CN222073577U - An intelligent lighting control cabinet with moisture-proof structure - Google Patents
An intelligent lighting control cabinet with moisture-proof structure Download PDFInfo
- Publication number
- CN222073577U CN222073577U CN202420428466.0U CN202420428466U CN222073577U CN 222073577 U CN222073577 U CN 222073577U CN 202420428466 U CN202420428466 U CN 202420428466U CN 222073577 U CN222073577 U CN 222073577U
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- Prior art keywords
- control cabinet
- cabinet
- condensation
- intelligent lighting
- lighting control
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- 238000009833 condensation Methods 0.000 claims abstract description 61
- 230000005494 condensation Effects 0.000 claims abstract description 60
- 239000004065 semiconductor Substances 0.000 claims abstract description 46
- 238000005057 refrigeration Methods 0.000 claims abstract description 23
- 238000005192 partition Methods 0.000 claims abstract description 19
- 238000001816 cooling Methods 0.000 claims description 9
- 238000007664 blowing Methods 0.000 claims description 2
- 238000007791 dehumidification Methods 0.000 abstract description 10
- 238000009825 accumulation Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 15
- 230000000694 effects Effects 0.000 description 8
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000012423 maintenance Methods 0.000 description 5
- 230000015271 coagulation Effects 0.000 description 2
- 238000005345 coagulation Methods 0.000 description 2
- 238000005286 illumination Methods 0.000 description 2
- 238000009423 ventilation Methods 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 208000002925 dental caries Diseases 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000002265 prevention Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
- Y02B20/40—Control techniques providing energy savings, e.g. smart controller or presence detection
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
本实用新型涉及一种具有防潮结构的智能照明控制柜，属于智能照明控制柜技术领域包括：冷凝柜，冷凝柜内连接有隔板，隔板将冷凝柜隔离出两个相互连通的腔体，隔板连接有半导体制冷片，半导体制冷片的冷面朝向控制柜热面背离控制柜，半导体制冷片热面对应的腔体内连接有向冷凝柜内送风的风扇组，半导体制冷片冷面对应的腔体与控制柜连通；其能解决现有技术中先冷凝后加热的方式除湿会进一步增加热量堆积，导致控制柜内温度上升，不利于电子元件的正常工作的技术问题。
The utility model relates to an intelligent lighting control cabinet with a moisture-proof structure, belonging to the technical field of intelligent lighting control cabinets and comprising: a condensing cabinet, a partition is connected inside the condensing cabinet, the partition isolates the condensing cabinet into two mutually connected cavities, the partition is connected to a semiconductor refrigeration plate, the cold surface of the semiconductor refrigeration plate faces the control cabinet and the hot surface is away from the control cabinet, a fan group for supplying air to the condensing cabinet is connected in the cavity corresponding to the hot surface of the semiconductor refrigeration plate, and the cavity corresponding to the cold surface of the semiconductor refrigeration plate is connected to the control cabinet; the utility model can solve the technical problem in the prior art that dehumidification by condensation first and then heating will further increase heat accumulation, causing the temperature in the control cabinet to rise, which is not conducive to the normal operation of electronic components.
Description
Technical Field
The utility model belongs to the technical field of intelligent illumination control cabinets, and particularly relates to an intelligent illumination control cabinet with a dampproof structure.
Background
The intelligent lighting control cabinet is widely applied to road lighting control, when the intelligent lighting control cabinet is used for mountain tunnel lighting control, the influence of geographical factors is high, the air humidity in a tunnel in which the intelligent lighting control cabinet works is high, the influence on internal electronic elements is high, active ventilation is adopted for dampproofing the electronic elements, active ventilation and dampproofing are adopted only, and when the ambient humidity is high, the air humidity in the control cabinet is still high, so that an effective dehumidification effect cannot be achieved.
The patent with the prior publication number of CN217115198U discloses a condensation prevention and dehumidification power distribution cabinet, which comprises a power distribution cabinet body and a dehumidification device positioned in the cabinet body, wherein the dehumidification device comprises a box body, a partition plate is arranged in the box body, the partition plate divides the interior of the box body into a condensation cavity and a heat dissipation cavity, a semiconductor refrigeration sheet is further arranged on the partition plate, the refrigeration surface of the semiconductor refrigeration sheet is positioned in the condensation cavity, and the heat dissipation surface of the semiconductor refrigeration sheet is positioned in the heat dissipation cavity; the partition board is provided with a vent for communicating the condensation cavity and the heat dissipation cavity, and a fan is arranged at the vent and used for blowing condensed gas in the condensation cavity into the heat dissipation cavity.
The prior art has the following problems:
The electronic components in the control cabinet work and generate heat per se and need better heat dissipation, and dehumidification in a mode of condensation before heating can further increase heat accumulation, so that the temperature in the control cabinet rises, and the normal work of the electronic components is not facilitated.
Disclosure of utility model
The utility model provides an intelligent lighting control cabinet with a dampproof structure, which can solve the technical problems that heat accumulation is further increased due to dehumidification in a mode of condensation and heating in the prior art, so that the temperature in the control cabinet is increased, and the normal operation of electronic elements is not facilitated.
In order to achieve the above purpose, the present utility model is realized by the following technical scheme:
the application provides an intelligent lighting control cabinet with a dampproof structure, which comprises: the condensing cabinet is connected with a partition board, the partition board isolates the condensing cabinet from two cavities which are communicated with each other, the partition board is connected with a semiconductor refrigerating sheet, the cold face of the semiconductor refrigerating sheet faces the hot face of the control cabinet and deviates from the control cabinet, a fan group for supplying air in the condensing cabinet is connected in the cavity corresponding to the hot face of the semiconductor refrigerating sheet, and the cavity corresponding to the cold face of the semiconductor refrigerating sheet is communicated with the control cabinet.
According to the technical scheme, the air sent by the fan set firstly passes through the hot surface of the semiconductor refrigerating sheet to cool the semiconductor refrigerating sheet and meanwhile increases the air temperature, so that the working temperature of the cold surface is increased while the same temperature difference is obtained, and the phenomenon that the cold surface is transferred to the control cabinet to be further condensed due to the temperature difference is avoided; the cold air dehumidified by the cold surface condensation further enters the control cabinet to cool and dissipate heat of the electronic element, so that proper humidity and temperature are provided for the normal operation of the electronic element, and the normal operation of the electronic element is facilitated.
In the utility model, one side of the partition plate, which is far away from the semiconductor refrigerating sheet, is connected with a condensation component, the condensation component is arranged corresponding to the semiconductor refrigerating sheet, and the condensation component comprises a plurality of condensation thorns.
Through above-mentioned technical scheme, adopt condensation thorn to increase the sharp point quantity in the cavity, the existence of sharp point can provide more condensation cores, and sharp point has less radius of curvature simultaneously for the gathering of hydrone on the sharp point is easier, has improved the efficiency of condensation.
In the utility model, the bottom of the cavity corresponding to the cold surface of the semiconductor refrigeration sheet is connected with a guide plate, and the lowest part of the guide plate is connected with a drain pipe.
Through above-mentioned technical scheme, adopt guide plate and drain pipe, with comdenstion water drainage condensing cabinet, prevented the accumulation of comdenstion water, reduced the work load of manual maintenance.
In the utility model, both sides of the control cabinet are connected with the condensing cabinet.
Through the technical scheme, the double condensing cabinets are adopted, so that alternate condensation dehumidification can be realized, and the influence of frosting on the condensation effect caused by continuous operation of the cold face of the semiconductor refrigerating sheet is avoided.
In the utility model, the condensing cabinet is connected with the hanging lugs, the control cabinet is provided with the slots, and the hanging lugs are inserted into the slots.
Through above-mentioned technical scheme, adopt the connected mode of hangers and slot, can realize the quick dismantlement of condensation cabinet and change, improved maintenance efficiency.
In the utility model, the top of the control cabinet is provided with the exhaust port, the communication part of the cavity corresponding to the cold surface of the semiconductor refrigeration piece and the control cabinet is provided with the air inlet, and the air inlet is arranged below the side surface of the control cabinet.
Through above-mentioned technical scheme, adopt the setting of air intake lower exhaust port overhead, make cold air from bottom to top cool down the heat dissipation to electronic component, have better radiating effect.
In the utility model, a cover plate is covered above the exhaust port, and a gap is reserved between the cover plate and the exhaust port.
Through above-mentioned technical scheme, adopt the apron to reduce the direct gas exchange of switch board with external world, further improved dampproofing effect.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, it being obvious that the drawings in the following description are only some embodiments of the utility model, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
Fig. 1 is an isometric view of an intelligent lighting control cabinet with a moisture-proof structure according to an embodiment of the present utility model;
FIG. 2 is an exploded view of an intelligent lighting control cabinet with a moisture-proof structure according to an embodiment of the present utility model;
FIG. 3 is an exploded view of a condensing unit according to an embodiment of the present utility model;
fig. 4 is a partial cross-sectional view of a condensation cabinet provided by an embodiment of the present utility model;
fig. 5 is a second partial cross-sectional view of a condensation cabinet according to an embodiment of the present utility model;
fig. 6 is a partial cross-sectional view III of a condensation cabinet provided by an embodiment of the utility model;
FIG. 7 is an isometric view of a coagulation assembly provided by an embodiment of the present utility model;
fig. 8 is an airflow schematic diagram of an intelligent lighting control cabinet with a moisture-proof structure according to an embodiment of the present utility model.
Icon: 1-a condensation cabinet; 101-an air outlet; 102-a separator; 103-semiconductor refrigerating sheets; 104-a fan set; 105-side covers; 106-a coagulation assembly; 1061-mounting plate; 1062-condensation thorns; 107-deflector; 1071-drain pipe; 108-an air inlet hole; 109-drainage holes; 110-hanging lugs; 2-a control cabinet; 201-an air inlet; 202-a slot; 3-cover plate; 4-exhaust port.
Detailed Description
Embodiments of the present application will be described in detail below with reference to the accompanying drawings.
In the description of the present application, it should be understood that the terms "center," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like indicate orientations or positional relationships based on the orientation or positional relationships shown in the drawings, merely to facilitate describing the present application and simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application.
The terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present application, unless otherwise indicated, the meaning of "a plurality" is two or more.
In the description of the present application, it should be noted that, unless explicitly stated and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, welded, bolted, or riveted; the connecting device can be fixedly connected, detachably connected or integrally connected; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present application will be understood in specific cases by those of ordinary skill in the art.
Examples
Referring to fig. 1-8, fig. 1-8 illustrate an embodiment of the present application.
The embodiment provides an intelligent lighting control cabinet with dampproofing structure, including condensing cabinet 1, as shown in fig. 2 and 4, condensing cabinet 1 welding has baffle 102, baffle 102 keeps apart condensing cabinet 1 left and right sides two cavitys that the top is intercommunicated, the right side laminating of baffle 102 has semiconductor refrigeration piece 103, the cold face (left side in fig. 4) of semiconductor refrigeration piece 103 is facing control cabinet 2, the hot face (right side in fig. 4) of semiconductor refrigeration piece 103 deviates from control cabinet 2, inlet opening 108 has been seted up to the downside in the cavity that the semiconductor refrigeration piece 103 hot face corresponds, be connected with the fan group 104 of supplying air in to condensing cabinet 1 on the inlet opening 108, the cavity that the semiconductor refrigeration piece 103 cold face corresponds communicates with control cabinet 2.
During assembly, the guide plate 107 is welded firstly, then the other components are mounted on the partition plate 102, then the partition plate 102 is welded in the condensation cabinet 1, finally the fan set 104 is mounted, then the side cover 105 is welded, the condensation cabinet 1 is assembled, the assembled condensation cabinet 1 is mounted on the side face of the control cabinet 2, and the whole assembly of the circuit is completed.
When the air cooling device is used, the air passes through the semiconductor refrigerating sheet 103 and is heated by the hot surface of the semiconductor refrigerating sheet 103 as shown in fig. 8, enters the cavity corresponding to the cold surface of the semiconductor refrigerating sheet 103 from the upper part of the partition plate 102 to be cooled and condensed, condensed water is converged at the bottom of the condensation cabinet 1, dehumidified dry air is cooled and enters the control cabinet 2, the cold air can be stacked upwards gradually at the bottom of the control cabinet 2 according to the principle of cooling and heating of the air, heat emitted by electronic elements is taken away, and the heated air is emitted from the exhaust port 4 at the top of the control cabinet 2.
Through the technical scheme, the air sent by the fan set 104 firstly passes through the hot surface of the semiconductor refrigerating sheet 103 to cool the semiconductor refrigerating sheet and meanwhile increases the air temperature, so that the working temperature of the cold surface is increased while the same temperature difference is obtained, and the phenomenon that the cold surface is transferred to the control cabinet 2 to be further condensed due to the temperature difference is avoided; the cold air dehumidified by the cold surface condensation further enters the control cabinet 2 to cool and dissipate heat of the electronic element, so that proper humidity and temperature are provided for the normal operation of the electronic element, and the normal operation of the electronic element is facilitated.
As a preferred embodiment, as shown in fig. 3 to 7, a condensation component 106 is connected to a side of the partition 102 facing away from the semiconductor refrigeration sheet 103, the condensation component 106 is disposed corresponding to the semiconductor refrigeration sheet 103, the condensation component 106 includes a plurality of double-pointed condensation pins 1062 welded to the mounting plate 1061, and the condensation pins 1062 are made of an aluminum alloy.
In use, the cold face of the semiconductor refrigeration sheet 103 is passed through the temperature transfer of the separator 102, reducing the temperature of the condensation spike 1062, while the plurality of condensation spikes 1062 provide a plurality of sharp points that provide a more suitable surface for condensation as the water vapor in the air encounters the surface, which form water droplets on the surface, the presence of the sharp points providing more condensation nuclei, i.e., water molecules can collect and form water droplets on the sharp points, the sharp points having a smaller radius of curvature, which facilitates the collection of water molecules on the sharp points, and in addition, the shape of the sharp points can also increase the surface area, providing more contact surface for condensation of water molecules. The shape of the sharp points can increase the local humidity, so that water molecules are more easily gathered and condensed.
Through above-mentioned technical scheme, adopt condensation thorn 1062 to increase the sharp point quantity in the cavity, the existence of sharp point can provide more condensation cores, and the sharp point has less radius of curvature simultaneously for the gathering of hydrone on the sharp point is easier, has improved the efficiency of condensation.
As a preferred embodiment, as shown in fig. 5, a V-shaped baffle 107 is welded at the bottom of the cavity corresponding to the cold surface of the semiconductor refrigeration sheet 103, a drain pipe 1071 is connected to the lowest part of the baffle 107, and the drain pipe 1071 is fixed by plugging through a drain hole 109 formed at the bottom of the condensation cabinet 1.
In use, condensed water is condensed at the sharp point of the condensation spike 1062, then drops downward into the baffle 107 and merges at the lowest point, and is then discharged through the drain 1071.
It should be noted that, the drain pipe 1071 further drains the condensed water into the drain system in the tunnel through a hose, so as to avoid evaporation of the condensed water and further increase the humidity of the environment around the control cabinet 2.
Through above-mentioned technical scheme, adopt guide plate 107 and drain pipe 1071, with comdenstion water discharge condensation cabinet 1, prevented the accumulation of comdenstion water, reduced the work load of manual maintenance.
As a preferred embodiment, as shown in fig. 1 and 2, both sides of the control cabinet 2 are connected with a condensation cabinet 1.
When the device is used, the single-side condensation cabinet 1 controls the on-off of the fan group 104 and the semiconductor refrigeration sheets 103 through the timing switch, and the double-side condensation cabinet 1 runs alternately, so that the effect of reducing dehumidification due to frosting is avoided when the semiconductor refrigeration sheets 103 stop working after condensation of frost is detected.
Through the technical scheme, the double condensing cabinets 1 are adopted, so that alternate condensation dehumidification can be realized, and the influence of frosting on the condensation effect caused by continuous operation of the cold surface of the semiconductor refrigerating sheet 103 is avoided.
As a preferred embodiment, as shown in fig. 2 and 4, the condensation cabinet 1 is welded with a hanging lug 110, the control cabinet 2 is provided with a slot 202, and the hanging lug 110 is inserted into the slot 202.
When in use, after the four lugs 110 are respectively pushed into the corresponding slots 202, the lugs 110 are downwards clamped into the slots 202 under the action of gravity, and the circuit is connected to complete the installation.
During maintenance, after the power supply circuit is disconnected, the condensation cabinet 1 is lifted upwards, and then the disassembly can be completed.
Through the above technical scheme, the connection mode of the hanging lugs 110 and the slots 202 is adopted, so that the quick disassembly and replacement of the condensation cabinet 1 can be realized, and the maintenance efficiency is improved.
As a preferred embodiment, as shown in fig. 2, the top of the control cabinet 2 is provided with an air outlet 4, a communication part between a cavity corresponding to the cold surface of the semiconductor refrigeration piece 103 and the control cabinet 2 is provided with an air inlet 201, and the air inlet 201 is provided below the side surface of the control cabinet 2.
Through the above technical scheme, the air inlet 201 is arranged below the air outlet 4 and is arranged above the air outlet, so that the cooling air cools and dissipates heat to the electronic element from bottom to top, and the electronic element has a better heat dissipation effect.
As a preferred embodiment, as shown in fig. 1, 2 and 8, a cover plate 3 is covered above the exhaust port 4, the cover plate 3 is welded to the top of the control cabinet 2 by four columns, and a gap is reserved between the cover plate 3 and the exhaust port 4.
Through above-mentioned technical scheme, adopt apron 3 to reduce the direct gas exchange of switch board 2 with the external world, further improved dampproofing effect.
The above description is merely an embodiment of the present utility model, but the scope of the present utility model is not limited thereto, and any person skilled in the art can easily think about changes or substitutions within the technical scope of the present utility model, and it is intended to cover the scope of the present utility model. Therefore, the protection scope of the present utility model shall be subject to the protection scope of the claims.
Claims (7)
1. Intelligent lighting control cabinet with dampproofing structure, its characterized in that includes:
The cooling device comprises a condensation cabinet (1), wherein a partition plate (102) is connected in the condensation cabinet (1), the partition plate (102) isolates two cavities which are mutually communicated, the partition plate (102) is connected with a semiconductor cooling sheet (103), the cold face of the semiconductor cooling sheet (103) faces towards a control cabinet (2), the hot face of the semiconductor cooling sheet (103) faces away from the control cabinet (2), a fan group (104) which is used for blowing air in the condensation cabinet (1) is connected in the cavity corresponding to the hot face of the semiconductor cooling sheet (103), and the cavity corresponding to the cold face of the semiconductor cooling sheet (103) is communicated with the control cabinet (2).
2. The intelligent lighting control cabinet with the dampproof structure according to claim 1, wherein one side of the partition board (102) away from the semiconductor refrigerating sheet (103) is connected with a condensation component (106), the condensation component (106) is arranged corresponding to the semiconductor refrigerating sheet (103), and the condensation component (106) comprises a plurality of condensation thorns (1062).
3. The intelligent lighting control cabinet with the dampproof structure according to claim 2, wherein a guide plate (107) is connected to the bottom of the cavity corresponding to the cold face of the semiconductor refrigeration piece (103), and a drain pipe (1071) is connected to the lowest part of the guide plate (107).
4. The intelligent lighting control cabinet with the dampproof structure according to claim 1, wherein both sides of the control cabinet (2) are connected with a condensing cabinet (1).
5. The intelligent lighting control cabinet with the dampproof structure according to claim 4, wherein the condensing cabinet (1) is connected with a hanging lug (110), the control cabinet (2) is provided with a slot (202), and the hanging lug (110) is inserted into the slot (202).
6. The intelligent lighting control cabinet with the dampproof structure according to claim 5, wherein an exhaust port (4) is formed in the top of the control cabinet (2), an air inlet (201) is formed in a position, corresponding to a cold surface of the semiconductor refrigerating sheet (103), of the cavity and the control cabinet (2), and the air inlet (201) is formed below the side face of the control cabinet (2).
7. The intelligent lighting control cabinet with the dampproof structure according to claim 6, wherein a cover plate (3) is covered above the air outlet (4), and a gap is formed between the cover plate (3) and the air outlet (4).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420428466.0U CN222073577U (en) | 2024-03-06 | 2024-03-06 | An intelligent lighting control cabinet with moisture-proof structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202420428466.0U CN222073577U (en) | 2024-03-06 | 2024-03-06 | An intelligent lighting control cabinet with moisture-proof structure |
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| Publication Number | Publication Date |
|---|---|
| CN222073577U true CN222073577U (en) | 2024-11-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202420428466.0U Active CN222073577U (en) | 2024-03-06 | 2024-03-06 | An intelligent lighting control cabinet with moisture-proof structure |
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| CN (1) | CN222073577U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119765411A (en) * | 2025-01-10 | 2025-04-04 | 西安热工研究院有限公司 | Auxiliary frequency regulation equipment and temperature regulation method for thermal power plants based on energy storage equipment |
-
2024
- 2024-03-06 CN CN202420428466.0U patent/CN222073577U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN119765411A (en) * | 2025-01-10 | 2025-04-04 | 西安热工研究院有限公司 | Auxiliary frequency regulation equipment and temperature regulation method for thermal power plants based on energy storage equipment |
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