CN221944770U - Electroplating water blowing device for semiconductor part - Google Patents

Abstract

The utility model discloses a semiconductor electroplating water blowing device, comprising an outer box body with a hollow structure, the outer box body is fixedly installed on the roof of a factory building through a mounting column fixedly installed on its upper surface, two blowers are fixedly installed on the upper surface of the outer box body, and a movable horizontal plate is arranged directly below the outer box body, and a mounting hook is rotatably installed on the lower surface of the movable horizontal plate, and a hanging frame is hung below the mounting hook, a semiconductor to be blown with water is hung in the hanging frame, and a transmission mechanism for driving the mounting hook to rotate is arranged above the movable horizontal plate. The semiconductor electroplating water blowing device adopts a new structural design, and a transmission mechanism is arranged above the movable horizontal plate. During the operation of the device, the driving gear below the outer box body rotates, so that the driven gear meshing with the driving gear drives the mounting hook to rotate, thereby rotating the entire hanging frame, and realizing a comprehensive water blowing operation on the semiconductor material.

Description

A water blowing device for electroplating semiconductor parts

Technical Field

The utility model relates to the technical field of electroplating water blowing, in particular to a semiconductor part electroplating water blowing device.

Background Art

Semiconductor materials are commonly used materials for precision electronic equipment. During the production process of semiconductor materials, other materials need to be plated on their surface by electroplating to achieve the purpose of corrosion protection. However, before electroplating, air flow is needed to blow off water stains on the surface of the semiconductor material after cleaning to avoid affecting the electroplating effect.

In the prior art, a Chinese patent with publication number CN211142213U discloses a reciprocating water blowing device for electroplating hangers, including a chassis, a slide rail, a slider, an air blowing assembly, an air source device and a driving mechanism. The slide rail is vertically fixed to the side of the chassis, the slider is slidably installed on the slide rail, and the driving mechanism is fixed inside the chassis and used to drive the slider to slide up and down. The air blowing assembly includes a vertical rod, a plurality of cross rods and a plurality of air blowing units. The upper part of the vertical rod is fixedly connected to the slider, and the plurality of cross rods are evenly arranged at equal intervals along the height direction of the vertical rod. Each cross rod is evenly provided with a plurality of air blowing units along the length direction. The air blowing unit is connected to the air source device through an air pipe. The air source device is arranged inside the chassis. The air source device continuously supplies air to the air blowing unit. The driving mechanism drives the air blowing assembly to reciprocate up and down, and can quickly blow dry the electroplating hangers passing by without leaving dead corners. The utility model has a simple structure and high drying efficiency.

During use, the above-mentioned device uses a blowing unit to blow out airflow to remove moisture from the workpiece surface. However, during actual use, the blowing unit can only move up and down and cannot rotate, so it can only blow in one direction. The workpiece needs to be turned over after blowing one side, which increases the workload of the staff.

Utility Model Content

The utility model aims to provide a semiconductor electroplating water blowing device to solve the problem in the background technology that the workpiece needs to be turned over, which increases the workload of personnel.

To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor electroplating water blowing device, comprising an outer box body with a hollow structure, the outer box body is fixedly mounted on the roof of a factory building through a mounting column fixedly mounted on its upper surface, and also includes:

Two blowers are fixedly installed on the upper surface of the outer box body, and a movable horizontal plate is arranged directly below the outer box body, and a mounting hook is rotatably installed on the lower surface of the movable horizontal plate, and a hanging frame is hung below the mounting hook, and a semiconductor that needs to be blown with water is hung in the hanging frame, and a transmission mechanism for driving the mounting hook to rotate is arranged above the movable horizontal plate;

The left and right sides of the lower surface of the outer box body are fixedly installed with water blowing nozzles, and the water blowing nozzles are connected to the outer box body through the delivery pipes fixedly installed on the outer surface.

A drying mechanism for absorbing water droplets is installed in the outer box body. The drying mechanism includes a drying sleeve in a hollow sleeve-shaped structure, and the drying sleeve is made of desiccant material as a whole.

Preferably, the transmission mechanism includes a driven gear coaxially fixedly mounted on the outside of the upper end of the mounting hook, and the mounting hook forms a rotating structure through the driven gear and the movable transverse plate.

Preferably, a telescopic cylinder is fixedly installed between the upper surface of the movable horizontal plate and the outer surface of the outer box body, and a meshing structure is formed between the driven gear and the driving gear, and the driven gear is rotatably installed below the outer box body.

Preferably, a dust filter plate is fixedly installed inside the outer box body, and the dust filter plate as a whole is in an inclined structure with the left side lower and the right side higher.

Preferably, the drying sleeve is fixedly mounted on the lower surface of the driving gear, and the rotating shaft of the driving gear is a hollow structure.

Preferably, a connecting pipe with a hollow structure is rotatably mounted on the upper end of the rotating shaft of the driving gear, and the top end of the connecting pipe is butted against the air inlet of the blower.

Preferably, a driven bevel gear is coaxially fixedly installed on the upper end of the driving gear to drive it to rotate, and the side of the driven bevel gear is meshingly connected with the driving bevel gear, and the driving bevel gear is driven to rotate by a driving motor fixedly installed inside the outer box body, and at the same time, a knocking cam for knocking the dust filter plate is fixedly installed outside the output shaft of the driving motor.

Compared with the prior art, the beneficial effects of the utility model are: the semiconductor component electroplating water blowing device adopts a new structural design, and its specific contents are as follows:

1. Hang the semiconductor material that needs to be blown with water on the hanging rack, and then hang the hanging rack under the movable horizontal plate through the installation hook. Then the airflow in the outer box enters the water blowing nozzle through the conveying pipe and is pressurized and sprayed out (the water blowing nozzle blows water intermittently at a certain frequency), and finally the water on the surface of the semiconductor material is blown off by the pressurized airflow;

Furthermore, a transmission mechanism is arranged above the movable horizontal plate. During the operation of the device, the driving gear below the outer box body rotates, so that the driven gear meshing with the driving gear drives the installation hook to rotate, thereby rotating the entire suspension frame (the driving gear rotates alternately in a forward and reverse cycle, so the suspension frame also rotates alternately in a forward and reverse cycle under the driving action of the gear), thereby realizing a comprehensive water blowing operation on the semiconductor material;

Furthermore, a dust filter plate is installed inside the outer box body, so that the airflow entering the outer box body through the blower passes through the dust filter plate, and the dust impurities therein are filtered out under the action of the filter plate of the dust filter plate.

2. The driving motor drives the active bevel gear to rotate, so that the driven bevel gear meshing with the active bevel gear drives the active gear to rotate. At the same time, the blower creates negative pressure inside the connecting pipe, sucking the blown water into the drying sleeve for drying to prevent it from dripping onto the surface of the semiconductor material again.

Furthermore, the driving motor drives the knocking cam to rotate synchronously during the rotation process, so that the knocking cam knocks the dust filter plate, causing the dust filter plate to vibrate, and the filtered dust and impurities are concentrated on one side by utilizing the inclined structure of the dust filter plate.

BRIEF DESCRIPTION OF THE DRAWINGS

Figure 1 is a schematic diagram of the overall structure of the utility model;

Figure 2 is a schematic diagram of the bottom structure of the outer box body of the utility model;

Figure 3 is a schematic diagram of the structure of the movable horizontal plate of the utility model;

FIG4 is a schematic structural diagram of the connection relationship between the suspension bracket and the mounting hook of the utility model;

Figure 5 is a schematic diagram of the cross-sectional structure of the outer box body of the utility model;

FIG6 is a schematic structural diagram of the connection relationship between the driving gear and the connecting pipe of the utility model;

FIG. 7 is a schematic diagram of the structure of the drive motor of the utility model.

In the figure: 1. outer box; 2. mounting column; 3. blower; 4. movable horizontal plate; 5. telescopic cylinder; 6. mounting hook; 7. driven gear; 8. hanging frame; 9. water blowing nozzle; 10. conveying pipeline; 11. driving gear; 12. drying sleeve; 13. dust filter plate; 14. connecting pipeline; 15. driven bevel gear; 16. driving bevel gear; 17. driving motor; 18. knocking cam.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Embodiment 1

Please refer to Figures 1 to 5. In order to solve the problem of dust impurities in the air being blown onto the surface of semiconductor materials and causing pollution, the present embodiment provides the following technical solutions, which specifically disclose: an outer box body 1 with a hollow structure, the outer box body 1 is fixedly installed on the roof of a factory building through a mounting column 2 fixedly installed on its upper surface, two blowers 3 are fixedly installed on the upper surface of the outer box body 1, and a movable horizontal plate 4 is arranged directly below the outer box body 1, and a mounting hook 6 is rotatably installed on the lower surface of the movable horizontal plate 4, and a hanging frame 8 is hung below the mounting hook 6, and a semiconductor that needs to be blown with water is hung in the hanging frame 8, a telescopic cylinder 5 is fixedly installed between the upper surface of the movable horizontal plate 4 and the outer surface of the outer box body 1, a dust filter plate 13 is fixedly installed inside the outer box body 1, and the dust filter plate 13 is an inclined structure with the left side lower and the right side higher as a whole, water blowing nozzles 9 are fixedly installed on the left and right sides of the lower surface of the outer box body 1, and the water blowing nozzles 9 form a communication structure with the outer box body 1 through a conveying pipe 10 fixedly installed on the outer surface.

When using the device, first, the telescopic cylinder 5 works to push the movable horizontal plate 4 downward, and the semiconductor material that needs to be blown with water is evenly suspended in the suspension frame 8, and then the suspension frame 8 is suspended under the installation hook 6, and then the blower 3 above the outer box body 1 is turned on, and the blower 3 is used to blow external air into the outer box body 1 (the dust filter plate 13 is used to filter the incoming air to remove dust and impurities therein), and then the air enters the water blowing nozzle 9 through the conveying pipe 10, and the water blowing nozzle 9 is used to pressurize the air and spray it out (the water blowing nozzle 9 intermittently blows water at a certain frequency), so as to achieve the purpose of blowing water on the surface of the semiconductor material.

Embodiment 2

Please refer to Figures 2 to 4. In order to solve the problem that the semiconductor material cannot be fully blown, the present embodiment provides the following technical solutions, a transmission mechanism is set, and the transmission mechanism is used to drive the suspension frame 8 to rotate, so as to achieve full water blowing of the semiconductor material. Specifically disclosed is: a transmission mechanism for driving the mounting hook 6 to rotate is set above the movable horizontal plate 4, the transmission mechanism includes a driven gear 7 coaxially fixedly mounted on the outside of the upper end of the mounting hook 6, and the mounting hook 6 forms a rotating structure through the driven gear 7 and the movable horizontal plate 4, and the driven gear 7 and the driving gear 11 form a meshing structure, and the driven gear 7 is rotatably mounted below the outer box body 1, and a driven bevel gear 15 is coaxially fixedly mounted on the upper end of the driving gear 11 to drive it to rotate, and the side of the driven bevel gear 15 is meshedly connected with the driving bevel gear 16, and the driving bevel gear 16 is driven to rotate by a driving motor 17 fixedly mounted inside the outer box body 1, and at the same time, a knocking cam 18 for knocking the dust filter plate 13 is fixedly mounted on the outside of the output shaft of the driving motor 17.

After the installation of the suspension frame 8 is completed, the telescopic cylinder 5 contracts and drives the movable cross plate 4 to move upward, and finally moves the driven gear 7 to a position meshed with the driving gear 11, and then the driving motor 17 inside the outer box body 1 is turned on. The driving motor 17 drives the driving bevel gear 16 to rotate. At this time, the driven bevel gear 15 meshed with the driving bevel gear 16 drives the driving gear 11 to rotate, so that the driven gear 7 meshed with the driving gear 11 drives the installation hook 6 to rotate (the driving gear 11 rotates alternately in a positive and reverse cycle, so the suspension frame 8 also rotates alternately in a positive and reverse cycle under the driving action of the gear), realizing the rotation of the entire semiconductor material so that it can fully accept the water blowing operation. At the same time, the driving motor 17 drives the knocking cam 18 to rotate during the rotation process, so that the knocking cam 18 knocks on the dust filter plate 13 to generate vibration, and the dust impurities filtered out of the dust filter plate 13 are concentrated on one side to avoid blockage.

Embodiment 3

Please refer to Figures 2, 6 and 7. In order to solve the problem of blown-off water droplets re-attaching to the surface of the semiconductor material, this embodiment provides the following technical solutions, wherein a drying mechanism is provided to adsorb the blown-off water droplets into the drying mechanism for drying. Specifically disclosed is: a drying mechanism for adsorbing water droplets is installed in the outer box body 1, the drying mechanism includes a drying sleeve 12 with a hollow sleeve-shaped structure, and the drying sleeve 12 is made of a desiccant material as a whole, the drying sleeve 12 is fixedly installed on the lower surface of the driving gear 11, and the rotating shaft of the driving gear 11 is a hollow structure, and a connecting pipe 14 with a hollow structure is rotatably installed on the upper end of the rotating shaft of the driving gear 11, and the top end of the connecting pipe 14 is butted against the air inlet of the blower 3.

During the water blowing process, the blower 3 is turned on to generate negative pressure inside the connecting pipe 14, so that the water droplets blown off the surface of the semiconductor material are sucked into the drying sleeve 12 for drying, thereby preventing the water droplets from dripping onto the surface of the semiconductor material again.

Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims (7)

1. The utility model provides a semiconductor electroplating blow water device, is including outer box (1) that is hollow structure, outer box (1) is through its upper surface fixed mounting's erection column (2) fixed mounting at the factory building roof, its characterized in that still includes:

Two air blowers (3) are fixedly arranged on the upper surface of the outer box body (1), a movable transverse plate (4) is arranged right below the outer box body (1), an installation hook (6) is rotatably arranged on the lower surface of the movable transverse plate (4), a hanging frame (8) is hung below the installation hook (6), a semiconductor needing to blow water is hung in the hanging frame (8), and a transmission mechanism for driving the installation hook (6) to rotate is arranged above the movable transverse plate (4);

the left side and the right side of the lower surface of the outer box body (1) are fixedly provided with water blowing spray heads (9), and the water blowing spray heads (9) form a communication structure with the outer box body (1) through a conveying pipeline (10) fixedly arranged on the outer surface

The drying mechanism for adsorbing water drops is arranged in the outer box body (1), the drying mechanism comprises a drying sleeve (12) with a hollow sleeve-shaped structure, and the whole drying sleeve (12) is made of a drying agent material.

2. A semiconductor electroplating bath according to claim 1, wherein: the transmission mechanism comprises a driven gear (7) coaxially and fixedly arranged outside the upper end of the installation hook (6), and the installation hook (6) forms a rotating structure with the movable transverse plate (4) through the driven gear (7).

3. A semiconductor electroplating bath according to claim 2, wherein: a telescopic cylinder (5) is fixedly arranged between the upper surface of the movable transverse plate (4) and the outer surface of the outer box body (1), a meshing structure is formed between the driven gear (7) and the driving gear (11), and the driven gear (7) is rotatably arranged below the outer box body (1).

4. A semiconductor electroplating bath according to claim 3, wherein: the dust filtering plate (13) is fixedly arranged in the outer box body (1), and the dust filtering plate (13) is of an inclined structure with a low left side and a high right side.

5. The semiconductor electroplating bath apparatus of claim 4, wherein: the drying sleeve (12) is fixedly arranged on the lower surface of the driving gear (11), and the rotating shaft of the driving gear (11) is of a hollow structure.

6. A semiconductor electroplating bath according to claim 5, wherein: the upper end of the rotating shaft of the driving gear (11) is rotatably provided with a connecting pipeline (14) with a hollow structure, and the top end of the connecting pipeline (14) is in butt joint with the air inlet of the air blower (3).

7. The semiconductor electroplating bath apparatus of claim 6, wherein: the novel dust filter is characterized in that a driven bevel gear (15) for driving the driven bevel gear (11) to rotate is coaxially and fixedly arranged at the upper end of the driving gear, a driving bevel gear (16) is connected to the side face of the driven bevel gear (15) in a meshed mode, the driving bevel gear (16) is driven to rotate by a driving motor (17) fixedly arranged in the outer box body (1), and a knocking cam (18) for knocking the dust filter plate (13) is fixedly arranged outside an output shaft of the driving motor (17).