CN222029076U - Electronic packaging device and power module - Google Patents
Electronic packaging device and power module Download PDFInfo
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- CN222029076U CN222029076U CN202323480207.7U CN202323480207U CN222029076U CN 222029076 U CN222029076 U CN 222029076U CN 202323480207 U CN202323480207 U CN 202323480207U CN 222029076 U CN222029076 U CN 222029076U
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Abstract
本实用新型涉及一种电子封装器件及功率模块，涉及半导体封装技术领域。本实用新型的电子封装器件包括用于安装芯片的衬板、包裹在衬板外的塑封体、以及用于连接衬板和外部电器的多个第一端子；第一端子至少部分嵌入塑封体内，第一端子为具有台阶的阶梯形结构，阶梯形结构的台阶端面与塑封体的成型顶面相齐平，以形成接触密封。由于第一端子为具有台阶的阶梯形结构，阶梯形结构的台阶端面与塑封体的成型顶面相齐平，转模时第一连接段与上模腔壁面直接接触，因此无需在塑封模具上为每个PIN针单独配置定位结构；由于在塑封时第一端子的台阶端面与塑封体之间形成接触密封，解决了转模塑封时容易发生环氧树脂外溢的问题。
The utility model relates to an electronic packaging device and a power module, and relates to the field of semiconductor packaging technology. The electronic packaging device of the utility model includes a liner for mounting a chip, a plastic package body wrapped outside the liner, and a plurality of first terminals for connecting the liner and an external electrical appliance; the first terminal is at least partially embedded in the plastic package body, and the first terminal is a stepped structure with steps, and the step end face of the stepped structure is flush with the molded top surface of the plastic package body to form a contact seal. Since the first terminal is a stepped structure with steps, the step end face of the stepped structure is flush with the molded top surface of the plastic package body, and the first connecting section is in direct contact with the wall surface of the upper mold cavity during mold transfer, there is no need to separately configure a positioning structure for each PIN pin on the plastic package mold; since a contact seal is formed between the step end face of the first terminal and the plastic package body during plastic sealing, the problem of epoxy resin overflowing easily during mold transfer and plastic sealing is solved.
Description
Technical Field
The present utility model relates to the field of semiconductor packaging technology, and in particular, to an electronic packaging device and a power module.
Background
With the rapid development of the fields of new energy power generation, electric automobiles and the like, the application range of the IGBT power module on the automobile is wider. The power module is a core component for controlling a motor, and the performance efficiency and the power consumption of the power module are directly related to the performance and the energy consumption state of the new energy automobile.
The packaging forms of the power semiconductor module are divided into encapsulation packaging and plastic packaging, wherein the plastic packaging adopts epoxy resin to package the power module, and the packaging has the advantages of high production efficiency, high reliability, low water absorption and the like, so that the packaging is more and more paid attention.
At present, the manufacturing method of the PIN needle in the plastic package is complex, the PIN needle can be completed only through technologies such as rib cutting and forming, the PIN needle is independently welded on the lining plate, and then the lining plate is subjected to plastic package, and a positioning structure is independently configured for each PIN needle on a plastic package die, so that the realization is difficult.
Disclosure of utility model
The utility model provides an electronic packaging device and a power module, which are used for solving the problem that a positioning structure is required to be configured for each PIN needle independently on a plastic packaging die in the plastic packaging process of the electronic packaging device in the prior art.
In one aspect, the utility model provides an electronic packaging device, which comprises a lining board for installing a chip, a plastic package body wrapped outside the lining board, and a plurality of first terminals for connecting the lining board and an external electric appliance;
The first terminal is at least partially embedded into the plastic package body, the first terminal is of a stepped structure with steps, and the end faces of the steps of the stepped structure are flush with the molded top face of the plastic package body to form contact seal.
Optionally, the first terminal includes a first connection section and a second connection section connected to each other; the first connecting section is embedded in the plastic package body, one end of the first connecting section is connected to the lining plate, and the other end of the first connecting section is flush with the top surface of the plastic package body;
The radial dimension of the first connecting section is larger than that of the second connecting section;
The first connecting section and the second connecting section are coaxially connected to form the stepped structure, and a step of the stepped structure is located on the end face of the first connecting section, which faces one side of the second connecting section.
As one embodiment, the first connection section of the first terminal is a connection body embedded in the plastic package body and connected with the lining plate;
The second connecting section is a pin connected between the connecting body and an external electric appliance;
The connecting body is of a sleeve structure, the outer diameter of one end of the pin, which is used for connecting the connecting body, is larger than the inner diameter of the connecting body, and the pin is embedded in the inner hole of the connecting body in an interference fit manner.
Optionally, a connecting part for connecting with the lining plate is formed at one end of the first connecting section, and the connecting part is a trapezoid structure formed by extending along the radial direction of the first connecting section;
After plastic packaging, the connecting part can resist and limit between the lining plate and the plastic packaging body.
As another embodiment, the first terminal is a stepped PIN needle integrally formed.
Optionally, the first terminals are all perpendicular to the lining board.
Optionally, the number of the chips is multiple, and the chips are interconnected through copper bars; and/or the number of the groups of groups,
The chip is welded on the lining board, and the chip and the lining board are interconnected through copper bars.
Optionally, the electronic packaging device further comprises a substrate for supporting and mounting the lining board; the base plate comprises a plate body for supporting and installing the lining plate and pin fins arranged on the plate body;
The heat generated by the chip can sequentially pass through the lining plate, the plate body and the pin fins and exchange heat with the cooling liquid flowing through the pin fins.
Optionally, the electronic package device further comprises:
And the second terminal is of a sheet structure, one end of the second terminal is welded on the lining plate, and the other end of the second terminal extends out of the lining plate and the plastic package body and is used for being connected with other electrical components outside the electronic package device.
In another aspect, the present utility model provides a power module including the electronic package device described above.
Compared with the prior art, the utility model has the advantages that:
1. At present, the manufacturing method of the PIN needle in the plastic package is complex, the PIN needle can be completed only through technologies such as rib cutting and forming, the PIN needle is independently welded on the lining plate, and then the lining plate is subjected to plastic package, and a positioning structure is independently configured for each PIN needle on a plastic package die, so that the realization is difficult. In view of the above technical problems, in this embodiment, since the first terminal has a stepped structure with a step, and the step end surface of the stepped structure is flush with the molded top surface of the plastic package body, the first connection section is directly contacted with the wall surface of the upper mold cavity during mold rotation, so that it is unnecessary to separately configure a positioning structure for each PIN on the plastic package mold; meanwhile, as contact seal is formed between the step end face of the first terminal and the plastic package body during plastic package, the problem that epoxy resin overflows easily during rotary plastic package is solved.
2. In the application, the first terminals are all perpendicular to the lining plate, so that the vertical space of the lining plate can be fully utilized, the horizontal area of the lining plate is reduced, the power density of the electronic packaging device can be improved, the size of the electronic packaging device is reduced as a whole, and the structure is more compact.
3. According to the integrated type substrate structure with the pin fins and the design scheme of the special-shaped pin fins, the heat dissipation capacity of the electronic packaging device can be improved, the heat dissipation is more efficient, and therefore the electronic packaging device is supported to continuously work at a higher temperature and can be applied to a low-power module.
4. According to the application, copper bars (DLB) are adopted for connection between chips, between chips and terminals and between chips and a lining board, so that the chip thermal resistance can be reduced, the loop inductance can be reduced, and the overall loss can be reduced.
5. The application adopts a single-lining-board three-phase full-bridge scheme, can flexibly adjust the circuit configuration according to the application scene, and is suitable for the low-power high-power density module package of the vehicle-specification-level application scene.
Drawings
The utility model will be described in more detail hereinafter on the basis of embodiments and with reference to the accompanying drawings.
FIG. 1 is a three-phase full-bridge circuit diagram in an embodiment of the utility model;
FIG. 2 is a schematic diagram of an electronic package device according to an embodiment of the present utility model;
FIG. 3 is a schematic diagram of the electronic package device of FIG. 2 when not encapsulated;
FIG. 4 is a top view of the electronic package of FIG. 3;
fig. 5 is a side view of the electronic package of fig. 3;
FIG. 6 is an isometric view of a substrate in an embodiment of the utility model;
Fig. 7 is a schematic view showing the structure of an internal device, in which a first terminal of the first embodiment is shown;
fig. 8 is a schematic view showing a structure of an internal device, in which a first terminal of a second embodiment is shown;
fig. 9 is a schematic structural view of a first terminal of a second embodiment.
Fig. 10 is a schematic view showing a structure of an internal device, in which a first terminal of a third embodiment is shown;
fig. 11 is a schematic structural view of a first terminal of a third embodiment.
Fig. 12 is a schematic structural view of an electronic package device mounted with a second terminal of another embodiment;
Fig. 13 is a schematic view of the electronic package device of fig. 12 in an unpackaged configuration.
Reference numerals:
1. a chip; 2. a lining plate; 3. a plastic package body;
4. a first terminal; 41. a first connection section; 42. a second connection section;
5. a substrate; 51. a plate body; 52. pin fins;
6. a second terminal; 61. a connection hole; 7. and a copper bar.
Detailed Description
The utility model will be further described with reference to the accompanying drawings.
The main components involved in this embodiment are a chip 1, a backing plate 2, a substrate 5, a first terminal 4, a second terminal 6 and a plastic package 3. The main components are described as follows:
(1) Liner plate 2: the mounting connection chip 1, the first terminal 4 and the second terminal 6 can be mounted, the lining board 2 is a direct copper-clad substrate (Direct Bond Copper, DBC or DCB for short), and the lining board 2 is in a flat plate shape. The lining plate 2 can be manufactured by adopting the processes of toughened ceramic (ZTA) or active metal brazing copper-clad technology (AMB) and the like; the ceramic insulating layer can be made of ceramic materials such as alumina, silicon nitride, aluminum nitride and the like or other insulating materials; in order to enhance the heat conductivity or structural strength of the insulating layer, the ceramics may be doped with an oxide such as zirconia (ZrO 2). The upper and lower surfaces of the lining board 2 are respectively provided with a conductive copper-clad layer for realizing the electrical connection between the electronic components. The copper-clad layer of the lining plate 2 can be bare copper, or other plating layers such as gold, nickel, silver and the like can be plated on the surface of copper. The shape of the copper-clad layer can be adjusted according to actual requirements, and the embodiment is not limited to this.
(2) Chip 1: the chip 1 is a power element mounted on the backing plate 2, and the chip 1 and the backing plate 2 are connected in a mounting manner and electrically interconnected. Specifically, tin-based solder welding can be adopted, and silver sintering, copper sintering and other processes can be adopted to realize the installation connection between the two. The electrical interconnection between the two can be realized by a metal bonding wire or a Cu Clip mode, and the electrical connection can be realized by copper wires, aluminum wires, copper strips or aluminum strips.
The chip 1 is provided in a plurality of, and a plurality of chips 1 are arranged on the lining plate 2. The chips are interconnected through bonding wires or Cu clips, and can be interconnected through copper wires, aluminum wires, copper strips or aluminum strips. The arrangement of the plurality of chips 1 on the backing plate 2 may be: the chip of the grounded lower tube is close to the DC terminal, the chip of the upper tube connected to the positive electrode of the power supply is close to the AC terminal, and the separation line of the upper tube and the lower tube is along the direction vertical to the connecting line between the DC terminal and the AC terminal; the parting line of the upper tube and the lower tube is along the connecting line direction of the DC terminal and the AC terminal.
The chip 1 may be an FRD/IGBT, MOSFET or SBD/IGBT made of silicon base, silicon carbide (SiC), gallium nitride (GaN) or the like, or may be other high-power chips 1.
As shown in fig. 1, in this embodiment, the module circuit adopts a three-phase full-bridge structure, adopts a single-liner-board 2 layout, uses six IGBTs and six FRD chips, and forms a single tube by antiparallel connection of each IGBT chip and each FRD chip, thereby forming a six-in-one three-phase full-bridge circuit topology. Of course, the FRD chip in the present embodiment may be replaced with a SiC chip.
(3) The first terminal 4 is used for electrically connecting the lining board 2 with the outside, one end of the second terminal 6 is connected to the lining board 2 by welding or adopting an ultrasonic welding process connection mode, and the other end extends along the direction vertical to the lining board 2; the first terminals 4 are arranged in a plurality, and the first terminals 4 are arranged on the lining board 2 at intervals.
In this embodiment, the first terminals 4 are all perpendicular to the liner plate 2, so that the form that the terminals extend out along the horizontal direction of the liner plate 2 in the conventional manner can be avoided, the vertical space of the liner plate 2 can be fully utilized, the occupied area of the first terminals 4 on the liner plate 2 is reduced, the utilization area of the liner plate 2 is effectively increased, and the horizontal area of the liner plate 2 is reduced, so that the size of the electronic packaging device is reduced as a whole, the power density of the electronic packaging device is increased, and the plastic packaging cost is reduced; in addition, parasitic parameters can be reduced, and the controllability of the chip 1 is enhanced.
The first terminal 4 is at least partially embedded in the plastic package body 3, the first terminal 4 is in a stepped structure with steps, and the step end face of the stepped structure is flush with the molded top surface of the plastic package body 3 so as to form contact seal.
At present, the manufacturing method of the PIN needle in the plastic package is complex, the PIN needle can be completed only through technologies such as rib cutting and forming, the PIN needle is independently welded on the lining plate 2, and then the lining plate 2 is subjected to plastic package, so that a positioning structure is required to be independently configured for each PIN needle on a plastic package die, and the realization is difficult. In view of the above technical problems, in this embodiment, since the first terminal 4 has a stepped structure with steps, the step end surface of the stepped structure is flush with the molded top surface of the plastic package body 3, and the first connection section 41 is in direct contact with the wall surface of the upper mold cavity during mold rotation, there is no need to separately configure a positioning structure for each PIN on the plastic package mold; meanwhile, as contact seal is formed between the step end face of the first terminal 4 and the plastic package body 3 during plastic package, the problem that epoxy resin overflows easily during rotary die plastic package is solved.
The first terminal 4 includes a first connection section 41 and a second connection section 42 connected to each other; the first connecting section 41 is embedded into the plastic package body 3, one end of the first connecting section 41 is connected to the lining plate 2, and the other end of the first connecting section is flush with the top surface of the plastic package body 3; the radial dimension of the first connecting section 41 is greater than the radial dimension of the second connecting section 42; the first connecting section 41 and the second connecting section 42 are coaxially connected to form a stepped structure, and steps of the stepped structure are located on the end face of the first connecting section 41 facing the side of the second connecting section 42.
As a first embodiment, the first terminal 4 is a linear PIN needle integrally formed.
As a second embodiment, the first terminal 4 is an integrally formed PIN needle, and has a stepped inverted-t structure, and the top of the step of the inverted-t structure is flush with the formed top surface of the plastic package body 3, so as to form a contact sealing area.
As a third embodiment, the first connection section 41 of the first terminal 4 is a connection body embedded in the plastic package body 3 and connected with the liner plate 2; the second connection section 42 is a pin connected between the connector and an external electric appliance; the connector is sleeve structure, is used for connecting the one end external diameter of connector to be greater than the interior bore of connector on the pin, and pin interference fit embeds in the hole of connector. The pin is the crimping pin, after the rotary die, one end interference fit embeds in the connector hole on the crimping pin, forms PressFIT structure to realize exempting from the welding pressure equipment.
Alternatively, one end of the first connecting section 41 is formed with a connecting portion for connecting with the liner plate 2, the connecting portion being a stepped structure formed along the radial extension of the first connecting section 41; after plastic packaging, the connecting part can resist and limit between the lining plate 2 and the plastic packaging body 3.
The first connecting section 41 is connected with the liner plate 2 through the connecting part, the connecting part can enlarge the contact area between the first connecting section 41 and the liner plate 2, the connection is firmer, meanwhile, the top wall of the connecting part resists against the plastic package body 3, the sleeve is prevented from falling out of the plastic package body 3, and the connection is firmer; the other end of the first connecting section 41 is flush with the top surface of the plastic package 3.
In this embodiment, the connecting body is welded on the lining board 2, the top end of the connecting body is in direct contact with the wall surface of the upper die cavity during die rotation, and one end of the lead is embedded in the inner hole of the connecting body in an interference fit manner after the die rotation forms the plastic package body 3, so that the lead is connected with the connecting body. Because the top end of the connecting body is in direct contact with the wall surface of the upper die cavity during the die rotating, a positioning structure is not required to be configured on the plastic package die for each PIN needle independently, and the problem that epoxy resin overflows easily during the die rotating plastic package is solved.
In this embodiment, when the PIN is used as the first terminal 4, the connection mode can be selected reasonably and flexibly according to practical situations, and the flexible configuration of the interface of the electronic packaging electric appliance can be realized by the welding mode of the PIN and the lining plate 2 and the mode of forming PressFIT structure by the interference fit and compression joint of the connector and the compression joint PIN, so as to meet the application demands of different interfaces of customers.
(4) The second terminal 6 is in a sheet structure, one end of the second terminal 6 is connected to the lining plate 2 through solder welding or in an ultrasonic welding process connection mode, and the other end of the second terminal 6 extends out of the lining plate 2 and the plastic package body 3 and is used for being connected with other electrical components outside the electronic package device. The protruding portion of the second terminal 6 is arranged in parallel with the backing plate 2. As an embodiment, the protruding portion of the second terminal 6 is provided with a connection hole 61 through which the second terminal 6 can be screwed with an external component. As an embodiment, the protruding portion of the second terminal 6 has a planar plate-shaped structure, and laser welding may be used between the protruding portion and an external component.
Preferably, copper bars 7 (DLB) are adopted for connection between the chips, between the chip 1 and the terminals and between the chip 1 and the lining plate 2, so that the thermal resistance of the chip 1 can be reduced, the loop inductance can be reduced, and the overall loss can be reduced.
(5) The substrate 5 plays a critical role in the overall heat dissipation of the electronic package, and the substrate 5 includes a board body 51 and pin fins 52 provided on the board body 51. The heat generated by the chip 1 sequentially passes through the lining plate 2, the plate body 51 and the pin fins 52, and exchanges heat with the cooling liquid flowing through the pin fins 52, and transfers the heat to the cooling liquid, thereby reducing the temperature of the chip 1.
The board body 51 serves to provide mechanical support for the electronic package device in this embodiment and to enhance the mounting interface. The lining board 2 is mounted on the board body 51, and the interconnection between the lining board 2 and the base board can adopt welding of tin-based solder, sintering modes such as silver sintering, copper sintering and the like, and transient liquid phase welding modes. A boss for supporting the lining plate 2 and keeping the welding thickness between the lining plate 2 and the plate body 51 is circumferentially arranged on the plate body 51; alternatively, the thickness of the boss is 0.05mm to 0.3mm. The size of the board 51 is adjusted according to the size of the circuit layout range, and the overall size of the board 51 in this embodiment is not greater than 80×90 mm.
The pin fin 52 is mainly used for heat dissipation, one end of the pin fin 52 is connected to the plate body 51, and the other end extends along a direction away from the plate body 51. The pin fins 52 are arranged in a plurality, and the pin fins 52 are arranged on the plate body 51 at intervals; the plurality of pin fins 52 may be arranged in a uniform array or in a non-uniform array. The length of the pin fin 52 is slightly less than the depth of the heat sink, alternatively the pin fin 52 is 5.5mm to 6.5mm in length. The pin fin 52 may have a columnar shape, and the cross-section thereof may have a circular shape, an elliptical shape, a diamond shape, a square shape, a track shape, or a fin shape, or may have a combination of two or three, or may have other shapes, which is not limited in this embodiment.
The pin fin 52 may be integrally formed with the plate body 51, or may be fixed to the plate body 51 by adhesion, welding, or the like. The integrated substrate 5 structure with the pin fins 52 and the design of the special-shaped pin fins 52 in the present embodiment can perform efficient heat dissipation, and can be applied to a low-power module.
The plate 51 and the pin fin 52 are made of high heat conduction materials, and may be bare copper, or may be plated with nickel, silver or other plating layers on the surface of the copper layer, or may be made of other high heat conduction materials.
(6) The plastic package body 3 wraps the lining plate 2 and the chip 1 thereon, plays roles of insulating protection and sealing protection, supports the circuit mounting interface, has no influence on heat dissipation of the electronic packaging device, and can support the electronic packaging device to continuously work at a higher temperature by adopting the high-temperature resistant characteristic of the plastic package body 3 which is made of high polymer materials, such as epoxy resin. Of course, other materials meeting the requirements of pressure resistance and moisture resistance can be adopted for the plastic package body 3.
In this embodiment, the electronic package device is formed as follows: the chip 1, the first terminal 4 and the second terminal 6 are respectively welded on the lining plate 2, and the lining plate 2 is welded on the base plate 5; electrically connecting the electronic devices; and then performing transfer molding encapsulation to form the plastic package body 3.
In this embodiment, the first terminals 4 are all perpendicular to the liner plate 2, so that the vertical space of the liner plate 2 can be fully utilized, the horizontal area of the liner plate 2 is reduced, the power density of the electronic packaging device can be improved, the size of the electronic packaging device is reduced as a whole, and the structure is more compact; further, the integrally formed substrate 5 structure with the pin fins 52 and the design scheme of the special-shaped pin fins 52 in the embodiment can improve the heat dissipation capacity of the electronic packaging device, and the heat dissipation is more efficient, so that the electronic packaging device is supported to continuously work at a higher temperature, and the integrated pin fins can be applied to a low-power module.
When the PIN needle is used as the first terminal 4, the connection mode can be selected reasonably and flexibly according to actual conditions, namely, the connection mode can be realized through welding the PIN needle and the lining plate 2 and the connection mode can be realized through interference fit compression joint of the connection body and the compression joint type PIN to form a PressFIT structure.
The embodiment of the utility model adopts a single lining plate 2 three-phase full-bridge scheme, can flexibly adjust the circuit configuration according to the application scene, and is suitable for the low-power high-power density module package of the vehicle-scale application scene.
While the utility model has been described with reference to a preferred embodiment, various modifications may be made and equivalents may be substituted for elements thereof without departing from the scope of the utility model. In particular, the technical features mentioned in the respective embodiments may be combined in any manner as long as there is no structural conflict. The present utility model is not limited to the specific embodiments disclosed herein, but encompasses all technical solutions falling within the scope of the claims.
Claims (10)
1. An electronic packaging device is characterized by comprising a lining plate (2) for installing a chip (1), a plastic package body (3) wrapped outside the lining plate (2), and a plurality of first terminals (4) for connecting the lining plate (2) and an external electric appliance;
The first terminal (4) is at least partially embedded into the plastic package body (3), the first terminal (4) is of a stepped structure with steps, and the step end face of the stepped structure is flush with the molded top face of the plastic package body (3) so as to form contact seal.
2. Electronic package device according to claim 1, characterized in that the first terminal (4) comprises a first connection section (41) and a second connection section (42) connected to each other; the first connecting section (41) is embedded into the plastic package body (3), one end of the first connecting section (41) is connected to the lining plate (2), and the other end of the first connecting section is flush with the top surface of the plastic package body (3);
The radial dimension of the first connecting section (41) is greater than the radial dimension of the second connecting section (42);
The first connecting section (41) and the second connecting section (42) are coaxially connected to form the stepped structure, and a step of the stepped structure is positioned on the end face of the first connecting section (41) facing to one side of the second connecting section (42).
3. The electronic package device according to claim 2, wherein the first connection section (41) of the first terminal (4) is a connection body embedded in the plastic package body (3) and connected to the backing plate (2);
the second connecting section (42) is a pin connected between the connecting body and an external electric appliance;
The connecting body is of a sleeve structure, the outer diameter of one end of the pin, which is used for connecting the connecting body, is larger than the inner diameter of the connecting body, and the pin is embedded in the inner hole of the connecting body in an interference fit manner.
4. An electronic package according to claim 2 or 3, wherein one end of the first connection section (41) is formed with a connection portion for connection with the backing plate (2), the connection portion being a stepped structure formed along a radial extension of the first connection section (41);
after plastic packaging, the connecting part can resist and limit between the lining plate (2) and the plastic packaging body (3).
5. Electronic packaging device according to claim 1, characterized in that the first terminal (4) is an integrally formed stepped PIN.
6. Electronic package device according to claim 1, characterized in that the first terminals (4) are each arranged perpendicular to the backing plate (2).
7. An electronic package device according to any of claims 1-3, characterized in that the chips (1) are arranged in a plurality, the plurality of chips (1) being interconnected by copper bars (7); and/or the number of the groups of groups,
The chip (1) is welded on the lining board (2), and the chip and the lining board are interconnected through the copper bar (7).
8. -Electronic package device according to any of claims 1 to 3, further comprising a base plate (5) for supporting the mounting of the backing plate (2); the base plate (5) comprises a plate body (51) for supporting and mounting the lining plate (2), and pin fins (52) arranged on the plate body (51);
The heat generated by the chip (1) can sequentially pass through the lining plate (2), the plate body (51) and the pin fins (52) and exchange heat with the cooling liquid flowing through the pin fins (52).
9. The electronic package of any of claims 1-3, further comprising:
The second terminal (6) is of a sheet structure, one end of the second terminal (6) is welded on the lining plate (2), and the other end of the second terminal extends out of the lining plate (2) and the plastic package body (3) and is used for being connected with other electrical components outside the electronic package device.
10. A power module comprising the electronic package device of any one of claims 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323480207.7U CN222029076U (en) | 2023-12-19 | 2023-12-19 | Electronic packaging device and power module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323480207.7U CN222029076U (en) | 2023-12-19 | 2023-12-19 | Electronic packaging device and power module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN222029076U true CN222029076U (en) | 2024-11-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323480207.7U Active CN222029076U (en) | 2023-12-19 | 2023-12-19 | Electronic packaging device and power module |
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| Country | Link |
|---|---|
| CN (1) | CN222029076U (en) |
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2023
- 2023-12-19 CN CN202323480207.7U patent/CN222029076U/en active Active
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