CN222112974U - Silicon wafer cleaning device for preparing silicon target material - Google Patents
Silicon wafer cleaning device for preparing silicon target material Download PDFInfo
- Publication number
- CN222112974U CN222112974U CN202420204783.4U CN202420204783U CN222112974U CN 222112974 U CN222112974 U CN 222112974U CN 202420204783 U CN202420204783 U CN 202420204783U CN 222112974 U CN222112974 U CN 222112974U
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- Prior art keywords
- silicon wafer
- silicon
- cleaning
- preparing
- cleaning device
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- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 98
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 98
- 239000010703 silicon Substances 0.000 title claims abstract description 98
- 238000004140 cleaning Methods 0.000 title claims abstract description 71
- 239000013077 target material Substances 0.000 title claims abstract description 10
- 238000003860 storage Methods 0.000 claims abstract description 14
- 230000005540 biological transmission Effects 0.000 claims abstract description 12
- 238000003825 pressing Methods 0.000 claims description 19
- 229920000742 Cotton Polymers 0.000 claims description 5
- 235000012431 wafers Nutrition 0.000 abstract description 69
- 239000007788 liquid Substances 0.000 abstract description 11
- 238000000034 method Methods 0.000 abstract description 9
- 230000007613 environmental effect Effects 0.000 abstract description 4
- 239000007787 solid Substances 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 5
- 238000005520 cutting process Methods 0.000 description 3
- 239000002699 waste material Substances 0.000 description 3
- 238000009434 installation Methods 0.000 description 2
- 238000011084 recovery Methods 0.000 description 2
- 238000005299 abrasion Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910003460 diamond Inorganic materials 0.000 description 1
- 239000010432 diamond Substances 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000003912 environmental pollution Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本申请公开了一种制备硅靶材的硅片清洗装置，包括立柱横撑，所述立柱横撑之间设置有横撑连接架，所述横撑连接架的上端设置有驱动组件，所述驱动组件的输出端设置有硅片放置座，所述硅片放置座包括外置框体、硅片置物架、套接轴和传动组，所述硅片置物架的上下两端设置有套接轴，所述套接轴的两端套设在外置框体，本申请具备高效的清洗性能、灵活的工件定位功能以及对硅片的良好保护作用，实现了硅片清洗过程的安全、高效和环保，立柱横撑和横撑连接架构建了坚固的基础结构，保证了整个装置在工作过程中的稳定性；驱动组件通过传动组带动硅片置物架旋转，确保硅片在清洗过程中能均匀地接触清洗液，提高了清洗效率和质量。
The present application discloses a silicon wafer cleaning device for preparing silicon target material, comprising upright columns and horizontal braces, a horizontal brace connecting frame is arranged between the upright columns and horizontal braces, a driving assembly is arranged at the upper end of the horizontal brace connecting frame, a silicon wafer placement seat is arranged at the output end of the driving assembly, the silicon wafer placement seat comprises an external frame, a silicon wafer storage rack, a sleeve shaft and a transmission group, upper and lower ends of the silicon wafer storage rack are provided with sleeve shafts, and both ends of the sleeve shaft are sleeved on the external frame. The present application has efficient cleaning performance, flexible workpiece positioning function and good protection for silicon wafers, realizes the safety, efficiency and environmental protection of the silicon wafer cleaning process, the upright columns and horizontal braces and the horizontal brace connecting frame construct a solid basic structure, and ensures the stability of the entire device during operation; the driving assembly drives the silicon wafer storage rack to rotate through the transmission group, to ensure that the silicon wafers can evenly contact the cleaning liquid during the cleaning process, and improve the cleaning efficiency and quality.
Description
Technical Field
The application relates to the technical field of silicon wafer treatment, in particular to a silicon wafer cleaning device for preparing a silicon target material.
Background
In the preparation of silicon targets, the silicon wafers need to be cut, diamond cutting is a high-efficiency cutting mode, more cutting scraps can be generated, and the traditional silicon wafer cleaning mode often has uneven cleaning, insufficient contact between cleaning liquid and the silicon wafers, and influences the cleaning effect. Meanwhile, the unstable fixation of the silicon wafer in the cleaning process can also cause the displacement or even falling off of the silicon wafer during rotation or movement, and adverse effects are brought to the quality of the silicon wafer and the yield of the production line. In addition, in the aspect of environmental protection and energy saving, many existing devices can not effectively recycle and reuse the waste cleaning liquid, so that resource waste and environmental pollution are caused.
Disclosure of Invention
The application aims to overcome the existing defects, and provides a silicon wafer cleaning device for preparing a silicon target, which is provided with a high-efficiency stable driving system to ensure that a silicon wafer can be uniformly contacted with cleaning liquid, and the silicon wafer fixing mode is safe and reliable, ensures the stability of the silicon wafer in the cleaning process, and effectively recovers and recycles cleaning waste liquid so as to achieve the purposes of energy conservation and environmental protection, and can effectively solve the problems in the background art.
The silicon wafer cleaning device for preparing the silicon target comprises upright cross braces, wherein a cross brace connecting frame is arranged between the upright cross braces, a driving assembly is arranged at the upper end of the cross brace connecting frame, a silicon wafer placing seat is arranged at the output end of the driving assembly, the silicon wafer placing seat comprises an external frame body, a silicon wafer placing frame, a sleeving shaft and a transmission group, the sleeving shafts are arranged at the upper end and the lower end of the silicon wafer placing frame, the two ends of the sleeving shaft are sleeved on the external frame body, the transmission group is connected at the upper end of the sleeving shaft (7), cleaning assemblies are arranged at the two sides of the upright cross braces, each cleaning assembly comprises a side support, a linear sliding rail, a power assembly and a cleaning cross brace, a linear sliding rail is arranged on each side support, and the driving end of the power assembly is connected with the cleaning cross brace arranged on the linear sliding rail.
As a preferable technical scheme of the application, the lower end of the upright post cross brace is provided with a pad brace group, and the pad brace group is connected with an external fixing frame through a fastener.
As a preferable technical scheme of the application, the output end of the driving component is connected with the transmission group on the silicon wafer placing seat.
As a preferable technical scheme of the application, the silicon wafer storage rack is composed of an external ring and a pressing block, wherein a chute is arranged on the external ring, and the pressing block is arranged on the chute in a sliding manner.
As a preferable technical scheme of the application, the inner side of the pressing block is provided with the buffer cotton attached to the inner side.
As a preferable technical scheme of the application, the end part of the pressing block adopts an inclined design.
Compared with the prior art, the cleaning device has the advantages of high-efficiency cleaning performance, flexible workpiece positioning function and good protection effect on the silicon wafer, safety, high efficiency and environmental protection in the silicon wafer cleaning process are realized, a firm basic structure is built by the upright cross braces and the cross brace connecting frames, the stability of the whole device in the working process is guaranteed, the driving assembly drives the silicon wafer storage frames to rotate through the transmission group, the silicon wafer can be ensured to be uniformly contacted with cleaning liquid in the cleaning process, the cleaning efficiency and quality are improved, the cleaning assembly is provided with the linear slide rail and the power assembly, the cleaning cross braces can be accurately adjusted according to the position and the angle of the silicon wafer, so that the silicon wafer can be cleaned uniformly in all directions, and the design of the adjustable nozzles on the cleaning cross braces is suitable for the silicon wafers with different shapes and sizes, so that the pertinence and the comprehensiveness of cleaning are further enhanced.
Drawings
FIG. 1 is a schematic diagram of the structure of the present application;
FIG. 2 is a front view of the present application;
FIG. 3 is a schematic view of a silicon wafer carrier.
In the figure, a column transverse strut 1, a transverse strut connecting frame 2, a driving component 3, a silicon wafer placing seat 4, an external frame 5, a silicon wafer storage rack 6, a sleeve joint shaft 7, a transmission group 8, a cleaning component 9, a side support 10, a linear sliding rail 11, a power component 12, a cleaning transverse strut 13, a pad support group 14, an external ring 15, an external fixing frame 16, a sliding chute 17, a pressing block 18 and buffer cotton 19 are arranged.
Detailed Description
The following description of the embodiments of the present application will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present application, but not all embodiments. Based on the embodiment of the present application (for convenience of description and understanding, the following description will be given with the upper part of fig. 2 as the upper part). All other embodiments, which can be made by those skilled in the art without the inventive effort, are intended to be within the scope of the present application.
Referring to fig. 1-3, the application provides a technical scheme that a silicon wafer cleaning device for preparing a silicon target material comprises upright column cross braces 1, wherein cross brace connecting frames 2 are arranged between the upright column cross braces 1, and driving components 3 are arranged at the upper ends of the cross brace connecting frames 2.
The upright column cross brace 1 plays a role in supporting the structure of the whole device, and ensures the stability and the firmness of the upright column cross brace. The cross brace connecting frame 2 is connected with the upright post cross brace 1, so that the rigidity and the strength of the device are improved. The driving component 3 provides power to drive the silicon wafer storage rack 6 in the silicon wafer placing seat 4 to rotate, so that the silicon wafer can be uniformly contacted with the cleaning liquid in the cleaning process.
The output of drive assembly 3 is provided with silicon chip and places seat 4, silicon chip is placed seat 4 and is included external framework 5, silicon chip supporter 6, cup joints axle 7 and drive group 8, the upper and lower both ends of silicon chip supporter 6 are provided with cup joints axle 7, cup joint the both ends cover of axle 7 and establish at external framework 5, and cup joint the upper end of axle (7) and be connected with drive group 8.
The wafer placing seat 4 is used for placing a silicon wafer, the external frame body 5 is used for fixing the silicon wafer placing frame 6 and providing installation positions for installation of components, the silicon wafer placing frame 6 is used for fixing the silicon wafer, and the sleeving shaft 7 is connected with the silicon wafer placing frame 6 and the external frame body 5, so that the silicon wafer placing frame 6 can rotate in the external frame body 5. The transmission group 8 is connected with the sleeve joint shaft 7 and the driving component 3 and transmits power to enable the silicon wafer storage rack 6 to rotate along with the rotation of the driving component 3.
The two sides of the upright column cross brace 1 are provided with cleaning components 9, each cleaning component 9 comprises a side support 10, a linear slide rail 11, a power component 12 and a cleaning cross brace 13, the linear slide rail 11 is installed on the side support 10, the cleaning cross brace 13 is arranged on the linear slide rail 11, and the driving end of the power component 12 is connected with the cleaning cross brace 13 arranged on the linear slide rail 11.
The cleaning assembly 9 is used for cleaning the silicon wafer, and the side supports 10 support the cleaning assembly 9 so that the cleaning assembly can move on two sides of the upright cross brace 1. The linear slide 11 is mounted on the side support 10 to provide a smooth moving track to enable the cleaning frame 13 to move horizontally on the linear slide 11. The power component 12 provides power to drive the cleaning cross frame 13 to move on the linear slide rail 11, so that the cleaning cross frame 13 can be adjusted according to the position and the angle of the silicon wafer, and the optimal cleaning effect is achieved. The cleaning cross bracket 13 is arranged on the linear slide rail 11 and is used for spraying cleaning liquid to clean the silicon wafer. The cleaning cross frame 13 is provided with a plurality of nozzles, which can be adjusted according to the shape and the size of the silicon wafer to realize uniform and comprehensive cleaning.
Further, a pad support group 14 is arranged at the lower end of the upright column cross brace 1, and the pad support group 14 is connected with an external fixing frame 16 through a fastener.
The pad support group 14 is arranged at the lower end of the upright column cross brace 1 and is used for heightening the whole device, so that the whole device keeps a certain distance from the ground, and the discharge and recovery of cleaning liquid are facilitated. The external mount 16 is used to mount the entire device against rocking or tilting during cleaning.
Further, the output end of the driving component 3 is connected with a transmission group 8 on the silicon wafer placing seat 4.
Further, the silicon wafer storage rack 6 is composed of an external ring 15 and a pressing block 18, a sliding groove 17 is arranged on the external ring 15, and the pressing block 18 is arranged on the sliding groove 17 in a sliding mode.
The outer ring 15 forms a circular space for placing the wafer. The press block 18 is used for pressing the silicon wafer to prevent the silicon wafer from falling off or shifting during the rotation process.
Further, the inside of the pressing block 18 is provided with a buffer cotton 19 attached to the inside.
The buffer cotton 19 is attached to the inner side of the pressing block 18, so that abrasion and scratch to the silicon wafer can be reduced.
Further, the end of the pressing block 18 adopts an inclined design.
The end part of the pressing block 18 adopts an inclined design, so that the pressing block 18 can be better adapted to silicon wafers, and the pressing effect is ensured.
When in use, a silicon wafer is placed in the external ring 15, the position of the pressing block 18 is adjusted to be tightly attached to the silicon wafer, and the silicon wafer is pressed to be fixed on the silicon wafer storage rack 6. The driving component 3 is started to enable the silicon wafer storage rack 6 to start rotating, and meanwhile the power component 12 is started to enable the cleaning cross bracket 13 to move on the linear slide rail 11 to clean the silicon wafer. After the cleaning is finished, the driving assembly 3 and the power assembly 12 are stopped, the pressing block 18 is loosened, the silicon wafer is taken out, the cleaning liquid can be discharged through a water outlet below the external fixing frame 16, and the cleaning liquid can be recovered and reused through a recovery system.
Although embodiments of the present application have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the application, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The silicon wafer cleaning device for preparing the silicon target comprises upright cross braces (1), wherein a cross brace connecting frame (2) is arranged between the upright cross braces (1), and is characterized in that a driving component (3) is arranged at the upper end of the upright cross braces connecting frame (2), a silicon wafer placing seat (4) is arranged at the output end of the driving component (3), the silicon wafer placing seat (4) comprises an external frame body (5), a silicon wafer storage rack (6), a sleeving shaft (7) and a transmission group (8), sleeving shafts (7) are arranged at the upper end and the lower end of the silicon wafer storage rack (6), two ends of the sleeving shaft (7) are sleeved on the external frame body (5), a transmission group (8) is connected with the upper end of the sleeving shaft (7), cleaning components (9) are arranged at the two sides of the upright cross braces (1), each cleaning component (9) comprises a side support (10), a linear slide rail (11), a power component (12) and a cleaning cross brace (13), a linear slide rail (11) is arranged on the side support (10), and the linear slide rail (11) is arranged on the side support (11), and the power component (13) is connected with the linear cross brace (13).
2. The silicon wafer cleaning device for preparing the silicon target material according to claim 1, wherein a pad support group (14) is arranged at the lower end of the upright post cross support (1), and the pad support group (14) is connected with an external fixing frame (16) through a fastener.
3. The silicon wafer cleaning device for preparing the silicon target material according to claim 1, wherein the output end of the driving component (3) is connected with a transmission group (8) on the silicon wafer placing seat (4).
4. The silicon wafer cleaning device for preparing the silicon target material according to claim 1, wherein the silicon wafer storage rack (6) is composed of an external ring (15) and a pressing block (18), a sliding groove (17) is formed in the external ring (15), and the pressing block (18) is slidably arranged in the sliding groove (17).
5. A silicon wafer cleaning device for preparing a silicon target material according to claim 4, wherein buffer cotton (19) is attached to the inner side of the pressing block (18).
6. A silicon wafer cleaning device for preparing a silicon target material as set forth in claim 4, wherein the end of said press block (18) is of an inclined design.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420204783.4U CN222112974U (en) | 2024-01-29 | 2024-01-29 | Silicon wafer cleaning device for preparing silicon target material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420204783.4U CN222112974U (en) | 2024-01-29 | 2024-01-29 | Silicon wafer cleaning device for preparing silicon target material |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222112974U true CN222112974U (en) | 2024-12-06 |
Family
ID=93688983
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420204783.4U Active CN222112974U (en) | 2024-01-29 | 2024-01-29 | Silicon wafer cleaning device for preparing silicon target material |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222112974U (en) |
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2024
- 2024-01-29 CN CN202420204783.4U patent/CN222112974U/en active Active
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