CN221993864U

CN221993864U - Low energy consumption motherboard and industrial computer

Info

Publication number: CN221993864U
Application number: CN202420605832.5U
Authority: CN
Inventors: 王军; 仲少佳
Original assignee: Suzhou Haite Automation Equipment Co ltd
Current assignee: Suzhou Haite Automation Equipment Co ltd
Priority date: 2024-03-27
Filing date: 2024-03-27
Publication date: 2024-11-12
Anticipated expiration: 2034-03-27

Abstract

The utility model provides a low-energy consumption main board, which comprises a main board body, wherein a CPU module is arranged at the top of the main board body, and a heat conduction module is assembled at the top of the CPU module; the heat conduction module is provided with a bottom plate, the bottom plate is assembled and arranged at the top of the CPU module, the bottom of the bottom plate is abutted against the top of the CPU module, a heat conduction support is fixedly arranged at the top of the bottom plate, slots are uniformly formed in the heat conduction support, and elastic heat conduction pieces are arranged in the slots; in the utility model, the top cover of the industrial personal computer is contacted with the elastic heat conducting fin, and the heat generated by the CPU module is transferred to the top cover provided with the heat radiating fin outside through the bottom plate, the heat conducting support and the elastic heat conducting piece, so that the heat of heating parts such as the CPU is radiated outwards, and the purpose of radiating is achieved; the thickness of the heat conduction module can be adjusted according to the distance between the main board body and the top cover, and the miniaturized design of the industrial personal computer is facilitated.

Description

Low-energy consumption mainboard and industrial personal computer

Technical Field

The utility model belongs to the technical field of industrial personal computers, and particularly relates to a low-energy-consumption main board and an industrial personal computer.

Background

In the field of industrial control, an industrial personal computer usually needs to operate for a long time, and if the energy consumption is too high, the problems of heating, temperature rise and the like of the industrial personal computer are caused, so that the existing industrial personal computer main board mostly adopts a low-energy-consumption design, and the heat generated in the operation process can be reduced.

Because the heat generated by the low-energy-consumption main board is small, components such as a fan and the like do not need to be additionally arranged to dissipate heat, and the housing of the industrial personal computer is used for dissipating heat generally, but the heat transfer is generally carried out between the components such as the CPU and the like which are easy to generate heat and the housing through air, so that the heat conduction effect is poor, and the heat generated by the components such as the CPU and the like which are easy to generate heat cannot be guided to the housing in time and can be dissipated outwards through the housing.

In the prior art, the Chinese patent document with the authorized bulletin number of CN219122645U discloses a low-power-consumption industrial control main board, wherein the low-power-consumption industrial control main board is provided with a double-layer structure on a radiating module part, and radiating areas are provided at the bottom and the top of a substrate, so that the power consumption requirement on a radiating fan is reduced by enlarging the radiating area; however, the double-layer structure design occupies a larger space, which is unfavorable for the miniaturization design of the industrial personal computer.

Therefore, a miniaturized design beneficial to heat transfer of heat generating components such as a CPU to a housing for heat dissipation needs to be designed, so as to solve the technical problems faced at present.

Disclosure of Invention

Aiming at the defects existing in the prior art, the utility model provides a low-energy-consumption main board and an industrial personal computer which are beneficial to the miniaturization design of the industrial personal computer and the heat transfer of heating components such as a CPU (Central processing Unit) and the like to a shell for heat dissipation.

The technical scheme of the utility model is as follows: the low-energy-consumption main board comprises a main board body, wherein a CPU module is arranged at the top of the main board body, and a heat conduction module is assembled at the top of the CPU module; the heat conduction module is provided with a bottom plate, the bottom plate is assembled and arranged at the top of the CPU module, the bottom of the bottom plate is in butt joint with the top of the CPU module, a heat conduction support is fixedly arranged at the top of the bottom plate, slots are uniformly formed in the heat conduction support, and elastic heat conduction pieces are arranged in the slots.

The elastic heat conduction piece is of an inverted U-shaped structure, and two ends of the elastic heat conduction piece are inserted into the slots at the top of the heat conduction support in an interference manner.

The inside of the elastic heat conduction piece is provided with an elastic support piece with an inverted U-shaped structure, and the outer side of the elastic support piece is coated with a heat conduction sleeve.

The bottom of bottom plate is fixed and is provided with the heat conduction gasket, the bottom of bottom plate be provided with the recess that the heat conduction gasket matees, the heat conduction gasket is fixed to be set up the inside of recess.

The bottom plate is rectangular plate body structure, the four corners department of bottom plate all is provided with the elastic assembly spare.

The elastic assembly part is provided with a supporting cylinder fixedly arranged at the top of the bottom plate, a backing ring is slidably arranged in the supporting cylinder, a blocking edge corresponding to the backing ring is fixedly arranged at the top of the supporting cylinder, and a spring is arranged between the backing ring and the bottom plate.

An industrial personal computer comprising the low-energy motherboard of any one of the above.

The utility model has the beneficial effects that: in the utility model, one surface of the main board body with the CPU module is upwards placed in the industrial personal computer, when the top cover of the industrial personal computer is covered on the top of the industrial personal computer, the top cover of the industrial personal computer is contacted with the elastic heat conducting fin, and the heat generated by the CPU module is transferred to the top cover provided with the heat radiating fins outside through the bottom plate, the heat conducting support and the elastic heat conducting piece, so that the heat of heating components such as the CPU is radiated outwards, and the purpose of heat radiation is achieved; the thickness of the heat conduction module can be adjusted according to the distance between the main board body and the top cover, and the miniaturized design of the industrial personal computer is facilitated.

Drawings

Fig. 1 is a schematic structural diagram of a low-power motherboard according to the present utility model.

Fig. 2 is a schematic structural diagram of a heat conduction module according to the present utility model.

FIG. 3 is a second schematic diagram of the heat conduction module according to the present utility model.

Fig. 4 is a schematic structural view of an elastic heat conductive member according to the present utility model.

Fig. 5 is a schematic view of the structure of the elastic assembly of the present utility model.

Detailed Description

Various exemplary embodiments of the present utility model will now be described in detail with reference to the accompanying drawings. The description of the exemplary embodiments is merely illustrative, and is in no way intended to limit the utility model, its application, or uses. The present utility model may be embodied in many different forms and is not limited to the embodiments described herein. These embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the utility model to those skilled in the art. It should be noted that: the relative arrangement of parts and steps, the composition of materials, numerical expressions and numerical values set forth in these embodiments should be construed as exemplary only and not limiting unless otherwise specifically stated.

The terms "first," "second," and the like, as used herein do not denote any order, quantity, or importance, but rather are used to distinguish one element from another. The word "comprising" or "comprises" and the like means that elements preceding the word encompass the elements recited after the word, and not exclude the possibility of also encompassing other elements. "upper", "lower", "left", "right", etc. are used merely to indicate relative positional relationships, which may also be changed when the absolute position of the object to be described is changed.

As shown in fig. 1 and 2, the low-energy consumption motherboard comprises a motherboard body 1, wherein a CPU module 2 is arranged at the top of the motherboard body 1, a heat conduction module 3 is assembled at the top of the CPU module 2, four corners of the CPU module 2 in the prior art are provided with internal thread structures, and the heat conduction module 3 can be assembled at the top of the CPU module 2 by matching the internal thread structures with bolts; the heat conduction module 3 is provided with a bottom plate 31, the bottom plate 31 is assembled and arranged at the top of the CPU module 2, the bottom of the bottom plate 31 is abutted to the top of the CPU module 2, a heat conduction support 33 is fixedly arranged at the top of the bottom plate 31, slots 34 are uniformly formed in the heat conduction support 33, and elastic heat conduction pieces 35 are arranged in the slots 34; in this embodiment, the side of the main board body 1 with the CPU module 2 is placed in the industrial personal computer housing, and when the top cover of the industrial personal computer is covered on the top of the industrial personal computer housing, the top cover of the industrial personal computer contacts with the elastic heat conducting sheet 35, and the heat generated by the CPU module 2 is transferred to the top cover provided with the heat radiating fins outside through the bottom board 1, the heat conducting support 33 and the elastic heat conducting member 35, so that the heat of the heat generating components such as the CPU is radiated outwards, and the purpose of heat radiation is achieved; the thickness of the heat conduction module 3 can be adjusted according to the distance between the main board body 1 and the top cover, which is beneficial to the miniaturized design of the industrial personal computer.

In some embodiments, the bottom plate 31 and the heat conducting support 33 are made of a material with good heat conductivity, such as copper or aluminum alloy.

In some embodiments, as shown in fig. 2, the elastic heat conducting member 35 has an inverted U-shaped structure, two ends of the elastic heat conducting member 35 are inserted into the slot 34 at the top of the heat conducting support 33 in an interference manner, two ends of the elastic heat conducting member 35 are inserted into the heat conducting support 33 in an interference manner, and the connection is tight, so that the heat conducting effect is ensured.

In some embodiments, as shown in fig. 4, the elastic heat conducting member 35 has an elastic supporting member 351 with an inverted U-shaped structure, the outside of the elastic supporting member 351 is covered with a heat conducting sleeve 352, the heat conducting sleeve 352 is a heat conducting silica gel sheet sleeved on the outside of the elastic supporting member 351, and the elastic supporting member 351 can adopt an elastic copper sheet.

In some embodiments, as shown in fig. 3, a heat-conducting gasket 36 is fixedly arranged at the bottom of the bottom plate 31, a groove matched with the heat-conducting gasket 36 is arranged at the bottom of the bottom plate 31, the heat-conducting gasket 36 is fixedly arranged in the groove, and the heat-conducting gasket 36 has certain elasticity, so that the contact area with the top of the CPU module 2 is ensured, and the heat-conducting effect is ensured; specifically, the thermally conductive pad 36 is a thermally conductive silicone sheet.

In some embodiments, as shown in fig. 2, the bottom plate 31 is in a rectangular plate structure, four corners of the bottom plate 31 are respectively provided with an elastic assembly 32, the bottom plate 31 is assembled and fixed on the main board body 1 by bolts in the elastic assembly 32, and the bottom plate 31 is elastically acted on the top of the CPU module 2, so that the heat conduction module 3 and the CPU module 2 are kept in close contact.

In some embodiments, as shown in fig. 5, the elastic assembly 32 has a supporting cylinder 321 fixedly arranged at the top of the bottom plate 31, a backing ring 323 is slidably arranged in the supporting cylinder 321, a blocking edge 322 corresponding to the backing ring 323 is fixedly arranged at the top of the supporting cylinder 321, a spring 324 is arranged between the backing ring 323 and the bottom plate 31, when the heat conduction module 3 is fixed on the CPU module 2, a bolt is inserted into the backing ring 323, penetrates through the bottom plate 31 and is connected with an internal thread structure of the CPU module 2, the bolt pushes the backing ring 323 to move downwards, and the spring 324 is compressed, so that the heat conduction module 3 and the CPU module 2 keep close to each other by the elasticity of the spring 324.

In some embodiments, an industrial personal computer is disclosed, including a low-power motherboard as in any of the embodiments above.

Thus, various embodiments of the present utility model have been described in detail. In order to avoid obscuring the concepts of the utility model, some details known in the art have not been described. How to implement the solutions disclosed herein will be fully apparent to those skilled in the art from the above description.

The above examples only represent some embodiments of the utility model, which are described in more detail and are not to be construed as limiting the scope of the utility model. It should be noted that it will be apparent to those skilled in the art that several variations and modifications can be made without departing from the spirit of the utility model, which are all within the scope of the utility model. Accordingly, the scope of protection of the present utility model is to be determined by the appended claims.

Claims

1. The utility model provides a low energy consumption mainboard which characterized in that: the CPU module is assembled at the top of the main board body and provided with a heat conduction module;

The heat conduction module is provided with a bottom plate, the bottom plate is assembled and arranged at the top of the CPU module, the bottom of the bottom plate is in butt joint with the top of the CPU module, a heat conduction support is fixedly arranged at the top of the bottom plate, slots are uniformly formed in the heat conduction support, and elastic heat conduction pieces are arranged in the slots.

2. The low-power motherboard of claim 1, wherein: the elastic heat conduction piece is of an inverted U-shaped structure, and two ends of the elastic heat conduction piece are inserted into the slots at the top of the heat conduction support in an interference manner.

3. The low-power motherboard of claim 2, wherein: the inside of the elastic heat conduction piece is provided with an elastic support piece with an inverted U-shaped structure, and the outer side of the elastic support piece is coated with a heat conduction sleeve.

4. The low-power motherboard of claim 1, wherein: the bottom of bottom plate is fixed and is provided with the heat conduction gasket, the bottom of bottom plate be provided with the recess that the heat conduction gasket matees, the heat conduction gasket is fixed to be set up the inside of recess.

5. The low-power motherboard of claim 1, wherein: the bottom plate is rectangular plate body structure, the four corners department of bottom plate all is provided with the elastic assembly spare.

6. The low-power motherboard of claim 5, wherein: the elastic assembly part is provided with a supporting cylinder fixedly arranged at the top of the bottom plate, a backing ring is slidably arranged in the supporting cylinder, a blocking edge corresponding to the backing ring is fixedly arranged at the top of the supporting cylinder, and a spring is arranged between the backing ring and the bottom plate.

7. An industrial personal computer, which is characterized in that: comprising a low-power motherboard according to any of claims 1 to 6.