CN222090015U - Heat radiation structure of electronic equipment - Google Patents
Heat radiation structure of electronic equipment Download PDFInfo
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- CN222090015U CN222090015U CN202422640517.9U CN202422640517U CN222090015U CN 222090015 U CN222090015 U CN 222090015U CN 202422640517 U CN202422640517 U CN 202422640517U CN 222090015 U CN222090015 U CN 222090015U
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Abstract
The utility model relates to the technical field of cabinet heat dissipation, in particular to a heat dissipation structure of electronic equipment, which comprises a cabinet body and a mounting frame, wherein the bottom end of the mounting frame is fixedly connected with the bottom end of the inner part of the cabinet body, a plurality of mounting plates are arranged in the mounting frame, two fans are embedded at the top of the cabinet body, a heat absorption mechanism for absorbing heat of electronic elements is arranged on the mounting plates, and a heat conduction mechanism for heat transportation is arranged at the top of the cabinet body.
Description
Technical Field
The utility model relates to the technical field of cabinet heat dissipation, in particular to a heat dissipation structure of electronic equipment.
Background
The cabinet is a special cabinet for storing and managing IT equipment such as servers, network equipment and storage equipment, the main functions of the cabinet include providing protection for the equipment, shielding electromagnetic interference, orderly arranging the equipment and facilitating maintenance and management of the equipment, the classification of the cabinet is various, the cabinet can be classified according to the functions, application ranges, materials and structural characteristics, for example, the cabinet can be fixed or sliding, open or closed, and cabinets with different sizes and specifications are suitable for different installation requirements, heat is usually generated by the equipment in the cabinet during operation, and heat dissipation treatment is needed to be carried out on the equipment in the cabinet by using heat dissipation equipment, so that the service life of the equipment is prolonged;
The Chinese patent CN220326128U discloses a heat radiation structure of an artificial intelligence service cabinet, which is added with the function of conveniently cleaning a heat radiation fan, so that the heat radiation structure has the effects of starting the heat radiation fan and quickly cleaning the heat radiation fan, and the condition that the heat radiation fan of the service cabinet is cleaned more fussy is prevented;
But when the heat dissipation is carried out to the inside of the cabinet, the heat of the equipment at the bottom of the cabinet is easy to gather at the top of the cabinet under the action of the fan, and due to the lack of a mechanism for distributing the whole heat inside the cabinet and the heat emitted by the equipment, the heat of the equipment at the top of the cabinet is higher than that of the equipment at the bottom, so that the equipment at the top of the cabinet is easy to damage, and based on the phenomenon, the heat dissipation structure of the electronic equipment is provided.
Disclosure of utility model
The utility model aims to provide a heat dissipation structure of electronic equipment, which aims to solve the problem that the heat of equipment at the top of a cabinet is higher than that of equipment at the bottom of the cabinet due to the lack of a mechanism for dividing the whole heat inside the cabinet and the heat emitted by the equipment in the background art.
The heat radiation structure of the electronic equipment comprises a cabinet body and a mounting frame, wherein the bottom end of the mounting frame is fixedly connected with the bottom end of the inner part of the cabinet body, a plurality of mounting plates are arranged in the mounting frame, two fans are embedded at the top of the cabinet body, a heat absorption mechanism for absorbing heat of electronic elements is arranged on the mounting plates, a heat conduction mechanism for heat transportation is arranged at the top of the cabinet body, the heat absorption mechanism can be arranged on the mounting plates in a vertical moving mode, the heat conduction mechanism is arranged at the rear side of the mounting plates, the heat conduction mechanism is communicated with the heat absorption mechanism, and the heat conduction mechanism is communicated with the fans positioned at the left side.
Preferably, a plurality of heat outlets are formed in the top of the cabinet body, the plurality of heat outlets are arranged in a rectangular array, and the interior of the cabinet body is communicated with the plurality of heat outlets.
Preferably, the heat absorption mechanism comprises a hollow rod, a plurality of guiding holes are formed in the top end of the mounting plate, the guiding holes are arranged in a rectangular array, a heat conduction cavity is formed in the mounting plate, a plurality of placing holes communicated with the heat conduction cavity are formed in the top end of the mounting plate in a penetrating mode, a hollow cylinder is fixedly connected to the placing holes, the outer wall of the hollow cylinder is communicated with a first heat absorption hole in the heat conduction cavity, two supporting plates are fixedly connected to the bottom of the outer wall of the hollow cylinder and are symmetrically arranged in an annular array, clamping plates are fixedly connected to opposite sides of the supporting plates, the hollow rod penetrates through the hollow cylinder, second heat absorption holes are formed in the top and the bottom of the hollow rod, two clamping grooves are symmetrically arranged in the annular array, and connecting plates are fixedly connected to the rear side of the mounting plate.
Preferably, the heat conduction mechanism comprises a hollow plate, a conical cylinder is fixedly connected below the fan, close to the left, at the top end of the inner part of the cabinet body, the top end of the hollow plate is fixedly connected with the bottom end of the conical cylinder, a plurality of mounting holes are formed in one side of the hollow plate, the plurality of mounting holes are arranged at equal intervals in a linear array, a plurality of fixing plates are fixedly connected to the two sides of the hollow plate, close to the outer sides of the plurality of mounting holes, of the plurality of fixing plates respectively, and one side of each adjacent fixing plate is provided with a positioning bolt through threaded connection.
Preferably, the heat absorbing mechanism is connected with the fixing plate through two positioning bolts respectively.
Preferably, one side of each of the plurality of fixing plates is connected with a baffle plate through two positioning bolts.
Compared with the prior art, the utility model provides the heat dissipation structure of the electronic equipment by improving the heat dissipation structure, and has the following improvements and advantages:
1. According to the utility model, the clamping plates are aligned with the clamping grooves, so that a plurality of hollow rods can move up and down according to the appearance of external equipment, the plurality of hollow rods which are not moved can surround the outer side of the equipment, the plurality of hollow rods are matched with the second heat absorption holes positioned above to facilitate heat conduction into the heat conduction cavity, the plurality of moving hollow rods move to the upper side of the lower mounting plate, the second heat absorption holes positioned below are matched to absorb heat emitted by the equipment positioned on the lower mounting plate, the left fan and the hollow plates are used for conveniently and directly radiating the equipment positioned at the bottom of the cabinet, and the right fan is matched to absorb the heat in the cabinet, so that the heat is split, and the radiating effect is better.
Drawings
FIG. 1 is a schematic diagram of the structure of the present utility model;
FIG. 2 is a schematic view of the structure of the cone of the present utility model;
FIG. 3 is a front view of the hollow slab of the present utility model;
FIG. 4 is a cross-sectional view of a mounting plate of the present utility model;
FIG. 5 is a schematic structural view of the hollow bar of the present utility model;
FIG. 6 is a schematic view of the structure of the mounting plate of the present utility model;
fig. 7 is a partial cross-sectional view of the cabinet of the utility model.
Reference numerals illustrate:
1. the heat-conducting cabinet comprises a cabinet body, a mounting plate, a guide hole, a placement hole, a heat conducting cavity, a hollow cylinder, a first heat absorbing hole, a support plate, a clamping plate, a 10 hollow rod, a 11 second heat absorbing hole, a 12 clamping groove, a 13 connecting plate, a 14 hollow plate, a 15 fixing plate, a 16 positioning bolt, a 17 blocking plate, a 18 conical cylinder, a 19 fan, a 20 heat-emitting hole, a 21 mounting hole, a 22 mounting frame and a mounting frame.
Detailed Description
The present utility model will be further described with reference to specific embodiments, however, it will be appreciated by those skilled in the art that the detailed description herein with reference to the accompanying drawings is for better illustration, and that the utility model is not necessarily limited to such embodiments, but rather is intended to cover various equivalent alternatives or modifications, as may be readily apparent to those skilled in the art.
FIGS. 1-7 illustrate preferred embodiments of the present utility model, and the present utility model will be further described with reference to FIGS. 1-7.
The utility model provides a heat radiation structure of electronic equipment, including the cabinet body 1 and mounting bracket 22, mounting bracket 22 bottom and the inside bottom fixed connection of cabinet body 1 install a plurality of mounting panel 2 in the mounting bracket 22, the top of the cabinet body 1 is inlayed and is equipped with two fans 19, be provided with the endothermic mechanism that is used for absorbing electronic component heat on the mounting panel 2, cabinet body 1 top is provided with the heat conduction mechanism that is used for heat to carry, the setting that endothermic mechanism can reciprocate is on mounting panel 2, heat conduction mechanism sets up the rear side at mounting panel 2, heat conduction mechanism is linked together with endothermic mechanism, and heat conduction mechanism communicates with the fan 19 that is located the left side.
Through heat absorption mechanism and heat conduction mechanism cooperation, the fan 19 that conveniently is located the left side directly dispels the heat to the equipment that is located cabinet body 1 bottom to the cooperation is located the fan 19 on the right side and absorbs the heat of cabinet body 1 inside, with this to the heat reposition of redundant personnel processing, the radiating effect is better.
Further, a plurality of apopore 20 has been seted up at cabinet body 1 top, and a plurality of apopore 20 is rectangular array setting, and cabinet body 1 is inside to be linked together with a plurality of apopore 20, through setting up a plurality of apopore 20 at cabinet body 1 top, avoids under the rainwater weather, and the rainwater gets into cabinet body 1 inside from apopore 20.
Further, the heat absorption mechanism includes hollow pole 10, a plurality of guiding hole 3 has been seted up on mounting panel 2 top, a plurality of guiding hole 3 is rectangular array setting, mounting panel 2 inside is provided with heat conduction chamber 5, mounting panel 2 top runs through has the placing hole 4 of a plurality of intercommunication heat conduction chamber 5, place inside fixedly connected with hollow section of thick bamboo 6 of hole 4, hollow section of thick bamboo 6 outer wall intercommunication heat conduction chamber 5 inside first heat absorption hole 7, two backup pads 8 of hollow section of thick bamboo 6 outer wall bottom fixedly connected with, two backup pads 8 are annular array symmetry setting, the equal fixedly connected with of opposite one side of two backup pads 8 gives joint plate 9, hollow pole 10 runs through inside hollow section of thick bamboo 6, hollow pole 10 top and bottom have all seted up second heat absorption hole 11, two draw-in grooves 12 have been seted up to hollow pole 10 bottom, two draw-in grooves 12 are annular array symmetry setting, mounting panel 2 rear side fixedly connected with connecting plate 13, when draw-in groove 12 stagger with joint plate 9, thereby hollow section of thick bamboo 6 supports restriction to hollow pole 10.
Further, the heat conduction mechanism comprises a hollow plate 14, a conical barrel 18 is fixedly connected to the lower portion of a fan 19, close to the left, of the top end of the cabinet body 1, the top end of the hollow plate 14 is fixedly connected with the bottom end of the conical barrel 18, a plurality of mounting holes 21 are formed in one side of the hollow plate 14, the plurality of mounting holes 21 are arranged at equal intervals in a linear array, a plurality of fixing plates 15 are fixedly connected to the outer sides, close to the plurality of mounting holes 21, of the two sides of the hollow plate 14 respectively, positioning bolts 16 are connected to one side of each adjacent fixing plate 15 through threads, and heat emitted by equipment at the bottom of the cabinet body 1 is conveniently absorbed through the fan 19, close to the left.
Further, the heat absorbing mechanism is connected with the fixed plate 15 through two positioning bolts 16 respectively, and two ends of one side of the connecting plate 13 are connected with the fixed plate 15 through the two positioning bolts 16 respectively, so that heat in the mounting plate 2 is conveniently guided into the hollow plate 14 through the connecting plate 13, and the heat is conveyed.
Further, one side of the plurality of fixing plates 15 which are not connected with the connecting plate 13 is respectively connected with a blocking plate 17 through two positioning bolts 16, and the blocking plate 17 is convenient for blocking the mounting holes 21 which are not connected with the connecting plate 13.
Firstly, when equipment is installed, the equipment is taken above an installation plate 2, a hollow rod 10 is rotated, so that the hollow rod 10 drives two clamping grooves 12 at the bottom to rotate to be aligned with two clamping plates 9, the limitation on the hollow rod 10 is relieved, the hollow rod 10 moves downwards until a second heat absorption hole 11 above the hollow rod 10 is aligned with a first heat absorption hole 7 on the outer wall of a hollow cylinder 6, a plurality of hollow rods 10 can move up and down according to the appearance of external equipment, a plurality of hollow rods 10 which are convenient to move can surround the outer side of the equipment, the plurality of hollow rods 10 which are convenient to move are matched with the second heat absorption holes 11 positioned above, so that heat is conveniently led into a heat conducting cavity 5, a plurality of hollow rods 10 which are convenient to move are matched with the upper side of the installation plate 2 below, the second heat absorption holes 11 positioned below are also matched with the heat emitted by the equipment positioned on the installation plate 2 below, two fans 19 are started, the heat emitted by the equipment positioned at the bottom of a cabinet 1 sequentially passes through the second heat absorption holes 11, the first heat absorption holes 7, the heat conducting plates 14 and the heat conducting plates 20 are more matched with the heat conducting plates 1, and the heat is discharged from the heat conducting plates 1 to the heat conducting plates are matched with the heat conducting plates 1;
secondly, the height of the part of the mounting plate 2 on the mounting frame 22 needs to be adjusted according to the specification of equipment, the baffle plate 17 can be detached through the positioning bolts 16, then the connecting plate 13 on one side of the mounting plate 2 is aligned with the fixing plate 15 with the proper height on one side of the hollow plate 14, and the connecting plate 13 and the fixing plate 15 are limited and fixed through the positioning bolts 16.
The above description is only a preferred embodiment of the present utility model, and is not intended to limit the utility model in any way, and any person skilled in the art may make modifications or alterations to the disclosed technical content to the equivalent embodiments. However, any simple modification, equivalent variation and variation of the above embodiments according to the technical substance of the present utility model still fall within the protection scope of the technical solution of the present utility model.
Claims (5)
1. The heat dissipation structure of the electronic equipment is characterized by comprising a cabinet body (1) and a mounting frame (22), wherein the bottom end of the mounting frame (22) is fixedly connected with the bottom end inside the cabinet body (1), a plurality of mounting plates (2) are arranged in the mounting frame (22), two fans (19) are embedded at the top of the cabinet body (1), a heat absorption mechanism for absorbing heat of electronic elements is arranged on the mounting plates (2), a heat conduction mechanism for heat transportation is arranged at the top of the cabinet body (1), the heat absorption mechanism can be arranged on the mounting plates (2) in a vertically movable manner, the heat conduction mechanism is arranged at the rear side of the mounting plates (2), the heat conduction mechanism is communicated with the heat absorption mechanism, and the heat conduction mechanism is communicated with the fans (19) positioned at the left side;
The heat conduction mechanism comprises a hollow plate (14), a conical barrel (18) is fixedly connected below a fan (19) of which the top end is close to the left side in the cabinet body (1), the top end of the hollow plate (14) is fixedly connected with the bottom end of the conical barrel (18), a plurality of mounting holes (21) are formed in one side of the hollow plate (14), the plurality of mounting holes (21) are arranged at equal intervals in a linear array, a plurality of fixing plates (15) are fixedly connected to the two sides of the hollow plate (14) close to the outer sides of the plurality of mounting holes (21) respectively, and positioning bolts (16) are connected to one side of each adjacent fixing plate (15) through threads.
2. The heat radiation structure of electronic equipment according to claim 1, wherein the top of the cabinet body (1) is provided with a plurality of heat outlets (20), the plurality of heat outlets (20) are arranged in a rectangular array, and the interior of the cabinet body (1) is communicated with the plurality of heat outlets (20).
3. The heat radiation structure of electronic equipment is characterized in that the heat radiation mechanism comprises a hollow rod (10), a plurality of guide holes (3) are formed in the top end of the mounting plate (2), the guide holes (3) are arranged in a rectangular array, a heat conduction cavity (5) is formed in the mounting plate (2), a plurality of placing holes (4) communicated with the heat conduction cavity (5) are formed in the top end of the mounting plate (2) in a penetrating mode, a hollow cylinder (6) is fixedly connected to the inside of the placing holes (4), first heat absorption holes (7) are formed in the outer wall of the hollow cylinder (6) and communicated with the inside of the heat conduction cavity (5), two supporting plates (8) are fixedly connected to the bottom of the outer wall of the hollow cylinder (6), the two supporting plates (8) are symmetrically arranged in an annular array, clamping plates (9) are fixedly connected to opposite sides of the two supporting plates (8), the hollow rod (10) penetrates through the inside of the hollow cylinder (6), second heat absorption holes (11) are formed in the top and the bottom of the hollow rod (10), two clamping grooves (12) are formed in the bottom end of the hollow rod (10), and two annular grooves (12) are formed in the annular grooves (12) and are fixedly connected to the mounting plate (13).
4. The heat dissipating structure of an electronic device as set forth in claim 1, wherein the heat absorbing mechanism is connected to the fixing plate (15) by two positioning bolts (16), respectively.
5. The heat dissipating structure of an electronic device as set forth in claim 4, wherein the baffle plates (17) are connected to one side of the plurality of fixing plates (15) by two positioning bolts (16), respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422640517.9U CN222090015U (en) | 2024-10-31 | 2024-10-31 | Heat radiation structure of electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202422640517.9U CN222090015U (en) | 2024-10-31 | 2024-10-31 | Heat radiation structure of electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222090015U true CN222090015U (en) | 2024-11-29 |
Family
ID=93592494
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202422640517.9U Active CN222090015U (en) | 2024-10-31 | 2024-10-31 | Heat radiation structure of electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN222090015U (en) |
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2024
- 2024-10-31 CN CN202422640517.9U patent/CN222090015U/en active Active
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