CN222210668U - Electric control part and air conditioner - Google Patents

Abstract

The utility model discloses an electric control component and an air conditioner, wherein the electric control component comprises a circuit board and a heat radiation plate, the two sides of the thickness of the circuit board are a first side and a second side respectively, heating devices are arranged on the first side and the second side, a heating device patch on the first side is installed, the height of at least one heating device on the second side is larger than that of any heating device on the first side, the heat radiation plate is installed on the circuit board and is positioned on the first side of the circuit board, and a radiating fin is arranged on one side, far away from the circuit board, of the heat radiation plate. Therefore, the assembling difficulty can be reduced, static electricity and mechanical stress damage in the assembling process are avoided, the assembling precision, the assembling quality and the assembling efficiency are improved, the radiator support and other structures are not required, and the electric control part structure is simplified.

Description

Electric control part and air conditioner

Technical Field

The utility model relates to the technical field of electric control, in particular to an electric control component and an air conditioner.

Background

In the related art, the electric control part is mainly in the form of an insert, the plug-in device needs to be fixed with the radiator through a screw, the radiator is radiated through the external fan, and an air channel space is reserved in the box body of the electric control part so as to radiate through convection.

However, the fastening process of the plugging device and the radiator can increase the assembly steps, reduce the assembly efficiency, and needs manual plug-in components, the process of fastening the plugging device is easily affected by static electricity, and the assembly process of the radiator is easily affected by mechanical stress, the reliability and the stability are poor, and the box body reserves the air duct space, so that the box body has a larger open area, the protection effect on dust, foreign matters and insect pests is limited, and the reliability and the stability of the electric control part can be reduced.

Disclosure of utility model

The present utility model aims to solve at least one of the technical problems existing in the prior art. Therefore, the utility model aims to provide the electric control component, which has higher assembly efficiency and lower probability of being influenced by static electricity and mechanical stress in the assembly process.

The utility model also provides an air conditioner adopting the electric control component.

The electric control component comprises a circuit board and a heat dissipation plate, wherein the two sides of the thickness of the circuit board are a first side and a second side respectively, heat generating devices are arranged on the first side and the second side, a patch of the heat generating device on the first side is installed, the height of at least one heat generating device on the second side is larger than that of any heat generating device on the first side, the heat dissipation plate is installed on the circuit board and is located on the first side of the circuit board, and heat dissipation fins are arranged on one side, far away from the circuit board, of the heat dissipation plate.

According to the electric control component provided by the embodiment of the utility model, the patch type device is arranged at least on the first side of the circuit board, and the circuit board is fixed on the first side, so that on one hand, at least part of heating devices are assembled in a patch mode, an independent radiator is not required to be arranged for radiating the heating devices, the assembly difficulty can be reduced, static electricity and mechanical stress damage in the assembly process are avoided, the assembly precision, the assembly quality and the assembly efficiency are improved, on the other hand, the radiating plate is used for radiating the patch type devices, a cooling air channel is not required to be formed between the radiating plate and the patch type device, and structures such as a radiator bracket are not required to be arranged.

According to some embodiments of the utility model, a flexible heat-conducting gasket is arranged between the heat-dissipating plate and the heat-generating device on the first side, and the heat-conducting gasket is in interference fit between the heat-dissipating plate and the heat-generating device.

In some embodiments, the heat dissipation plate includes a plate body and a support column, the heat dissipation fin is disposed on a side of the plate body away from the circuit board, the support column is disposed on a side of the plate body facing the circuit board, and the support column is supported on the circuit board, so that a space is kept between the plate body and the heat generating device on the first side.

Further, the distance between the plate body and the heating device on the first side is more than or equal to 0.5mm.

Further, the support column is fixedly connected with the circuit board through a fastener.

According to some embodiments of the utility model, the heat dissipating plate includes a plate body and a bump, the heat dissipating fin is disposed on a side of the plate body away from the circuit board, and the bump is disposed on a side of the plate body facing the circuit board and corresponding to at least a part of the heat generating device on the first side.

Further, the heating device of the first side comprises a first heating part and a second heating part which are arranged at intervals, the maximum height of the first heating part is smaller than that of the second heating part, the convex blocks comprise a first convex block and a second convex block which are arranged at intervals, the protruding height of the first convex block is larger than that of the second convex block, the first convex block corresponds to the first heating part, and the second convex block corresponds to the second heating part.

In some embodiments, the heat generating device on the first side forms a plurality of heat generating parts arranged at intervals, the heat dissipating fins form a plurality of heat dissipating groups arranged at intervals, and the plurality of heat generating parts are arranged in one-to-one correspondence with the plurality of heat dissipating groups.

Further, the heating device of the first side comprises a first heating part and a second heating part which are arranged at intervals, the plurality of heat dissipation groups comprise a first heat dissipation group and a second heat dissipation group which are arranged at intervals, and one of the first heat dissipation group and the second heat dissipation group, which is larger in heat dissipation fin height, corresponds to one of the first heating part and the second heating part, which is larger in heat productivity.

Further, the plurality of heat dissipation groups are arranged at intervals along the first direction, each heat dissipation group comprises a plurality of heat dissipation fins arranged at intervals along the first direction, the distance between two adjacent heat dissipation fins in the same heat dissipation group is smaller than the distance between two adjacent heat dissipation groups, each heat dissipation fin is configured as an elongated sheet body extending along a second direction perpendicular to the first direction, and two ends of the heat dissipation fin in the second direction are respectively extended to edges of two opposite ends of the heat dissipation plate.

According to some embodiments of the present utility model, a plane perpendicular to the thickness direction of the circuit board is taken as a projection plane, and the orthographic projection of the circuit board on the projection plane falls completely within the range of orthographic projection of the heat dissipation plate on the projection plane.

Further, the electric control part further comprises a housing, wherein the housing is arranged on one side, close to the circuit board, of the heat dissipation plate, and the housing is connected with the heat dissipation plate so as to form a mounting cavity for accommodating the circuit board between the housing and the heat dissipation plate.

Further, the housing is of an integral structure or of a multi-plate splicing structure.

Further, the housing is provided with a heat dissipation structure.

Further, at least one side of the housing is provided with a via hole.

According to some embodiments of the utility model, the heat dissipating plate includes a plate body in the form of a flat plate, and the heat dissipating fin is provided on a side of the plate body away from the circuit board.

An air conditioner according to a second aspect of the present utility model includes the electronic control unit described in the above embodiment.

Further, the air conditioner comprises an air conditioner outdoor unit, the electric control component is arranged in the air conditioner outdoor unit, a condenser and a main air channel for cooling the condenser are arranged in the air conditioner outdoor unit, and the cooling fins are arranged in the main air channel or a cooling air channel communicated with the main air channel.

Further, the heating device of the first side comprises at least one of an inverter module, a semiconductor power device in the PFC circuit and a rectifier bridge stack.

Additional aspects and advantages of the utility model will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the utility model.

Drawings

FIG. 1 is a schematic diagram of an electronic control unit according to an embodiment of the present utility model;

fig. 2 is a schematic diagram illustrating the disassembly of the electronic control components according to an embodiment of the present utility model;

FIG. 3 is another schematic diagram of an electronic control unit according to an embodiment of the present utility model;

FIG. 4 is a schematic view of an angle of a circuit board according to an embodiment of the utility model;

FIG. 5 is a schematic view of another angle of a circuit board according to an embodiment of the utility model;

FIG. 6 is a schematic diagram of a heat sink according to an embodiment of the utility model;

Fig. 7 is another schematic view of a heat dissipating plate according to an embodiment of the present utility model.

Reference numerals:

The electronic control unit 100,

The circuit board 10, the first side 11, the second side 12, the heat generating device 13, the first heat generating portion 13a, the second heat generating portion 13b, the inductor 13c, the capacitor 13d,

Heat dissipation plate 20, plate body 21, support column 22, bump 23, first bump 23a, second bump 23b, heat dissipation fin 24, first heat dissipation group 24a, second heat dissipation group 24b,

Housing 30, heat dissipating structure 31, via 32, thermally conductive pad 40, and mounting cavity 50.

Detailed Description

Embodiments of the present utility model are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative and intended to explain the present utility model and should not be construed as limiting the utility model.

The following disclosure provides many different embodiments, or examples, for implementing different structures of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples. This repetition is for the purpose of simplicity and clarity and does not in itself dictate a relationship between the various embodiments and/or configurations discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the applicability of other processes and/or the use of other materials.

In the related art, the electric control component 100 mainly takes the form of an insert, the plug-in device needs to be fixed with the radiator through a screw, the radiator is cooled through an external air cooling structure, and an air duct space needs to be reserved in a box body of the electric control component 100 so as to dissipate heat through convection.

However, the fastening process of the plugging device and the radiator increases the assembly steps, reduces the assembly efficiency, and requires a manual plug, the process of fastening the plugging device is easily affected by static electricity, the process of installing the radiator to the heating device 13 is easily affected by mechanical stress, the reliability and stability are poor, and the box body reserves an air duct space, so that the box body has a larger open area, the protection effect on dust, foreign matters and insect pests is limited, and the reliability and stability of the electric control component 100 are also reduced.

Based on this, the utility model provides an electric control component 100, which can reduce the assembly difficulty of the electric control component 100, simplify the assembly steps of the electric control component 100, improve the assembly efficiency, reduce the manual plug-in operation and the radiator assembly operation, reduce the probability of the electric control component 100 being affected by static electricity and mechanical stress, improve the reliability and stability, and simultaneously, the open area in the box body of the electric control component 100 can be smaller without setting an air duct space alone, thereby having better protection effect on dust, foreign matters and insect pests, and further improving the reliability and stability of the electric control component 100.

Hereinafter, the electronic control unit 100 and the air conditioner according to the embodiment of the present utility model will be described in detail with reference to fig. 1 to 6.

As shown in fig. 1, 2 and 3, an electronic control unit 100 according to an embodiment of the present utility model includes a circuit board 10 and a heat dissipation plate 20.

As shown in fig. 4 and fig. 5, the two sides of the thickness of the circuit board 10 are a first side 11 and a second side 12, the first side 11 and the second side 12 are respectively provided with a heat generating device 13, the heat generating device 13 of the first side 11 is mounted in a patch mode, the height of at least one heat generating device 13 of the second side 12 is larger than that of any one of the heat generating devices 13 of the first side 11, the heat dissipation plate 20 is mounted on the circuit board 10 and is located on the first side 11 of the circuit board 10, and a side, far away from the circuit board 10, of the heat dissipation plate 20 is provided with a heat dissipation fin 24.

Specifically, the circuit board 10 has a first side 11 facing the heat dissipation plate 20 and a second side 12 facing away from the heat dissipation plate 20, the first side 11 and the second side 12 are each provided with a heat generation device 13, the heat generation devices 13 may include patch type devices mounted by patches and plug-in type devices mounted by plug-in welding, the heat generation devices 13 provided on the first side 11 are each configured as patch type devices, the heat generation devices 13 provided on the second side 12 may be patch type devices or plug-in type devices, and the height of at least one heat generation device 13 of the second side 12 is higher than the height of all the heat generation devices 13 of the first side 11, the heat dissipation plate 20 is located on the first side 11 and is fixedly connected with the circuit board 10, and a heat dissipation fin 24 may be provided on a side of the heat dissipation plate 20 facing away from the circuit board 10 to perform direct contact or indirect heat exchange type heat dissipation on the patch type devices provided on the first side 11 of the circuit board 10 through the heat dissipation fin 24.

It should be noted that, based on the patch type device provided on the first side 11, at least part of the heating device 13 in the electric control component 100 is selected as the patch type device, the installation height of the first side 11 can be reduced, the connection between the circuit board 10 and the heat dissipation plate 20 is facilitated, the heat dissipation plate 20 does not interfere with the heating device 13 of the first side 11, the high heating device 13 is provided on the second side 12, the connection between the heat dissipation plate 20 and the circuit board 10 is not affected, the heat dissipation efficiency of the heating device 13 of the first side 11 can be improved by the heat dissipation plate 20, and the rapid heat dissipation of the heating device 13 of the first side 11 is realized, so that the heating device 13 with larger heat generation amount can be provided on the first side 11, the heat dissipation plate 20 directly dissipates the heat of the heating device 13 of the first side 11, an air cooling channel and a radiator are not required to be provided between the first side 11 and the box body of the electric control component 100, the space occupation of the electric control component 100 can be reduced, the open area of the box body can be reduced, and the protection effect of the electric control component 100 can be improved.

It can be understood that the heat generating device 13 in the electric control component 100 generates heat during operation, and based on the amount of generated heat, a patch type device is selected as a heat dissipating device with more generated heat and is arranged on the first side 11, a patch type device or a plug-in type device is selected as a device with less generated heat and is arranged on the second side 12, and the heat generating device 13 which is configured as a patch type device is not required to be manually plugged, so that the production efficiency is improved, static electricity generated by manual assembly is avoided, the damage risk of static electricity to the electric control component 100 is reduced, the automatic assembly is higher, the probability of mechanical stress damage to the heat generating device 13 in the process of arranging a radiator and assembling the radiator to the circuit board 10 is also reduced, and meanwhile, the problems of tin connection and poor welding caused by pin welding of the plug-in type device can be solved.

It can be appreciated that the radiating fin 24 is disposed on one side of the radiating plate 20 far away from the circuit board 10, the other side is suitable for contact radiating with the chip device on the circuit board 10, the radiator support and other structures are not required, the cost of the electronic control component 100 can be reduced, the structure of the electronic control component 100 is simplified, the radiating fin 24 disposed on the radiating plate 20 far away from the first side 11 is specifically a multi-layer spacing and oppositely disposed convex plate body 21 structure, and the radiating plate 20 can be made of metal structures with high radiating efficiency such as aluminum materials, copper materials and the like, so as to effectively realize radiating.

According to the electronic control component 100 of the embodiment of the utility model, by arranging the patch type device at least on the first side 11 of the circuit board 10 and fixing the circuit board 10 on the first side 11, on one hand, at least part of the heating devices 13 are assembled in a patch type without arranging an independent radiator to radiate the heating devices 13, so that the assembly difficulty can be reduced, static electricity and mechanical stress damage in the assembly process can be avoided, the assembly precision, the assembly quality and the assembly efficiency can be improved, on the other hand, the radiating plate 20 radiates the heat of the patch type device, a cooling air channel is not required to be formed between the two, and structures such as a radiator bracket are not required to be arranged, so that the open area and the volume of a box body of the electronic control component 100 can be reduced while the structure of the electronic control component 100 is simplified, and the protection effect of the electronic control component 100 can be improved.

It should be noted that the heat generating device 13 of the first side 11 may include at least one of power devices involved in the control of the air conditioner, wherein the power devices may be smart power modules for variable frequency control, insulated gate bipolar transistors, fast recovery diodes, rectifier bridge stacks, etc., and the surface is configured in a paste form, and may be soldered on the surface of the circuit board 10 (i.e., the first side 11) through a soldering process, and after the circuit board 10 and the heat dissipating plate 20 are fastened, the power devices of the first side 11 may be cooled through the heat dissipating plate 20, and the circuit board 10 may be a PCB board for mounting the above power devices and other electrical components, and the heat generating device 13 disposed on the first side 11 is not limited to the power devices.

According to some embodiments of the present utility model, a flexible heat-conducting spacer 50 is disposed between the heat-dissipating plate 20 and the heat-generating device 13 of the first side 11, and the heat-conducting spacer 50 is interference fit between the heat-dissipating plate 20 and the heat-generating device 13. It should be noted that fig. 2 shows the heat conducting pad 50 hidden, and fig. 5 shows an exploded view of the heat conducting pad 50 and the heat dissipating plate 20 not assembled.

Specifically, the heat conducting spacer 50 is a heat conducting medium for flexible assembly and matching, and can be used for filling between the chip device and the heat dissipation plate 20 by adopting a silica gel pad or other structures, so that the gap between the chip device and the heat dissipation plate 20 is filled, the heat dissipation efficiency and the heat dissipation effect between the chip device and the heat dissipation plate are improved, the chip device and the bottom plate are prevented from being directly and rigidly contacted or rigidly matched, and the probability of mechanical damage of the chip device is reduced.

Therefore, by arranging the heat conducting gasket 50, the heat dissipation effect and the heat dissipation efficiency of the patch type device can be improved, local heat concentration is avoided, the service life of the patch type device is prolonged, and mechanical damage of the patch type device can be avoided.

As shown in fig. 3, 6 and 7, in some embodiments, the heat dissipation plate 20 includes a plate body 21 and support columns 22, the heat dissipation fins 24 are disposed on a side of the plate body 21 away from the circuit board 10, the support columns 22 are disposed on a side of the plate body 21 facing the circuit board 10, and the support columns 22 are supported on the circuit board 10 so as to maintain a space between the plate body 21 and the heat generating devices 13 on the first side 11.

Specifically, the board body 21 and the circuit board 10 are oppositely arranged, the area of the board body 21 is smaller than or equal to the area of the circuit board 10, or the area of the circuit board 10 is smaller than or equal to the area of the board body 21, the supporting columns 22 can be arranged in four corner areas and middle areas of the board body 21, no wiring or device arrangement is ensured on the circuit board 10, interference between the supporting columns 22 and the circuit board 10 is avoided, the supporting columns 22 extend towards the first side 11, the heat dissipation plate 20 and the circuit board 10 are separated by the supporting columns 22, an installation space is defined, the patch type devices can be arranged in the installation space, the heat dissipation device 13 and the board body 21 are ensured to be separated, the probability of mechanical damage to the heat dissipation device 13 is reduced, the thickness of the heat conduction gasket can be slightly larger than or equal to the distance between the heat dissipation device 13 and the board body 21, the heat dissipation plate body 21 is filled between the board body 21 and the heat dissipation device 13, the heat dissipation effect and the heat dissipation efficiency of the heat dissipation plate 20 are improved.

It should be noted that, the heat dissipation fins 24 are disposed on one side of the plate body 21 far away from the support columns 22, and the heat dissipation fins 24 may be disposed on one side of the plate body 21 far away from the first side 11, or the heat dissipation fins 24 may be disposed corresponding to the heat generating device 13, and the heat dissipation area of the heat dissipation plate 20 may be increased by the arrangement of the heat dissipation fins 24, so as to realize rapid cooling of the heat dissipation plate 20, and further realize rapid heat dissipation of the heat generating device 13.

Further, a distance between the plate body 21 and the heat generating device 13 of the first side 11 is 0.5mm or more.

Illustratively, the height of the supporting column 22 is H1, the height of the fixing position of the heating device 13 is H2, the height of the heating device 13 is H3, and the distance is 0.5mm, so that H1-H2 is more than or equal to H3+0.5mm.

Therefore, the distance between the circuit board 10 and the heat dissipation plate 20 is not less than 0.5mm, while the heat conduction gasket 50 is made of elastic material with elasticity, and the basic thickness is not less than 0.5mm, so that the gap between the heating device 13 and the plate body 21 is effectively filled, the effect of interference fit is achieved, and the heat dissipation effect and the heat dissipation efficiency are improved.

Further, as shown in fig. 3, the support columns 22 are fastened to the circuit board 10 by fasteners.

Specifically, support columns 22 may be disposed on at least two of the four corner regions of the board body 21 and the middle region of the board body 21, so that an installation space is stably defined by the support columns 22, and an installation structure may be formed by the support columns 22, for example, internal threads are disposed inside the support columns 22, or clamping members are disposed at ends of the support columns 22, and the fastening members may be screws or clamping members, which correspond to the circuit board 10 and are provided with assembly holes, and the screws or clamping members penetrate through the assembly holes and are in threaded fit or clamping fit with the support columns 22, so as to realize assembly between the heat dissipation plate 20 and the circuit board 10.

Thus, the integrated assembly of the heat dissipation plate 20 and the circuit board 10 can be realized, the assembly efficiency is further improved, the heat dissipation plate 20 and the heating device 13 can be more attached, and the heat dissipation effect is better.

Referring to fig. 6 and 7, according to some embodiments of the present utility model, the heat dissipation plate 20 includes a plate body 21 and a bump 23, the heat dissipation fin 24 is disposed on a side of the plate body 21 away from the circuit board 10, and the bump 23 is disposed on a side of the plate body 21 facing the circuit board 10 and corresponding to at least a portion of the heat generating device 13 on the first side 11.

Specifically, the bump 23 is formed on a side of the plate body 21 away from the heat dissipation fins 24, and the heat dissipation fins 24 are disposed corresponding to the heat generating device 13, and one or more bumps 23 may be provided, where the bump 23 extends toward the first side 11, so that a distance between the heat generating device 13 located on the first side 11 and the heat dissipation plate 20 is more reasonable.

It should be noted that the specifications of the plurality of heat generating devices 13 disposed on the first side 11 may be the same or different, the heights of the corresponding plurality of heat generating devices 13 in the opposite directions of the first side 11 and the second side 12 may be different, and the heights of the plurality of bumps 23 may be one or more, and the heights of the plurality of bumps 23 may be the same or different, and for example, the heat generating devices 13 disposed on the first side 11 may include a first patch type device, a second patch type device, and a third patch type device, and the heights of the heat generating devices sequentially increase, and two corresponding bumps 23 may correspond to the first patch type device, one bump 23 corresponds to the second patch type device, and the third patch type device is directly opposite to the board 21, so that the distance between the first patch type device and the bump 23, the distance between the second patch type device and the other bump 23, and the specification between the third patch type device and the board 21 may be similar, and the heat dissipation efficiency and the heat dissipation effect may be improved by using the heat conducting pad 50 with the same dimensions.

It can be understood that the distance between the first patch type device and the bump 23 and the distance between the second patch type device and the other bump 23 are made similar, and the distance between the third patch type device and the board 21 may be selected and laid entirely, that is, an entire heat conducting pad 50 is directly laid on the first side 11, so as to improve the assembly efficiency of the electronic control component 100, or based on the number of heat generating devices 13 on the first side 11 and the heat dissipation requirement, several pieces of small heat conducting pads 50 after cutting are selected and used, and the number of heat generating devices 13 and the heat dissipation requirement are reasonably set corresponding to each other, so as to reduce the cost of the electronic control component 100.

As shown in fig. 3, further, the heat generating device 13 of the first side 11 includes a first heat generating portion 13a and a second heat generating portion 13b that are disposed at intervals, the maximum height of the first heat generating portion 13a is smaller than the maximum height of the second heat generating portion 13b, the bump 23 includes a first bump 23a and a second bump 23b that are disposed at intervals, the protruding height of the first bump 23a is greater than the protruding height of the second bump 23b, the first bump 23a is disposed corresponding to the first heat generating portion 13a, and the second bump 23b is disposed corresponding to the second heat generating portion 13 b.

It should be noted that the first heat generating portion 13a and the second heat generating portion 13b play a role in the present utility model, and it is intended herein to point out that the heat generating device 13 on the first side 11 includes a plurality of types, and is distinguished by the first heat generating portion 13a and the second heat generating portion 13b based on the difference in height dimension of the heat generating device 13, instead of defining the first side 11 to include two types of heat generating devices 13, the first heat generating portion 13a and the second heat generating portion 13b are defined respectively, that is, the first side 11 may be provided with two or more patch-type devices, and based on the height dimension of the heat generating device 13, the first heat generating portion 13a and the second heat generating portion 13b are defined as two heat generating devices, that is, when two of the plurality of heat generating devices 13 are correspondingly provided with the bump 23 are compared, the height of the first heat generating portion 13a may be defined as the second heat generating portion 13b, and the height of the lower heat generating device may be defined as the first heat generating portion 13a, and the corresponding first bump 23a and the second bump 23b may be defined as the first heat generating portion 13a, that is not based on the type definition, that the corresponding first bump 23a plays a role in the first side 11, that the first side 11 is provided with two or more than two types of patch-type devices, and the first bump 23a plays a role in the role in defining the first heat generating device, and that the first side 11 is provided with two or more than two types of heat generating device.

Therefore, through the arrangement of the first bump 23a and the second bump 23b, the distances between the various heating devices 13 with different heights on the first side 11 and the heat dissipation plate 20 are similar, and the heat conduction gasket 50 or the whole heat conduction gasket 50 with uniform specification is selected, so that the assembly difficulty is reduced, and meanwhile, the heat dissipation efficiency of the different heating devices 13 can be improved based on the arrangement of the bumps 23, and the cooling effect of the electric control component 100 is further improved.

In some embodiments, the heat generating devices 13 of the first side 11 are configured to have a plurality of heat generating parts spaced apart along a first direction, the plurality of bumps 23 are also spaced apart along the first direction, and each bump 23 is configured as an elongated bump extending along a second direction perpendicular to the first direction, for example, the first direction may be one of a length direction and a width direction of the heat dissipating plate 20, and the second direction may be the other of the length direction and the width direction of the heat dissipating plate 20, so that the structure of the bump 23 may be simplified, the correspondence of the bump 23 to the heat generating parts may be ensured, and materials and costs may be reduced.

As shown in fig. 3, 4 and 5, in some embodiments, the heat generating devices 13 of the first side 11 form a plurality of heat generating parts arranged at intervals, the heat dissipating fins 24 form a plurality of heat dissipating groups arranged at intervals, and the plurality of heat generating parts are arranged in a one-to-one correspondence with the plurality of heat dissipating groups.

Specifically, the plurality of patch devices on the first side 11 may be disposed at intervals, so that each patch device is individually configured as a heat generating portion, or at least two patch devices in the plurality of patch devices may be disposed in a concentrated manner, so that at least two patch devices disposed in a concentrated manner define a heat generating portion, that is, each heat generating portion includes at least one heat generating device 13, and the corresponding heat dissipating fins 24 may be disposed on the plate body 21 in a dispersed manner, each heat dissipating fin 24 forms a fin group, each fin group is defined as a heat dissipating group, the heat dissipating groups are disposed corresponding to the heat generating portion, each heat dissipating group can correspondingly cool and dissipate heat of one heat generating portion, so as to realize corresponding heat dissipation of the needle, and the plurality of heat dissipating groups may be disposed at intervals, so as to avoid heat interference between the plurality of heat dissipating groups, thereby improving heat concentration on the heat dissipating plate 20, and improving heat dissipating efficiency and heat dissipating effect.

It should be noted that, a plurality of heat dissipation fins 24 may be disposed in each heat dissipation group, and based on the difference of the heat dissipation amounts of different heat dissipation portions, the lengths and densities of the heat dissipation fins 24 in each heat dissipation group may be different, for example, the lengths of the heat dissipation fins 24 of the heat dissipation group corresponding to the heat dissipation portion with relatively large heat dissipation amount may be longer, the densities may be larger, the lengths of the heat dissipation fins 24 of the heat dissipation group corresponding to the heat dissipation portion with relatively small heat dissipation amount may be shorter, and the densities may be smaller.

The heat generating device 13 of the first side 11 includes a first heat generating portion 13a and a second heat generating portion 13b disposed at intervals, the plurality of heat dissipation groups includes a first heat dissipation group 24a and a second heat dissipation group 24b disposed at intervals, a greater one of the heights of the heat dissipation fins 24 in the first heat dissipation group 24a and the second heat dissipation group 24b corresponds to a greater one of the heat generation amounts of the first heat generating portion 13a and the second heat generating portion 13b, and, when the first heat generating portion 13a is disposed corresponding to the first heat dissipation group 24a and the second heat generation portion 13b is disposed corresponding to the second heat dissipation group 24b, the height of the heat dissipation fins 24 in the first heat dissipation group 24a is greater than the height of the heat dissipation fins 24 in the second heat dissipation group 24b if the heat generation amount of the first heat generation portion 13a is smaller than the heat generation amount of the second heat generation portion 13b, and the height of the heat dissipation fins 24 in the first heat dissipation group 24a is smaller than the height of the heat dissipation fins 24 in the second heat dissipation group 24 b.

It should be noted that the first heat generating portion 13a and the second heat generating portion 13b play a role in the present utility model, and it is intended herein to indicate that the heat generating device 13 of the first side 11 includes a plurality of kinds, and is distinguished by the first heat generating portion 13a and the second heat generating portion 13b based on the difference in heat generation amount of the heat generating device 13, instead of defining the first side 11 to include two kinds of heat generating devices 13, the first heat generating portion 13a and the second heat generating portion 13b are defined respectively, that is, the first side 11 may be provided with two or more kinds of chip type devices, and is defined as the first heat generating portion 13a and the second heat generating portion 13b based on the difference in heat generation amount of the heat generating device 13.

Illustratively, during the first chip period, the second chip device and the third chip device are included, the heat generation amount of the first chip device is the largest, the heat generation amount of the third chip device is the smallest, and when the first chip device is compared with the second chip device, the first chip device with a large heat generation amount may be defined as the first heat generating portion 13a, while the second chip device with a low heat generation amount may be defined as the second heat generating portion 13b, and when the second chip device is compared with the third chip device, the second chip device with a large heat generation amount may be defined as the first heat generating portion 13a, and the third chip device with a small heat generation amount may be defined as the second heat generating portion 13b.

Therefore, the lengths of the radiating fins 24 in different radiating groups can be adjusted at least, so that different radiating groups can radiate heat of various heating devices 13 with different heating values in a targeted manner, the radiating effect and the radiating efficiency are improved, meanwhile, the occurrence of local heat concentration on the radiating plate 20 can be avoided, the length of the radiating fins 24 corresponding to the heating device 13 with smaller heating value can be shorter, and the material cost of the electric control component 100 can be reduced.

As shown in fig. 1 and 6, further, the plurality of heat dissipation groups are arranged at intervals along the first direction, and each heat dissipation group includes a plurality of heat dissipation fins 24 arranged at intervals along the first direction, the spacing L between two adjacent heat dissipation fins 24 in the same heat dissipation group is smaller than the spacing W between two adjacent heat dissipation groups, each heat dissipation fin 24 is configured as an elongated sheet body extending along a second direction perpendicular to the first direction, and both ends of the heat dissipation fin 24 in the second direction extend to edges of opposite ends of the heat dissipation plate 20, respectively.

Specifically, the heat generating groups on the first side 11 are sequentially arranged in a first direction, the first direction may be one of a length direction and a width direction of the heat dissipating plate 20, and the plurality of heat dissipating fins 24 in each corresponding heat dissipating group are also arranged at intervals along the first direction, so that the number of the heat dissipating fins 24 corresponding to each heat generating device 13 is multiple, and the heat dissipating efficiency is improved, while the second direction may be the other one of the length direction and the width direction of the heat dissipating plate 20, and each heat dissipating fin 24 extends along the second direction, so as to increase the heat dissipating area of the heat dissipating plate 20 and improve the heat dissipating efficiency.

Meanwhile, the distance between any two adjacent radiating fins 24 in the same radiating group is smaller than the distance between two adjacent radiating fins 24 (see fig. 5), so that heat exchange can be realized faster between the adjacent radiating fins 24 in the same radiating group, the temperature equalizing effect in the same radiating group is improved, the temperature equalizing property is improved, the cooling is realized, the local overheating is avoided, the heating device 13 is prevented from being lowered in frequency and even burnt, the working stability of the electric control component 100 is improved, the distance between the adjacent radiating groups is larger than the distance between the adjacent radiating fins 24, heat exchange interference can be reduced, heat exchange between the adjacent radiating groups is reduced, and the radiating effect of each radiating group is improved.

According to some embodiments of the present utility model, a plane perpendicular to the thickness direction of the circuit board 10 is taken as a projection plane, and the orthographic projection of the circuit board 10 on the projection plane falls completely within the range of orthographic projection of the heat dissipation plate 20 on the projection plane.

Specifically, the thickness direction of the circuit board 10 is defined as the height direction of the bump 23 and the heat generating device 13 located on the first side 11, and the plane defined by the length direction and the width direction of the circuit board 10 is parallel to the projection plane, on which a projection of the circuit board 10 having a length and a width can be formed, and correspondingly, on the projection plane, the heat dissipation plate 20 also defines a projection of the heat dissipation plate 20 having a length and a width, and the outline size of the projection of the heat dissipation plate 20 is greater than the outline size of the projection of the circuit board 10, that is, the width size and the length size of the heat dissipation plate 20 are greater than or equal to the length size and the width size of the circuit board 10, so that the heat dissipation plate 20 can completely cover the circuit board 10, thereby improving the heat exchange effect and the heat exchange efficiency of the heat dissipation plate 20 on the circuit board 10.

In addition, the heat dissipation plate 20 is disposed on the first side 11 of the circuit board 10, and may also be formed into a supporting structure of the circuit board 10, so that the box body of the electric control component 100 does not need to further be provided with a structural plate located outside the heat dissipation plate 20, the structure of the electric control component 100 can be simplified, the cost is reduced, the heat dissipation plate 20 is integrated with the box body, the structural strength of the box body can be improved, and the overall structural stability and reliability of the electric control component 100 are improved.

As shown in fig. 1, further, the electronic control part 100 further includes a cover case 30, the cover case 30 being provided at a side of the heat dissipation plate 20 near the circuit board 10, the cover case 30 being connected with the heat dissipation plate 20 to form a mounting cavity for receiving the circuit board 10 between the cover case 30 and the heat dissipation plate 20.

Wherein, the housing 30 and the heat dissipation plate 20 define a box body of the electric control component 100, and the heat dissipation plate 20 and the housing 30 can form an integrated assembly structure, so that the assembly steps can be further simplified, and the assembly efficiency can be improved.

It should be noted that, the circuit board 10 may be provided with a socket, the housing 30 may be provided with a hole for avoiding the socket, and at least two connecting wire vias are reserved, and at least two fixing structures are formed at the same time, and the fixing structures may be a clamping structure or a screw structure, so that the housing 30 may be stably and reliably connected with the heat dissipation plate 20, thereby improving the structural stability and reliability of the electronic control component 100.

As shown in fig. 1 and 2, the housing 30 is a unitary structure, or a multi-panel splice structure.

For example, the housing 30 may include a first plate opposite to the heat dissipation plate 20 and a plurality of second plates surrounding the first plate, where the first plate and the second plates may be an integral piece, such as an integrally injection molded metal piece, and the first plate and the second plate may also be spliced by a connection structure, so that a sealing assembly structure is formed between the housing 30 and the heat dissipation plate 20, protection and upgrade of the circuit board 10 and devices thereon are achieved, the housing 30 may be an aluminum structure or a plastic structure, and a heat dissipation structure 31 may also be provided on the second plate, so as to perform auxiliary heat dissipation on the circuit board 10 and the heat dissipation device 13 thereon through the housing 30, thereby further improving the heat dissipation effect.

As shown in fig. 1 and 2, the housing 30 has a heat dissipation structure 31 thereon.

Illustratively, the heat dissipating structure 31 may be configured as a heat dissipating grille, which is opened on the first plate and/or the second plate, and the heat dissipating structure 31 may also be configured as a fin structure, and the fin length of the fin structure formed on the housing 30 is smaller than the length of the heat dissipating fins 24 on the heat dissipating plate 20, which mainly plays a role in assisting heat dissipation.

Of course, the box structure defined by the casing 30 and the heat dissipation plate 20 may also be formed into a fully sealed structure, so as to improve the protection effect of the electronic control component 100, effectively prevent attack of insect pests, dust and foreign matters, and improve the working reliability and use safety of the electronic control component 100.

In addition, as shown in FIG. 2, in some embodiments, a via 32 may be disposed on at least one side of the housing 30, e.g., the housing 30 includes a top plate and a plurality of side plates, and the via 32 may be disposed on at least one of the top plate or the plurality of side plates to satisfy the wire-out requirement and reduce the difficulty of wiring.

As shown in fig. 6, according to some embodiments of the present utility model, the heat dissipation plate 20 includes a plate body 21 in the form of a flat plate, and the heat dissipation fins 24 are provided on a side of the plate body 21 remote from the circuit board 10.

Specifically, the plate body 21 in the form of a flat plate can form the protruding block 23 on the surface of one side facing the first side 11, and the radiating fin 24 can be formed on the side facing away from the first side 11, so that the position of the radiating fin 24 is more reasonable, the radiating effect is better, the structure of the radiating plate 20 can be simplified, the assembly difficulty of the electric control component 100 can be reduced, and the assembly efficiency can be improved.

The air conditioner according to the second aspect of the present utility model includes the electric control unit 100 in the above embodiment, and has technical effects identical to those of the electric control unit 100, and will not be described herein.

Further, the air conditioner comprises an air conditioner outdoor unit, the electric control part 100 is arranged in the air conditioner outdoor unit, a condenser and a main air duct for radiating heat of the condenser are arranged in the air conditioner outdoor unit, and the radiating fins 24 are arranged in the main air duct or a radiating air duct communicated with the main air duct.

Specifically, the electric control component 100 is integrated in the outdoor unit of the air conditioner, for example, the heat dissipation plate 20 or the housing 30 of the electric control component 100 is fixed on the casing of the outdoor unit of the air conditioner, and at least part of the heat dissipation plate 20 is arranged in the main air duct at the same time, so that the heat dissipation air duct formed between the heat dissipation fins 24 is communicated with the main air duct, the cooling of the heat dissipation plate 20 is realized through the air flow in the main air duct, and the cooling of the electric control component 100 is realized without arranging a cooling fan for cooling the electric control component 100 separately, so that the structure of the outdoor unit of the air conditioner can be further simplified, and the cost of the air conditioner is reduced.

In some embodiments, the heat generating device 13 of the first side 11 may include at least one of an inverter module, a semiconductor power device in a PFC circuit (abbreviation of power factor correction, power Factor Correction), and a rectifier bridge stack, and may include at least one of an intelligent power module (IPM, INTELLIGENT POWER MODULE), a power switching device (IGBT, insulated gate bipolar transistor), a fast recovery diode, and a rectifier bridge stack, for example.

In some embodiments, the heat generating device 13 of the second side 12 may comprise at least one of an inductance 13c, a capacitance 13 d.

Other configurations and operations of electrical controls and air conditioners according to embodiments of the present utility model are known to those of ordinary skill in the art and will not be described in detail herein.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present utility model.

Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be, for example, fixedly connected, detachably connected, or integrally formed, mechanically connected, electrically connected, or in communication, directly connected, or indirectly connected via an intervening medium, or in communication between two elements or in an interaction relationship between two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "up" or "down" a second feature may be the first and second features in direct contact, or the first and second features in indirect contact via an intervening medium. Moreover, a first feature being "above," "over" and "on" a second feature may be a first feature being directly above or obliquely above the second feature, or simply indicating that the first feature is level higher than the second feature. The first feature being "under", "below" and "beneath" the second feature may be the first feature being directly under or obliquely below the second feature, or simply indicating that the first feature is less level than the second feature.

In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms are not necessarily directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, the different embodiments or examples described in this specification and the features of the different embodiments or examples may be combined and combined by those skilled in the art without contradiction.

Although embodiments of the present utility model have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the spirit and scope of the utility model as defined by the appended claims and their equivalents.

Claims (19)

1. An electrically controlled component, comprising:

The thickness of the circuit board is provided with a first side and a second side respectively, the first side and the second side are provided with heating devices, the heating devices on the first side are mounted in a surface-mounted manner, and the height of at least one heating device on the second side is larger than that of any heating device on the first side;

And the radiating plate is arranged on the circuit board and positioned on the first side of the circuit board, and one side, far away from the circuit board, of the radiating plate is provided with radiating fins.

2. The electronic control component of claim 1, wherein a flexible thermally conductive gasket is disposed between the heat spreader plate and the heat generating device on the first side, and wherein the thermally conductive gasket is interference fit between the heat spreader plate and the heat generating device.

3. The electronic control unit according to claim 1, wherein the heat radiating plate includes a plate body and support columns, the heat radiating fins are provided on a side of the plate body away from the circuit board, the support columns are provided on a side of the plate body facing the circuit board, and the support columns are supported on the circuit board so that a space is maintained between the plate body and the heat generating device on the first side.

4. An electrically controlled member according to claim 3, wherein the spacing between the plate body and the heat generating device on the first side is 0.5mm or more.

5. An electrically controlled member according to claim 3, wherein the support posts are fixedly connected to the circuit board by fasteners.

6. The electronic control unit according to claim 1, wherein the heat dissipating plate includes a plate body and a bump, the heat dissipating fin is disposed on a side of the plate body away from the circuit board, and the bump is disposed on a side of the plate body facing the circuit board and corresponding to at least a part of the heat generating device on the first side.

7. The electronic control of claim 6, wherein the heat generating device on the first side includes a first heat generating portion and a second heat generating portion disposed at intervals, a maximum height of the first heat generating portion is smaller than a maximum height of the second heat generating portion, the bump includes a first bump and a second bump disposed at intervals, a protruding height of the first bump is larger than a protruding height of the second bump, the first bump is disposed corresponding to the first heat generating portion, and the second bump is disposed corresponding to the second heat generating portion.

8. The electronic control unit according to claim 1, wherein the heat generating devices on the first side are arranged with a plurality of heat generating portions at intervals, the heat radiating fins are arranged with a plurality of heat radiating groups at intervals, and the plurality of heat generating portions are arranged in one-to-one correspondence with the plurality of heat radiating groups.

9. The electronic control unit according to claim 8, wherein the heat generating device on the first side includes a first heat generating portion and a second heat generating portion that are disposed at intervals, and the plurality of heat dissipating groups includes a first heat dissipating group and a second heat dissipating group that are disposed at intervals, and one of the first heat dissipating group and the second heat dissipating group having a greater height of heat dissipating fins is disposed corresponding to the one of the first heat generating portion and the second heat generating portion having a greater amount of heat generation.

10. The electronic control according to claim 8, wherein a plurality of the heat dissipation groups are arranged at intervals along a first direction, and each of the heat dissipation groups includes a plurality of the heat dissipation fins arranged at intervals along the first direction, a pitch of two adjacent heat dissipation fins in the same heat dissipation group is smaller than a pitch between two adjacent heat dissipation groups, each of the heat dissipation fins is configured as an elongated sheet body extending along a second direction perpendicular to the first direction, and both ends of the heat dissipation fins in the second direction extend to edges of opposite ends of the heat dissipation plate, respectively.

11. The electronic control part according to any one of claims 1 to 10, wherein a plane perpendicular to a thickness direction of the circuit board is taken as a projection plane, and an orthographic projection of the circuit board on the projection plane falls entirely within a range of an orthographic projection of the heat radiation plate on the projection plane.

12. The electrically controlled member according to claim 11, further comprising a housing provided on a side of the heat dissipation plate near the circuit board, the housing being connected to the heat dissipation plate to form a mounting cavity between the housing and the heat dissipation plate for receiving the circuit board.

13. The electrical control component of claim 12, wherein the housing is of unitary construction or of a multi-panel splice construction.

14. The electrically controlled member of claim 12 wherein said housing has a heat dissipating structure thereon.

15. The electrical control component of claim 12, wherein the housing has a wire via disposed on at least one side thereof.

16. The electronic control according to claim 1, wherein the heat radiating plate includes a plate body in the form of a flat plate, and the heat radiating fin is provided on a side of the plate body remote from the circuit board.

17. An air conditioner comprising an electrical control unit according to any one of claims 1 to 16.

18. The air conditioner according to claim 17, wherein the air conditioner comprises an air conditioner outdoor unit, the electric control component is arranged in the air conditioner outdoor unit, a condenser and a main air duct for cooling the condenser are arranged in the air conditioner outdoor unit, and the cooling fin is arranged in the main air duct or a cooling air duct communicated with the main air duct.

19. The air conditioner of claim 17, wherein the heat generating device of the first side includes at least one of an inverter module, a semiconductor power device in a PFC circuit, and a rectifier bridge stack.