of the components, for example, in fig. 1, the X direction is the width direction of the housing 1, the Y direction is the length direction of the housing 1, the Z direction is the thickness direction or the vertical direction of the housing 1, and the X, Y, Z directions have two opposite sides. The coordinate system is merely provided for assistance in explanation and should not be construed as limiting the actual layout positions of the internal components of the present utility model.
Referring to fig. 1, 2, 3, 4, a refrigerated mobile charging apparatus 100 for cooling and/or charging a handheld electronic device is disclosed.
The refrigeration mobile charging device 100 has the function of cooling and charging the handheld electronic equipment. Because handheld electronic equipment can produce a large amount of heat in long-time use, if not in time cool down it, handheld electronic equipment's temperature can be very high, will greatly reduced handheld electronic equipment's operation smoothness, reduce user's use experience, still can make handheld electronic equipment spontaneous combustion under serious circumstances. The handheld electronic device mainly refers to a mobile phone, a tablet, a handheld game machine and the like.
The refrigeration mobile charging device 100 provided by the embodiment of the utility model comprises:
A housing 1, wherein a containing cavity 11 is formed in the housing 1, and an air inlet area and an air outlet area (hereinafter, the air inlet area and the air outlet area will be described) are further formed in the housing 1;
It should be noted that, the air inlet area is an area for allowing ambient air to enter the accommodating cavity 11, and the air outlet area is an area for allowing hot air in the accommodating cavity 11 to be discharged, and both the air inlet area and the air outlet area are both arranged on the housing 1. More specifically, the air inlet area and the air outlet area are hole structures arranged on the casing 1, and may be, for example, circular holes or kidney-shaped holes.
A rechargeable battery 2, wherein the rechargeable battery 2 is accommodated in the accommodating cavity 11;
the air duct component 5 is fixed in the accommodating cavity 11, and is provided with a bracket accommodating space 53, an air inlet duct 51 and an air outlet duct 52 which are communicated with the bracket accommodating space 53, wherein the air inlet duct 51 is communicated with an air inlet area, and the air outlet duct 52 is communicated with an air outlet area;
The heat dissipation bracket 3 is fixed in the accommodating cavity 11, the heat dissipation bracket 3 comprises a heat absorption portion 31 and a heat dissipation portion 32, the heat dissipation portion 32 is accommodated in the bracket accommodating space 53, specifically, in the embodiment shown in fig. 3 and 4, the heat absorption portion 31 is substantially formed at the position where the upper side surface of the heat dissipation bracket 3 contacts with the heat generating surface of the semiconductor refrigeration sheet 4, the heat absorption portion 31 is used for absorbing the heat carried by the heat generating surface of the semiconductor refrigeration sheet 4, and all the rest positions except the heat absorption portion 31 of the heat dissipation bracket 3 can be regarded as the heat dissipation portion 32. In order to ensure a good heat dissipation effect, the heat dissipation bracket 3 is generally made of a metal material with good heat conduction performance, for example, an aluminum material.
In the working process of the utility model, the heat dissipation bracket 3 is used for dissipating heat of the semiconductor refrigerating sheet 4, so that the temperature of the heat dissipation bracket 3 is increased, if the temperature of the heat dissipation bracket 3 is not timely reduced, the heat dissipation bracket 3 is in a higher temperature state, the heat dissipation effect of the semiconductor refrigerating sheet 4 is greatly reduced, the refrigerating effect of the semiconductor refrigerating sheet 4 is affected, and meanwhile, the accommodating cavity 11 is also in a high temperature state, and the normal operation of other electronic components is further affected.
Because the heat dissipation part 32 is accommodated in the bracket accommodating space 53, the air inlet duct 51 and the air outlet duct 52 are communicated with the bracket accommodating space 53, the air inlet duct 51 is also communicated with the air inlet area, the air outlet duct 52 is also communicated with the air outlet area, so that the ambient air at room temperature can more conveniently exchange heat with the heat dissipation part 32, and the hot air around the heat dissipation part 32 can conveniently flow out from the accommodating cavity 11 through the air outlet area and return to the ambient air.
The semiconductor refrigeration piece 4 supplies power through the rechargeable battery 2, one side of the semiconductor refrigeration piece 4, which generates heat, is connected with the heat absorbing part 31 in a heat conduction way, and the one side of the semiconductor refrigeration piece 4, which generates heat, is used for cooling the handheld electronic equipment;
An adapting circuit is further required to be arranged between the rechargeable battery 2 and the semiconductor refrigeration piece 4 to adapt the voltage and current suitable for the operation of the semiconductor refrigeration piece 4, so that the semiconductor refrigeration piece 4 can work normally. Since the semiconductor refrigerating sheet 4 is in a heat generating state on one side and in a refrigerating state on the other side during operation. One side of the semiconductor refrigeration piece 4 that generates heat needs to conveniently emit heat to ensure the refrigeration effect of the semiconductor refrigeration piece 4. Therefore, in order to facilitate heat dissipation, the heat-generating surface of the semiconductor cooling plate 4 is thermally connected to the heat-absorbing portion 31, in this embodiment, the heat-absorbing portion 31 may be configured to be flat, so as to contact with the heat-generating surface of the semiconductor cooling plate 4 as much as possible, and may be coated with a coating such as heat-conducting silicone grease for better heat exchange.
The air duct component 5 is used for enabling ambient air to conveniently contact and exchange heat with the heat dissipation bracket 3 through the air inlet area and the air inlet duct 51 arranged on the shell 1, and the ambient air is heated to hot air after contacting and exchanging heat with the heat dissipation bracket 3, is transferred to the air outlet area arranged on the shell 1 through the air outlet duct 52, flows out of the air outlet area and returns to the ambient air. The inlet duct 51 and the outlet duct 52 thus function to allow ambient air and hot air to flow in predetermined paths, respectively, which helps to optimize the airflow path.
In particular, in the embodiment shown in fig. 3, 4 and 5, the air inlet area 12 is disposed on two opposite side walls of the bottom shell 1a, and the air outlet area 13 is disposed on the bottom shell 1a, and both the air inlet area 12 and the air outlet area 13 are through hole structures disposed on the side walls or the bottom shell of the bottom shell 1 a.
The fan 5a is configured to form an air flow between the air inlet area 12, the air inlet duct 51, the heat dissipation portion 32, the air outlet duct 52 and the air outlet area 13, so as to take away heat carried by the heat dissipation portion 32.
The fan 5a is used for generating airflow power so as to enable heat carried by the heat dissipation part 32 to quickly exchange heat with ambient air, and keep the heat dissipation part 32 in a low-temperature state.
In one embodiment, referring to fig. 3 and 4, the heat absorbing portion 31 has a flat structure, the heat dissipating portion 32 is provided with a plurality of heat dissipating fins 321, a heat dissipating channel 322 is formed between two adjacent heat dissipating fins 321, and the heat dissipating portion 32 is further provided with a fan slot 323, and the fan 5a is installed in the fan slot 323.
Taking fig. 3, 4, and 5 as an example, the fan 5a is configured to blow air downwards (towards the bottom direction of the accommodating cavity 11 or the negative direction of the Z direction), ambient air, and the heat carried by the heat dissipating portion 32 rapidly exchanges heat with the ambient air to form hot air flowing downwards from the heat dissipating channel 322 through the air outlet channel 52, and under the action of the fan 5a, the surface of the heat dissipating portion 32 forms a fast flowing air flow, so as to accelerate the heat exchange between the ambient air and the heat dissipating portion 32, ensure that the heat dissipating portion 32 is in a relatively low temperature state, and maintain the heat dissipating effect of the heat dissipating bracket 3.
Referring to fig. 1, 2 and 3, the housing 1 includes an upper cover 1b and a bottom case 1a, wherein an upper portion of the bottom case 1a is of an open structure and is connected to the accommodating chamber 11 formed in the bottom case 1a, and the upper cover 1b is covered on the open structure.
In this embodiment of the present utility model, the housing 1 may be divided into two parts, one part is a bottom shell 1a, the other part is an upper cover 1b, the upper part of the bottom shell 1a is an open structure, and the open structure at the upper part of the bottom shell 1a is communicated to the accommodating cavity 11, and when the upper cover 1b is opened, the components of the present utility model may be installed in the accommodating cavity 11 from the open structure or removed from the accommodating cavity 11. Further, the upper cover 1b may be separated from or combined with the bottom case 1a in the Z direction.
In the embodiment shown in fig. 3, 4 and 5, the air inlet area 12 is disposed at a side wall of the bottom shell 1a, and the air outlet area 13 is disposed at a bottom of the bottom shell 1 a.
In this embodiment, under the action of the fan 5a, ambient air enters the air inlet duct 51 from the air inlet area 12 provided on the side wall of the bottom shell 1a, then flows from the air inlet duct 51 to the rack accommodating space 53, exchanges heat with the heat dissipating part 32, and flows to the air outlet area 13 provided on the bottom of the bottom shell 1a through the air outlet duct 52 to return to the ambient air.
Referring to the embodiment shown in fig. 3 and 4, the air duct member 5 includes a flat-plate-shaped air duct body 50, a supporting portion 54 disposed at the lower side of the air duct body 50, the air inlet duct 51 formed by a partition plate disposed at the upper side of the air duct body 50, and the air outlet duct 52 disposed through the upper and lower sides of the air duct body 50, and the air duct member 5 is supported on the bottom of the bottom case 1a by the supporting portion 54.
In particular, in the embodiment shown in fig. 3 and 4, it is preferable that the air duct member 5 is an integrally formed structure made of plastic, the number of the air inlet ducts 51 is two, the air inlet areas 12 are disposed on two opposite sides of the bottom case 1a, specifically, the two air inlet ducts 51 are disposed parallel to the air duct main body 50 and respectively opposite to one of the air inlet areas 12 on two opposite sides of the bottom case 1a, the air outlet duct 52 is disposed through the air duct main body 50, and the air outlet duct 52 is disposed right above the air outlet area 13 and opposite to the air outlet area 13.
Referring to the embodiment shown in fig. 6, the air inlet area 12 and the air outlet area 13 are both disposed at the side wall of the bottom case 1a, and two ends of one side wall of the bottom case 1a are respectively provided with the air outlet area 13.
Referring to the embodiment shown in fig. 6, the air duct member 5 is formed at the bottom of the bottom case 1a, and each of the air outlet areas 13 is correspondingly provided with one air outlet duct 52.
Referring to the embodiment shown in fig. 6, the air duct member 5 is integrally formed with the bottom case 1a, and the air outlet duct 52 is formed by a partition plate. The arrangement structure of the fan 5a is not limited to the structure shown in fig. 6, and the direction of the air flow shown by the arrow in fig. 6 may be formed.
Referring to the embodiment shown in fig. 3 and 4, the upper side and the lower side of the upper cover 1b are respectively provided with a first heat conducting groove 20 and a second heat conducting groove 21, the bottoms of the first heat conducting groove 20 and the second heat conducting groove 21 are further communicated to form a through groove 22, a first heat conducting metal sheet 23 is arranged in the first heat conducting groove 20, a second heat conducting metal sheet 24 is arranged in the second heat conducting groove 21, a third heat conducting metal sheet 25 is arranged in the through groove 22, the first heat conducting metal sheet 23 is in heat conducting connection with the second heat conducting metal sheet 24 through the third heat conducting metal sheet 25, the lower surface of the second heat conducting metal sheet 24 is in heat conducting connection with one surface refrigerated by the semiconductor refrigeration sheet 4, and the upper surface of the first heat conducting metal sheet 23 is in heat conducting connection with an electronic device.
Referring to fig. 3 and 4, the device further comprises a magnetic ring 10 or a plurality of circumferentially distributed magnets, wherein the magnetic ring 10 is connected to the inner wall of one side surface of the shell 1. In the embodiment shown in fig. 3 and 4, the magnetic ring 10 is connected to the inner wall of the upper cover 1b (the upper cover 1b may be regarded as one of the sides of the housing 1), and when the handheld electronic device is placed on the outer wall of the upper cover 1b for charging and/or cooling, the handheld electronic device is magnetically adsorbed by the magnetic ring 10, so that the handheld electronic device can be kept on the outer wall of the upper cover 1b without sliding off.
Referring to fig. 3 and 4, a schematic diagram of one embodiment of the cooperation of the semiconductor refrigeration sheet 4, the wireless charging coil 9, the magnetic ring 10 and the upper cover 1b is shown. The schematic structural view is seen from the vertical direction, i.e. the Z direction, the semiconductor refrigerating sheet 4 is located at the lowest position, and the refrigerating surface of the semiconductor refrigerating sheet 4 faces upwards, the wireless charging coil 9 is located above the semiconductor refrigerating sheet 4, in addition, a round hole is formed in the middle of the wireless charging coil 9, and the third heat conducting metal sheet 25 is just arranged on the round hole.
Further, a magnetic ring 10 is located outside the wireless charging coil 9, and the magnetic ring 10 may be embedded at the inner wall of the upper cover 1 b.
Referring to fig. 3 and 4, the semiconductor refrigeration piece limiting block 15 made of a heat insulating material is further included, the semiconductor refrigeration piece limiting block 15 is arranged on the upper portion of the heat absorbing portion 31, the semiconductor refrigeration piece limiting block 15 forms a limiting area 151, and the semiconductor refrigeration piece 4 is arranged in the limiting area 151.
In particular, in the embodiment shown in fig. 4 and 5, the semiconductor refrigeration sheet limiting block 15 is made of a rigid foam material, and practically all materials with poor heat conduction performance including the rigid foam material can be used, so that heat exchange on two sides of the semiconductor refrigeration sheet 4 can be limited as far as possible, and meanwhile, the semiconductor refrigeration sheet 4 is limited.
The foregoing is merely illustrative of the present utility model, and the present utility model is not limited thereto, and any person skilled in the art will readily recognize that variations or substitutions are within the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.