CN222016933U

CN222016933U - Electronic devices

Info

Publication number: CN222016933U
Application number: CN202420328282.7U
Authority: CN
Inventors: 李伟; 于任斌; 周杰
Original assignee: Sungrow Power Supply Co Ltd
Current assignee: Sungrow Power Supply Co Ltd
Priority date: 2024-02-21
Filing date: 2024-02-21
Publication date: 2024-11-15
Anticipated expiration: 2034-02-21

Abstract

The application discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic device comprises a shell, an electronic component and a heat dissipation component. The casing is formed with the installation cavity, the casing still is provided with air intake and air outlet, electronic component installs in the installation cavity, electronic component includes the circuit board and installs in a plurality of electronic devices of circuit board, the guard portion is installed in the circuit board, so that the guard portion is suitable for and forms at least one sealed chamber with the circuit board between, at least one sealed chamber is arranged in holding a plurality of electronic devices, the radiating component is used for inhaling outside air from the air intake and discharges the air of installation intracavity from the air outlet, so, can effectively prevent pollutant invasion such as dust, moisture, harmful gas, thereby protect electronic device from corroding and damaging, the radiating component is through inhaling outside cold air and discharging inside hot air, the air cycle of installation intracavity has been promoted effectively, the radiating efficiency to electronic component is improved.

Description

Electronic equipment

Technical Field

The application belongs to the technical field of electronic equipment, and particularly relates to electronic equipment.

Background

The existing inverter/power equipment comprises various electronic devices, such as a PCB (printed circuit board), an IGBT (insulated Gate Bipolar transistor) module, a capacitor, a resistor, an inductor, a reactor and the like, and certain waterproof and dustproof properties are required because the devices are guaranteed to reliably operate, so that the devices are mostly placed in a closed cavity, and the cavity is called an electronic cavity. Because the electronic devices have impedance, the electronic devices can generate heat due to loss generated by passing current in the working process, and the devices are required to be radiated in order to avoid heat accumulation of equipment, so that the devices are lower than the allowable temperature. The existing electronic cavity mostly dissipates heat through natural conduction and radiation, or a turbulent fan is added inside to strengthen heat dissipation, and then an air-air heat exchanger and external ring temperature are adopted to indirectly exchange heat, but certain loss exists in heat exchange, and the heat exchange efficiency is still to be improved. And along with the continuous increase of the capacity of the existing inversion/power equipment, the heat flux density of devices in the electronic cavity is also increased, and the existing heat dissipation mode can not meet the heat dissipation requirement gradually.

Disclosure of utility model

The present application aims to solve at least one of the technical problems existing in the prior art. Therefore, the application provides the electronic equipment which can effectively prevent pollutants such as dust, moisture, harmful gas and the like from invading, thereby protecting electronic devices from corrosion and damage, and the heat dissipation component effectively promotes air circulation in the mounting cavity and improves heat dissipation efficiency of the electronic component by sucking external cold air and exhausting internal hot air.

In a first aspect, the present application provides an electronic device, comprising:

The shell is provided with an installation cavity, and the shell is also provided with an air inlet and an air outlet which are communicated with the shell;

An electronic assembly mounted within the mounting cavity, the electronic assembly including a circuit board and a plurality of electronic devices mounted to the circuit board;

A guard mounted to the circuit board such that the guard is adapted to form at least one sealed cavity with the circuit board, the at least one sealed cavity to house at least a portion of the plurality of electronic devices;

The heat dissipation assembly is arranged in the installation cavity and used for sucking outside air from the air inlet and discharging the air in the installation cavity from the air outlet.

According to the electronic equipment, at least one sealing cavity is formed between the protection part and the circuit board and is used for accommodating at least part of the electronic devices, so that the sealing cavity provides a space isolated from the external environment for the electronic devices, and pollutants such as dust, moisture and harmful gas are effectively prevented from invading, so that the electronic devices are protected from corrosion and damage, and the heat dissipation assembly effectively promotes air circulation in the installation cavity and improves heat dissipation efficiency of the electronic assembly by sucking external cold air and exhausting internal hot air.

According to an embodiment of the application, at least part of the inner wall surface of the at least one sealed cavity is in abutment with at least part of the outer wall surfaces of the plurality of electronic devices; and/or the number of the groups of groups,

The heat dissipation assembly comprises at least one heat dissipation fan, and the at least one heat dissipation fan is installed in the installation cavity close to at least one of the air inlet and the air outlet.

According to one embodiment of the application, the guard comprises a heat shrink film.

According to one embodiment of the application, at least part of the plurality of electronic devices comprises a first electronic device and a second electronic device, the first electronic device having a height greater than a height of the second electronic device;

The heat-shrinkable film comprises a first film region and a second film region, wherein the first film region corresponds to the first electronic device, and the second film region corresponds to the second electronic device, and the shrinkage ratio of the first film region is larger than that of the second film region.

According to one embodiment of the application, the guard is made of metal sheathing.

According to one embodiment of the application, the guard includes a contoured housing provided to house at least a portion of the plurality of electronic devices such that the contoured housing and the circuit board are adapted to form the sealed cavity therebetween.

According to one embodiment of the application, the profiling housing comprises a plurality of profiling housings corresponding to at least part of the plurality of electronic devices, an inner wall surface of each profiling housing being in contact with at least part of an outer wall surface of the corresponding electronic device; and/or the number of the groups of groups,

The profiling shell is provided with a metal profiling shell or a ceramic profiling shell.

According to one embodiment of the application, the electronic device further comprises a heat conducting part, wherein the heat conducting part is arranged between the protection part and the electronic device, and the heat conducting part is respectively attached to the inner wall surface of the protection part and the outer wall surface of the electronic device.

According to an embodiment of the present application, the heat conducting part is made of at least one of heat dissipation glue, heat conducting carbon paste and heat conducting silver paste.

According to one embodiment of the present application, the filter assembly is mounted to the housing, and is configured to filter air entering the housing to remove moisture and dust from the air.

Additional aspects and advantages of the application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the application.

Drawings

The foregoing and/or additional aspects and advantages of the application will become apparent and may be better understood from the following description of embodiments taken in conjunction with the accompanying drawings in which:

Fig. 1 is a schematic structural diagram of an electronic device according to an embodiment of the present application;

fig. 2 is a second schematic structural diagram of an electronic device according to an embodiment of the present application.

Reference numerals:

An electronic device 100;

the device comprises a shell 110, a mounting cavity 111, an air inlet 112 and an air outlet 113;

an electronic assembly 120, a circuit board 121, an electronic device 122;

Guard 130, contoured shroud 1311;

A heat dissipation assembly 140 and a heat dissipation fan 141;

a filter assembly 160;

Sealing the cavity a.

Detailed Description

Embodiments of the present application are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the application.

An electronic device 100 according to an embodiment of the application is described below with reference to fig. 1-2.

The electronic device 100 includes a housing 110, an electronic component 120, a protection portion 130, and a heat dissipation component 140.

The housing 110 is formed with a mounting cavity 111, and the housing 110 is further provided with an air inlet 112 and an air outlet 113 which are communicated with the housing 110, so that the design of the air inlet 112 and the air outlet 113 allows air to circulate inside and outside the housing 110, which is beneficial to heat dissipation. The mounting cavity 111 provides a relatively closed environment for internal components (e.g., circuit board 121, motor, sensor, etc.) that helps protect the components from external dust, moisture, physical impact, etc. The housing 110 may also be configured to reduce noise.

In other embodiments, the air inlet 112 and the air outlet 113 may be provided one or more, and in particular, the number and shape of the air inlet 112 and the air outlet 113 are not limited.

In addition, referring to fig. 1 and 2, the air inlet 112 and the air outlet 113 are disposed on two opposite side walls of the housing, so that the air inlet 112 and the air outlet 113 are respectively disposed on two opposite sides of the housing, which is helpful for forming a smooth air flow path. The layout can reduce vortex and dead angle of air in the shell, so that the air can pass through the air inlet 112 and the air outlet 113 more quickly and uniformly, and the heat dissipation effect is improved. The air inlet 112 and the air outlet 113 are arranged separately, so that hot air can be prevented from directly flowing back to the air inlet 112, and recirculation of the hot air is avoided. This helps to keep the temperature of the air entering the device low, thereby improving the heat dissipation efficiency. By separating the air inlet 112 from the air outlet 113, dust and other contaminants build up inside the device can be reduced. This arrangement helps to maintain cleanliness inside the device, reduce maintenance frequency and extend device life. The air inlet 112 and the air outlet 113 are located at opposite sides of the housing so that the filter assembly can be more conveniently cleaned and replaced when necessary. This design simplifies the maintenance work of the equipment and reduces the maintenance cost.

An electronic component 120 is mounted in the mounting cavity 111, and the electronic component 120 includes a circuit board 121 and a plurality of electronic devices 122 mounted on the circuit board 121, so that the mounting cavity 111 provides a relatively closed environment, and can protect the circuit board 121 and the electronic devices 122 from external dust, moisture, physical impact, and other adverse factors. This is critical to ensure long-term stable operation of the electronic device 100. The centralized mounting of the electronic components 120 within the mounting cavity 111 helps optimize the spatial layout of the device, resulting in a more compact overall structure. This not only can reduce the volume and weight of the electronic device 100, but also can help to improve portability and integrability of the electronic device 100. By mounting the electronic assembly 120 within the mounting cavity 111 provided with the air inlet 112 and the air outlet 113, a heat dissipation design of the electronic device 100 is facilitated. Air may circulate inside and outside the housing 110, carrying away heat generated by the electronics 122, ensuring that the electronic device 100 is not damaged or degraded by overheating. The design of the mounting cavity 111 may reduce electromagnetic interference (EMI) and leakage of electromagnetic radiation (EMR) to some extent, thereby improving electromagnetic compatibility of the electronic device 100. This is particularly important for electronic devices 100 that are required to meet certain electromagnetic compatibility standards. The centralized mounting of the electronic components 120 within the mounting cavity 111 facilitates the maintenance and upgrade of the equipment. By isolating the electronic assembly 120 from the external environment, the risk of air failure or damage to the electronic device 100 due to external factors (e.g., static electricity, chemical corrosion, etc.) may be reduced, thereby improving the safety of the electronic device 100. In addition, the overall aesthetic appearance of the electronic device 100 may also be improved.

The protecting part 130 is mounted on the circuit board 121, so that at least one sealed cavity a is formed between the protecting part 130 and the circuit board 121, and the sealed cavity a is used for accommodating at least part of the electronic devices 122, thus, the sealed cavity a provides a space isolated from the external environment for the electronic devices 122, and effectively prevents the invasion of pollutants such as dust, moisture, harmful gas and the like, thereby protecting the electronic devices 122 from corrosion and damage. Since the sealed cavity a reduces the influence of environmental factors on the electronic device 122, the overall reliability and stability of the electronic apparatus 100 can be improved. This is particularly important for devices that operate in harsh environmental conditions. Electromagnetic interference is reduced: the sealed cavity a may shield electromagnetic radiation to some extent, reducing electromagnetic interference (EMI) between the electronic devices 122, thereby improving electromagnetic compatibility of the apparatus. By centralizing portions of the electronics 122 within the sealed cavity a, the assembly process of the apparatus may be simplified and maintenance and replacement of these components may be facilitated. The sealed cavity a can prevent direct damage to the electronic device 122 due to accidental touch or external physical impact, thereby improving the safety of the electronic apparatus 100. By reducing the negative impact of environmental factors on the electronic devices 122, the sealed cavity a design helps to extend the useful life of these devices, thereby extending the service life of the overall apparatus. The sealed cavity a may also prevent external cold air from directly cooling the electronics 122, thereby reducing the risk of air formation of condensation.

The heat dissipation assembly 140 is installed in the installation cavity 111, and the heat dissipation assembly 140 is configured to suck external air from the air inlet 112 and exhaust air in the installation cavity 111 from the air outlet 113, so that the heat dissipation assembly 140 effectively promotes air circulation in the installation cavity 111 by sucking external cold air and exhausting internal hot air, and ensures that the temperature in the electronic device 100 is maintained within a safe and stable range, thereby preventing performance degradation or damage caused by overheating. Through continuous and effective heat dissipation, the operating temperature of the internal components of the electronic device 100 can be reduced, reducing thermal stress and thermal fatigue, and further extending the service life of the electronic components 120. The stable heat dissipation performance helps to reduce performance fluctuations of the electronic device 100 due to temperature variations, thereby improving overall stability and reliability of the electronic device 100. The design of the heat dissipating electronic component 120 can reduce energy consumption as much as possible while satisfying the heat dissipating requirement, and improve the energy efficiency ratio of the electronic device 100. The reasonable design of the air inlet and outlet 113, and the efficient heat dissipation electronic assembly 120, optimizes the air flow path and reduces turbulence and eddy currents, thereby reducing the noise level during operation of the electronic device 100. The heat dissipating electronic component 120 is integrated within the mounting cavity 111, which helps to save internal space of the electronic device 100, making the overall layout more compact and efficient.

According to the electronic apparatus 100 of the present application, since at least one sealing cavity a is formed between the protecting part 130 and the circuit board 121, the at least one sealing cavity a is used to accommodate at least a portion of the plurality of electronic components 122, and thus, the sealing cavity a provides a space for the electronic components 122 to be isolated from the external environment, and effectively prevents invasion of pollutants such as dust, moisture, harmful gases, etc., thereby protecting the electronic components 122 from corrosion and damage, and the heat dissipation assembly 140 effectively promotes air circulation in the mounting cavity 111 by sucking external cold air and exhausting internal hot air, and improves heat dissipation efficiency of the electronic components 120.

Referring to fig. 1 and 2, in an embodiment, at least a portion of the inner wall surface of the at least one sealed cavity a is in contact with at least a portion of the outer wall surfaces of the plurality of electronic devices 122, such that when the inner wall surface of the sealed cavity a is in close contact with the outer wall surfaces of the electronic devices 122, this helps to optimize the heat conduction path. The heat generated by the electronic device 122 in the working process can be more directly and rapidly transferred to the inner wall of the sealing cavity a through the contact surface, and further dissipated to the surrounding environment, so that the heat dissipation efficiency is improved. The close-fitting design helps to reduce the gap between the electronic device 122 and the inner wall of the sealed cavity a, thereby more efficiently utilizing the installation space. This helps to achieve compactness of the device internal layout, possibly helping to reduce the overall size of the electronic device 100 or increase the installation space of other functional components. The attachment design may provide some physical support for the electronics 122, enhancing its stability on the circuit board 121. This helps to reduce the risk of air dislodging or dislodging of the electronic device 122 due to external factors such as vibration, shock, etc. The closely attached design can enhance the shielding effect of the sealed cavity a on electromagnetic radiation to a certain extent. This is particularly important for electronic devices 100 that are required to meet certain electromagnetic compatibility standards, helping to reduce electromagnetic interference (EMI) between electronic devices 122.

Referring to fig. 1 and 2, in an embodiment, the heat dissipating assembly 140 includes at least one heat dissipating fan 141, and the at least one heat dissipating fan 141 is installed in the installation cavity 111 near at least one of the air inlet 112 and the air outlet 113, so that the heat dissipating fan 141 can actively suck external cold air and exhaust internal hot air, thereby accelerating the flow speed of air in the installation cavity 111, effectively improving heat dissipating efficiency, and ensuring that the temperature inside the electronic device 100 is controlled within a safe range. The heat radiation fan 141 is installed at a position close to the air inlet 112 or the air outlet 113, so that air flowing through the area can be guided and accelerated more directly, targeted heat radiation of a specific area is realized, and the heat radiation effect is optimized. The heat radiation fan 141 helps to reduce the influence of thermal stress and thermal fatigue on the electronic component 120 by reducing the operating temperature inside the electronic device 100, thereby extending the service life of the electronic device 100. The operation of the heat radiation fan 141 helps to maintain the stability of the internal temperature of the electronic device 100, reduce performance fluctuations due to temperature changes, and improve the overall stability and reliability of the electronic device 100. The heat radiation fan 141 is integrated in the mounting cavity 111, which contributes to saving the internal space of the electronic apparatus 100, making the overall layout more compact and efficient.

Referring to fig. 1, in one embodiment, the protecting part 130 includes a heat shrink film, and thus, the heat shrink film has excellent physical and chemical stability, and can effectively insulate an external environment from an apparatus or a product. It can prevent moisture, dust and corrosion, has a certain buffer function, and can reduce damage to the electronic device 122 caused by external impact. The heat shrink film has excellent flexibility and stretchability and can accommodate electronic devices 122 of various shapes and sizes. So that the heat shrink film can be tightly adhered to the surface of the electronic device 122, whether it is a regular or irregular shape, providing overall protection. The heat shrink film shrinks and tightly wraps around the electronic device 122 after heating, which makes it very easy to handle and apply. By using the heat shrinkage film, the packaging process can be simplified, and the production efficiency can be improved. The heat shrink film generally has transparent or translucent characteristics that clearly show the appearance and details of the electronic device 122. This not only facilitates identification of the electronic device 122. The use of heat shrink film can reduce production cost.

It should be noted that, when the heat shrinkage film is applied on the surface of the electronic device and tightened, a larger gap exists in the heat shrinkage film supported between the electronic device and the electronic device, and a heated profiling tool (profiling is a shape of a gap between the electronic device) can be adopted to compress the outer side of the heat shrinkage film, so that the gap between the electronic device and the heat shrinkage film is reduced, and the heat dissipation effect is improved.

In an embodiment, at least a portion of the plurality of electronic devices 122 includes a first electronic device 122 and a second electronic device 122, the first electronic device 122 has a height greater than a height of the second electronic device 122, the heat shrink film includes a first film region corresponding to the first electronic device 122 and a second film region corresponding to the second electronic device 122, wherein the shrinkage ratio of the first film region is greater than the shrinkage ratio of the second film region, such that the use of heat shrink film regions of different shrinkage ratios ensures that each electronic device 122 is properly wrapped and protected due to the different heights of the electronic devices 122. The first film region has a larger shrinkage ratio and can be closely attached to the first electronic device 122, while the second film region is adapted to the size of the second electronic device 122. By adjusting the shrink ratio of the different film regions, it can be ensured that each electronic device 122 is subjected to a uniform and appropriate pressure, thereby providing optimized physical protection. This is particularly important to prevent damage to the electronics 122 from external shock, vibration or friction. The packaging requirements of electronic devices 122 with different heights can be met by using a single heat shrinkage film, and the replacement of packaging materials with different sizes in the production process is avoided, so that the production flow is simplified, and the production efficiency is improved. By precisely controlling the shrink ratios of the different film regions, the appearance of the final electronic component 120 can be ensured to be neat and consistent, and the aesthetic degree and the professional feel of the electronic component 120 can be improved.

In one embodiment, the guard 130 is made of a metal sheathing, and thus, the metal sheathing has excellent strength and rigidity, and is effective against external impact, vibration and compression, providing a solid mechanical protection for the electronic components 122 inside. The metal material has excellent electromagnetic shielding performance and can effectively block external electromagnetic interference (EMI) and Radio Frequency Interference (RFI), thereby protecting the internal electronics 122 from electromagnetic influence and ensuring normal operation of the electronic apparatus 100. Metal is a good thermal conductor and the metal cover plate can rapidly conduct internally generated heat to the outside, helping to dissipate heat and prevent the electronic device 100 from overheating. The metal sheathing has excellent chemical stability and corrosion resistance, and is resistant to corrosion by various severe environmental conditions such as humidity, salt, chemicals, etc., thereby ensuring long-term stable operation of the electronic device 100. The metal sheathing panels may be easily customized and modified by stamping, cutting, bending, etc. to accommodate the shape and size requirements of different electronic devices 100. The metal cover plate has unique appearance and texture, can improve the overall aesthetic degree and grade sense of the electronic equipment 100, and meets the aesthetic requirement of modern consumers on the appearance of the product. The metal material has good recoverability, meets the requirements of environmental protection and sustainable development, and is beneficial to reducing resource waste and environmental pollution.

It should be noted that the metal sheathing is typically a sheet material formed by compounding one or more metal sheets with other materials (e.g., insulating materials, adhesives, etc.). Its composition may vary according to the application requirements, but the sheet metal is an integral part thereof. Common metal materials include aluminum, copper, steel, etc., which have good heat conducting properties. The metal sheathing mainly relies on sheet metal to effect heat transfer. Free electrons within the metal can move freely under the influence of a thermal field, rapidly transferring heat from one region to another. This way of conducting heat allows the metal to have a high thermal conductivity and to conduct heat quickly and efficiently. The interfacial thermal resistance between the sheet metal and other materials (e.g., insulating materials) also affects the overall thermal conductivity. In order to reduce the interfacial thermal resistance, measures such as increasing the thickness of the metal sheet, increasing the contact area between the metal and the insulating material, etc. are generally taken.

Referring to fig. 2, in an embodiment, the protecting portion 130 includes a profiling housing, where at least a portion of the plurality of electronic devices 122 is covered by the profiling housing, so that the sealing cavity a is adapted to be formed between the profiling housing and the circuit board 121, and thus the profiling housing provides an additional protective barrier for the electronic devices 122, and effectively prevents harmful substances such as external impurities, moisture, dust, etc. from penetrating into the sealing cavity a, thereby protecting the electronic devices 122 from damage. By forming a sealed cavity a between the contoured housing and the circuit board 121, air flow can be controlled and directed, helping to optimize the heat dissipation path, improve heat dissipation efficiency, and ensure that the electronic device 122 operates within a suitable temperature range. The contoured housing may act as part of an electromagnetic shield to reduce interference of external electromagnetic fields with the electronic device 122, while also helping to prevent electromagnetic radiation generated by the electronic device 122 from leaking into the external environment, improving electromagnetic compatibility of the electronic device 100. The design of the profiling shell can increase the stability of the whole structure and reduce the damage risk of the electronic equipment 100 caused by external forces such as vibration, impact and the like in the transportation and use processes. The contoured housing shape matches the electronics 122, simplifying the assembly process and reducing installation errors. The compact design of the contoured housing helps to conserve device interior space, make the overall layout more rational and efficient, and helps to achieve miniaturization or integration of the electronic device 100.

It should be noted that the shape and size of the contoured housing may be customized to the specific electronics 122 and application requirements, providing greater design flexibility and personalized options. The application is not limited to the specific shape and size of the contoured housing.

In one embodiment, the profiling housing includes a plurality of profiling housings 1311, the plurality of profiling housings 1311 corresponding to at least a portion of the plurality of electronic devices 122, an inner wall surface of each profiling housing 1311 abutting at least a portion of an outer wall surface of a corresponding electronic device 122, such that precise and effective protection of the corresponding electronic device 122 may be ensured by designing the corresponding profiling housing 1311 for at least a portion of the plurality of electronic devices 122. This targeted design helps to reduce the risk of damage due to external shock, vibration or environmental factors. The abutting design of the contoured cover 1311 to the outer wall of the electronic device 122 helps optimize the heat conduction path. The heat generated by the electronics 122 may be transferred more directly to the contoured housing 1311 through the contact surface and effectively dissipated, thereby improving heat dissipation efficiency. Because the contoured cover 1311 is tailored to the shape and size of the electronics 122, space waste can be minimized, making the internal layout of the electronic device 100 more compact and efficient. The design of the contoured cover 1311 may make the assembly process more intuitive and simplified, as they correspond directly to a particular electronic device 122. At the same time, this also facilitates the disassembly and maintenance work of the device. The close-fitting design of the contoured housing 1311 may enhance shielding against electromagnetic interference (EMI) to some extent. If a particular electronic device 122 needs to be repaired or replaced, the corresponding profiling housing 1311 is only opened without disassembling the entire profiling housing 1311, thereby greatly improving maintainability of the electronic device 100.

In one embodiment, the contoured case 1311 is configured as a metallic or ceramic contoured case 1311, 1311 such that the metallic contoured case 1311 has excellent strength and rigidity to effectively resist external shock and vibration and provide solid mechanical protection to the internal electronics 122. The metallic profiling housing 1311 is capable of effectively blocking external electromagnetic interference (EMI) and Radio Frequency Interference (RFI), protecting the internal electronics 122 from electromagnetic interference. The metal profiling cover 1311 can quickly conduct heat generated inside to the outside, and helps to dissipate heat and prevent overheating of the device. The metal profiling cover 1311 is simple to process. The ceramic profiling cover 1311 has excellent high temperature stability, can maintain structural and performance stability in a high temperature environment, and is suitable for the electronic device 100 in a high temperature working environment. The ceramic profiling cover 1311 can effectively isolate the electronic device 122 from the outside, and improve the safety and reliability of the apparatus. The ceramic profiling cover 1311 has good stability to most chemicals, is not susceptible to corrosion and erosion, and can protect the internal electronics 122 in harsh chemical environments. The ceramic profiling cover 1311 helps reduce the overall weight of the electronic device 100.

In an embodiment, the electronic apparatus 100 further includes a heat conducting portion, where the heat conducting portion is disposed between the protecting portion 130 and the electronic device 122, and the heat conducting portion is respectively attached to an inner wall surface of the protecting portion 130 and an outer wall surface of the electronic device 122, so that the design of the heat conducting portion significantly improves the conduction efficiency of heat from the electronic device 122 to the protecting portion 130. Since the heat conducting portion is closely attached to both the electronic device 122 and the shielding portion 130, heat can be more quickly and directly transferred, thereby preventing accumulation of heat inside the electronic apparatus 100. By effectively dissipating heat, the thermally conductive portion helps maintain the electronic device 122 within a suitable operating temperature range, reducing the risk of performance degradation or damage due to overheating. The optimized thermal management not only protects the electronics 122, but also helps to extend the lifetime of the overall electronic device 100. The heat conductive portion contributes to improving the overall stability and reliability of the electronic device 100 by reducing temperature fluctuations and hot spot formation. The integrated design of the thermally conductive section may simplify the overall design and manufacturing process of the electronic device 100, reducing the number of components and assembly complexity. The heat conducting part can provide stable heat dissipation performance under various environmental conditions (including high and low temperature, humidity change and the like), and the environmental adaptability of the electronic device 100 is enhanced.

In an embodiment, the material of the heat conducting part includes at least one of heat dissipating glue, heat conducting carbon paste and heat conducting silver paste, so that these materials (heat dissipating glue, heat conducting carbon paste and heat conducting silver paste) are all excellent heat conductors, and can quickly and effectively conduct the heat generated by the electronic device 122 to the protecting part 130, so as to prevent the heat from accumulating inside the electronic device 100, thereby maintaining the electronic device 122 in a suitable operating temperature range. These thermally conductive materials generally have good flowability and workability, and are convenient to coat, fill, or mold during the manufacturing process, thereby simplifying the production process and improving the production efficiency. The materials such as the heat-conducting carbon paste and the heat-conducting silver paste can provide good heat-conducting performance, and meanwhile, can also keep stable electrical performance, so that the influence on the electrical performance of the electronic equipment 100 is reduced. By using relatively common heat conducting materials such as heat dissipating glue, heat conducting carbon paste or heat conducting silver paste, the production cost can be reduced to a certain extent, and the materials are also generally easy to obtain and maintain. The optimized thermal management design helps to reduce failures and performance degradation of the electronic device 100 due to overheating, thereby improving the reliability and operational life of the electronic device 100.

It should be noted that the heat conductive silver paste is a special paste, and mainly comprises silver powder, an organic solvent and a surfactant. Silver powder is the main component of the heat-conducting silver paste, and has good electric conductivity and heat-conducting property. The organic solvent is used for adjusting the viscosity and fluidity of the silver paste so as to be uniformly coated on the surface of the substrate in the preparation process. The surfactant is used for stabilizing the dispersion state of silver particles and preventing aggregation. The heat conduction principle of the heat conduction silver paste mainly depends on the high heat conduction property of silver powder. Silver is an excellent heat conducting material with high thermal conductivity. In thermally conductive silver pastes, the silver powder is present in the form of particles, which particles form a thermally conductive network in the paste. When heat is transferred through the heat-conducting silver paste, the silver particles can rapidly conduct the heat to the whole paste, so that rapid heat dissipation is realized. In addition, the heat conducting performance of the heat conducting silver paste is also influenced by factors such as silver powder content, particle size, dispersion state and the like. In order to improve the heat conductive property, the content of silver powder is generally increased, and the particle size and dispersion state are optimized. Meanwhile, the heat conducting performance of the heat conducting silver paste can be further improved by adding other heat conducting fillers or auxiliary agents.

The heat conducting carbon slurry is one kind of composite material comprising carbon base nanometer material, solvent, assistant, etc. The carbon-based nano materials have excellent heat conduction performance and can rapidly transfer heat. The heat conduction principle of the heat conduction carbon paste is mainly based on the heat conduction mechanism of the carbon-based nanomaterial. Carbon-based nanomaterials such as carbon nanotubes and graphene have very high thermal conductivities, which can efficiently conduct heat from one region to another. In the heat-conducting carbon paste, the carbon-based nano materials form heat-conducting networks, and when heat is transferred through the carbon paste, the heat-conducting networks can rapidly disperse and conduct the heat into the whole carbon paste, so that rapid heat dissipation is realized. In addition, the heat conducting performance of the heat conducting carbon slurry is also influenced by the content, the dispersion state and the interaction with solvents and other auxiliary agents of the carbon-based nano materials. In order to improve the heat conducting property, the content and the dispersion state of the carbon-based nanomaterial can be optimized, and proper solvents and auxiliaries can be selected.

Heat-dissipating glue, also known as heat-conducting glue or thermal interface material, is a material specifically designed to enhance the heat dissipation of electronic device 100. It is typically applied between a heating element (e.g., CPU, GPU, etc.) and a heat sink to fill the small gap between them and to efficiently transfer heat. The heat-dissipating glue mainly comprises a base polymer, a heat-conducting filler and other additives. The base polymer is the main component of the gel, which provides tackiness and plasticity to the gel so that the heat-dissipating gel can be easily applied to the component requiring heat dissipation. The heat conductive filler is a key component in the heat-dissipating glue, and is generally made of a material with high heat-conducting property, such as metal oxide, carbon material (e.g. graphite, carbon fiber), heat conductive ceramic (e.g. alumina, boron nitride) or nano material (e.g. carbon nano tube, nano graphene sheet). These fillers form a thermally conductive network in the gel, effectively transferring heat. Other additives may include chemicals for adjusting viscosity, improving wettability, enhancing adhesion, or providing electrical insulation properties. The heat conduction principle of the heat dissipation glue is mainly realized by the heat conduction filler inside the heat dissipation glue. When the heating element generates heat, the heat-conducting filler in the heat-dissipating glue can quickly absorb and transfer the heat. Due to the continuous thermally conductive network formed between the thermally conductive fillers, heat can be rapidly transferred to the heat sink through these networks and then dissipated by the heat sink to the surrounding environment. In this way, the heat dissipation glue can effectively reduce the working temperature of the heating element and improve the heat dissipation performance of the whole electronic device 100.

Referring to fig. 1 and 2, in an embodiment, the electronic device 100 further includes a filter assembly 160, where the filter assembly 160 is mounted on the housing 110, and the filter assembly 160 is configured to filter the air entering the housing 110 to remove moisture and dust in the air, so that the filter assembly 160 effectively blocks contaminants such as moisture and dust in the air from entering the interior of the device, thereby reducing potential damage to the electronic device 122 by the contaminants. This helps to maintain the performance and extend the useful life of the electronic device 122. By reducing the effects of external contaminants, the filter assembly 160 helps to maintain the cleanliness and dryness of the device's internal environment, thereby improving the overall stability and reliability of the electronic device 100. Because the filter assembly 160 reduces the chance of contaminants entering the equipment, the frequency of cleaning and maintenance of the equipment may be reduced, thereby reducing maintenance costs and effort. While the primary purpose of the filter assembly 160 is to filter air, it may also direct and optimize air flow to some extent, helping to the heat dissipation design of the device. The filter assembly 160 is capable of operating in a variety of environmental conditions, particularly in dusty, high humidity environments, and is effective in protecting equipment from these adverse factors. The filter assembly 160 indirectly extends the useful life of the overall apparatus while reducing equipment failure and maintenance requirements.

It should be noted that the filter assembly 160 may include a combination filter, which is a device that integrates multiple filtering functions, and generally includes a particulate filter for removing dust and a desiccant or hygroscopic layer for absorbing moisture. The filter can remove dust and moisture in the air at the same time through physical interception, adsorption and moisture absorption. The technology of the combined filter is mature, and the application is not limited to this.

The terms first, second and the like in the description and in the claims, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used may be interchanged, as appropriate, such that embodiments of the present application may be implemented in sequences other than those illustrated or described herein, and that the objects identified by "first," "second," etc. are generally of a type, and are not limited to the number of objects, such as the first object may be one or more. Furthermore, in the description and claims, "and/or" means at least one of the connected objects, and the character "/", generally means that the associated object is an "or" relationship.

In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present application and simplifying the description, and do not indicate or imply that the device or element being referred to must have a specific orientation, be configured and operated in a specific orientation, and therefore should not be construed as limiting the present application.

In the description of the application, a "first feature" or "second feature" may include one or more of such features.

In the description of the present application, "plurality" means two or more.

In the description of the application, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, and may also include the first and second features not being in direct contact but being in contact with each other by another feature therebetween.

In the description of the application, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature.

In the description of the present specification, reference to the terms "one embodiment," "some embodiments," "illustrative embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the application. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present application have been shown and described, it will be understood by those of ordinary skill in the art that: many changes, modifications, substitutions and variations may be made to the embodiments without departing from the spirit and principles of the application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, comprising:

A housing is formed with a mounting cavity, and the housing is further provided with an air inlet and an air outlet communicated with the housing;

An electronic assembly is installed in the installation cavity, wherein the electronic assembly includes a circuit board and a plurality of electronic devices installed on the circuit board;

a protection portion, the protection portion being mounted on the circuit board so that the protection portion is suitable for forming at least one sealed cavity between the protection portion and the circuit board, the at least one sealed cavity being used to accommodate at least part of the plurality of electronic devices;

A heat dissipation component is installed in the installation cavity, and is used to suck in external air from the air inlet and discharge the air in the installation cavity from the air outlet.

2. The electronic device according to claim 1, characterized in that at least part of the inner wall surface of the at least one sealed cavity is in contact with at least part of the outer wall surfaces of the plurality of electronic devices; and/or,

The heat dissipation assembly includes at least one heat dissipation fan, and the installation cavity is provided with the at least one heat dissipation fan near at least one of the air inlet and the air outlet.

3 . The electronic device according to claim 1 , wherein the protective portion comprises a heat shrink film.

4. The electronic device according to claim 3, characterized in that at least part of the plurality of electronic devices comprises a first electronic device and a second electronic device, and a height of the first electronic device is greater than a height of the second electronic device;

The heat shrinkable film includes a first film region and a second film region, the first film region corresponds to the first electronic device, the second film region corresponds to the second electronic device, wherein the shrinkage ratio of the first film region is greater than that of the second film region.

5 . The electronic device according to claim 1 , wherein the protective portion is made of a metal cladding plate.

6. The electronic device according to claim 1, characterized in that the protection part comprises a contoured shell, and the contoured shell is arranged to cover at least part of the plurality of electronic devices so that the sealed cavity is formed between the contoured shell and the circuit board.

7. The electronic device according to claim 6, characterized in that the contoured housing comprises a plurality of contoured covers, the plurality of contoured covers correspond to at least part of the plurality of electronic devices, and the inner wall surface of each of the contoured covers is at least partially in contact with the outer wall surface of the corresponding electronic device; and/or,

The contoured housing is configured as a metal contoured housing or a ceramic contoured housing.

8. The electronic device according to any one of claims 1 to 7, further comprising a heat conducting portion, wherein the heat conducting portion is disposed between the protective portion and the electronic device, and the heat conducting portion is in contact with an inner wall surface of the protective portion and an outer wall surface of the electronic device, respectively.

9 . The electronic device according to claim 8 , wherein the heat conducting part is made of at least one of heat dissipation glue, heat conductive carbon paste and heat conductive silver paste.

10. The electronic device according to any one of claims 1 to 7, further comprising a filter assembly, wherein the filter assembly is mounted on the housing, and the filter assembly is used to filter the air entering the housing to remove moisture and dust in the air.