CN222155483U - Fixing mechanism for processing semiconductor chip - Google Patents
Fixing mechanism for processing semiconductor chip Download PDFInfo
- Publication number
- CN222155483U CN222155483U CN202420453549.5U CN202420453549U CN222155483U CN 222155483 U CN222155483 U CN 222155483U CN 202420453549 U CN202420453549 U CN 202420453549U CN 222155483 U CN222155483 U CN 222155483U
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- Prior art keywords
- semiconductor chip
- top surface
- fixing mechanism
- workbench
- metal plate
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 54
- 230000007246 mechanism Effects 0.000 title claims abstract description 30
- 239000002184 metal Substances 0.000 claims abstract description 41
- 230000006835 compression Effects 0.000 claims description 12
- 238000007906 compression Methods 0.000 claims description 12
- 230000000149 penetrating effect Effects 0.000 claims description 2
- 238000009434 installation Methods 0.000 abstract description 6
- 238000011017 operating method Methods 0.000 abstract 1
- 238000003825 pressing Methods 0.000 description 16
- 230000000694 effects Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model discloses a fixing mechanism for processing semiconductor chips, which belongs to the technical field of semiconductor chip processing and solves the problem that the prior device needs to manually lift handles one by one and is troublesome to use, and comprises a workbench, wherein the top surface of the workbench is fixedly provided with an electromagnet opposite to a through groove, the fixing mechanism comprises a transverse plate fixedly arranged on the side surface of a support column, the bottom surface of the transverse plate is fixedly connected with one end of a reset spring, the other end fixedly connected with metal sheet of reset spring, the middle part fixed mounting of metal sheet top surface has the installation piece, the side fixed mounting of installation piece has electric telescopic handle, electric telescopic handle's output fixed mounting has the compact heap, through with the electro-magnet outage back, the metal sheet can be drawn back the normal position by the pulling force of reset spring shrink, then can realize compressing tightly the automation of semiconductor chip and fix and loosen, the semiconductor chip of the workstation top surface of being convenient for take off has reduced artificial operating procedure.
Description
Technical Field
The utility model relates to the technical field of semiconductor chip processing, in particular to a fixing mechanism for semiconductor chip processing.
Background
In the process of processing semiconductor chips, the chips are required to be fixed on a workbench for processing, but the chips are difficult to take out after the fixing and the processing are completed and cannot be automatically adjusted according to the sizes of the chips.
Through searching, in the application with the patent application number of CN202022869011.7, a fixing mechanism for processing a semiconductor chip is disclosed, and comprises a bottom plate, wherein two grooves are formed in the right side and the lower end of the bottom plate, a clamping block I and a clamping block II are respectively and slidably connected to the tops of the grooves, a moving groove and a pressing opening are formed in the clamping block I and the clamping block II, two groups of sliding blocks are respectively and slidably connected to the front side and the left side of the fixing frame, the tops of the sliding blocks are fixedly connected with the pressing mechanism through bolts, the screw rod is in threaded connection with a fixing block, and the bottoms of the fixing block are welded with the grooves;
although the fixing mechanism for processing the semiconductor chip can select a proper compression position according to the chip structure, the size of the fixing mechanism can be freely adjusted according to the size of the chip, and the chip can be taken out only by lifting the handle after production is completed, the fixing mechanism for processing the semiconductor chip needs to manually lift the handles one by one after the chip is processed, so that the operation steps are increased, and the use is more troublesome.
Therefore, we propose a fixing mechanism for semiconductor chip processing.
Disclosure of utility model
Aiming at the defects of the prior art, the utility model provides a fixing mechanism for processing a semiconductor chip, which solves the problem that the prior device needs to manually lift handles one by one and is troublesome to use.
The fixing mechanism for processing the semiconductor chip comprises a workbench, wherein four opposite support columns are fixedly arranged at four corners of the top surface of the workbench;
Four groups of fixing mechanisms with opposite positions are arranged on the periphery of the top surface of the workbench, four through grooves with opposite positions and penetrating through the through grooves are formed in the top surface of the workbench, and electromagnets with the opposite positions of the through grooves are fixedly arranged on the top surface of the workbench;
the fixing mechanism comprises a transverse plate fixedly arranged on the side face of the support column, one end of a reset spring is fixedly connected to the bottom face of the transverse plate, a metal plate is fixedly connected to the other end of the reset spring, an installation block is fixedly arranged in the middle of the top face of the metal plate, an electric telescopic rod is fixedly arranged on the side face of the installation block, and a compression block is fixedly arranged at the output end of the electric telescopic rod.
Preferably, one end of a telescopic rod is fixedly arranged on the bottom surface of the transverse plate, the other end of the telescopic rod is fixedly arranged on the top surface of the metal plate, and the telescopic rod is positioned at the inner ring of the reset spring, wherein when the metal plate is attracted by an electromagnet after the metal plate is electrified or the metal plate is pulled upwards by the reset spring after the electromagnet is powered off, the situation of position deviation during movement of the metal plate can be avoided through the telescopic rod.
Preferably, the reset springs are symmetrically arranged at two ends of the top surface of the metal plate, and the size of the metal plate is matched with that of the through groove, wherein the metal plate can penetrate through the through groove to be attached to the top surface of the electromagnet, so that the compression block is pressed at the edge of the semiconductor chip, and the phenomenon of the semiconductor chip deviation is avoided.
Preferably, soft rubber is adhered to the bottom surface of the compression block, and a plurality of groups of installation blocks, electric telescopic rods and compression blocks can be additionally arranged, wherein the soft rubber is adhered to the bottom surface of the compression block, so that the compression block can be prevented from damaging a semiconductor chip, and the plurality of groups of installation blocks, electric telescopic rods and compression blocks are arranged, so that the fixing effect of the semiconductor chip on the top surface of the workbench is improved.
Preferably, the attraction force to the metal plate is larger than the elastic force of the return spring when the electromagnet is electrified, wherein the situation that the metal plate is pulled back by the tensile force of the return spring and the semiconductor chip is fixed insecurely can be avoided.
Preferably, the telescopic length of the electric telescopic rod is matched with the size of the workbench, wherein the compression block can be positioned at the edges of semiconductor chips with different sizes through the telescopic of the electric telescopic rod and is compressed and fixed.
The utility model provides a fixing mechanism for processing a semiconductor chip. The beneficial effects are as follows:
1. According to the fixing mechanism for processing the semiconductor chip, after the electromagnet is electrified, the metal plate can be attracted downwards, the pressing block can be pressed against the edge of the top surface of the semiconductor chip, the effect of fixing the semiconductor chip is achieved, after the electromagnet is powered off, the metal plate can be pulled back to the original position by the pulling force of the shrinkage of the reset spring, the automatic pressing fixing and loosening of the semiconductor chip can be realized, the semiconductor chip with the processed top surface of the workbench is conveniently taken down, the manual operation steps are reduced, and the problem that the conventional device needs to manually lift the handles one by one and is troublesome to use is solved;
2. This fixed establishment is used in semiconductor chip processing drives the compact heap through electric telescopic handle and removes, can make the compact heap be located the edge of not unidimensional semiconductor chip top surface, has reached the purpose that compresses tightly fixedly to not unidimensional semiconductor chip.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic side view of the present utility model;
FIG. 3 is a schematic view of a workbench according to the present utility model;
FIG. 4 is a schematic view of a fixing mechanism according to the present utility model;
Fig. 5 is a schematic diagram of the structure of fig. 4 a according to the present utility model.
In the figure, 1, a workbench; 2, through grooves, 3, electromagnets, 4, supporting columns, 5, fixing mechanisms, 51, transverse plates, 52, return springs, 53, metal plates, 54, mounting blocks, 55, electric telescopic rods, 56, pressing blocks, 57 and telescopic rods.
Detailed Description
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Example 1:
As shown in fig. 1-4, the device comprises a workbench 1, four opposite supporting columns 4 are fixedly arranged at four corners of the top surface of the workbench 1, four sets of opposite fixing mechanisms 5 are arranged around the top surface of the workbench 1, four opposite through grooves 2 are formed in the top surface of the workbench 1 and penetrate through the through grooves 2, an electromagnet 3 opposite to the through grooves 2 is fixedly arranged on the top surface of the workbench 1, the fixing mechanism 5 comprises a transverse plate 51 fixedly arranged on the side surface of the supporting columns 4, one end of a reset spring 52 is fixedly connected to the bottom surface of the transverse plate 51, the other end of the reset spring 52 is fixedly connected with a metal plate 53, a mounting block 54 is fixedly arranged in the middle of the top surface of the metal plate 53, an electric telescopic rod 55 is fixedly arranged on the side surface of the mounting block 54, a pressing block 56 is fixedly arranged at the output end of the electric telescopic rod 55, after the electromagnet 3 is electrified, the metal plate 53 can be attracted downwards, the pressing block 56 can be pressed on the edge of the top surface of a semiconductor chip on the top surface of the workbench 1, the effect of the semiconductor chip can be achieved, after the electromagnet 3 is electrified, the metal plate 53 can be automatically contracted by the reset spring 52, one end of the reset spring 52 is fixedly connected with the metal plate 53, the top surface of the semiconductor chip can be automatically pulled back to the top surface of the workbench, the semiconductor chip can be conveniently and manually pressed, and the working stage can be finished, and the manual work can be finished;
Example 2:
As shown in fig. 4-5, one end of a telescopic rod 57 is fixedly arranged on the bottom surface of the transverse plate 51, the other end of the telescopic rod 57 is fixedly arranged on the top surface of the metal plate 53, the telescopic rod 57 is positioned on the inner ring of the reset spring 52, the reset spring 52 is symmetrically arranged at two ends of the top surface of the metal plate 53, the size of the metal plate 53 is matched with that of the through groove 2, when the metal plate 53 is attracted by the electromagnet 3 after being electrified or the metal plate 53 is pulled upwards by the reset spring 52 after the electromagnet 3 is powered off, the situation of position deviation during the movement of the metal plate 53 can be avoided through the telescopic rod 57, the metal plate 53 can pass through the through groove 2 to be attached to the top surface of the electromagnet 3, and then the edge of a semiconductor chip of the workbench 1 is pressed by 56, so that the situation of the deviation of the semiconductor chip is avoided;
Example 3:
As shown in fig. 2-5, soft rubber is adhered to the bottom surface of the pressing block 56, multiple groups of mounting blocks 54, electric telescopic rods 55 and pressing blocks 56 can be additionally arranged, the suction force of the electromagnet 3 on the metal plate 53 is larger than the elastic force of the reset spring 52, the telescopic length of the electric telescopic rods 55 is matched with the size of the workbench 1, the pressing blocks 56 can be prevented from damaging a semiconductor chip by adhering soft rubber to the bottom surface of the pressing blocks 56, the fixing effect on the semiconductor chip on the top surface of the workbench 1 can be improved by arranging multiple groups of mounting blocks 54, the electric telescopic rods 55 and the pressing blocks 56, the phenomenon that the semiconductor chip is not firmly fixed due to the fact that the metal plate 53 is pulled back by the tensile force of the reset spring 52 can be avoided, and the pressing blocks 56 can be positioned at edges of semiconductor chips with different sizes through telescopic of the electric telescopic rods 55 and are pressed and fixed.
The working principle and the use flow of the fixing mechanism for the semiconductor chip processing are that the semiconductor chip is firstly placed in the middle of the top surface of the workbench 1, then the electric telescopic rod 55 is started, the pressing block 56 is pushed to the edge of the top surface of the semiconductor chip through the electric telescopic rod 55, then the electromagnet 3 is started, the metal plate 53 passes through the through groove 2 and is tightly attached to the top surface of the electromagnet 3 through the attractive force between the electromagnet 3 and the metal plate 53, at the moment, the pressing block 56 is tightly pressed on the edge of the top surface of the semiconductor chip, the fixing of the semiconductor chip is completed, after the semiconductor chip is processed, the power supply of the electromagnet 3 is disconnected, the metal plate 53 is contracted by the reset spring 52 to be pulled upwards, and the pressing block 56 is separated from the top surface of the semiconductor chip, so that the processed semiconductor chip can be taken down.
While the fundamental and principal features of the utility model and advantages of the utility model have been shown and described, it will be apparent to those skilled in the art that the utility model is not limited to the details of the foregoing exemplary embodiments, but may be embodied in other specific forms without departing from the spirit or essential characteristics thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive, the scope of the utility model being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.
Furthermore, it should be understood that although the present disclosure describes embodiments, not every embodiment is provided with a separate embodiment, and that this description is provided for clarity only, and that the disclosure is not limited to the embodiments described in detail below, and that the embodiments described in the examples may be combined as appropriate to form other embodiments that will be apparent to those skilled in the art.
Claims (6)
1. The fixing mechanism for processing the semiconductor chip comprises a workbench (1), wherein four opposite support columns (4) are fixedly arranged at four corners of the top surface of the workbench (1);
The automatic feeding device is characterized in that four groups of fixing mechanisms (5) with opposite positions are arranged on the periphery of the top surface of the workbench (1), four through grooves (2) with opposite positions and penetrating through the top surface of the workbench (1) are formed in the top surface of the workbench (1), and electromagnets (3) with the positions opposite to the through grooves (2) are fixedly arranged on the top surface of the workbench (1);
The fixing mechanism (5) comprises a transverse plate (51) fixedly mounted on the side face of the supporting column (4), one end of a reset spring (52) is fixedly connected to the bottom face of the transverse plate (51), a metal plate (53) is fixedly connected to the other end of the reset spring (52), a mounting block (54) is fixedly mounted in the middle of the top face of the metal plate (53), an electric telescopic rod (55) is fixedly mounted on the side face of the mounting block (54), and a compression block (56) is fixedly mounted at the output end of the electric telescopic rod (55).
2. The fixing mechanism for semiconductor chip processing according to claim 1, wherein one end of a telescopic rod (57) is fixedly arranged on the bottom surface of the transverse plate (51), the other end of the telescopic rod (57) is fixedly arranged on the top surface of the metal plate (53), and the telescopic rod (57) is positioned on the inner ring of the return spring (52).
3. The fixing mechanism for semiconductor chip processing as set forth in claim 1, wherein said return springs (52) are symmetrically disposed at both ends of the top surface of the metal plate (53), and the metal plate (53) is sized to match the through groove (2).
4. The fixing mechanism for semiconductor chip processing as set forth in claim 1, wherein soft rubber is adhered to the bottom surface of the compression block (56), and a plurality of groups of mounting blocks (54), electric telescopic rods (55) and compression blocks (56) are additionally arranged.
5. The fixing mechanism for semiconductor chip processing according to claim 1, wherein the attraction force of the electromagnet (3) to the metal plate (53) is greater than the elastic force of the return spring (52) when the electromagnet is energized.
6. A semiconductor chip processing fixing mechanism according to claim 1, wherein the telescopic length of said electric telescopic rod (55) is matched with the size of the table (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420453549.5U CN222155483U (en) | 2024-03-09 | 2024-03-09 | Fixing mechanism for processing semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420453549.5U CN222155483U (en) | 2024-03-09 | 2024-03-09 | Fixing mechanism for processing semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222155483U true CN222155483U (en) | 2024-12-13 |
Family
ID=93781647
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420453549.5U Active CN222155483U (en) | 2024-03-09 | 2024-03-09 | Fixing mechanism for processing semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222155483U (en) |
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2024
- 2024-03-09 CN CN202420453549.5U patent/CN222155483U/en active Active
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