CN222106604U - A wafer bonding electrical performance test fixture - Google Patents
A wafer bonding electrical performance test fixture Download PDFInfo
- Publication number
- CN222106604U CN222106604U CN202323467941.XU CN202323467941U CN222106604U CN 222106604 U CN222106604 U CN 222106604U CN 202323467941 U CN202323467941 U CN 202323467941U CN 222106604 U CN222106604 U CN 222106604U
- Authority
- CN
- China
- Prior art keywords
- base
- test fixture
- fixedly connected
- wafer bonding
- electrical property
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 238000011056 performance test Methods 0.000 title description 3
- 238000012360 testing method Methods 0.000 claims abstract description 35
- 230000007246 mechanism Effects 0.000 claims abstract description 12
- 230000000694 effects Effects 0.000 abstract description 4
- 238000001514 detection method Methods 0.000 abstract 1
- 235000012431 wafers Nutrition 0.000 description 28
- 238000010586 diagram Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 230000007547 defect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model discloses a wafer bonding electrical property testing jig which comprises a testing jig body, wherein the upper surface of the testing jig body is fixedly connected with a base, the top of the base is slidably connected with a placing plate, the outer walls of the two sides of the placing plate are slidably connected with limiting frames, two connecting frames are fixedly connected between the limiting frames, a clearance groove is formed in the placing plate, a U-shaped frame is slidably connected in the clearance groove, the U-shaped frame penetrates through the connecting frames, and the two ends of the U-shaped frame are fixedly connected with fixing blocks. The utility model not only can adjust the position of the bonded wafer, facilitate the detection of the subsequent test jig body, improve the positioning effect of the device, but also can fix the position of the placing plate through the cooperation of the wedge-shaped block and the rotating handle, improve the fixing effect of the device, and further can stabilize the position of the placing plate through the auxiliary fixing mechanism.
Description
Technical Field
The present utility model relates to the field of wafer testing technology, and in particular, to a wafer bonding electrical performance testing jig.
Background
Wafer bonding refers to the process of bringing two wafers into contact sufficiently tightly that they can be firmly bonded together, and after wafer bonding, the die will be tested for performance, wherein there is an electrical performance test.
Through retrieving, publication number CN216771921U discloses a novel bonding electrical property high-efficiency test fixture, has simple structure, and it is more convenient to assemble, does not need to cut into the smallclothes after bonding the wafer and tests, and is with low costs, the higher characteristics of efficiency of assembly, nevertheless has following defect, need adjust when placing the wafer, makes the wafer be in under the thimble, is the position of direct contact wafer and removal wafer generally, and the wafer is touched the damage easily at the in-process of removal, leads to the wafer to scrap.
Disclosure of utility model
The utility model provides a wafer bonding electrical property test fixture for solving the defects in the prior art.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The utility model provides a wafer bonding electrical property test fixture, includes the test fixture body, the upper surface fixedly connected with base of test fixture body, the top sliding connection of base has the board of placing, and the equal sliding connection of both sides outer wall of placing the board has the spacing, fixedly connected with two link between the spacing, keep away the position groove in the inside of placing the board, keep away the sliding connection in position groove and have U type frame, and U type frame passes the link, the equal fixedly connected with fixed block in both ends of U type frame, the equal sliding connection of both sides outer wall of base has the wedge type piece, and the fixed block contacts with the wedge type piece, the inside rotation of base is connected with the worm, and the one end of worm passes base and fixedly connected with commentaries on classics handle, and the change the inside of base is equipped with power unit, the both sides of base all are equipped with supplementary fixed establishment.
As a still further scheme of the utility model, the power mechanism comprises a mounting groove, the mounting groove is arranged in the base, a connecting rod is rotationally connected in the mounting groove, a worm wheel and a gear are connected to an outer side key of the connecting rod, the worm wheel is meshed with a worm, a placing groove is arranged at the bottom of the placing plate, a rack is fixedly connected in the placing groove, and the rack is meshed with the gear.
As a still further scheme of the utility model, the auxiliary fixing mechanism comprises a plurality of clamping blocks, the clamping blocks are fixed on the outer wall of one side of the base through bolts, clamping plates are connected to the outer walls of the two sides of the base in a rotating mode, the clamping plates and the clamping blocks are clamped, and the limiting frame can be sleeved on the outer sides of the clamping plates.
As a still further scheme of the utility model, a plurality of anti-skid patterns are arranged on the outer side of the circumference of the rotating handle, and the anti-skid patterns are uniformly distributed.
As a still further proposal of the utility model, one side of the base is fixedly connected with an elastic clamping frame, and the elastic clamping frame can be clamped with the connecting frame.
As a still further scheme of the utility model, one side of the wedge-shaped block is fixedly connected with a rubber block.
As a still further proposal of the utility model, the bottom of the connecting frame is fixedly connected with a rubber strip.
As a still further scheme of the utility model, the outer wall of the bottom of the test jig body is fixedly connected with a plurality of feet which are symmetrically distributed.
The beneficial effects of the utility model are as follows:
1. Through the setting of placing the bench installation rack, at first place the wafer after bonding to place the upper surface of board, then rotate the twist grip, the worm rotates and makes the worm wheel drive the connecting rod and rotate to make the gear drive through the rack and place the board and remove along the base, and then make the position of wafer after the bonding obtain adjusting, make things convenient for follow-up test tool body to detect it, improved the location effect of device.
2. Through the setting of wedge type piece, downward pulling spacing makes link pulling U type frame along keeping away a position groove downwardly moving to make fixed block extrusion wedge type piece, make wedge type piece and changeing the inseparable contact, and then make the position of placing the board obtain fixing, improved the fixed effect of device.
3. Through the cooperation of auxiliary fixed establishment and elasticity card frame, place the board and remove and make the cardboard remove, rotate the cardboard downwards, make its card go into in the fixture block, the cover is in the outside of cardboard when spacing moves downwards to the position to the cardboard is restricted, in the elastic card frame was gone into to the card when the link moved downwards, further made the position of placing the board more stable, improved the result of use of device.
Drawings
FIG. 1 is a schematic perspective view of a wafer bonding electrical property testing tool according to the present utility model;
FIG. 2 is a schematic diagram of a partial cross-sectional structure of a wafer bonding electrical property test fixture according to the present utility model;
FIG. 3 is a schematic diagram of a partial enlarged structure of a wafer bonding electrical property testing tool according to the present utility model;
fig. 4 is a schematic diagram of a partial enlarged structure of a wafer bonding electrical performance test fixture according to the present utility model.
In the figure, 1, a test fixture body; 2, a ground anchor, 3, a base, 4, a rotating handle, 5, a rubber block, 6, a wedge-shaped block, 7, a fixed block, 8, a U-shaped frame, 9, a clamping block, 10, an elastic clamping frame, 11, a clamping plate, 12, a limiting frame, 13, a placing plate, 14, a connecting frame, 15, a rubber strip, 16, a clearance groove, 17, a placing groove, 18, a rack, 19, a connecting rod, 20, a mounting groove, 21, a worm wheel, 22, a gear, 23, a worm, 24 and an anti-skid pattern.
Detailed Description
The following description of the embodiments of the present utility model will be made with reference to the accompanying drawings, in which embodiments of the present utility model are shown, and in which embodiments are shown, by way of illustration, only, and not all embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.
Referring to fig. 1-4, a wafer bonding electrical property test fixture, including test fixture body 1, test fixture body 1's upper surface has base 3 through the bolt fastening, the top sliding connection of base 3 has place board 13, place board 13's both sides outer wall equal sliding connection has spacing 12, there are two link 14 through the bolt fastening between the spacing 12, keep away the position groove 16 has been seted up to the inside of placing board 13, keep away position groove 16 sliding connection has U type frame 8, and U type frame 8 passes link 14, the both ends of U type frame 8 all have fixed block 7 through the bolt fastening, the both sides outer wall of base 3 all sliding connection has wedge type piece 6, and fixed block 7 contacts with wedge type piece 6, the inside rotation of base 3 is connected with worm 23, the one end of worm 23 passes base 3 and welds and has the commentaries on classics handle 4, and change handle 4 and wedge type piece 6 contact, pull down spacing 12, make link 14 pull U type frame 8 along keep away position groove 16 move down, thereby make fixed block 7 push away from wedge type piece 6, make the wedge type piece 6 and the position of wedge type 6 and the position of die carrier 3, and then make the power take place mechanism and make the inside of the position of the wafer 13 and make the fixed mechanism and carry out, and carry out the position of the fixed mechanism and make the fixed position of the following the fixed to the base of the fixed surface of the wafer, and the fixed surface of the base is equipped with the fixed to the position of the following of the wafer 13, and is placed on the power to the base 13, and is convenient, and the fixed to the position of the base is placed and the position of the device and is placed to the opposite to the position to the base 13 and is 13.
The power mechanism comprises a mounting groove 20, the mounting groove 20 is arranged in the base 3, a connecting rod 19 is rotationally connected in the mounting groove 20, a worm wheel 21 and a gear 22 are connected to an outer key of the connecting rod 19, the worm wheel 21 is meshed with a worm 23, a placing groove 17 is arranged at the bottom of the placing plate 13, a rack 18 is welded in the placing groove 17, the rack 18 is meshed with the gear 22, a rotating handle 4 is rotated, the worm 23 rotates to drive the connecting rod 19 to rotate by the worm wheel 21 so as to drive the gear 22 to drive the rack 18 to move, the auxiliary fixing mechanism comprises a plurality of clamping blocks 9, the clamping blocks 9 are fixed on one side outer wall of the base 3 through bolts, clamping plates 11 are rotationally connected to two side outer walls of the base 3, the clamping plates 11 and the clamping blocks 9 are clamped, a limiting frame 12 can be sleeved on the outer side of the clamping plates 11, the placing plate 13 moves to downwards rotate the clamping plates 11 so as to clamp the clamping blocks 9, the limiting frame 12 moves downwards and is sleeved on the outer side of the clamping plate 11, so that the position of the clamping plate 11 is limited, a plurality of anti-skid patterns 24 are formed on the outer side of the circumference of the rotating handle 4, the anti-skid patterns 24 are uniformly distributed, an elastic clamping frame 10 is fixed on one side of the base 3 through bolts, the elastic clamping frame 10 can be clamped with the connecting frame 14, the connecting frame 14 moves downwards and is clamped into the elastic clamping frame 10, the position of the placing plate 13 is further stable, a rubber block 5 is adhered to one side of the wedge-shaped block 6, the rubber block 5 can protect the rotating handle 4, the wedge-shaped block 6 is prevented from being easily worn due to direct contact with the rotating handle 4, friction force between the wedge-shaped block 6 and the rotating handle 4 can be increased, a rubber strip 15 is adhered to the bottom of the connecting frame 14, a plurality of feet 2 are fixed on the outer wall of the bottom of the testing jig body 1 through bolts, and the ground feet 2 are symmetrically distributed.
When the device is needed to be used, firstly, the bonded wafer is placed on the upper surface of the placement plate 13, then the rotating handle 4 is rotated, the worm 23 rotates to enable the worm wheel 21 to drive the connecting rod 19 to rotate, so that the gear 22 drives the placement plate 13 to move along the base 3 through the rack 18, the position of the bonded wafer is adjusted, then the limiting frame 12 is pulled downwards, the connecting frame 14 pulls the U-shaped frame 8 to move downwards along the avoidance groove 16, the wedge-shaped block 6 is extruded by the fixing block 7, the wedge-shaped block 6 is tightly contacted with the rotating handle 4, the position of the placement plate 13 is fixed, meanwhile, the placement plate 13 moves to enable the clamping plate 11 to move, the clamping plate 11 is rotated downwards to clamp into the clamping block 9, the limiting frame 12 is sleeved outside the clamping plate 11 when moving downwards, the position of the clamping plate 11 is limited, the connecting frame 14 is clamped into the elastic clamping frame 10 when moving downwards, the position of the placement plate 13 is further stable, and the subsequent testing tool body 1 is convenient to detect the bonding electrical property of the wafer.
Finally, it should be noted that, for those skilled in the art, modifications may still be made to the technical solutions described in the foregoing embodiments, or equivalents may be substituted for part of the technical features thereof. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.
Claims (8)
1. Wafer bonding electrical property test fixture, including test fixture body (1), its characterized in that, the last fixed surface of test fixture body (1) is connected with base (3), and the top sliding connection of base (3) has place board (13), and the equal sliding connection of both sides outer wall of placing board (13) has spacing (12), fixedly connected with two link (14) between spacing (12), keep away stand (16) have been seted up to the inside of placing board (13), keep away stand (16) sliding connection has U type frame (8), and U type frame (8) pass link (14), the equal fixedly connected with fixed block (7) in both ends of U type frame (8), the equal sliding connection in both sides outer wall of base (3) has wedge type piece (6), and fixed block (7) contact with wedge type piece (6), the inside rotation of base (3) is connected with worm (23), and the one end of worm (23) is passed base (3) and is fixedly connected with and is changeed (4), and changes base (4) and wedge type piece (6) and the inside of base (3), both sides of side mechanism (3) have been equipped with auxiliary mechanism.
2. The wafer bonding electrical property test fixture according to claim 1, wherein the power mechanism comprises a mounting groove (20), the mounting groove (20) is formed in the base (3), a connecting rod (19) is rotationally connected in the mounting groove (20), a worm wheel (21) and a gear (22) are connected to an outer side key of the connecting rod (19), the worm wheel (21) is meshed with the worm (23), a placing groove (17) is formed in the bottom of the placing plate (13), a rack (18) is fixedly connected in the placing groove (17), and the rack (18) is meshed with the gear (22).
3. The wafer bonding electrical property test fixture according to claim 1, wherein the auxiliary fixing mechanism comprises a plurality of clamping blocks (9), the clamping blocks (9) are fixed on one side outer wall of the base (3) through bolts, clamping plates (11) are rotatably connected to two side outer walls of the base (3), the clamping plates (11) and the clamping blocks (9) are clamped, and the limiting frame (12) can be sleeved on the outer sides of the clamping plates (11).
4. The wafer bonding electrical property test fixture according to claim 1, wherein a plurality of anti-skidding patterns (24) are formed on the outer side of the circumference of the rotating handle (4), and the anti-skidding patterns (24) are uniformly distributed.
5. The wafer bonding electrical property testing jig according to claim 1, wherein an elastic clamping frame (10) is fixedly connected to one side of the base (3), and the elastic clamping frame (10) can be clamped with the connecting frame (14).
6. The wafer bonding electrical property test fixture according to claim 1, wherein a rubber block (5) is fixedly connected to one side of the wedge block (6).
7. The wafer bonding electrical property test fixture according to claim 6, wherein a rubber strip (15) is fixedly connected to the bottom of the connecting frame (14).
8. The wafer bonding electrical property test fixture according to claim 1, wherein a plurality of ground feet (2) are fixedly connected to the outer wall of the bottom of the test fixture body (1), and the ground feet (2) are symmetrically distributed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323467941.XU CN222106604U (en) | 2023-12-19 | 2023-12-19 | A wafer bonding electrical performance test fixture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323467941.XU CN222106604U (en) | 2023-12-19 | 2023-12-19 | A wafer bonding electrical performance test fixture |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222106604U true CN222106604U (en) | 2024-12-03 |
Family
ID=93612151
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323467941.XU Active CN222106604U (en) | 2023-12-19 | 2023-12-19 | A wafer bonding electrical performance test fixture |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222106604U (en) |
-
2023
- 2023-12-19 CN CN202323467941.XU patent/CN222106604U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN115394676B (en) | Inspection bench and inspection method for photovoltaic cell product | |
| CN212459239U (en) | Automobile door handle shell detection device that shocks resistance | |
| CN222106604U (en) | A wafer bonding electrical performance test fixture | |
| CN212170162U (en) | Automobile pipeline inspection device | |
| CN218896132U (en) | Positioning fixture for magnetic test of magnet | |
| CN219004684U (en) | Efficient drilling jig for automobile hubs | |
| CN210090178U (en) | Tensile strength detection device of dust collector connecting shaft assembly | |
| CN218873338U (en) | Straightening clamp for screw rod assembly | |
| CN217033377U (en) | Neodymium iron boron rapid hardening piece column crystal property detection device | |
| CN217276913U (en) | Anti extrusion detection device of tire for automobile manufacturing | |
| CN213581300U (en) | Electricity core short circuit accredited testing organization and electricity core processing equipment | |
| CN220605880U (en) | Movable fixture for solar cell testing probe row | |
| CN222636862U (en) | Solid state disk test fixture | |
| CN218765170U (en) | Spacing tool for automobile inspection device | |
| CN223107800U (en) | A master alloy tester | |
| CN220872574U (en) | Ground resistance on-line monitoring device convenient to wiring | |
| CN214473490U (en) | Test fixture of battery management platform | |
| CN220649992U (en) | Automobile engine axle sleeve check out test set | |
| CN219842535U (en) | New energy battery's check out test set | |
| CN220817331U (en) | Electric instrument testing device | |
| CN222768244U (en) | A photovoltaic film welding detection fixture | |
| CN221667643U (en) | Be applied to high-speed rotatory CT detection device of lamination battery | |
| CN222106603U (en) | Detection mechanism after wafer plastic packaging | |
| CN217901949U (en) | Adjustable test platform for ASIC chip development | |
| CN220339925U (en) | Pressure-bearing testing device for inner support of tunnel |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |