CN221934420U - Manufacturing equipment of semiconductor separator - Google Patents

Abstract

The utility model relates to a manufacturing device for semiconductor separators, including a workbench, a glue dispenser is arranged on the outside of the workbench, a fixing device is arranged on the upper surface of the workbench, a dust cleaning mechanism for cleaning dust is arranged on the right side of the fixing device, an auxiliary mechanism for assisting in cleaning dust is arranged on the left side of the fixing device, and a control panel is fixed on the front of the glue dispenser. In the manufacturing device for semiconductor separators, the dust cleaning mechanism sucks away dust and debris on the semiconductor separator and dust and debris that are about to fall on the semiconductor separator through the cooperation of an air expansion box, a collection box, a fan, a positioning box, a first dustproof net, a bottom plate and a collection pipe, thereby preventing dust and debris from affecting the quality of glue dispensing of the semiconductor separator by the glue dispenser, and at the same time, the cooperation of a cover plate, a positioning block, a positioning plate and a positioning spring facilitates the removal of the first dustproof net and the bottom plate to process the collected dust and debris.

Description

A semiconductor separator manufacturing device

Technical Field

The utility model relates to the technical field of semiconductor separator processing, in particular to a semiconductor separator manufacturing device.

Background Art

A glue dispensing machine is needed when processing semiconductor separators. The current glue dispensing machines have low movement accuracy and are prone to glue drawing, which affects chip bonding. Therefore, we have made improvements and proposed a manufacturing equipment for semiconductor separators.

For example, Chinese patent CN215377370U discloses a semiconductor separator manufacturing device, including a base, characterized in that anti-slip pads are installed at the four corners of the bottom end of the base, a first chassis is provided at the top of the base, slide grooves are provided on both sides of the first chassis, a first slide plate is provided on the inner side of the slide groove, a placement plate is installed on the top of the first slide plate, slide bars are provided on both sides of the base, support rods are provided on both sides of the base, a cross bar is installed on the top of the support rod, a second chassis is installed on one side of the cross bar, slide grooves are provided on the top of one side and the bottom of one side of the cross bar, a slide block is provided on the inner side of the slide groove, one side of the slide block and the third chassis are fixedly installed, a second slide plate is provided on one side of the third chassis, a glue dispenser is installed on one side of the second slide plate, and a glue storage box is installed on one side of the second slide plate. The semiconductor separator manufacturing device has a simple and reasonable structure, a novel design, simple and convenient operation, can effectively realize precise positioning, and does not draw wires or drip glue during glue dispensing, and has high practical value.

The above patent still has certain defects. The patent has a simple and reasonable structure, novel design, and simple and convenient operation. However, the semiconductor separator is not cleaned before dispensing. If there is dust or small debris on the semiconductor separator during dispensing, the dispensing effect will be poor, resulting in gaps in the dispensing, which will lead to the failure of dispensing and the need to remove the glue and re-dispense.

Utility Model Content

In view of the deficiencies in the prior art, the utility model provides a semiconductor separator manufacturing device, which has the advantages of cleaning dust before dispensing, etc., and solves the problem that the presence of dust or small debris on the semiconductor separator will lead to poor effect after dispensing.

To achieve the above-mentioned purpose, the utility model provides the following technical solutions: a semiconductor separator manufacturing device, comprising a workbench, a glue dispenser is arranged outside the workbench, a fixing device is arranged on the upper surface of the workbench, a dust cleaning mechanism for cleaning dust is arranged on the right side of the fixing device, an auxiliary mechanism for assisting in cleaning dust is arranged on the left side of the fixing device, and a control panel is fixed on the front of the glue dispenser;

The dispensing machine includes a support base fixed on the right side of the fixing device, a collection box is fixed on the upper surface of the support base, no less than two air expansion boxes are fixed on the left side of the collection box, the right side of the collection box is connected to a collection pipe, the right side of the collection pipe is connected to a positioning box fixed on the upper surface of the workbench, a fan is fixed on the right side of the positioning box, two positioning plates are fixed on the upper surface of the positioning box, the interior of the positioning box is slidably connected to a bottom plate, the upper surface of the bottom plate is fixed to a first dustproof net, and the upper surface of the first dustproof net is fixed to a cover plate slidably connected between opposite sides of the two positioning plates.

Furthermore, the dust cleaning mechanism also includes at least two positioning springs fixed inside the cover plate, and positioning blocks inserted into the positioning plate are fixed on opposite sides of the positioning springs on the left and right sides.

Furthermore, the cross-section of the air diffuser box is in the shape of a trapezoid, and the positioning box is in the shape of a rectangular parallelepiped with a hollow interior and a missing upper surface and a missing lower surface.

Furthermore, an air inlet for connecting to the collecting pipe is provided on the left side of the positioning box, and an air outlet for connecting to the air blower is provided on the right side of the positioning box.

Furthermore, one side opposite to the two positioning plates is provided with a positioning groove for the positioning block to be inserted into, and the shape of the opposite side of the two positioning blocks is semicircular.

Furthermore, the auxiliary mechanism includes a fixing seat fixed on the left side of the fixing device, a supporting box is fixed on the upper surface of the fixing seat, a second dustproof net is fixed on the left side of the supporting box, connecting blocks are fixed on the top and bottom walls of the inner cavity of the supporting box, and no less than two fans are fixed between the opposite sides of the two connecting blocks.

Furthermore, the support box is in the shape of a rectangular parallelepiped with a hollow interior and missing left and right sides, and the fans, which are not less than two in number, are evenly distributed between opposite sides of the two connection blocks.

Compared with the prior art, the technical solution of this application has the following beneficial effects:

1. The manufacturing equipment of the semiconductor separator, the dust cleaning mechanism sucks away the dust and debris on the semiconductor separator and the dust and debris that will fall on the semiconductor separator through the cooperation of the air expansion box, the collection box, the fan, the positioning box, the first dustproof net, the bottom plate and the collection pipe, so as to prevent the dust and debris from affecting the quality of the glue dispensing machine for the semiconductor separator. At the same time, the cooperation of the cover plate, the positioning block, the positioning plate and the positioning spring facilitates the removal of the first dustproof net and the bottom plate to handle the collected dust and debris.

2. The manufacturing equipment of the semiconductor separator, under the action of the auxiliary mechanism, cooperates with the support box, the second dustproof net, the connecting block and the fan to make the air flow quickly to the right, and carry the dust and debris on the semiconductor separator during the flow, so that the dust and debris far away from the cleaning mechanism will not be sucked away by the cleaning mechanism due to insufficient wind force.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of the structure of the utility model;

Figure 2 is a schematic diagram of the dust cleaning mechanism of the utility model;

FIG3 is an enlarged schematic diagram of the structure at A in FIG2 of the present utility model;

FIG. 4 is a schematic diagram of the auxiliary mechanism of the utility model.

In the figure: 1 dispensing machine, 2 cleaning mechanism, 201 air expansion box, 202 collecting box, 203 cover plate, 204 fan, 205 positioning box, 206 first dust screen, 207 bottom plate, 208 collecting pipe, 209 support seat, 210 positioning block, 211 positioning plate, 212 positioning spring, 3 workbench, 4 fixing device, 5 auxiliary mechanism, 501 fixing seat, 502 supporting box, 503 second dust screen, 504 connecting block, 505 fan, 6 control panel.

DETAILED DESCRIPTION

The following will be combined with the drawings in the embodiments of the utility model to clearly and completely describe the technical solutions in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all of the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the utility model.

Please refer to Figure 1. A semiconductor separator manufacturing device in this embodiment includes a workbench 3. A dispensing machine 1 is arranged on the outside of the workbench 3. The dispensing machine 1 is a common device on the market for dispensing semiconductor separators. A fixing device 4 is arranged on the upper surface of the workbench 3. The fixing device 4 is a common device on the market for fixing semiconductor separators and driving them to move back and forth. A dust cleaning mechanism 2 for cleaning dust is arranged on the right side of the fixing device 4, and an auxiliary mechanism 5 for assisting in cleaning dust is arranged on the left side of the fixing device 4. A control panel 6 is fixed on the front of the dispensing machine 1. The electrical components appearing in the text are all electrically connected to the main controller and the power supply. The main controller can be a conventional known device for control such as a computer, and the existing public power connection technology is not repeated in the text.

Please refer to Figures 2-3. In order to clean dust, the dispensing machine 1 in this embodiment includes a support base 209 fixed on the right side of the fixing device 4, a collection box 202 is fixed on the upper surface of the support base 209, and at least two air expansion boxes 201 are fixed on the left side of the collection box 202. The right side of the collection box 202 is connected to a collection pipe 208, and the right side of the collection pipe 208 is connected to a positioning box 205 fixed on the upper surface of the workbench 3. A fan 204 is fixed to the right side of the positioning box 205, and two positioning plates 211 are fixed to the upper surface of the positioning box 205. The interior of the positioning box 205 is slidably connected to a bottom plate 207, and the upper surface of the bottom plate 207 is fixed with a first dustproof net 206. The first dustproof net 206 is shaped like a rectangular parallelepiped with a hollow interior and the upper surface, lower surface and left side are all missing. The upper surface of the first dustproof net 206 is fixed with a cover plate 203 slidably connected between the opposite sides of the two positioning plates 211.

The air expansion box 201 sucks the dust and debris on the semiconductor separator into the collection box 202, and at the same time sucks away the dust and debris that will fall on the semiconductor separator. Then the collection pipe 208 extracts the dust and debris collected in the collection box 202 and transports it to the positioning box 205, thereby completing the cleaning of the dust and debris.

The cross-section of the air expansion box 201 is trapezoidal in shape, the positioning box 205 is in the shape of a rectangular solid with a hollow interior and missing upper and lower surfaces, an air inlet connected to the collecting pipe 208 is provided on the left side of the positioning box 205, and an air outlet connected to the air supply fan 204 is provided on the right side of the positioning box 205.

In this embodiment, the cleaning mechanism 2 also includes no less than two positioning springs 212 fixed inside the cover plate 203, and the left and right side positioning springs 212 are fixed on the opposite sides with positioning blocks 210 inserted into the positioning plate 211. The two positioning plates 211 have positioning grooves on the opposite sides for the positioning blocks 210 to be inserted. The shape of the opposite sides of the two positioning blocks 210 is semicircular. When the cover plate 203 moves, the positioning blocks 210 are driven to move together. When the positioning blocks 210 move, the positioning plates 211 push the positioning blocks 210 into the interior of the cover plate 203 along the curved surface of the positioning blocks 210, and at the same time, the positioning springs 212 are compressed by the positioning blocks 210, thereby releasing the restriction of the positioning blocks 210 on the cover plate 203.

It should be noted that the cleaning mechanism 2 absorbs dust and debris on the semiconductor separator and dust and debris that are about to fall on the semiconductor separator through the cooperation of the air expansion box 201, the collection box 202, the fan 204, the positioning box 205, the first dustproof net 206, the bottom plate 207 and the collection pipe 208, thereby preventing dust and debris from affecting the quality of dispensing of the semiconductor separator by the dispensing machine 1.

Please refer to Figure 4. In order to blow away the dust, the auxiliary mechanism 5 in this embodiment includes a fixing base 501 fixed to the left side of the fixing device 4, a supporting box 502 is fixed to the upper surface of the fixing base 501, a second dustproof net 503 is fixed to the left side of the supporting box 502, and the flowing air passes through the second dustproof net 503 to clean up the dust and debris contained in the air, and the top wall and bottom wall of the inner cavity of the supporting box 502 are fixed with connecting blocks 504, and no less than two fans 505 are fixed between the opposite sides of the two connecting blocks 504.

In this embodiment, the support box 502 is shaped like a rectangular parallelepiped with a hollow interior and missing left and right sides. No less than two fans 505 are evenly distributed between the opposite sides of the two connecting blocks 504. The control method of this application is controlled by a controller. The control circuit of the controller can be implemented by simple programming by technicians in this field. The provision of power is also common knowledge in this field. This application is mainly used to protect mechanical devices, so this application will no longer explain the control method and circuit connection in detail.

It should be noted that the auxiliary mechanism 5 enables the air to flow quickly to the right through the cooperation of the support box 502, the second dustproof net 503, the connecting block 504 and the fan 505, and carries the dust and debris on the semiconductor separator during the flow, so that the dust and debris far away from the cleaning mechanism 2 will not be sucked away by the cleaning mechanism 2 due to insufficient wind force.

The working principle of the above embodiment is:

(1) After the semiconductor separator is fixed on the fixing device 4, the fan 204 is started, and the air expansion box 201 sucks the dust and debris on the semiconductor separator into the collecting box 202, and at the same time sucks away the dust and debris that will fall on the semiconductor separator. Then the collecting pipe 208 extracts the dust and debris collected in the collecting box 202 and transports them to the positioning box 205, and makes the dust and debris fall on the first dustproof net 206. The cleaning mechanism 2 sucks away the dust and debris on the semiconductor separator and the dust and debris that will fall on the semiconductor separator through the cooperation of the air expansion box 201, the collecting box 202, the fan 204, the positioning box 205, the first dustproof net 206, the bottom plate 207 and the collecting pipe 208, thereby preventing the dust and debris from affecting the quality of the dispensing of the semiconductor separator by the dispensing machine 1.

(2) After the semiconductor separator is fixed on the fixing device 4, the fan 505 is started. The fan 505 causes the air to flow rapidly to the right, and allows the flowing air to pass through the second dustproof net 503 to clean up the dust and debris contained in the air. At the same time, the rapidly flowing air blows toward the semiconductor separator on the fixing device 4, blowing away the dust and debris on the semiconductor separator to the right. The auxiliary mechanism 5 enables the air to flow rapidly to the right through the cooperation of the support box 502, the second dustproof net 503, the connecting block 504 and the fan 505, and carries the dust and debris on the semiconductor separator together during the flow, so that the dust and debris far away from the cleaning mechanism 2 will not be sucked away by the cleaning mechanism 2 due to insufficient wind force.

It should be noted that, in this article, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

Although the embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that many changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention.

Claims (7)

1. Manufacturing equipment for semiconductor separators, comprising a table (3), characterized in that: the automatic dust removing device is characterized in that a dispensing machine (1) is arranged on the outer side of the workbench (3), a fixing device (4) is arranged on the upper surface of the workbench (3), a dust removing mechanism (2) for removing dust is arranged on the right side of the fixing device (4), an auxiliary mechanism (5) for assisting in removing dust is arranged on the left side of the fixing device (4), and a control panel (6) is fixed on the front face of the dispensing machine (1);

The utility model provides a point gum machine (1) is including fixing supporting seat (209) on fixing device (4) right side, the upper surface of supporting seat (209) is fixed with collection box (202), the left side of collection box (202) is fixed with expansion case (201) that quantity is not less than two, the right side intercommunication of collection box (202) has collecting pipe (208), the right side intercommunication of collecting pipe (208) has positioning box (205) of fixing at workstation (3) upper surface, the right side of positioning box (205) is fixed with fan (204), the upper surface of positioning box (205) is fixed with two locating plates (211), the inside sliding connection of positioning box (205) has bottom plate (207), the upper surface of bottom plate (207) is fixed with first dust screen (206), the upper surface of first dust screen (206) is fixed with apron (203) of sliding connection between two locating plate (211) opposite sides.

2. A manufacturing apparatus of a semiconductor separator according to claim 1, wherein: the ash cleaning mechanism (2) further comprises positioning springs (212) which are fixed in the cover plate (203) and have not less than two in number, and positioning blocks (210) which are inserted in the positioning plate (211) are fixed on the left side and the right side of the positioning springs (212) and on the opposite side.

3. A manufacturing apparatus of a semiconductor separator according to claim 1, wherein: the cross section of the air expansion box (201) is trapezoid, and the positioning box (205) is cuboid with hollow inside and missing upper surface and lower surface.

4. A manufacturing apparatus of a semiconductor separator according to claim 1, wherein: an air inlet for communicating the collecting pipe (208) is formed in the left side of the positioning box (205), and an air outlet for communicating the air supply fan (204) is formed in the right side of the positioning box (205).

5. A manufacturing apparatus of a semiconductor separator according to claim 2, wherein: positioning grooves for inserting the positioning blocks (210) are formed in the opposite sides of the two positioning plates (211), and the opposite sides of the two positioning blocks (210) are semicircular.

6. A manufacturing apparatus of a semiconductor separator according to claim 1, wherein: the auxiliary mechanism (5) comprises a fixing seat (501) fixed on the left side of the fixing device (4), a supporting box (502) is fixed on the upper surface of the fixing seat (501), a second dust screen (503) is fixed on the left side of the supporting box (502), connecting blocks (504) are fixed on the top wall and the bottom wall of an inner cavity of the supporting box (502), and a plurality of fans (505) with the number not less than two are fixed between two opposite sides of the connecting blocks (504).

7. A manufacturing apparatus of a semiconductor separator according to claim 6, wherein: the shape of the supporting box (502) is a cuboid with hollow inside and missing left and right sides, and the fans (505) with the number not less than two are uniformly distributed between the opposite sides of the two connecting blocks (504).