CN222071164U - Heat radiation structure for computer case - Google Patents

Abstract

The utility model discloses a heat dissipation structure for a computer case, which relates to the technical field of case heat dissipation, including a case body, a mainboard is arranged inside the case body, a processor is installed at the front end of the mainboard, a heat dissipation assembly is installed at the front end of the processor, a plurality of first heat-conducting copper plates are installed at the lower end of the heat dissipation assembly, a second heat-conducting copper plate is installed at the inner bottom end of the case body, a water-cooling pipe is installed at the upper end of the second heat-conducting copper plate, a plurality of heat-conducting columns are installed outside the water-cooling pipe at the upper end of the second heat-conducting copper plate, and the upper end of the heat-conducting column is connected to the lower end of the first heat-conducting copper plate. The utility model plays a certain supporting role on the heat dissipation assembly through the heat-conducting column and the first heat-conducting copper plate, which can avoid the self-weight of the heat dissipation assembly from having a greater impact on the heat dissipation assembly, and avoid the heat dissipation assembly from becoming loose when the computer is running.

Description

Heat radiation structure for computer case

Technical Field

The utility model relates to the technical field of heat dissipation of a computer case, in particular to a heat dissipation structure for a computer case.

Background

The chassis is a carrier of most of computers, and the chassis is a part of computer accessories, and plays a main role in placing and fixing all the computer accessories, so that the chassis plays a role in supporting and protecting, and when a processor in the computer accessories runs, a large amount of heat can be generated, and a special heat dissipation structure is needed for heat dissipation.

The existing heat dissipation structure of the processor is generally divided into a water cooling structure and an air cooling structure, more metal heat dissipation fins are needed to be used for heat dissipation of the air cooling structure, so that the weight of the heat dissipation structure is large, a part of processors and mainboards in the chassis are arranged on the side wall of the chassis, the heat dissipation structure with large weight is additionally arranged on the surface of the processor, the phenomenon of looseness is easy to occur under the action of gravity, and once the water cooling structure is damaged, irreversible damage can be caused to accessories in the chassis.

Disclosure of utility model

The present utility model is directed to a heat dissipation structure for a computer case, so as to solve the above-mentioned problems in the prior art.

In order to achieve the above purpose, the present utility model provides the following technical solutions: the utility model provides a heat radiation structure for computer machine case, includes the machine case body, the inside of machine case body is provided with the mainboard, the treater is installed to the front end of mainboard, radiator unit is installed to the front end of treater, a plurality of first heat conduction copper is installed to radiator unit's lower extreme, the second heat conduction copper is installed to the inside bottom of machine case body, the water cooling pipe is installed to the upper end of second heat conduction copper, a plurality of heat conduction posts are installed to the upper end that the water cooling pipe outside is located the second heat conduction copper, the upper end of heat conduction post is connected with the lower extreme of first heat conduction copper.

Preferably, a first ventilation layer is arranged at the upper end of the case body, and a second ventilation layer is arranged at the front end of the case body.

Preferably, the inner wall of the chassis body is provided with a through hole connected with the outside, and a plurality of first cooling fans are installed in the through hole.

Preferably, the heat dissipation assembly comprises a second heat dissipation fan, heat dissipation fins and heat conduction copper pipes, wherein a plurality of heat conduction copper pipes are arranged at the front end of the processor, the heat dissipation fins are arranged at the other ends of the plurality of heat conduction copper pipes, and the second heat dissipation fan is arranged at the upper end of the heat dissipation fins.

Preferably, a transverse partition plate is arranged in the case body, and a plurality of longitudinal radiating holes matched with the first heat conducting copper plate for use are formed in the upper end of the partition plate.

Preferably, a circulating bin communicated with the water cooling pipe is arranged at the position, located at the right end of the second heat conduction copper plate, of the bottom end inside the case body, and a third cooling fan is arranged inside the circulating bin.

Compared with the prior art, the utility model has the beneficial effects that:

1. This heat radiation structure for computer machine case dispels the heat for the treater when the computer operation through setting up the radiator unit, and radiator unit's lower extreme is connected with a plurality of first heat conduction copper that possess high-efficient heat conduction function, and first heat conduction copper's lower extreme is connected with a plurality of heat conduction posts, plays certain supporting role to radiator unit through heat conduction post and first heat conduction copper, can avoid radiator unit's dead weight to produce great influence to radiator unit, avoids when the computer operation, and radiator unit produces the condition that looseness appears.

2. This heat radiation structure for computer machine case has the water-cooled tube through interlude between the heat conduction post, and the heat that the treater produced can transmit to radiator unit, and partial heat can be passed through first heat conduction copper and heat conduction post, dispel the heat to the heat conduction post through the water-cooled tube, and the water-cooled tube carries out the inner loop with circulation storehouse, dispel the heat to circulation storehouse through third radiator fan, and circulation storehouse and water-cooled tube all are located the lower extreme of baffle, and the liquid that the water-cooled structure produced after damaging can not produce great influence to quick-witted case internal fittings.

Drawings

FIG. 1 is a schematic diagram of the overall structure of the present utility model;

FIG. 2 is a schematic view of the structure of the housing of the chassis body according to the present utility model;

FIG. 3 is a schematic view of the internal water-cooled tube structure of the present utility model;

Fig. 4 is a schematic structural diagram of a heat dissipating assembly according to the present utility model.

In the figure: 1. a chassis body; 2. a first ventilation layer; 3. a second ventilation layer; 4. a first heat radiation fan; 5. a main board; 6. a heat dissipation assembly; 601. a second heat radiation fan; 602. a heat sink; 603. a heat conducting copper pipe; 7. a partition plate; 8. a heat radiation hole; 9. a first thermally conductive copper plate; 10. a heat conducting column; 11. a circulation bin; 12. a third heat radiation fan; 13. a second thermally conductive copper plate; 14. a water-cooled tube; 15. a processor.

Detailed Description

The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to be within the scope of the utility model.

In the description of the present utility model, it should be noted that the directions or positional relationships indicated by the terms "upper", "lower", "inner", "outer", "front", "rear", "both ends", "one end", "the other end", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific direction, be configured and operated in the specific direction, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "provided," "connected," and the like are to be construed broadly, and may be fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communication between two elements. The specific meaning of the above terms in the present utility model will be understood in specific cases by those of ordinary skill in the art.

As shown in fig. 1 to 4, the heat dissipation structure for a computer case of this embodiment includes a case body 1, the inside of the case body 1 is provided with a main board 5, a processor 15 is installed at the front end of the main board 5, the main board 5 and the processor 15 are all of the prior art, it should be noted that the inside of the case body 1 contains various accessories, the main board 5 and the processor 15 are only partial accessories, the front end of the processor 15 is provided with a heat dissipation component 6, the heat dissipation component 6 dissipates heat to the processor 15, the lower end of the heat dissipation component 6 is provided with a plurality of first heat conduction copper plates 9, the heat of the heat dissipation component 6 can be transferred through the first heat conduction copper plates 9, and plays a supporting role to the heat dissipation component 6, the inside bottom end of the case body 1 is provided with a second heat conduction copper plate 13, the upper end of the second heat conduction copper plate 13 is provided with a water-cooled tube 14, the water-cooled liquid inside the water-cooled tube 14 can dissipate heat the externally connected accessories in the circulation process, the upper end of the water-cooled tube 14 is provided with a plurality of heat conduction columns 10, the upper end of the heat conduction columns 10 can be directly contacted with the first heat conduction columns 9 and the first heat conduction columns 9 can directly contact the first heat conduction columns 9.

Specifically, the upper end of machine case body 1 is provided with first ventilation layer 2, and the front end of machine case body 1 is provided with second ventilation layer 3, and first ventilation layer 2 and second ventilation layer 3 are detachable threaded connection with the relation of being connected of machine case body 1, and a plurality of heat dissipation through-holes have all been seted up on the surface on first ventilation layer 2 and second ventilation layer 3, make things convenient for the inside air current of machine case body 1 to circulate.

Further, the inner wall of the case body 1 is provided with a through hole for connecting the outside, a plurality of first cooling fans 4 are installed in the through hole, and the inside of the case body 1 can be cooled through the plurality of first cooling fans 4 connected with the outside, so that the airflow in the case body 1 can be accelerated to circulate.

Further, the heat dissipation assembly 6 comprises a second heat dissipation fan 601, heat dissipation fins 602 and heat conduction copper pipes 603, the front end of the processor 15 is provided with a plurality of heat conduction copper pipes 603, the other ends of the plurality of heat conduction copper pipes 603 are provided with heat dissipation fins 602, the upper ends of the heat dissipation fins 602 are provided with the second heat dissipation fan 601, heat of the processor 15 is transferred to the inside of the heat dissipation fins 602 through the heat conduction copper pipes 603, the heat dissipation fins 602 are composed of a plurality of flaky metal sheets, certain gaps exist among the plurality of metal sheets, so that the contact area between the metal sheets and air is enlarged, the heat dissipation effect is accelerated, and the heat dissipation of the heat dissipation fins 602 is achieved through the second heat dissipation fan 601.

Further, the inside of the case body 1 is provided with a transverse partition 7, the upper end of the partition 7 is provided with a plurality of longitudinal radiating holes 8 matched with the first heat conducting copper plate 9, the partition 7 can divide the case body 1 into two spaces, the position of the first heat conducting copper plate 9 can be fixed by the partial radiating holes 8, and the redundant radiating holes 8 are used for circulation among airflows.

Furthermore, the position of the bottom end inside the case body 1, which is located at the right end of the second heat conducting copper plate 13, is provided with a circulation bin 11 which is communicated with the water cooling pipe 14, a third heat radiating fan 12 is arranged inside the circulation bin 11, a water pump is arranged inside the circulation bin 11, water cooling liquid is driven to circulate between the circulation bin 11 and the water cooling pipe 14 through the water pump, the circulation bin 11 and the water cooling pipe 14 are both installed below the partition plate 7, the water cooling pipe 14 is inserted between the heat conducting columns 10, heat generated by the processor 15 is transferred to the heat radiating component 6, part of the heat is transferred through the first heat conducting copper plate 9 and the heat conducting columns 10, the heat is radiated through the water cooling pipe 14 and the circulation bin 11, the circulation bin 11 is radiated through the third heat radiating fan 12, the circulation bin 11 and the water cooling pipe 14 are both located at the lower end of the partition plate 7, and the liquid generated after the water cooling structure is damaged does not greatly affect internal fittings of the case.

The application method of the embodiment is as follows: through setting up radiator unit 6 and radiating for treater 15 when the computer is running, radiator unit 6's lower extreme is connected with a plurality of first heat conduction copper 9 that possess high-efficient heat conduction function, and first heat conduction copper 9's lower extreme is connected with a plurality of heat conduction posts 10, plays certain supporting role to radiator unit 6 through heat conduction post 10 and first heat conduction copper 9, can avoid radiator unit 6's dead weight to produce great influence to radiator unit 6, avoids when the computer is running, radiator unit 6 produces the circumstances that looseness appears.

Finally, it should be noted that: the foregoing description is only a preferred embodiment of the present utility model, and the present utility model is not limited thereto, but it is to be understood that modifications and equivalents of some of the technical features described in the foregoing embodiments may be made by those skilled in the art, although the present utility model has been described in detail with reference to the foregoing embodiments. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present utility model should be included in the protection scope of the present utility model.

Claims (6)

1. A heat dissipation structure for a computer case, comprising a case body (1), characterized in that: a mainboard (5) is arranged inside the case body (1), a processor (15) is installed at the front end of the mainboard (5), a heat dissipation component (6) is installed at the front end of the processor (15), a plurality of first heat-conducting copper plates (9) are installed at the lower end of the heat dissipation component (6), a second heat-conducting copper plate (13) is installed at the bottom end of the case body (1), a water cooling pipe (14) is installed at the upper end of the second heat-conducting copper plate (13), a plurality of heat-conducting columns (10) are installed outside the water cooling pipe (14) at the upper end of the second heat-conducting copper plate (13), and the upper end of the heat-conducting column (10) is connected to the lower end of the first heat-conducting copper plate (9). 2. The heat dissipation structure for a computer case according to claim 1, characterized in that a first ventilation layer (2) is provided at the upper end of the case body (1), and a second ventilation layer (3) is provided at the front end of the case body (1). 3. The heat dissipation structure for a computer case according to claim 1, characterized in that: a through hole connected to the outside is opened on the inner wall of the case body (1), and a plurality of first heat dissipation fans (4) are installed inside the through hole. 4. The heat dissipation structure for a computer case according to claim 1 is characterized in that: the heat dissipation component (6) includes a second heat dissipation fan (601), a heat sink (602) and a thermally conductive copper tube (603), a plurality of thermally conductive copper tubes (603) are installed at the front end of the processor (15), a heat sink (602) is installed at the other end of the plurality of thermally conductive copper tubes (603), and a second heat dissipation fan (601) is installed at the upper end of the heat sink (602). 5. The heat dissipation structure for a computer case according to claim 1 is characterized in that a transverse partition (7) is installed inside the case body (1), and a plurality of longitudinal heat dissipation holes (8) are opened at the upper end of the partition (7) for matching with the first heat-conducting copper plate (9). 6. The heat dissipation structure for a computer case according to claim 1 is characterized in that a circulation chamber (11) connected to a water cooling pipe (14) is provided at the bottom of the interior of the case body (1) at the right end of the second heat-conducting copper plate (13), and a third heat dissipation fan (12) is provided inside the circulation chamber (11).