CN222105904U

CN222105904U - An embedded motherboard

Info

Publication number: CN222105904U
Application number: CN202420726605.8U
Authority: CN
Inventors: 杨东; 刘进
Original assignee: Shenzhen Hanzsung Technology Co ltd
Current assignee: Shenzhen Hanzsung Technology Co ltd
Priority date: 2024-04-10
Filing date: 2024-04-10
Publication date: 2024-12-03
Anticipated expiration: 2034-04-10

Abstract

The utility model relates to the technical field of mainboards, in particular to an embedded mainboard which comprises a mainboard body, wherein plug strips are fixed on two sides of the top end of the mainboard body, components are installed on the surface of the top end of the mainboard body, mounting frames are installed at two ends of the mainboard body, heat-conducting silica gel pads are adhered to the inner surfaces of the mounting frames, and the mounting frames are installed at two ends of the mainboard body through the heat-conducting silica gel pads. The fixing device has the beneficial effects that the fixing device keeps the fixing frame and the main board body to fix, so that the fixing board and the clamping plate on the outer side of the fixing frame are stably arranged, the height of the clamping plate on the side face of the fixing board can be adjusted according to the embedded fixing and clamping position on the computer in the fixing process of the main board body, the fixing nuts can be loosened, the height position of the clamping plate can be adjusted up and down along the fixing rod, and therefore the main board body can be accurately fixed into the computer through the clamping plate.

Description

Embedded main board

Technical Field

The utility model relates to the technical field of mainboards, in particular to an embedded mainboard.

Background

The main board, also called motherboard, system board or motherboard, is divided into two kinds of commercial main board and industrial main board. It is installed in the case and is one of the most basic and important components of microcomputer. The main board is generally a rectangular circuit board, on which the main circuit system forming the computer is mounted, and generally has elements such as a control chip, a key and panel control switch interface, an indicator light plug-in connector, an expansion slot, a direct current power supply plug-in connector of the main board and the plug-in card, and the like.

The embedded main board is a cpu board embedded in industrial equipment for control and data processing, and the volume, power consumption, heat dissipation and other requirements of the embedded main board are relatively high. Therefore, the embedded motherboard needs to have the characteristics of small volume, high integration level, stable performance and the like.

At present, embedded mainboards are often seen and used in our daily lives.

For example, chinese patent publication No. CN213750983U provides an embedded motherboard, which comprises a motherboard body, the front side surface of motherboard body is connected with the cooling plate through fixed establishment, the cavity has been seted up to the inside of cooling plate, a plurality of louvres have all been seted up to the front and back both sides of cooling plate, the inside fixedly connected with condenser tube of cooling plate, first round hole has all been seted up at the inside one side top of cavity and opposite side bottom, inlet tube and outlet pipe are respectively through corresponding two first round holes fixedly connected with in both ends of condenser tube, the front side surface fixedly connected with coupling cover of cooling plate, the front side surface center department fixed mounting of coupling cover has radiator fan.

The device can cool down the mainboard fast when the mainboard is in operation, prevents to lead to the mainboard to take place the short circuit because of the high temperature to improve the life of mainboard, can also be convenient for install and dismantle cooling plate and mainboard body.

The existing embedded main board is fixed in the installation process by the aid of clamping structures on two sides of the main board, the height position cannot be adjusted, and therefore the embedded main board is difficult to align accurately to the embedded mounting clamping position, so that the main board cannot be embedded and clamped stably and accurately, meanwhile, the main board body is fixed in the clamping structures on two sides, after the clamping structures or the main board body fail or are damaged, the main board body is inconvenient to disassemble or replace, the whole main board body is discarded and is wasted, and the failed or damaged clamping structures or the main board body are inconvenient to disassemble, replace and maintain.

Disclosure of utility model

The utility model aims to solve the defects that in the prior art, clamping structures on two sides of a main board are relatively fixed, and the height position cannot be adjusted, so that the embedded installation clamping position is difficult to align accurately and the main board is embedded, and the main board cannot be embedded and clamped stably and accurately.

In order to achieve the above purpose, the present utility model provides the following technical solutions:

The utility model provides an embedded mainboard, includes the mainboard body, the top both sides of mainboard body are fixed with the grafting strip, the top surface mounting of mainboard body has components and parts, the installing frame is installed at the both ends of mainboard body, the internal surface paste of installing frame has the heat conduction silica gel pad, the installing frame is separated by the heat conduction silica gel pad is installed the both ends of mainboard body, open at the upper and lower both ends of installing frame has first connecting hole, the inside of first connecting hole is passed there is first bolt, first bolt is separated by the heat conduction silica gel pad top is tight the side of mainboard body, the outside of installing frame is fixed with the mounting panel, the upper and lower both ends of mounting panel are fixed with the backup pad, two be fixed with the installation pole between the backup pad, the outside of mounting panel is provided with the joint board, open on the surface of joint board has the guiding hole.

Further, the mounting rod slides through the guide hole, and the clamping plate is slidably mounted on the outer side of the mounting plate through the mounting rod.

Further, the outer end of the clamping plate protrudes out of the outer end of the supporting plate, a first shock pad is adhered to the surface of the outer end of the clamping plate, and the section of the first shock pad is of a C-shaped structure.

Further, the installation pole is threaded rod structure, and vertical setting is in the outside of mounting panel, the surface connection of installation pole has fastening nut, fastening nut is located the upper and lower both ends of guiding hole, the joint board passes through fastening nut with fastening installation connection between the installation pole.

Further, the top and the bottom on mounting panel surface evenly open there is the second connecting hole, the second connecting hole is screw hole structure, and the level sets up.

Further, the second bolt penetrates through the second connecting hole, a locknut is connected to the surface of the second bolt, and the locknut is located at one end of the second connecting hole and close to the mounting frame.

Further, the outer end of the second bolt is fixed with a jacking plate, the outer side of the jacking plate is connected with a second shock pad, and the second shock pad is of a round structure.

Further, the outside edge of mainboard body is pasted and is had the heat conduction silica gel post, the height of heat conduction silica gel post is not less than the grafting strip with the height of components and parts.

The embedded main board provided by the utility model has the beneficial effects that:

1. According to the utility model, the mounting frames are detachably arranged on the two sides of the main board body, and the heat-conducting silica gel pads are arranged on the mounting frames, so that the heat dissipation on the two sides of the main board body can be facilitated, the vibration conduction of the mounting frames to the two sides of the main board body can be reduced, the stability of the main board body is kept, and the side surfaces of the main board body are tightly propped up through the first bolts at the upper end and the lower end of the mounting frames through the heat-conducting silica gel pads, so that the mounting frames and the main board body are firmly arranged, and the stable arrangement of the structures such as the mounting plates and the clamping plates on the outer sides of the mounting frames is kept.

2. According to the utility model, the mounting plate is fixed on the outer side of the mounting frame, the supporting plates are fixed at the upper end and the lower end of the mounting plate, the mounting rod is fixed between the two supporting plates, the clamping plate is mounted on the side face of the mounting plate and passes through the guide hole on the surface of the clamping plate through the mounting rod, the clamping plate is mounted through the fastening nut, the upper end and the lower end of the mounting plate are respectively provided with the second bolt through the second connecting hole, the outer ends of the second bolts are respectively provided with the jacking plate and the second shock-absorbing pad, so that the height of the clamping plate on the side face of the mounting plate can be adjusted according to the embedded mounting clamping position on the computer in the mounting process of the main board body, the fastening nut can be loosened, the height position of the clamping plate can be adjusted up and down along the mounting rod, and then the fastening nut can be used for fastening and mounting, the main board body can be accurately mounted into the computer through the fastening nut, the main board body can be kept stable in the clamping mounting of the main board body, meanwhile, the second bolts can be rotated, the jacking plate and the second shock-absorbing pads are driven to jack the mounting positions on the two sides of the main board body, the main board body can be improved in the mounting stability, and the shock-absorbing performance of the main board can be improved through the first shock-absorbing pad and the main board and the shock-absorbing frame.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is an enlarged view of the utility model at D of FIG. 1;

FIG. 3 is an enlarged view of FIG. 1 at E in accordance with the present utility model;

FIG. 4 is a cross-sectional view of FIG. 1 of the present utility model;

FIG. 5 is an enlarged view of the utility model at A of FIG. 4;

FIG. 6 is an enlarged view of the utility model at B of FIG. 4;

FIG. 7 is an enlarged view of FIG. 4 at C in accordance with the present utility model;

FIG. 8 is a top view of FIG. 1 in accordance with the present utility model;

fig. 9 is a side view of fig. 1 of the present utility model.

In the figure, 1, a main board body, 2, a heat conduction silica gel column, 3, a plugging strip, 4, a mounting frame, 5, a second bolt, 6, a supporting plate, 7, a jacking plate, 8, a mounting plate, 9, a mounting rod, 10, a connecting plate, 11, a first shock pad, 12, a fastening nut, 13, a guide hole, 14, a locknut, 15, a second connecting hole, 16, a second shock pad, 17, a first connecting hole, 18, a first bolt, 19, a heat conduction silica gel pad, 20 and a component.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments.

Referring to fig. 1, 2, 3, 4, 5, 6, 7, 8 and 9, an embedded motherboard in the drawings includes a motherboard body 1, two sides of a top end of the motherboard body 1 are fixed with plugging strips 3 for connection with external devices, a component 20 is mounted on a surface of the top end of the motherboard body 1, and mounting frames 4 are mounted at two ends of the motherboard body 1.

In detail, the heat-conducting silica gel pad 19 is adhered to the inner surface of the mounting frame 4, the mounting frame 4 is mounted at two ends of the main board body 1 through the heat-conducting silica gel pad 19, the upper end and the lower end of the mounting frame 4 are provided with first connecting holes 17, the first connecting holes 17 are of threaded hole structures, first bolts 18 penetrate through the inside of the first connecting holes 17, and the first bolts 18 are tightly propped against the side surface of the main board body 1 through the heat-conducting silica gel pad 19, so that the main board body 1 is kept to be stably and detachably mounted.

Moreover, the outside of installing frame 4 is fixed with mounting panel 8, mounting panel 8 rectangular plate structure, and vertical setting, the upper and lower both ends of mounting panel 8 are fixed with backup pad 6, backup pad 6 is rectangular plate structure, and the level setting.

Meanwhile, a mounting rod 9 is fixed between the two support plates 6, a clamping plate 10 is arranged on the outer side of the mounting plate 8, the clamping plate 10 is of a rectangular plate structure and is horizontally arranged, and a guide hole 13 is formed in the surface of the clamping plate 10.

Further, the mounting rod 9 is slidably inserted through the guide hole 13, and the locking plate 10 is slidably mounted on the outer side of the mounting plate 8 via the mounting rod 9.

Further, the outer end of the clamping plate 10 protrudes out of the outer end of the supporting plate 6, a first shock pad 11 is adhered to the outer end surface of the clamping plate 10, the cross section of the first shock pad 11 is in a C-shaped structure, and external vibration is reduced to be conducted to the surface of the mounting plate 8.

Further, the mounting rod 9 is of a threaded rod structure and is vertically arranged on the outer side of the mounting plate 8, a fastening nut 12 is connected to the surface of the mounting rod 9, the fastening nut 12 is located at the upper end and the lower end of the guide hole 13, and the clamping plate 10 is fixedly mounted and connected with the mounting rod 9 through the fastening nut 12, so that the height of the clamping plate 10 can be adjusted up and down along the mounting rod 9.

Further, the top and bottom ends of the surface of the mounting plate 8 are uniformly provided with second connecting holes 15, the second connecting holes 15 are of threaded hole structures and are horizontally arranged, second bolts 5 penetrate through the second connecting holes 15, the second bolts 5 and the mounting rod 9 are arranged at staggered intervals, the surface of the second bolts 5 is connected with locknuts 14, and the locknuts 14 are located at one ends of the second connecting holes 15 and are close to the mounting frame 4.

Further, the outer end of the second bolt 5 is fixed with a tightening plate 7, the tightening plate 7 is of a circular plate structure and is vertically arranged, the outer side of the tightening plate 7 is connected with a second shock pad 16, and the second shock pad 16 is of a circular structure.

Further, the outer side edge of the main board body 1 is adhered with the heat-conducting silica gel column 2, and the height of the heat-conducting silica gel column 2 is not less than the height of the plugging strip 3 and the component 20, so that the heat dissipation of the main board body 1 can be increased, and the influence of external extrusion and vibration on the main board body 1 can be reduced.

The mounting frames 4 are detachably arranged on the two sides of the main board body 1, and the heat-conducting silica gel pads 19 are arranged on the two sides of the main board body 1, so that the heat dissipation on the two sides of the main board body 1 can be facilitated, the vibration conduction of the mounting frames 4 on the two sides of the main board body 1 can be reduced, and the stability of the main board body 1 is kept.

The side surface of the main board body 1 is tightly supported by the first bolts 18 at the upper and lower ends of the mounting frame 4 via the heat conductive silica gel pads 19, and the mounting frame 4 and the main board body 1 are firmly mounted, so that the stable arrangement of the mounting plate 8, the clamping plate 10 and other structures outside the mounting frame 4 is maintained.

The mounting plate 8 is fixed on the outer side of the mounting frame 4, the support plates 6 are fixed on the upper end and the lower end of the mounting plate 8, the mounting rod 9 is fixed between the two support plates 6, and the clamping plate 10 is mounted on the side surface of the mounting plate 8, passes through the guide hole 13 on the surface of the clamping plate 10 through the mounting rod 9, and is fastened and mounted through the fastening nut 12.

And, on the upper and lower end surfaces of the mounting plate 8, a second bolt 5 is mounted and connected through a second connection hole 15, and a knock-up plate 7 and a second shock pad 16 are provided at the outer end of the second bolt 5.

So, mainboard body 1 can adjust the height of joint board 10 at mounting panel 8 side according to embedded installation joint position on the computer in the installation, can become flexible fastening nut 12 to adjust the high position of joint board 10 from top to bottom along installation pole 9, later accessible fastening nut 12 carries out fastening installation, thereby can make the mainboard body 1 can be through the accurate installation of joint board 10 into the computer, keep mainboard body 1 joint installation stable.

Simultaneously, can rotate second bolt 5, drive the tight board of top 7 and the tight mounted position of main board body 1 both sides of second shock pad 16 top to can improve the installation stability of main board body 1, and reduce the vibration influence of outside vibrations to joint board 10, mounting panel 8 and installing frame 4 through first shock pad 11 and second shock pad 16, improve the shock-resistant buffer performance of main board body 1.

The foregoing is only a preferred embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art, who is within the scope of the present utility model, should make equivalent substitutions or modifications according to the technical scheme of the present utility model and the inventive concept thereof, and should be covered by the scope of the present utility model.

Claims

1. An embedded motherboard, comprising a motherboard body (1), characterized in that: plug strips (3) are fixed on both sides of the top of the motherboard body (1), components (20) are installed on the top surface of the motherboard body (1), mounting frames (4) are installed at both ends of the motherboard body (1), thermal conductive silicone pads (19) are adhered to the inner surface of the mounting frame (4), the mounting frame (4) is installed at both ends of the motherboard body (1) through the thermal conductive silicone pads (19), and first connection holes are opened at the upper and lower ends of the mounting frame (4) (17), a first bolt (18) passes through the inside of the first connecting hole (17), and the first bolt (18) is pressed against the side of the main board body (1) through the thermal conductive silicone pad (19), a mounting plate (8) is fixed on the outside of the mounting frame (4), support plates (6) are fixed at the upper and lower ends of the mounting plate (8), a mounting rod (9) is fixed between the two support plates (6), and a clamping plate (10) is arranged on the outside of the mounting plate (8), and a guide hole (13) is opened on the surface of the clamping plate (10).

2. An embedded motherboard according to claim 1, characterized in that: the mounting rod (9) slides through the guide hole (13), and the clamping plate (10) is slidably mounted on the outer side of the mounting plate (8) through the mounting rod (9).

3. An embedded motherboard according to claim 1, characterized in that: the outer end of the clamping plate (10) protrudes from the outer end of the support plate (6), a first shock-absorbing pad (11) is adhered to the outer end surface of the clamping plate (10), and the cross-section of the first shock-absorbing pad (11) is a C-shaped structure.

4. An embedded motherboard according to claim 2, characterized in that: the mounting rod (9) is a threaded rod structure and is vertically arranged on the outside of the mounting plate (8), the surface of the mounting rod (9) is connected with a fastening nut (12), the fastening nut (12) is located at the upper and lower ends of the guide hole (13), and the clamping plate (10) is fastened and installed with the mounting rod (9) through the fastening nut (12).

5. An embedded motherboard according to claim 1, characterized in that second connection holes (15) are evenly opened at the top and bottom ends of the surface of the mounting plate (8), and the second connection holes (15) are threaded hole structures and are horizontally arranged.

6. An embedded motherboard according to claim 5, characterized in that: a second bolt (5) passes through the inside of the second connecting hole (15), a locking nut (14) is connected to the surface of the second bolt (5), and the locking nut (14) is located at one end of the second connecting hole (15) and close to the mounting frame (4).

7. An embedded motherboard according to claim 6, characterized in that: a tightening plate (7) is fixed to the outer end of the second bolt (5), and a second shock-absorbing pad (16) is connected to the outer side of the tightening plate (7), and the second shock-absorbing pad (16) is a circular structure.

8. An embedded motherboard according to claim 1, characterized in that: a thermally conductive silicone column (2) is adhered to the outer edge of the motherboard body (1), and the height of the thermally conductive silicone column (2) is not less than the height of the connector strip (3) and the component (20).