CN222050836U

CN222050836U - Singlechip chip based on arm framework

Info

Publication number: CN222050836U
Application number: CN202322940160.1U
Authority: CN
Inventors: 许锋; 高松
Original assignee: Core Technology Wuhan Co ltd
Current assignee: Core Technology Wuhan Co ltd
Priority date: 2023-11-01
Filing date: 2023-11-01
Publication date: 2024-11-22
Anticipated expiration: 2033-11-01

Abstract

The utility model discloses a single chip microcomputer chip based on an arm architecture, which comprises an upper packaging layer and a lower packaging layer, wherein a clamping groove is formed in the top of the lower packaging layer, a chip core is clamped in the clamping groove, the bottom of the upper packaging layer is fixedly connected with the lower packaging layer to package the chip core, and two rows of pin connectors are fixedly connected to two sides of the lower packaging layer. According to the utility model, the chip core is packaged and protected through the upper packaging layer and the lower packaging layer, the pins are damaged and replaced through the matched connection of the pin connectors and the pin bodies, the maintenance is more convenient, the passive heat radiation capacity of the chip is increased through the heat radiation structure with a flat design, meanwhile, the size of the device is reduced, and the miniaturized design and installation are convenient, so that the device has the advantages of good heat radiation junction effect, miniaturized design and reduced structural cost.

Description

Singlechip chip based on arm framework

Technical Field

The utility model relates to the technical field of single chip chips, in particular to a single chip based on an arm architecture.

Background

The single chip microcomputer is an integrated circuit chip, and is a small and perfect microcomputer system formed by integrating functions of a CPU (central processing unit), a RAM (random access memory), a ROM (read only memory), various I/O (input/output) ports, an interrupt system, a timer/counter and the like with data processing capacity on a silicon chip by adopting a very large scale integrated circuit technology, and is widely applied to the field of industrial control. From the 80 th of the last century, the current 4-bit and 8-bit single-chip microcomputer is developed to the current 300M high-speed single-chip microcomputer, and when the single-chip microcomputer works, a large amount of heat is emitted by a single-chip microcomputer chip, and the heat dissipation design is needed for the chip so as to ensure the stable operation of the device.

For example, patent application number 202121712568.8 discloses a singlechip chip radiator, including the singlechip chip, singlechip chip top is provided with cooling mechanism, cooling mechanism includes the radiating block, radiating block top both sides all are provided with multiunit fin, every group the fin comprises horizontal fin and longitudinal fin, every group all fixed welding between the fin, horizontal fin bottom and radiating block fixed welding. According to the utility model, the heat dissipation mechanism is arranged, so that the temperature of the single chip microcomputer chip is prevented from being too high when the single chip microcomputer works, and the single chip microcomputer cannot work normally, the heat dissipation block on the single chip microcomputer chip is made of aluminum materials, and the difficulty in processing by using the aluminum materials is small, the weight is light, the heat conduction performance is good, and therefore the temperature on the single chip microcomputer chip can be reduced rapidly, and the single chip microcomputer chip can work at the normal temperature.

However, in the above prior art, a thicker heat dissipation mechanism is stacked on the chip, which is not beneficial to the miniaturized design of the singlechip and increases the structural cost of the device.

Disclosure of utility model

Aiming at the problems existing in the prior art, the utility model aims to provide a singlechip chip based on an arm architecture.

In order to solve the problems, the utility model adopts the following technical scheme.

The utility model provides a singlechip chip based on arm framework, includes encapsulation layer and lower encapsulation layer, the draw-in groove has been seted up at the top of lower encapsulation layer, the inside joint of draw-in groove has the chip core, the bottom of going up the encapsulation layer and lower encapsulation layer fixed connection realize the encapsulation to the chip core, the equal fixedly connected with in both sides of lower encapsulation layer is two rows of pin joints, the other end of pin joint extends to the outside of lower encapsulation layer, just pin joint's inside grafting has the pin body, the top fixed mounting of going up the encapsulation layer has heat radiation structure.

As a further description of the above technical solution: the pin connector is characterized in that a slot is formed in the pin connector, and one end of the pin body is fixedly connected with a plug which is in plug-in fit with the slot.

As a further description of the above technical solution: the length of the plug is greater than the depth of the slot, a glue groove is formed between one end of the pin connector opposite to the pin body, and insulating glue is injected into the glue groove.

As a further description of the above technical solution: the heat radiation structure comprises a heat radiation silica gel layer and a heat radiation block, wherein the bottom of the heat radiation block is adhered to the top of the upper packaging layer through the heat radiation silica gel layer.

As a further description of the above technical solution: the heat dissipation device comprises a heat dissipation block, wherein heat dissipation convex blocks are fixedly connected to two sides of the top of the heat dissipation block, and first heat dissipation grooves are formed in the top of the heat dissipation block in an equidistance manner.

As a further description of the above technical solution: the bottom of the lower packaging layer is provided with second heat dissipation grooves which are arranged at equal intervals.

Compared with the prior art, the utility model has the advantages that:

This scheme is through heat radiation structure cooperation pin joint cooperation pin body use to when having realized that the device possesses good heat dissipation knot effect, and with the miniaturized design of device, and reduce the advantage of the structural cost of device.

Drawings

FIG. 1 is a schematic perspective view of the present utility model;

FIG. 2 is a schematic cross-sectional elevation view of the present utility model;

Fig. 3 is an enlarged schematic view of the structure of the portion a in fig. 2.

The reference numerals in the figures illustrate:

1. An upper encapsulation layer; 2. a lower encapsulation layer; 21. a second heat dissipation groove; 3. a clamping groove; 4. a chip core; 5. a pin joint; 51. a slot; 6. a pin body; 61. a plug; 62. a glue groove; 63. insulating glue; 7. a heat dissipation structure; 71. a heat dissipation silica gel layer; 72. a heat dissipation block; 721. a heat dissipation bump; 722. a first heat dissipation groove.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model;

Referring to fig. 1-3, in the utility model, a single chip microcomputer chip based on an arm architecture comprises an upper packaging layer 1 and a lower packaging layer 2, a clamping groove 3 is formed at the top of the lower packaging layer 2, a chip core 4 is clamped in the clamping groove 3, the bottom of the upper packaging layer 1 is fixedly connected with the lower packaging layer 2 to package the chip core 4, two rows of pin connectors 5 are fixedly connected to two sides of the lower packaging layer 2, the other ends of the pin connectors 5 extend to the outer side of the lower packaging layer 2, a pin body 6 is inserted in the pin connectors 5, and a heat dissipation structure 7 is fixedly installed at the top of the upper packaging layer 1.

According to the utility model, the chip core 4 is packaged and protected through the upper packaging layer 1 and the lower packaging layer 2, and the pins are matched and connected through the pin connector 5 and the pin body 6, so that the pins can be damaged and replaced, the maintenance is more convenient, the passive heat radiation capacity of the chip is increased through the heat radiation structure 7 with a flat design, meanwhile, the volume of the device is reduced, and the miniaturization design and installation are convenient, so that the device has a good heat radiation junction effect, and the device is miniaturized, and the structural cost of the device is reduced.

Please refer to fig. 3, wherein: the pin joint 5 is internally provided with a slot 51, and one end of the pin body 6 is fixedly connected with a plug 61 which is in plug-in fit with the slot 51.

In the utility model, the pin body 6 and the pin joint 5 are conveniently assembled, disassembled and replaced by matching the plug 61 with the slot 51.

Please refer to fig. 2 and 3, wherein: the length of the plug 61 is greater than the depth of the slot 51, a glue groove 62 is provided between the opposite ends of the pin terminal 5 and the pin body 6, and insulating glue 63 is injected into the glue groove 62.

In the utility model, the length of the plug 61 is longer than the depth of the slot 51 to form the glue groove 62, and the glue groove is bonded by the insulating glue 63, so that the connection is stable and firm, and the later replacement operation is convenient.

Referring to fig. 1 and 2, the heat dissipation structure 7 includes a heat dissipation silica gel layer 71 and a heat dissipation block 72, wherein the bottom of the heat dissipation block 72 is adhered to the top of the upper package layer 1 through the heat dissipation silica gel layer 71.

In the utility model, the heat of the chip core 4 is led out and radiated by the heat radiation silica gel layer 71 and the heat radiation block 72, so that the heat radiation effect of the device is improved.

Please refer to fig. 1 and 2, wherein: the heat dissipation bumps 721 are fixedly connected to two sides of the top of the heat dissipation block 72, and the first heat dissipation grooves 722 are formed in the top of the heat dissipation block 72 in an equidistant manner.

In the utility model, the heat dissipation area of the heat dissipation block 72 is increased by matching the heat dissipation bump 721 with the first heat dissipation groove 722, so that the device has good heat dissipation effect.

Please refer to fig. 1 and 2, wherein: the bottom of the lower package layer 2 is provided with second heat dissipation grooves 21 which are equidistantly arranged.

In the utility model, the surface area of the device is increased by the second heat dissipation grooves 21, so that the heat dissipation effect is conveniently improved.

The foregoing is a preferred embodiment of the present utility model; the scope of the utility model is not limited in this respect. Any person skilled in the art, within the technical scope of the present disclosure, may apply to the present utility model, and the technical solution and the improvement thereof are all covered by the protection scope of the present utility model.

Claims

1. A single-chip microcomputer chip based on an ARM architecture, comprising an upper packaging layer (1) and a lower packaging layer (2), characterized in that: a card slot (3) is provided at the top of the lower packaging layer (2), a chip core (4) is carded inside the card slot (3), the bottom of the upper packaging layer (1) is fixedly connected to the lower packaging layer (2) to package the chip core (4), two rows of pin connectors (5) are fixedly connected on both sides of the lower packaging layer (2), the other end of the pin connector (5) extends to the outside of the lower packaging layer (2), and a pin body (6) is inserted inside the pin connector (5), and a heat dissipation structure (7) is fixedly installed on the top of the upper packaging layer (1).

2. According to the ARM architecture-based single-chip microcomputer chip of claim 1, it is characterized in that: a slot (51) is provided inside the pin connector (5), and one end of the pin body (6) is fixedly connected to a plug (61) that is plugged into and fits with the slot (51).

3. According to claim 2, a single-chip microcomputer chip based on an ARM architecture is characterized in that: the length of the plug (61) is greater than the depth of the slot (51), a glue groove (62) is provided between the ends of the pin connector (5) and the pin body (6) opposite to each other, and insulating glue (63) is injected into the glue groove (62).

4. According to the ARM architecture-based single-chip microcomputer chip of claim 1, it is characterized in that: the heat dissipation structure (7) includes a heat dissipation silicone layer (71) and a heat dissipation block (72), and the bottom of the heat dissipation block (72) is bonded to the top of the upper packaging layer (1) through the heat dissipation silicone layer (71).

5. According to the ARM architecture-based single-chip microcomputer chip of claim 4, it is characterized in that: the top two sides of the heat dissipation block (72) are fixedly connected with heat dissipation bumps (721) arranged at equal distances, and the top of the heat dissipation block (72) is provided with first heat dissipation grooves (722) arranged at equal distances.

6. The ARM architecture-based single-chip microcomputer chip according to claim 1, characterized in that: the bottom of the lower packaging layer (2) is provided with second heat dissipation grooves (21) arranged at equal distances.