CN222192882U - Heat pipe conduction cooling device - Google Patents
Heat pipe conduction cooling device Download PDFInfo
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- CN222192882U CN222192882U CN202420443232.3U CN202420443232U CN222192882U CN 222192882 U CN222192882 U CN 222192882U CN 202420443232 U CN202420443232 U CN 202420443232U CN 222192882 U CN222192882 U CN 222192882U
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Abstract
The utility model belongs to the technical field of heat management, and relates to a heat pipe conduction heat dissipation device. The heat pipe conduction heat dissipation device comprises a porous heat pipe and a heat radiator, wherein an inserting groove is formed in the bottom of the heat radiator, one end of the porous heat pipe is inserted into the inserting groove in a sealing mode, the other end of the porous heat pipe is closed, a first diversion hole and a second diversion hole which is located below the first diversion hole are further formed in the bottom of the heat radiator, a first micro-channel hole and a second micro-channel hole which is located below the first micro-channel hole are formed in the porous heat pipe, and the first micro-channel hole, the first diversion hole, the second diversion hole and the second micro-channel hole are connected end to end in sequence and communicated to form a circulation channel. The heat pipe conduction heat dissipation device can reduce the thermal resistance between the radiator and the porous heat pipe to a lower level, so that the heat dissipation efficiency is greatly improved.
Description
Technical Field
The utility model belongs to the technical field of heat management, and particularly relates to a heat pipe conduction heat dissipation device.
Background
In the fields of electric automobiles, industrial electronics, consumer electronics, machine rooms, data servers and the like, equipment or devices can generate a large amount of heat during operation, if the heat cannot be timely dissipated, the temperature or the ambient temperature of the equipment can be continuously increased, and the high temperature can seriously influence the operation stability and the service life of the equipment, so that various heat management needs to be performed, and the equipment can work in a proper temperature range. Thermal management involves heat transfer and dissipation, wherein one type of heat transfer device is a porous heat pipe. Porous heat pipes are only a heat conduction device, not a heat conduction and heat dissipation device, and to apply the heat pipe to heat dissipation, a certain heat conduction and heat dissipation device, such as a heat dissipation fin, must be installed at the heat dissipation end of the heat pipe.
The main mode that adopts at present is that the mode that pastes through heat conduction silica gel at the radiating end realizes the combination of heat pipe and fin, and this kind of mode exists great thermal resistance for radiating efficiency greatly reduced, the area of fin or the flow of increase refrigerant need be increased to improve radiating efficiency.
Disclosure of utility model
The utility model aims to solve the technical problem that the heat dissipation efficiency is greatly reduced by combining a heat pipe and a heat dissipation fin through a heat conduction silica gel bonding mode at a heat dissipation end in the prior art.
In order to solve the technical problems, the embodiment of the utility model provides a heat pipe conduction heat dissipation device, which comprises a porous heat pipe and a radiator, wherein an inserting groove is formed in the bottom of the radiator, one end of the porous heat pipe is inserted into the inserting groove in a sealing way, and the other end of the porous heat pipe is closed;
The bottom of the radiator is also provided with a first diversion hole and a second diversion hole positioned below the first diversion hole, and the porous heat pipe is provided with a first micro-channel hole and a second micro-channel hole positioned below the first micro-channel hole;
The first micro-channel holes, the first diversion holes, the second diversion holes and the second micro-channel holes are connected end to end and communicated in sequence to form a circulation channel.
According to the heat pipe conduction heat dissipation device provided by the embodiment of the utility model, the bottom of the heat radiator is provided with the first diversion hole and the second diversion hole which are arranged up and down, the porous heat pipe is provided with the first micro-channel hole and the second micro-channel hole which are arranged up and down, and the first micro-channel hole, the first diversion hole, the second diversion hole and the second micro-channel hole are connected and communicated end to end in sequence to form a circulation channel. Thus, the bottom of the heat sink has similar characteristics to a porous heat pipe. Compared with the gluing mode in the prior art, the heat resistance between the radiator and the porous heat pipe can be reduced to a lower level, so that the heat dissipation efficiency is greatly improved. And under the same heat radiation efficiency, the area of the radiator or the flow of the refrigerant can be reduced, which is beneficial to the cost reduction and the miniaturization of the heat pipe conduction heat radiation device.
Optionally, the first diversion hole, the second diversion hole, the first micro-channel hole and the second micro-channel hole are respectively provided with a plurality of diversion holes;
The first diversion holes are correspondingly communicated with the second diversion holes in a one-to-one or one-to-many mode, the first micro-channel holes are correspondingly communicated with the second micro-channel holes in a one-to-one or one-to-many mode, the first diversion holes are correspondingly communicated with the first micro-channel holes in a one-to-one or one-to-many mode, and the second diversion holes are correspondingly communicated with the second micro-channel holes in a one-to-one or one-to-many mode.
Optionally, the central axes of the first diversion holes are all located in a first plane, and the central axes of the second diversion holes are all located in a second plane;
The central axes of the first micro-channel holes are all positioned in a third plane, and the central axes of the second micro-channel holes are all positioned in a fourth plane;
Optionally, the first plane is parallel to the second plane, and the third plane is parallel to the fourth plane.
Optionally, a tooth structure is disposed on an inner sidewall of the first micro-channel hole and/or the second micro-channel hole.
Optionally, a tooth structure is disposed on an inner sidewall of the first deflector hole and/or the second deflector hole.
Optionally, the porous heat pipe is in sealing connection with the inner wall of the plugging groove in a welding or gluing mode.
Optionally, the cross-sectional shape of the plugging groove is consistent with the cross-sectional shape of the porous heat pipe, and the cross-sectional size of the plugging groove is slightly larger than the cross-sectional size of the porous heat pipe.
Optionally, the porous heat pipe is flat.
Optionally, the radiator is a fin, a liquid-cooled heat exchanger, a water-cooled plate, a copper plate or an aluminum plate.
Drawings
FIG. 1 is a schematic diagram of a heat pipe conduction heat dissipating device according to an embodiment of the present utility model;
FIG. 2 is a cross-sectional view of FIG. 1 taken perpendicular to the axis of the porous heat pipe;
FIG. 3 is a cross-sectional view of FIG. 1 along the axis of the porous heat pipe;
FIG. 4 is an enlarged schematic view at A in FIG. 3;
fig. 5 is an enlarged schematic view at B in fig. 3.
Reference numerals in the specification are as follows:
1. A porous heat pipe; 11, a first micro-channel hole 12, a second micro-channel hole;
2. The heat radiator comprises a heat radiator, a plugging groove, a first diversion hole, a second diversion hole and a second diversion hole.
Detailed Description
In order to make the technical problems, technical schemes and beneficial effects solved by the utility model more clear, the utility model is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the utility model.
As shown in fig. 1 and fig. 2, the heat pipe conduction heat dissipation device provided by the embodiment of the utility model comprises a porous heat pipe 1 and a heat radiator 2, wherein an inserting groove 21 is arranged at the bottom of the heat radiator 2, one end of the porous heat pipe 1 is inserted into the inserting groove 21 in a sealing manner, and the other end of the porous heat pipe 1 is closed.
The bottom of the radiator 2 is further provided with a first diversion hole 22 and a second diversion hole 23 positioned below the first diversion hole 22, and the porous heat pipe 1 is provided with a first micro-channel hole 11 and a second micro-channel hole 12 positioned below the first micro-channel hole 11.
The first micro-channel hole 11, the first diversion hole 22, the second diversion hole 23 and the second micro-channel hole 12 are connected end to end and communicated in sequence to form a circulation channel.
Specifically, the first end of the first diversion hole 22 is communicated with the first end of the second diversion hole 23, the second end of the first diversion hole 22 is communicated with the first end of the first micro-channel hole 11, the second end of the second diversion hole 23 is communicated with the first end of the second micro-channel hole 12, and the second end of the first micro-channel hole 11 is communicated with the second end of the second micro-channel hole 12, so that the end-to-end connection and communication among the first micro-channel hole 11, the first diversion hole 22, the second diversion hole 23 and the second micro-channel hole 12 are realized.
According to the heat pipe conduction heat dissipation device provided by the embodiment of the utility model, the bottom of the heat radiator 2 is provided with the first diversion hole 22 and the second diversion hole 23 which are arranged up and down, the porous heat pipe 1 is provided with the first micro-channel hole 11 and the second micro-channel hole 12 which are arranged up and down, and the first micro-channel hole 11, the first diversion hole 22, the second diversion hole 23 and the second micro-channel hole 12 are connected and communicated end to end in sequence to form a circulation channel. Thus, the bottom of the heat sink 2 has similar characteristics to the porous heat pipe 1. Compared with the gluing mode in the prior art, the thermal resistance between the radiator 2 and the porous heat pipe 1 can be reduced to a lower level, so that the radiating efficiency is greatly improved. And under the same heat radiation efficiency, the area of the radiator 2 or the flow of the refrigerant can be reduced, which is beneficial to the cost reduction and the miniaturization of the heat pipe conduction heat radiation device.
In the heat pipe conduction heat dissipation device, the heat absorption end (closed end) of the porous heat pipe 1 is connected to a heating element, the heat of the heating element is conducted to the porous heat pipe 1, so that the refrigerant in the heat absorption end of the porous heat pipe 1 is heated and vaporized to form gas, a large amount of heat is absorbed in the vaporization process, the gas enters the heat dissipation end (one end connected with the heat radiator 2) of the porous heat pipe 1 from the heat absorption end of the porous heat pipe 1 through the first micro-channel hole 11, and contacts with the bottom of the heat radiator 2 through the first diversion hole 22, and the gas is cooled, liquefied and releases heat. Heat is dissipated by the heat sink 2. Then, the cooled liquid refrigerant flows back to the heat absorbing end of the porous heat pipe 1 through the second diversion holes 23 and the second micro-channel holes 12. The circulation is repeated in such a way that the heat of the heating element is conducted through the porous heat pipe 1 and then dissipated through the heat sink 2.
In an embodiment, as shown in fig. 2 to 5, the first deflector hole 22, the second deflector hole 23, the first micro-channel hole 11 and the second micro-channel hole 12 may be provided in plurality.
At this time, the first diversion holes 22 and the second diversion holes 23 are correspondingly communicated in a one-to-one or one-to-many manner, the first micro-channel holes 11 and the second micro-channel holes 12 are correspondingly communicated in a one-to-one or one-to-many manner, the first diversion holes 22 and the first micro-channel holes 11 are correspondingly communicated in a one-to-one or one-to-many manner, and the second diversion holes 23 and the second micro-channel holes 12 are correspondingly communicated in a one-to-one or one-to-many manner.
The two holes connected with each other can be communicated in a one-to-one mode or a one-to-many mode, so long as a circulating channel can be formed between the porous heat pipe 1 and the radiator 2.
In an embodiment, as shown in fig. 2 to 5, the central axes of the plurality of first diversion holes 22 are all located in a first plane, and the central axes of the plurality of second diversion holes 23 are all located in a second plane, so as to implement the arrangement of each first diversion hole 22 and each second diversion hole 23 on the radiator 2.
The central axes of the first micro-channel holes 11 are all located in a third plane, and the central axes of the second micro-channel holes 12 are all located in a fourth plane, so that the arrangement of the first micro-channel holes 11 and the second micro-channel holes 12 on the porous heat pipe 1 is realized.
In an embodiment, as shown in fig. 2 to 5, the first plane is parallel to the second plane. The third plane is parallel to the fourth plane, so that the arrangement of each deflector hole (the first deflector hole 22 and the second deflector hole 23) and each microchannel hole (the first microchannel hole 11 and the second microchannel hole 12) is realized, and the formation of the circulation channel is realized.
In an embodiment, as shown in fig. 2 to 5, the inner side walls of the first micro-channel hole 11 and/or the second micro-channel hole 12 are provided with tooth structures.
The inner side walls of the first diversion holes 22 and/or the second diversion holes 23 are provided with tooth-shaped structures.
When no tooth structure is provided on the inner side wall of a certain hole (the first microchannel hole 11, the second microchannel hole 12, the first guide hole 22 and/or the second guide hole 23), the inner side wall of the hole is smooth.
On the one hand, the tooth-shaped structures can increase the contact area between the refrigerant and each micro-channel hole and/or each diversion hole under the condition that the aperture of each micro-channel hole and/or each diversion hole is not increased, so that the heat conduction efficiency is further improved. On the other hand, the tooth-shaped structure of the inner side wall of each micro-channel hole and/or each diversion hole is similar to a capillary structure, so that each micro-channel hole and/or each diversion hole forms a similar capillary hole, and liquefied refrigerant is favorable for flowing back from the heat dissipation end to the heat absorption end to form circulation.
In one embodiment, as shown in fig. 2 to 5, the individual teeth of the tooth-like structure are arc-shaped, and the entire tooth-like structure is in the shape of a wavy groove.
In other embodiments not shown in the figures, the individual teeth of the tooth-like structure may also be of other shapes, such as triangular or trapezoidal, etc.
In an embodiment, the cross-sectional shape of the insertion groove 21 is identical to the cross-sectional shape of the porous heat pipe 1, and the cross-sectional size of the insertion groove 21 is slightly larger than the cross-sectional size of the porous heat pipe 1, so that the porous heat pipe 1 can be inserted into the insertion groove 21 with a gap. After one end of the porous heat pipe 1 is inserted into the insertion groove 21, the porous heat pipe 1 is in sealing connection with the inner wall of the insertion groove 21 by welding or gluing.
The cross section of the porous heat pipe 11 refers to a cross section perpendicular to the extending direction of the porous heat pipe 11, and the extending direction of each micro-channel hole (the first micro-channel hole 11 and the second micro-channel hole 12) and each flow guiding hole (the first flow guiding hole 22 and the second flow guiding hole 23) is identical to, or relatively inclined to, or relatively curved to, the extending direction of the porous heat pipe 11.
In an embodiment, as shown in fig. 1 to 5, the porous heat pipe 1 is flat, that is, the porous heat pipe 1 is a micro-channel porous flat pipe, and a certain amount of refrigerant is filled in the porous heat pipe 1 as a working medium. The refrigerant has a low boiling point characteristic to be vaporized when absorbing heat of the heating element.
In one embodiment, as shown in fig. 1 to 5, the heat sink 2 is a fin. In other embodiments not shown, the heat sink may be a liquid-cooled heat exchanger, a water-cooled plate, a copper plate, or an aluminum plate, among other elements capable of dissipating heat.
The foregoing description of the preferred embodiments of the utility model is not intended to be limiting, but rather is intended to cover all modifications, equivalents, and alternatives falling within the spirit and principles of the utility model.
Claims (10)
1. The heat pipe conduction heat dissipation device is characterized by comprising a porous heat pipe and a radiator, wherein an inserting groove is formed in the bottom of the radiator, one end of the porous heat pipe is inserted into the inserting groove in a sealing manner, and the other end of the porous heat pipe is closed;
The bottom of the radiator is also provided with a first diversion hole and a second diversion hole positioned below the first diversion hole, and the porous heat pipe is provided with a first micro-channel hole and a second micro-channel hole positioned below the first micro-channel hole;
The first micro-channel holes, the first diversion holes, the second diversion holes and the second micro-channel holes are connected end to end and communicated in sequence to form a circulation channel.
2. The heat pipe conduction heat sink as recited in claim 1 wherein a plurality of said first deflector aperture, said second deflector aperture, said first microchannel aperture and said second microchannel aperture are each provided;
The first diversion holes are correspondingly communicated with the second diversion holes in a one-to-one or one-to-many mode, the first micro-channel holes are correspondingly communicated with the second micro-channel holes in a one-to-one or one-to-many mode, the first diversion holes are correspondingly communicated with the first micro-channel holes in a one-to-one or one-to-many mode, and the second diversion holes are correspondingly communicated with the second micro-channel holes in a one-to-one or one-to-many mode.
3. The heat pipe conduction heat sink as recited in claim 2 wherein the central axes of the plurality of first deflector holes are all located in a first plane and the central axes of the plurality of second deflector holes are all located in a second plane;
the central axes of the first micro-channel holes are all located in a third plane, and the central axes of the second micro-channel holes are all located in a fourth plane.
4. The heat pipe conductive heat sink of claim 3 wherein said first plane is parallel to said second plane and said third plane is parallel to said fourth plane.
5. The heat pipe conductive heat sink as claimed in claim 1, wherein the first micro-channel holes and/or the second micro-channel holes are provided with tooth-like structures on inner side walls thereof.
6. The heat pipe conduction heat sink as recited in claim 1 wherein the first and/or second flow directing holes have a tooth-like structure on an inner sidewall thereof.
7. The heat pipe conduction heat sink as recited in claim 1 wherein said porous heat pipe is sealingly connected to said inner wall of said mating groove by welding or gluing.
8. The heat pipe conductive heat sink of claim 1 wherein the cross-sectional shape of the mating groove is consistent with the cross-sectional shape of the porous heat pipe, the cross-sectional dimension of the mating groove being slightly larger than the cross-sectional dimension of the porous heat pipe.
9. The heat pipe conductive heat sink of claim 1 wherein the porous heat pipe is flat.
10. The heat pipe conduction heat sink of claim 1 wherein the heat sink is a fin, liquid cooled heat exchanger, water cooled plate, copper plate or aluminum plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420443232.3U CN222192882U (en) | 2024-03-07 | 2024-03-07 | Heat pipe conduction cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420443232.3U CN222192882U (en) | 2024-03-07 | 2024-03-07 | Heat pipe conduction cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222192882U true CN222192882U (en) | 2024-12-17 |
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ID=93823141
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420443232.3U Active CN222192882U (en) | 2024-03-07 | 2024-03-07 | Heat pipe conduction cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222192882U (en) |
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2024
- 2024-03-07 CN CN202420443232.3U patent/CN222192882U/en active Active
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