CN222167080U - Semiconductor chip processing testing device - Google Patents
Semiconductor chip processing testing device Download PDFInfo
- Publication number
- CN222167080U CN222167080U CN202420292972.1U CN202420292972U CN222167080U CN 222167080 U CN222167080 U CN 222167080U CN 202420292972 U CN202420292972 U CN 202420292972U CN 222167080 U CN222167080 U CN 222167080U
- Authority
- CN
- China
- Prior art keywords
- semiconductor chip
- plate
- clamping
- push rod
- electric push
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 89
- 238000012360 testing method Methods 0.000 title claims abstract description 21
- 230000007246 mechanism Effects 0.000 claims abstract description 50
- 238000001514 detection method Methods 0.000 claims abstract description 40
- 230000002457 bidirectional effect Effects 0.000 claims description 18
- 230000000149 penetrating effect Effects 0.000 claims description 8
- 230000001681 protective effect Effects 0.000 claims 1
- 239000000523 sample Substances 0.000 description 11
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000013475 authorization Methods 0.000 description 1
- 230000002146 bilateral effect Effects 0.000 description 1
- 230000003139 buffering effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
本实用新型公开了一种半导体芯片加工测试装置，涉及半导体芯片加工技术领域，解决现有的测试装置工作效率，并且在取下半导体芯片时需要将手伸入槽中，操作不便，而且探测针为固定安装，不能根据不同的半导体芯片进行更换，从而降低了实用性的问题，该方案包括底座，所述底座的上表面开设有滑槽，所述滑槽的内部滑动连接有用于夹持半导体芯片的双工位夹持机构，通过设置的双工位夹持机构，可以在检测完成一个后直接检测另一个，提高工作效率，通过设置的弹性升降机构和快速装夹机构，可以根据不同大小的半导体芯片快速更换不同规格的探测针，通过设置的顶出机构，可以在检测完成后自动将半导体芯片顶出，便于拿取。
The utility model discloses a semiconductor chip processing and testing device, which relates to the technical field of semiconductor chip processing, solves the problem that the working efficiency of the existing testing device is low, and when removing the semiconductor chip, the hand needs to be inserted into the groove, which is inconvenient to operate, and the detection needle is fixedly installed and cannot be replaced according to different semiconductor chips, thereby reducing the practicality. The scheme includes a base, the upper surface of the base is provided with a slide groove, and the inside of the slide groove is slidably connected with a double-station clamping mechanism for clamping the semiconductor chip. Through the provided double-station clamping mechanism, one can be directly detected after the detection is completed, thereby improving the working efficiency. Through the provided elastic lifting mechanism and the quick clamping mechanism, detection needles of different specifications can be quickly replaced according to semiconductor chips of different sizes. Through the provided ejection mechanism, the semiconductor chip can be automatically ejected after the detection is completed, so as to facilitate taking.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip processing, in particular to a semiconductor chip processing testing device.
Background
The semiconductor chip generally needs to be tested in production and processing, so that the quality is detected, the corresponding test is required to be changed irregularly in test, and according to the search, the patent with Chinese patent authorization number CN217034046U discloses a semiconductor chip processing and testing device which comprises a mounting plate and a detector fixedly connected with the mounting plate, the upper end of the detector is fixedly connected with a placing plate, a plurality of grooves are formed in the upper surface of the placing plate, the extruding block is pushed upwards under the limit of the chip through the extruding block and compresses a second spring, so that the extruding block is beneficial to extruding the chip in the grooves, the chip can be tightly attached to the upper end of a probe to be detected, and the extruding block is beneficial to extruding the chip through the elasticity of the second spring, so that the damage of the probe or the chip caused by overlarge extruding force can be avoided.
According to the technical scheme, although the protection clamping of the semiconductor chips is realized, the semiconductor chips can only be detected once in use, the semiconductor chips are required to be detached after detection and replaced by new semiconductor chips for detection, so that the working efficiency is reduced, hands are required to be stretched into the grooves when the semiconductor chips are taken down, the operation is inconvenient, and the detection needles are fixedly mounted and cannot be replaced according to different semiconductor chips, so that the practicability is reduced.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a semiconductor chip processing testing device, which solves the problems that the prior device can only detect one semiconductor chip each time when in use, the semiconductor chip needs to be detached after detection and replaced by a new semiconductor chip for detection, thereby reducing the working efficiency, the semiconductor chip needs to be taken down, hands need to be stretched into a groove, the operation is inconvenient, and a detection needle is fixedly installed and can not be replaced according to different semiconductor chips, so that the practicability is reduced.
The semiconductor chip processing and testing device comprises a base, wherein the upper surface of the base is provided with a sliding groove, the inside of the sliding groove is connected with a double-station clamping mechanism for clamping a semiconductor chip in a sliding mode, two ends of the double-station clamping mechanism are internally provided with ejection mechanisms in an embedded mode, one side of the upper surface of the base is fixedly provided with an L-shaped plate, the top of the L-shaped plate is provided with an elastic lifting mechanism in a penetrating mode, the lower surface of the elastic lifting mechanism is provided with a quick clamping mechanism in an embedded mode, the inside of the quick clamping mechanism is provided with a mounting plate in a clamping mode, the lower surface of the mounting plate is fixedly provided with a plurality of detection needles, the top of the L-shaped plate is fixedly provided with a detector for detecting the semiconductor chip, and the detector is connected with the detection needles through wires.
The double-station clamping mechanism comprises a sliding block which is connected inside a sliding groove, two placing plates are symmetrically and fixedly connected to the upper surface of the sliding block, a placing groove is formed in the upper surface of each placing plate, first through holes are symmetrically formed in the two sides of the inner wall of each placing groove, first electric push rods are fixedly arranged in the first through holes in an embedded mode, first clamping plates are fixedly connected to the movable ends of the first electric push rods, the first push rods can drive the first clamping plates on the two sides to move relatively, clamping of semiconductor chips is achieved, two semiconductor chips can be placed through the two placing plates respectively, and accordingly detection of the next semiconductor chip can be directly conducted.
The elastic lifting mechanism comprises a fourth electric push rod which penetrates through the top of the L-shaped plate and is fixedly installed on the top of the L-shaped plate, the bottom end of the movable end of the fourth electric push rod is fixedly connected with a top plate, the outer surface of the top plate symmetrically penetrates through two guide rods in a sliding connection mode, two rectangular plates are fixedly connected with the bottom ends of the guide rods together, springs are sleeved on the outer surfaces of the guide rods and are located between the top plate and the rectangular plates, threaded connection nuts are sleeved on the outer surfaces of the guide rods, and when the fourth electric push rod drives a probe to descend, the springs can buffer the probe, so that pins of a semiconductor chip are prevented from being damaged.
Preferably, the double-station clamping mechanism further comprises a second through hole formed in the other side of the inner wall of the placing groove, a second electric push rod is fixedly arranged in the second through hole in an embedded mode, a second clamping plate is fixedly connected to the movable end of the second electric push rod, the second electric push rod drives the second clamping plate to move, and the second electric push rod is matched with one side of the inner wall of the placing groove to fix the semiconductor chip in the other two directions.
Preferably, the ejection mechanism comprises a storage groove formed in the inner bottom of the placing groove, a third electric push rod is fixedly arranged at the inner bottom of the storage groove, an ejector plate is fixedly connected to the top end of the movable end of the third electric push rod and is in sliding connection with the inner wall of the storage groove, and the third electric push rod drives the ejector plate to move upwards, so that the semiconductor chip can be ejected, and the semiconductor chip does not need to be stretched into the placing groove to be taken, so that the semiconductor chip ejection mechanism is convenient to use.
Preferably, the quick clamping mechanism comprises stroke grooves symmetrically formed in the lower surface of the rectangular plate, two bidirectional screw rods are connected between the stroke grooves in a penetrating and rotating mode, two clamping plates which are respectively connected with the inner walls of the two stroke grooves in a sliding mode are symmetrically connected with the outer surfaces of the two ends of the bidirectional screw rods in a threaded mode, the mounting plate is located at the position between the two clamping plates, the second bidirectional screw rods rotate to drive the two clamping plates to move relatively, and therefore mounting and replacement of the mounting blocks can be achieved quickly, and the detection needle can be replaced according to different semiconductor chips conveniently.
Preferably, one end of the bidirectional screw rod extends to the outside of the rectangular plate, and one end of the bidirectional screw rod, which is positioned outside the rectangular plate, is fixedly connected with a knob, and the knob is convenient for rotating the bidirectional screw rod.
Preferably, the protection pads are fixedly connected to one side of the outer surfaces of the first clamping plate and the second clamping plate, and the protection pads can protect the semiconductor chip.
The utility model provides a semiconductor chip processing testing device. The beneficial effects are as follows:
1. This semiconductor chip processing testing arrangement, through the duplex position fixture that sets up, not only can carry out the centre gripping to the semiconductor chip of equidimension not, can also directly detect another after detecting one moreover, improve work efficiency to solve current semiconductor chip detection device and need dismantle the semiconductor chip after detecting then carry out the operation that detects again after installing new semiconductor chip and cause the problem that work efficiency is low.
2. This semiconductor chip processing testing arrangement, through elasticity elevating system and the quick clamping mechanism that sets up, not only can cushion the probe needle, protection semiconductor chip stitch, but also can be according to the probe needle of the different specifications of the semiconductor chip quick replacement of equidimension, improve the practicality to solve current device probe needle and for fixed mounting, can not change and reduce the problem of practicality according to different semiconductor chips.
3. This semiconductor chip processing testing arrangement, through the ejection mechanism that sets up, can be after detecting the completion automatic ejecting with the semiconductor chip, be convenient for take to it needs the people to stretch into the groove with the hand after detecting to take out the chip to have solved current semiconductor chip detection device, inconvenient operation's problem.
Drawings
FIG. 1 is a schematic diagram of the overall structure of the present utility model;
FIG. 2 is a perspective view of a placement plate of the present utility model;
FIG. 3 is a schematic view showing the internal structure of the placement plate of the present utility model;
FIG. 4 is a schematic view of a portion of the structure of the elastic lifting mechanism and the quick clamping mechanism of the present utility model;
Fig. 5 is a schematic view of the internal structure of the elastic lifting mechanism and the quick clamping mechanism of the present utility model.
In the figure, 1, a base, 2, a chute, 3, a double-station clamping mechanism, 31, a sliding block, 32, a placing plate, 33, a placing groove, 34, a first through hole, 35, a first electric push rod, 36, a first clamping plate, 37, a second electric push rod, 38, a second clamping plate, 4, an ejection mechanism, 41, a storage groove, 42, a third electric push rod, 43, an ejection plate, 5, an L-shaped plate, 6, an elastic lifting mechanism, 61, a fourth electric push rod, 62, a top plate, 63, a guide rod, 64, a rectangular plate, 65, a spring, 66, a nut, 7, a quick clamping mechanism, 71, a stroke groove, 72, a double-station screw rod, 73, a clamping plate, 74, a knob, 8, a mounting plate, 9, a detection needle, 10 and a detector.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1:
As shown in fig. 1 and fig. 3, a semiconductor chip processing testing device, which comprises a base 1, spout 2 has been seted up to the upper surface of base 1, the inside sliding connection of spout 2 has the duplex position fixture 3 that is used for centre gripping semiconductor chip, duplex position fixture 3 includes the slider 31 of sliding connection in spout 2 inside, the upper surface symmetry fixedly connected with of slider 31 places board 32, place board 32's upper surface has seted up standing groove 33, the inner wall bilateral symmetry of standing groove 33 has seted up first through-hole 34, the inside embedding fixed mounting of first through-hole 34 has first electric putter 35, the expansion end fixedly connected with first splint 36 of first electric putter 35, and first electric putter 35 moves and drives first splint 36 and remove to can carry out the centre gripping with the semiconductor chip, can place two semiconductor chips respectively through setting up two standing grooves 33, can detect another one after the detection immediately, has improved work efficiency, thereby has solved current semiconductor chip detection device and has need to dismantle the semiconductor chip after the new semiconductor chip of installation and has carried out the low work problem that detects again after the semiconductor chip.
The double-station clamping mechanism 3 further comprises a second through hole formed in the other side of the inner wall of the placing groove 33, a second electric push rod 37 is fixedly arranged in the second through hole in an embedded mode, a second clamping plate 38 is fixedly connected to the movable end of the second electric push rod 37, the second electric push rod 37 operates to drive the second clamping plate 38 to move, and the other two sides of the semiconductor chip can be limited by matching with the inner wall of the placing groove 33.
The first clamping plate 36 and the second clamping plate 38 are fixedly connected with a protection pad on one side of the outer surface, and the protection pad can protect the semiconductor chip.
Example 2:
As shown in fig. 1 and fig. 3, the ejector mechanism 4 is embedded and installed in two ends of the double-station clamping mechanism 3, the ejector mechanism 4 comprises a storage groove 41 formed in the inner bottom of the placement groove 33, a third electric push rod 42 is fixedly installed at the inner bottom of the storage groove 41, an ejector plate 43 slidably connected with the inner wall of the storage groove 41 is fixedly connected to the top end of the movable end of the third electric push rod 42, and the ejector plate 43 is driven to move upwards by the third electric push rod 42, so that a semiconductor chip can be ejected out and is convenient to take, and the problem that an existing semiconductor chip detection device needs a person to stretch the hand into the groove to take out the chip after detection is solved, and the operation is inconvenient.
Example 3:
As shown in fig. 1, fig. 4 and fig. 5, an L-shaped board 5 is fixedly installed on one side of the upper surface of the base 1, an elastic lifting mechanism 6 is installed on the top of the L-shaped board 5 in a penetrating manner, the elastic lifting mechanism 6 comprises a fourth electric push rod 61 fixedly installed on the top of the L-shaped board 5 in a penetrating manner, a top plate 62 is fixedly connected to the bottom end of the movable end of the fourth electric push rod 61, two guide rods 63 are symmetrically connected to the outer surface of the top plate 62 in a penetrating manner in a sliding manner, rectangular plates 64 are fixedly connected to the bottom ends of the two guide rods 63 together, springs 65 are sleeved on the outer surface of the guide rods 63 and are positioned between the top plate 62 and the rectangular plates 64, nuts 66 are sleeved on the outer surface of the guide rods 63 in a threaded manner, and the set springs 65 can buffer the probe 9 during detection, so that pins of a semiconductor chip are prevented from being damaged.
Example 4:
As shown in fig. 1, fig. 4 and fig. 5, the lower surface of the elastic lifting mechanism 6 is embedded with a quick clamping mechanism 7, a mounting plate 8 is clamped in the quick clamping mechanism 7, the quick clamping mechanism 7 comprises travel grooves 71 symmetrically arranged on the lower surface of the rectangular plate 64, two travel grooves 71 are connected with two bidirectional screw rods 72 in a penetrating and rotating manner, two clamping plates 73 which are respectively connected with the inner walls of the two travel grooves 71 in a sliding manner are symmetrically connected with the outer surfaces of the two bidirectional screw rods 72 in a threaded manner, the mounting plate 8 is positioned between the two clamping plates 73, the two clamping plates 73 are driven to move relatively by the rotation of the bidirectional screw rods 72, so that quick clamping of the mounting plate 8 can be realized, and different detection needles can be replaced conveniently, and the problem that the existing detection needles are fixedly mounted and cannot be replaced according to different semiconductor chips, so that practicability is reduced is solved.
One end of the bidirectional screw rod 72 extends to the outside of the rectangular plate 64, and one end of the bidirectional screw rod 72 located outside the rectangular plate 64 is fixedly connected with a knob 74, and the knob 74 is convenient for rotating the bidirectional screw rod 72.
The lower surface of the mounting plate 8 is fixedly provided with a plurality of detection needles 9, the top of the L-shaped plate 5 is fixedly provided with a detector 10 for detecting the semiconductor chip, and the detector 10 is connected with the detection needles 9 through wires so as to be convenient for detecting the semiconductor chip.
Working principle: placing the semiconductor chip into a placing groove 33, then respectively starting a first electric push rod 35 and a second electric push rod 37, further driving a first clamping plate 36 and a second clamping plate 38 to move, fixing the periphery of the semiconductor chip, avoiding moving during detection, then starting a fourth electric push rod 61, driving a probe 9 above to move downwards, detecting the semiconductor chip, when the probe 9 contacts with pins of the semiconductor chip, buffering the probe 9 during detection through a spring 65, avoiding damaging the pins of the semiconductor chip, releasing the fixing of the semiconductor chip after detection is completed, then starting a third electric push rod 42, driving an ejector plate 43 to move upwards, ejecting the semiconductor chip, facilitating taking, the problem that the existing semiconductor chip detection device needs a person to stretch a hand into a groove to take out a chip and is inconvenient to operate is solved, and another semiconductor chip to be detected can be placed into the other placing groove 33 and fixed during detection, and can be directly moved to the lower part of the detection needle 9 to carry out detection after detection is completed, so that the problem that the existing semiconductor chip detection device needs to detach the detected semiconductor chip and then carry out detection operation after installing the new semiconductor chip to cause low working efficiency is solved, when semiconductor chips with different sizes are detected, the knob 74 and the bidirectional screw 72 can be rotated, the bidirectional screw 72 can be rotated to drive the two clamping plates 73 to move relatively, thereby realizing quick clamping of the mounting plate 8 and facilitating replacement of different detection needles, therefore, the problem that the practicability of the existing device is reduced because the detection needle is fixedly installed and can not be replaced according to different semiconductor chips is solved.
While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The semiconductor chip processing and testing device comprises a base (1) and is characterized in that a chute (2) is formed in the upper surface of the base (1), a double-station clamping mechanism (3) for clamping a semiconductor chip is connected inside the chute (2) in a sliding manner, an ejection mechanism (4) is embedded and installed inside two ends of the double-station clamping mechanism (3), an L-shaped plate (5) is fixedly installed on one side of the upper surface of the base (1), an elastic lifting mechanism (6) is installed on the top of the L-shaped plate (5) in a penetrating manner, a quick clamping mechanism (7) is installed on the lower surface of the elastic lifting mechanism (6) in an embedded manner, a mounting plate (8) is installed inside the quick clamping mechanism (7), a plurality of detection needles (9) are fixedly installed on the lower surface of the mounting plate (8), and a detector (10) for detecting the semiconductor chip is fixedly installed on the top of the L-shaped plate (5) and connected with the detection needles (9) through wires;
The double-station clamping mechanism (3) comprises a sliding block (31) which is in sliding connection with the inside of the sliding groove (2), two placing plates (32) are symmetrically and fixedly connected to the upper surface of the sliding block (31), placing grooves (33) are formed in the upper surface of the placing plates (32), first through holes (34) are symmetrically formed in the two sides of the inner wall of each placing groove (33), first electric pushing rods (35) are fixedly arranged in the first through holes (34) in an embedded mode, and first clamping plates (36) are fixedly connected to the movable ends of the first electric pushing rods (35);
The elastic lifting mechanism (6) comprises a fourth electric push rod (61) which penetrates through the top of the L-shaped plate (5) and is fixedly installed, a top plate (62) is fixedly connected to the bottom end of the movable end of the fourth electric push rod (61), two guide rods (63) are symmetrically and slidably connected to the outer surface of the top plate (62), rectangular plates (64) are fixedly connected to the bottom ends of the two guide rods (63) together, springs (65) are sleeved on the outer surface of the guide rods (63) and located between the top plate (62) and the rectangular plates (64), and nuts (66) are sleeved on the outer surface of the guide rods (63).
2. The semiconductor chip processing test device according to claim 1, wherein the double-station clamping mechanism (3) further comprises a second through hole formed in the other side of the inner wall of the placing groove (33), a second electric push rod (37) is fixedly arranged in the second through hole in an embedded mode, and a second clamping plate (38) is fixedly connected to the movable end of the second electric push rod (37).
3. The semiconductor chip processing and testing device according to claim 1, wherein the ejection mechanism (4) comprises a storage groove (41) formed in the inner bottom of the placement groove (33), a third electric push rod (42) is fixedly arranged at the inner bottom of the storage groove (41), and an ejection plate (43) which is in sliding connection with the inner wall of the storage groove (41) is fixedly connected to the top end of the movable end of the third electric push rod (42).
4. The semiconductor chip processing and testing device according to claim 1, wherein the quick clamping mechanism (7) comprises stroke grooves (71) symmetrically formed in the lower surface of the rectangular plate (64), two bidirectional screw rods (72) are connected between the two stroke grooves (71) in a penetrating and rotating mode, two clamping plates (73) which are respectively connected with the inner walls of the two stroke grooves (71) in a sliding mode are symmetrically connected with the outer surfaces of two ends of the bidirectional screw rods (72) in a threaded mode, and the mounting plate (8) is located at a position between the two clamping plates (73).
5. The semiconductor chip processing test apparatus according to claim 4, wherein one end of the bidirectional screw (72) extends to the outside of the rectangular plate (64), and one end of the bidirectional screw (72) located outside the rectangular plate (64) is fixedly connected with a knob (74).
6. The semiconductor chip processing test apparatus as set forth in claim 2, wherein the first clamping plate (36) and the second clamping plate (38) are fixedly connected with protective pads on one side of their outer surfaces.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420292972.1U CN222167080U (en) | 2024-02-17 | 2024-02-17 | Semiconductor chip processing testing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420292972.1U CN222167080U (en) | 2024-02-17 | 2024-02-17 | Semiconductor chip processing testing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222167080U true CN222167080U (en) | 2024-12-13 |
Family
ID=93793350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420292972.1U Active CN222167080U (en) | 2024-02-17 | 2024-02-17 | Semiconductor chip processing testing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222167080U (en) |
-
2024
- 2024-02-17 CN CN202420292972.1U patent/CN222167080U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN211206712U (en) | Performance test tool for display screen driving mainboard chip | |
| CN209606573U (en) | A kind of apparatus for testing chip with position limiting structure | |
| CN117269737B (en) | Jig assembly for PCB test | |
| CN108325868B (en) | Four-station heat pipe temperature difference testing device | |
| CN117091477A (en) | Bearing inner diameter detection device for bearing machining and manufacturing | |
| CN119023411A (en) | A shock-resistant mobile phone tempered film detection device | |
| CN209231389U (en) | A kind of integrated circuit DC test manual probe device | |
| CN222167080U (en) | Semiconductor chip processing testing device | |
| CN214585862U (en) | FPC circuit board test fixture | |
| CN221261177U (en) | Testing arrangement is used in integrated circuit production and processing | |
| CN221572724U (en) | Whole board test fixture of PCB board | |
| CN220279387U (en) | Mechanical and electrical equipment detects platform | |
| CN220490601U (en) | Building material hardness detection device | |
| CN219245611U (en) | Intelligent detection equipment | |
| CN216977695U (en) | Strong-stability fixture for automotive interior inspection device | |
| CN218213344U (en) | A new energy battery safety detection device | |
| CN211134634U (en) | A kind of detection equipment for the core in the capacitor | |
| CN221726170U (en) | A probe testing device for semiconductor wafers | |
| CN223727875U (en) | Integrated circuit chip burning test frame capable of adapting to different sizes | |
| CN223139733U (en) | Electrical automation testing equipment | |
| CN215066821U (en) | Semiconductor power device test fixture | |
| CN221706824U (en) | A circuit breaker vacuum monitoring device | |
| CN222232361U (en) | Micro-crack detection device | |
| CN221650532U (en) | A wafer CP multiple parallel testing device | |
| CN218824623U (en) | Novel battery module automatic detector |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |