CN221993834U - Compound radiating server - Google Patents
Compound radiating server Download PDFInfo
- Publication number
- CN221993834U CN221993834U CN202323449286.5U CN202323449286U CN221993834U CN 221993834 U CN221993834 U CN 221993834U CN 202323449286 U CN202323449286 U CN 202323449286U CN 221993834 U CN221993834 U CN 221993834U
- Authority
- CN
- China
- Prior art keywords
- plate
- heat dissipation
- slot
- hard disk
- semiconductor refrigeration
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 150000001875 compounds Chemical class 0.000 title abstract description 8
- 239000004065 semiconductor Substances 0.000 claims abstract description 54
- 238000005057 refrigeration Methods 0.000 claims abstract description 53
- 230000017525 heat dissipation Effects 0.000 claims abstract description 49
- 238000001816 cooling Methods 0.000 claims abstract description 40
- 239000007788 liquid Substances 0.000 claims abstract description 32
- 239000002131 composite material Substances 0.000 claims abstract description 15
- 238000005192 partition Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000005679 Peltier effect Effects 0.000 description 1
- 239000000110 cooling liquid Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 230000001737 promoting effect Effects 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The embodiment of the utility model discloses a compound heat dissipation server, which comprises a slot shell, wherein the slot shell encloses a hard disk slot for inserting and placing a hard disk, the slot shell comprises a semiconductor refrigeration plate and a liquid cooling heat dissipation plate, the cold end of the semiconductor refrigeration plate faces the hard disk slot, and the hot end of the semiconductor refrigeration plate is attached to the liquid cooling heat dissipation plate. The composite heat dissipation server combines the semiconductor refrigeration plate and the liquid cooling heat dissipation plate to form a new slot shell, when the hard disk is inserted into the hard disk slot and releases heat, the cold end of the semiconductor refrigeration plate can rapidly cool and dissipate heat of the hard disk, the liquid cooling heat dissipation plate can absorb the heat of the hot end of the semiconductor refrigeration plate, the semiconductor refrigeration plate is helped to efficiently dissipate heat of the hard disk, the working environment temperature of the hard disk in the hard disk slot is protected, and the operation is stable.
Description
Technical Field
The utility model relates to the technical field of servers, in particular to a compound heat dissipation server.
Background
The existing server dissipates heat in an air cooling mode, heat dissipated from the server is absorbed through a fan, but the temperature of the whole machine body of the server is still high in a full-load running state, and the working efficiency of the server is reduced in a high-temperature environment.
Disclosure of utility model
The utility model aims to overcome the defects of the prior art and provide a compound heat dissipation server so as to solve the defects that the server in the prior art is overheated, the whole machine of the server is difficult to quickly dissipate heat by means of air cooling, and the working efficiency of the server is reduced in a high-temperature environment.
In order to achieve the above purpose, the present utility model adopts the following technical scheme:
The embodiment of the utility model provides a compound heat dissipation server, which comprises: the slot shell encloses and closes the hard disk slot that forms the inserted hard disk, the slot shell includes semiconductor refrigeration board and liquid cooling heating panel, the cold junction of semiconductor refrigeration board orientation hard disk slot, the hot junction paste in the liquid cooling heating panel.
In one possible implementation manner, the slot housing includes an upper plate, the upper plate is of a double-layer structure, the outer layer is the liquid cooling heat dissipation plate, and the inner layer is the semiconductor refrigeration plate.
In one possible implementation manner, the slot housing includes a lower plate, the lower plate has a double-layer structure, the outer layer is the liquid cooling heat dissipation plate, and the inner layer is the semiconductor refrigeration plate.
In one possible implementation manner, the slot housing includes a left-side board, the left-side board has a double-layer structure, the outer layer is the liquid cooling heat dissipation board, and the inner layer is the semiconductor refrigeration board.
In one possible implementation manner, the slot housing includes a right-hand plate, the right-hand plate has a double-layer structure, the outer layer is the liquid cooling heat dissipation plate, and the inner layer is the semiconductor refrigeration plate.
In one possible implementation, the upper plate, lower plate, left plate, right plate are connected to form the slot housing.
In one possible implementation, any one of the vertical cross-sections of the slot housing is rectangular.
In one possible implementation manner, a vertical partition plate is vertically arranged in the slot housing, and the vertical partition plate and the slot housing enclose to form at least two hard disk slots.
In one possible implementation manner, the liquid cooling heat dissipation plate comprises a plate body and a pipe body, wherein the plate body is attached to the hot end of the semiconductor refrigeration plate, and the pipe body is embedded in the plate body.
In one possible implementation, the server further includes a power source connected to the semiconductor refrigeration plate.
Compared with the prior art, the compound heat dissipation server combines the semiconductor refrigeration plate and the liquid cooling heat dissipation plate to form a new slot shell, when a hard disk is inserted into the hard disk slot and releases heat, the cold end of the semiconductor refrigeration plate can rapidly cool and dissipate heat of the hard disk, the liquid cooling heat dissipation plate can absorb heat of the hot end of the semiconductor refrigeration plate, the semiconductor refrigeration plate is helped to efficiently dissipate heat of the hard disk, the working environment temperature of the hard disk in the hard disk slot is protected to be proper, and the operation is stable.
The foregoing description is only an overview of the present utility model, and is intended to be more clearly understood as being carried out in accordance with the following description of the preferred embodiments, as well as other objects, features and advantages of the present utility model.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings required for the description of the embodiments will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present utility model, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a server with composite heat dissipation according to the present utility model;
FIG. 2 is a schematic perspective view of a slot housing in a server with composite heat dissipation according to the present utility model;
FIG. 3 is a schematic diagram of a front view of a slot housing in a server with composite heat dissipation according to the present utility model;
Fig. 4 is a partial enlarged view of fig. 3.
The figure identifies the description:
10. A socket housing; 101. an upper plate; 102. a lower plate; 103. a left plate; 104. a right plate; 11. a semiconductor refrigeration plate; 12. liquid cooling heat dissipation plate; 121. a plate body; 122. a tube body; 13. a hard disk slot; 14. a vertical partition board; 2. a server housing.
Detailed Description
The present utility model will be described in further detail with reference to the drawings and the detailed description, in order to make the objects, technical solutions and advantages of the present utility model more apparent.
The following description of the embodiments of the present utility model will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present utility model, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.
In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships as described based on the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model.
Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more such feature. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.
In the present utility model, unless explicitly specified and limited otherwise, the terms "mounted," "connected," "secured," and the like are to be construed broadly, and may be attached, detached, or integrated, for example; can be mechanically or electrically connected; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.
In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.
In the description of the present specification, a description referring to terms "one embodiment," "some embodiments," "examples," "specific examples," or "some examples," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present utility model. In this specification, schematic representations of the above terms should not be understood as necessarily being directed to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, one skilled in the art can combine and combine the different embodiments or examples described in this specification.
The slot housing 10 in the conventional server is formed by a metal plate, and is connected to the server housing 2, the hard disk slot 13 formed by enclosing the slot housing 10 is used for inserting a hard disk, and the air cooling device performs air cooling heat dissipation on the hard disk inserted in the hard disk slot 13. However, the temperature of the whole body of the server is still higher in the full-load running state, and the temperature of the hard disk cannot be effectively reduced.
Referring to fig. 1 to 4, according to the above situation that the conventional server cannot effectively reduce the temperature of the hard disk, an embodiment of the present utility model provides a server with composite heat dissipation, which includes: the slot shell 10, the slot shell 10 encloses and closes and form the hard disk slot 13 of inserting hard disk, and slot shell 10 includes semiconductor refrigeration board 11 and liquid cooling heating panel 12, and the cold junction of semiconductor refrigeration board 11 is towards hard disk slot 13, and the hot junction pastes in liquid cooling heating panel 12. It should be explained that, the semiconductor refrigeration plate 11 is a refrigeration technology based on the Peltier effect, and the refrigeration effect is generated by an electronic device (usually a Peltier chip), so that heat is transferred from one side of the refrigeration plate to the other side, specifically, the semiconductor refrigeration plate 11 has a cold end with a lower temperature and a hot end with a higher temperature, when a current flows from the N-type semiconductor to the P-type semiconductor, electrons will absorb heat of the surrounding environment with energy through conduction or thermal radiation, so that the temperature of the cold end is reduced; when current flows from the P-type semiconductor to the N-type semiconductor, electrons release energy and transfer it to the surrounding environment, raising the temperature of the hot side. In this way, the semiconductor refrigeration plate 11 realizes the temperature difference of the cold side and the hot side, so that heat can be moved from the cold side to the hot side, and the refrigeration effect is achieved.
In this embodiment, the semiconductor refrigeration board 11 is used to cool and dissipate heat of the hard disk in the hard disk slot 13, and further cool and dissipate heat of the server housing 2 and the internal environment of the server, so that temperatures of the hard disk and the working environment of the hard disk are effectively controlled, and working efficiency of the server is not affected due to too high temperature. Further, in order to improve the refrigerating effect, the embodiment further provides that the liquid cooling heat dissipation plate 12 is connected to the hot end of the semiconductor refrigerating plate 11, so as to enhance the heat dissipation and the heat dissipation, and make the operation of the semiconductor refrigerating plate 11 more efficient.
In another embodiment, an air cooling device is further disposed in the server, and the air cooling device is used for performing air cooling and heat dissipation on the hard disk slot 13. The arrangement of the air cooling device in the server belongs to the prior art, and will not be described here again.
Further, the socket housing 10 includes an upper plate 101, the upper plate 101 has a double-layer structure, the outer layer is a liquid cooling plate 12, and the inner layer is a semiconductor refrigeration plate 11.
Further, the socket housing 10 includes a lower plate 102, the lower plate 102 has a double-layer structure, the outer layer is a liquid cooling plate 12, and the inner layer is a semiconductor refrigeration plate 11.
Further, the socket housing 10 includes a left plate 103, the left plate 103 has a double-layer structure, the outer layer is a liquid cooling plate 12, and the inner layer is a semiconductor refrigeration plate 11.
Further, the socket housing 10 includes a right plate 104, the right plate 104 has a double-layer structure, the outer layer is a liquid cooling plate 12, and the inner layer is a semiconductor refrigeration plate 11.
Specifically, the upper plate 101, the lower plate 102, the left plate 103, and the right plate 104 are connected to form the slot housing 10.
Specifically, any one of the vertical cross sections of the slot housing 10 is rectangular.
In this embodiment, the slot housing 10 is composed of an upper plate 101, a lower plate 102, a left plate 103 and a right plate 104, wherein the left side of the upper plate 101 is perpendicular to the upper side of the left plate 103, the right side of the upper plate 101 is perpendicular to the upper side of the right plate 104, the left side of the lower plate 102 is perpendicular to the lower side of the left plate 103, the right side of the lower plate 102 is perpendicular to the lower side of the right plate 104, the upper plate 101 is parallel to the lower plate 102, and the left plate 103 is parallel to the right plate 104, thereby forming a housing structure with any vertical section being rectangular. Optionally, in a certain embodiment, at least one of the upper plate 101, the lower plate 102, the left plate 103 and the right plate 104 is a double-layer structure with an inner layer of the semiconductor refrigeration plate 11 and an outer layer of the liquid cooling heat dissipation plate 12, in a preferred embodiment, the upper plate 101, the lower plate 102, the left plate 103 and the right plate 104 are all double-layer structures with an inner layer of the semiconductor refrigeration plate 11 and an outer layer of the liquid cooling heat dissipation plate 12, so that heat dissipation can be performed on the hard disk in the hard disk slot 13 in all directions up, down, left and right, and the heat dissipation efficiency is higher. It should be noted that, the inner layer refers to a direction approaching the hard disk slot 13, and the outer layer refers to a direction separating from the hard disk slot 13.
Further, a vertical partition 14 is vertically arranged in the slot housing 10, and the vertical partition 14 and the slot housing 10 enclose to form at least two hard disk slots 13, so that the enclosed space of the slot housing 10 is more efficiently utilized.
In one possible implementation manner, the liquid cooling heat dissipation plate 12 includes a plate body 121 and a tube body 122, where the plate body 121 is attached to the hot end of the semiconductor refrigeration plate 11, and the tube body 122 is embedded in the plate body 121. Further, the tube 122 is a heat conductive copper tube, in which a cooling liquid is contained, and can absorb heat to cool the hot end of the semiconductor refrigeration plate 11, thereby promoting the refrigeration efficiency of the semiconductor refrigeration plate 11.
Further, the server also includes a power source connected to the semiconductor refrigeration panel 11.
Compared with the prior art, the compound heat dissipation server combines the semiconductor refrigeration plate and the liquid cooling heat dissipation plate to form a new slot shell, when a hard disk is inserted into the hard disk slot and releases heat, the cold end of the semiconductor refrigeration plate can rapidly cool and dissipate heat of the hard disk, the liquid cooling heat dissipation plate can absorb heat of the hot end of the semiconductor refrigeration plate, the semiconductor refrigeration plate is helped to efficiently dissipate heat of the hard disk, the working environment temperature of the hard disk in the hard disk slot is protected to be proper, and the operation is stable.
While the utility model has been described with reference to certain preferred embodiments, it will be understood by those skilled in the art that various changes and substitutions of equivalents may be made and equivalents will be apparent to those skilled in the art without departing from the scope of the utility model. Therefore, the protection scope of the utility model is subject to the protection scope of the claims.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323449286.5U CN221993834U (en) | 2023-12-15 | 2023-12-15 | Compound radiating server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202323449286.5U CN221993834U (en) | 2023-12-15 | 2023-12-15 | Compound radiating server |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN221993834U true CN221993834U (en) | 2024-11-12 |
Family
ID=93340305
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202323449286.5U Active CN221993834U (en) | 2023-12-15 | 2023-12-15 | Compound radiating server |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN221993834U (en) |
-
2023
- 2023-12-15 CN CN202323449286.5U patent/CN221993834U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI525300B (en) | Composite heat sink assembly for power module | |
| CN213816733U (en) | Heat dissipation device and laser light source | |
| CN201904319U (en) | Thermoelectric computer chip radiator | |
| CN111780456A (en) | A semiconductor refrigeration cooling device based on thermoelectric power generation | |
| CN102446877A (en) | A semiconductor cooling device | |
| CN219660230U (en) | Radiating assembly and electronic equipment | |
| CN205069617U (en) | Power module and vehicle that has it | |
| CN201894040U (en) | Cooling module | |
| CN206909027U (en) | Radiator and cooling system | |
| CN103066631B (en) | Electric bus on-board charger | |
| CN212618821U (en) | Air conditioner outer unit controller cooling device, outdoor unit and air conditioner | |
| CN211720962U (en) | Heat sink device | |
| CN211745081U (en) | Heat radiation structure | |
| CN207741053U (en) | A kind of radiator structure of LED array module | |
| CN210402259U (en) | Forced convection cooling fin | |
| CN217685509U (en) | Radiator and air condensing units | |
| CN218632017U (en) | Heat dissipation device, circuit board and battery module | |
| CN216213702U (en) | Cooling device for new energy automobile power battery | |
| CN210349818U (en) | Low flow resistance fin radiator | |
| CN211720642U (en) | Heat dissipation assembly and electric appliance | |
| CN210745850U (en) | Heat sink device | |
| CN222705503U (en) | A power device, a heat dissipation system and a power semiconductor device | |
| CN217721817U (en) | Heat radiator | |
| CN208191114U (en) | Radiator and vehicle for vehicle-mounted display terminal | |
| CN206685368U (en) | IGBT heat radiation modules and vehicle |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |