CN221979374U - A semiconductor heat sink - Google Patents

Abstract

The utility model discloses a semiconductor radiator, which comprises a shell, wherein a radiating component is arranged in the shell, an adsorption component for adsorbing a radiating object and a detection component for detecting the temperature of the radiating object are arranged at the bottom of the shell, and the radiating component and the detection component are connected with a control unit. According to the utility model, the magnetic plate can be adsorbed on the back of the mobile phone, the thermistor can drive the sliding block to move along the mounting frame and compress the spring, so that the thermistor is in close contact with the back of the mobile phone, heat of the back of the mobile phone is detected, the lower end of the semiconductor refrigeration plate is used for refrigerating, when the temperature is lower than the set temperature, the control unit controls the semiconductor refrigeration plate and the cooling fan to stop working, and when the temperature is higher than the set temperature, the semiconductor refrigeration plate and the cooling fan start working, thereby avoiding condensed water generated in the mobile phone with poor sealing performance and damaging the mobile phone.

Description

A semiconductor heat sink

Technical Field

The utility model relates to the technical field of radiators, in particular to a semiconductor radiator.

Background Art

Due to reasons such as the battery or hardware of the mobile phone, long-term use of the mobile phone can easily cause the phone to heat up and cause damage to the phone. Generally, a radiator is specially installed outside the mobile phone. This device solves the problem of the mobile phone having to deal with high-energy heat under abnormal working conditions for a long time, and uses semiconductor refrigeration components to achieve high-energy refrigeration, thereby ensuring that the mobile phone and game console can work normally.

The Chinese patent with the patent publication number CN219716969U discloses a semiconductor heat sink, including a heat-conducting component, the heat-conducting component includes a heat-conducting plate attached to the back of a mobile phone, a heat-conducting copper plate is arranged on the heat-conducting plate, a shell is arranged on the heat-conducting plate, a heat-dissipating component is arranged inside the shell, the shell includes a shell mounted on the heat-conducting plate, a connecting plate is arranged inside the shell, a semiconductor cooling sheet is arranged on the lower side of the heat-dissipating component, a control circuit component is arranged outside the semiconductor cooling sheet on the shell, the heat-dissipating component includes several annular heat-dissipating fin groups, and a heat-dissipating fan is arranged inside one of the annular heat-dissipating fin groups. The device is not easy to be blocked, and can avoid excessive temperature and damage to electronic components.

Existing semiconductor radiators can only be turned on or off manually. During use, after the temperature of the mobile phone drops, if the semiconductor radiator is continuously turned on, the temperature drops significantly, which may cause condensation water to form inside the mobile phone with poor sealing, causing damage to the mobile phone. In order to overcome these disadvantages, the utility model provides a semiconductor radiator.

Utility Model Content

The utility model aims to solve the shortcomings in the prior art and proposes a semiconductor radiator.

In order to achieve the above-mentioned purpose, the utility model adopts the following technical scheme: a semiconductor radiator, comprising a shell, a heat dissipation component is arranged inside the shell, an adsorption component for adsorbing the object to be cooled and a detection component for detecting the temperature of the object to be cooled are arranged at the bottom of the shell, and the heat dissipation component and the detection component are connected to a control unit.

Furthermore, the heat dissipation component includes a semiconductor refrigeration plate, the semiconductor refrigeration plate is electrically connected to the control unit, and a plurality of heat dissipation fins are distributed around the upper end of the semiconductor refrigeration plate.

Furthermore, the detection component includes a mounting frame, a slider is disposed inside the mounting frame, a thermistor is fixedly connected to the lower end of the slider, and the thermistor is electrically connected to the control unit.

Furthermore, an end cover is fixedly connected to the upper end of the shell, and the side surface and the end cover of the shell are both hollow structures.

Furthermore, a power supply slot is provided on one side of the shell, and a magnetic plate is fixedly connected to the lower end of the shell.

Furthermore, a fixing ring is fixedly connected to the upper end of the heat dissipation fin, a heat dissipation fan is arranged inside the heat dissipation fin, and the heat dissipation fan is electrically connected to the control unit.

Furthermore, the lower end of the thermistor passes through the lower end of the mounting frame, and the upper end of the slider is fixedly connected with a spring.

Furthermore, a connecting ring is fixedly connected to the upper end of the mounting frame, and the upper end of the spring is fixedly connected to the lower end of the connecting ring.

Beneficial effects of the utility model:

1. When the utility model is in use, the semiconductor radiator can be adsorbed on the back of the mobile phone through the arranged magnetic plate, the arranged thermistor will drive the slider to move along the mounting frame and compress the spring, so that the thermistor is in close contact with the back of the mobile phone and detects the heat on the back of the mobile phone, the lower end of the arranged semiconductor refrigeration plate is cooled, the arranged heat dissipation fins can conduct the heat generated by the upper end of the semiconductor refrigeration plate, and discharge the heat through the arranged heat dissipation fan.

2. When the utility model is in use, when the temperature of the semiconductor radiator is lower than the set temperature, the control unit controls the semiconductor refrigeration plate and the cooling fan to stop working. When the temperature is higher than the set temperature, the semiconductor refrigeration plate and the cooling fan start working, thereby preventing condensation water from being generated inside a mobile phone with poor sealing when the temperature is too low, causing damage to the mobile phone.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solution of the present invention, the drawings required for use in the description of the specific implementation methods will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

Figure 1: front view of the utility model;

Figure 2: bottom view of the utility model;

Figure 3: A schematic diagram of the heat dissipation assembly structure of the present invention;

Figure 4: Schematic diagram of the heat dissipation fin installation structure of the utility model;

Figure 5: Schematic diagram of the detection component structure of the utility model.

The reference numerals are as follows:

1. Shell; 2. End cover; 3. Heat dissipation assembly; 4. Power supply slot; 5. Magnetic plate; 6. Detection assembly; 7. Semiconductor refrigeration plate; 8. Heat dissipation fins; 9. Fixing ring; 10. Cooling fan; 11. Mounting frame; 12. Connecting ring; 13. Slider; 14. Spring; 15. Thermistor.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments of the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

As shown in Figures 1-5, a semiconductor radiator is disclosed, comprising a shell 1, a heat dissipation component 3 is arranged inside the shell 1, an adsorption component for adsorbing an object to be dissipated and a detection component 6 for detecting the temperature of the object to be dissipated are arranged at the bottom of the shell 1, the heat dissipation component 3 and the detection component 6 are connected with a control unit, the control unit is an MCU, the heat dissipation component 3 comprises a semiconductor refrigeration plate 7, the semiconductor refrigeration plate 7 is electrically connected to the control unit, a plurality of heat dissipation fins 8 are distributed on the circumference of the upper end of the semiconductor refrigeration plate 7, the detection component 6 comprises a mounting frame 11, a slider 13 is arranged inside the mounting frame 11, a thermistor 15 is fixedly connected to the lower end of the slider 13, and the thermistor 15 is electrically connected to the control unit.

As shown in FIGS. 1-5 , the upper end of the shell 1 is fixedly connected with an end cover 2, and the side surfaces of the shell 1 and the end cover 2 are both hollow structures, so that air can circulate and heat is dissipated.

As shown in the figure, a power slot 4 is provided on one side of the shell 1, and a magnetic plate 5 is fixedly connected to the lower end of the shell 1. A power cord can be connected through the power slot 4 to power the device, and the magnetic plate 5 can be adsorbed on the back of the mobile phone.

As shown in Figures 1-5, the upper end of the heat dissipation fin 8 is fixedly connected to a fixing ring 9, and a heat dissipation fan 10 is arranged on the inner side of the heat dissipation fin 8. The heat dissipation fin 8 can conduct the heat generated by the upper end of the semiconductor refrigeration plate 7 and discharge the heat through the heat dissipation fan 10.

As shown in Figures 1-5, the lower end of the thermistor 15 passes through the lower end of the mounting frame 11, the upper end of the slider 13 is fixedly connected to the spring 14, the upper end of the mounting frame 11 is fixedly connected to the connecting ring 12, the upper end of the spring 14 is fixedly connected to the lower end of the connecting ring 12, and the set thermistor 15 will drive the slider 13 to move along the mounting frame 11 and compress the spring 14, so that the thermistor 15 is in close contact with the back of the mobile phone and detects the temperature of the back of the mobile phone.

Working principle: When in use, the power cord can be connected through the power socket 4 to power the device, and the magnetic plate 5 can be adsorbed on the back of the mobile phone. The thermistor 15 will drive the slider 13 to move along the mounting frame 11 and compress the spring 14, so that the thermistor 15 is in close contact with the back of the mobile phone and detects the temperature of the back of the mobile phone. The lower end of the semiconductor refrigeration plate 7 is cooled to cool the mobile phone. The heat dissipation fins 8 can conduct the heat generated by the upper end of the semiconductor refrigeration plate 7 and discharge the heat through the heat dissipation fan 10. When the heat is lower than the set temperature, the control unit controls the semiconductor refrigeration plate 7 and the heat dissipation fan 10 to stop working. When the temperature is higher than the set temperature, the semiconductor refrigeration plate 7 and the heat dissipation fan 10 start working, thereby avoiding the generation of condensed water inside the mobile phone with poor sealing when the temperature is too low, causing damage to the mobile phone.

The preferred embodiments of the utility model disclosed above are only used to help explain the utility model. The preferred embodiments do not describe all the details in detail, nor do they limit the utility model to only specific implementation methods. Obviously, many modifications and changes can be made according to the content of this specification. This specification selects and specifically describes these embodiments in order to better explain the principles and practical applications of the utility model, so that technicians in the relevant technical field can well understand and use the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims (4)

1. A semiconductor heat sink, comprising a housing (1), characterized in that: a heat sink component (3) is arranged inside the housing (1), a suction component for sucking a heat dissipated object and a detection component (6) for detecting the temperature of the heat dissipated object are arranged at the bottom of the housing (1), the heat sink component (3) and the detection component (6) are connected to a control unit, the detection component (6) comprises a mounting frame (11), a slider (13) is arranged inside the mounting frame (11), and the bottom of the slider (13) is The end of the housing (1) is fixedly connected with a thermistor (15), the thermistor (15) is electrically connected to the control unit, the lower end of the thermistor (15) passes through the lower end of the mounting frame (11), the upper end of the slider (13) is fixedly connected with a spring (14), the upper end of the mounting frame (11) is fixedly connected with a connecting ring (12), the upper end of the spring (14) is fixedly connected with the lower end of the connecting ring (12), a power supply slot (4) is provided on one side of the housing (1), and the adsorption component is a magnetic plate (5). 2. A semiconductor radiator according to claim 1, characterized in that: the heat dissipation component (3) includes a semiconductor refrigeration plate (7), the semiconductor refrigeration plate (7) is electrically connected to the control unit, and a plurality of heat dissipation fins (8) are distributed around the upper end of the semiconductor refrigeration plate (7). 3. A semiconductor heat sink according to claim 1, characterized in that an end cover (2) is fixedly connected to the upper end of the shell (1), and the side surface of the shell (1) and the end cover (2) are both hollow structures. 4. A semiconductor heat sink according to claim 2, characterized in that: a fixing ring (9) is fixedly connected to the upper end of the heat dissipation fin (8), a heat dissipation fan (10) is arranged on the inner side of the heat dissipation fin (8), and the heat dissipation fan (10) is electrically connected to the control unit.