CN222089820U

CN222089820U - Efficient heat dissipation type PCBA board

Info

Publication number: CN222089820U
Application number: CN202420452545.5U
Authority: CN
Inventors: 徐燎燃; 黄世强
Original assignee: Guangdong Yuanchang Electronic Co ltd
Current assignee: Guangdong Yuanchang Electronic Co ltd
Priority date: 2024-03-09
Filing date: 2024-03-09
Publication date: 2024-11-29
Anticipated expiration: 2034-03-09

Abstract

The utility model relates to the technical field of PCBA boards, specifically to an efficient heat dissipation type PCBA board, including a board body, a plurality of heat conduction plates fixedly installed at the bottom of the board body, a mounting block installed at both ends of the heat conduction plate, a plurality of heat dissipation fins arranged at equal intervals installed on each mounting block, a heat dissipation box installed at both sides of the board body, and a plurality of heat dissipation components for strengthening the heat dissipation of the heat dissipation fins installed in each heat dissipation box. The utility model realizes rapid heat conduction from the high heat area of the PCBA board to the heat conduction plate by fixing a plurality of heat conduction plates at the bottom of the board body. The heat conduction plate can effectively disperse the heat and reduce the local temperature, thereby improving the overall heat dissipation efficiency. The setting of the heat dissipation fins increases the heat dissipation area, utilizes the natural convection effect of the heat dissipation fins, enhances the heat dissipation, and further improves the heat dissipation efficiency. The heat dissipation fins also force convection air through the heat dissipation component to accelerate the air flow around the heat dissipation fins, thereby significantly improving the heat dissipation performance.

Description

Efficient heat dissipation type PCBA board

Technical Field

The utility model relates to the technical field of PCBA boards, in particular to a high-efficiency heat dissipation type PCBA board.

Background

With the rapid development of electronic technology, the integration level of electronic devices is higher and higher, and particularly in the field of PCBA (printed circuit board assembly), the dense arrangement of electronic components results in a drastic increase in heat generation per unit area. Traditional heat dissipation modes, such as natural convection heat dissipation, simple heat dissipation fins and the like, have difficulty in meeting the requirement of efficient heat dissipation of modern electronic equipment. Poor heat dissipation not only affects the performance and life of electronic components, but may also lead to equipment failure and even damage in severe cases.

The PCBA board in the prior art lacks heat radiation structure, so when in actual use, the heat radiation can only be carried out through the circulation of air, thus the heat radiation effect is poor, and meanwhile, the air circulation performance of the PCBA board is poor at the installation position, thus the heat radiation effect is poorer. In view of this, we propose a highly efficient heat dissipation type PCBA board.

Disclosure of utility model

In order to make up for the defects, the utility model provides the efficient heat dissipation type PCBA board.

The technical scheme of the utility model is as follows:

The utility model provides a high-efficient heat dissipation formula PCBA board, includes the plate body, plate body bottom fixed mounting has a plurality of heat conduction board, a installation piece is all installed at the heat conduction board both ends, every all install the radiating fin that a plurality of equidistant set up on the installation piece, a radiating box is all installed to the plate body both sides, every install a plurality of in the radiating box and be used for strengthening radiating fin radiating subassembly, radiating fin erects, installation piece bottom with heat conduction board bottom parallel and level, heat conduction board both ends integrated into one piece has the connection piece with installation piece fixed connection.

As an optimal technical scheme, a plurality of heat conducting shafts penetrating through the plate body are fixed at the top of the heat conducting plate.

As the preferable technical scheme, every heat conduction shaft top all fixedly connected with a heat conduction piece, heat conduction piece top with plate body top parallel and level.

As the preferable technical scheme, each radiating box is internally fixedly connected with a mounting plate, and a plurality of radiating assemblies are mounted on the mounting plate.

As the preferable technical scheme, the heat dissipation assembly comprises fan blades rotatably connected to the mounting plate and a driving motor for driving the fan blades to rotate, and the driving motor is mounted on the mounting plate.

As an optimal technical scheme, an outer frame is fixedly arranged at the top of each radiating box, and a dust screen is arranged on the inner annular wall of the outer frame.

As an optimal technical scheme, the top of the mounting block is fixedly connected with the outer wall of the plate body.

As the preferable technical scheme, the top and the bottom of the radiating box are both openings, and the bottom is fixedly connected with the tops of the radiating fins.

Compared with the prior art, the utility model has the beneficial effects that:

1. according to the utility model, the plurality of heat conducting plates are fixedly arranged at the bottom of the plate body, so that rapid heat conduction from a high-heat area on the PCBA plate to the heat conducting plates is realized, the heat conducting plates can effectively disperse heat and reduce local temperature, thereby improving the overall heat dissipation efficiency, the heat dissipation area is increased due to the arrangement of the heat dissipation fins, and the heat dissipation efficiency is further improved due to the natural convection effect of the heat dissipation fins.

2. According to the utility model, convection air is forced by the heat radiation component, so that air flow around the heat radiation fins is accelerated, and the heat radiation performance is remarkably improved.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the structure of the plate of FIG. 1 with the plate removed;

FIG. 3 is a schematic view of the partial structure of FIG. 2 according to the present utility model;

Fig. 4 is a schematic view of a partial structure of fig. 3 according to the present utility model.

The meaning of each reference numeral in the figures is:

1. The heat-conducting plate comprises a plate body, heat-radiating fins, a heat-radiating box, an outer frame, a dustproof net, a mounting plate, a driving motor, a fan blade, a heat-conducting plate, a heat-conducting shaft, a heat-conducting plate, a connecting sheet and a mounting block.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

Referring to fig. 1-4, the present utility model provides a technical solution:

the utility model provides a high-efficient heat dissipation formula PCBA board, including plate body 1, plate body 1 bottom fixed mounting has a plurality of heat conduction board 5, a installation piece 6 is all installed at heat conduction board 5 both ends, all install the radiating fin 2 that a plurality of equidistant set up on every installation piece 6, a radiating box 3 is all installed to plate body 1 both sides, install a plurality of in every radiating box 3 and be used for strengthening radiating fin 2 radiating subassembly, radiating fin 2 erects and puts, installation piece 6 bottom and heat conduction board 5 bottom parallel and level, heat conduction board 5 both ends integrated into one piece have with installation piece 6 fixed connection's connection piece 52. Through at plate body 1 bottom fixed mounting a plurality of heat conduction board 5, realized from the high heat region on the PCBA board to the quick heat conduction of heat conduction board 5. The heat conducting plate 5 can effectively disperse heat and reduce local temperature, so that the overall heat radiation efficiency is improved, the heat radiation area is increased by the arrangement of the heat radiation fins 2, the heat radiation is enhanced by utilizing the natural convection effect of the heat radiation fins 2, the heat radiation efficiency is further improved, and the heat radiation assembly forces convection air to accelerate the air flow around the heat radiation fins 2, so that the heat radiation performance is remarkably improved.

As a preferred embodiment, a plurality of heat conducting shafts 50 penetrating through the plate body 1 are fixed on the top of the heat conducting plate 5. The top of each heat conducting shaft 50 is fixedly connected with a heat conducting fin 51, and the top of the heat conducting fin 51 is level with the top of the plate body 1. The heat conducting shaft 50 and the heat conducting fin 51 fixed at the top of the heat conducting plate 5 directly penetrate through the plate body 1, so that heat is effectively conducted from the inside of the PCBA plate to the outside, and the heat conducting shaft and the heat conducting fin 2 and the heat radiating box 3 are complementary, and the overall heat radiating capacity is improved. The top of the heat conducting fin 51 is flush with the top of the plate body 1, and the uniformity of heat dissipation is ensured.

As a preferred embodiment, a mounting plate 41 is fixedly connected in each heat dissipation box 3, and a plurality of heat dissipation components are mounted on the mounting plate 41. The heat dissipation assembly is fixed in the heat dissipation box 3 through the mounting plate 41, so that the stability and the reliability of the heat dissipation assembly are ensured.

Preferably, the heat dissipation assembly includes a fan blade 43 rotatably coupled to the mounting plate 41, and a driving motor 42 for driving the fan blade 43 to rotate, and the driving motor 42 is mounted on the mounting plate 41. In use, the fan blades 43 are driven by the drive motor 42 to rotate, thereby achieving air flow.

Preferably, in this embodiment, an outer frame 4 is fixedly installed on the top of each heat dissipation box 3, and a dust screen 40 is installed on the inner annular wall of the outer frame 4. The dust screen 40 effectively prevents dust and other pollutants from entering the heat dissipation box 3 on the premise of not affecting the heat dissipation performance, and protects the cleaning and long-term operation performance of the heat dissipation assembly.

Preferably, the top of the mounting block 6 is fixedly connected with the outer wall of the plate body 1. This structural design ensures the stability of the heat conducting plate 5 and the heat radiating fins 2.

As a preference of this embodiment, the top and bottom of the heat dissipation box 3 are both open, and the bottom is fixedly connected with the top of the plurality of heat dissipation fins 2. For enhancing the stability of the heat dissipation case 3.

When the efficient heat dissipation type PCBA board is used, a large amount of heat is generated when the electronic components on the PCBA board start to work. The heat is firstly transferred to the heat conducting plate 5 through the plate body 1 and is transferred to the radiating fins 2 through the mounting blocks 6, then all the driving motors 42 are started, and when the driving motors 42 work, the fan blades 43 are driven to rotate, so that forced convection is generated, the air flow around the radiating fins 2 is accelerated, the heat dissipation of the radiating fins 2 is further enhanced, and the plate body 1 can be effectively cooled;

It should be noted that, the heat conducting plate 5, the heat conducting shaft 50 and the heat conducting sheet 51 in the present embodiment are all made of electrically conductive and non-thermally conductive materials, and in the present embodiment, ceramics are used.

The foregoing has shown and described the basic principles, principal features and advantages of the utility model. It will be understood by those skilled in the art that the present utility model is not limited to the above-described embodiments, and that the above-described embodiments and descriptions are only preferred embodiments of the present utility model, and are not intended to limit the utility model, and that various changes and modifications may be made therein without departing from the spirit and scope of the utility model as claimed. The scope of the utility model is defined by the appended claims and equivalents thereof.

Claims

1. A high-efficiency heat dissipation PCBA board, comprising a board body (1), characterized in that: a plurality of heat conducting plates (5) are fixedly mounted on the bottom of the board body (1), a mounting block (6) is mounted on both ends of the heat conducting plate (5), a plurality of heat dissipating fins (2) arranged at equal intervals are mounted on each mounting block (6), a heat dissipation box (3) is mounted on both sides of the board body (1), a plurality of heat dissipation components for enhancing the heat dissipation of the heat dissipating fins (2) are mounted in each heat dissipation box (3), the heat dissipation fins (2) are vertically arranged, the bottom of the mounting block (6) is flush with the bottom of the heat conducting plate (5), and the two ends of the heat conducting plate (5) are integrally formed with connecting pieces (52) fixedly connected to the mounting block (6).

2. The high-efficiency heat dissipation PCBA board as described in claim 1 is characterized in that: a plurality of heat conduction shafts (50) that all pass through the board body (1) are fixed on the top of the heat conduction plate (5).

3. The high-efficiency heat dissipation PCBA board as described in claim 2 is characterized in that: a heat conducting plate (51) is fixedly connected to the top of each heat conducting shaft (50), and the top of the heat conducting plate (51) is flush with the top of the board body (1).

4. The high-efficiency heat dissipation PCBA board as described in claim 3 is characterized in that: each of the heat dissipation boxes (3) is fixedly connected to a mounting plate (41), and a plurality of the heat dissipation components are mounted on the mounting plate (41).

5. The high-efficiency heat dissipation PCBA board as described in claim 4 is characterized in that: the heat dissipation component includes a fan blade (43) rotatably connected to the mounting plate (41), and a drive motor (42) for driving the fan blade (43) to rotate, and the drive motor (42) is installed on the mounting plate (41).

6. The high-efficiency heat dissipation PCBA board as described in claim 5 is characterized in that: an outer frame (4) is fixedly installed on the top of each heat dissipation box (3), and a dustproof net (40) is installed on the inner ring wall of the outer frame (4).

7. The high-efficiency heat dissipation PCBA board according to claim 6, characterized in that the top of the mounting block (6) is fixedly connected to the outer wall of the board body (1).

8. The high-efficiency heat dissipation PCBA board as described in claim 7, characterized in that: the top and bottom of the heat dissipation box (3) are both open, and the bottom is fixedly connected to the tops of the plurality of heat dissipation fins (2).