CN221926079U - A ceramic copper-clad substrate structure that is convenient for testing peel strength - Google Patents

Abstract

The utility model discloses a ceramic copper-clad substrate structure that is convenient for testing peel strength, including a ceramic sheet, a fixing copper sheet and a testing copper sheet; a fixing copper sheet is arranged on the front of the ceramic sheet along its length direction, the fixing copper sheet is U-shaped, and its open end is arranged to the right along the length direction of the ceramic sheet; a testing copper sheet is also arranged on the front of the ceramic sheet relative to the fixing copper sheet along its length direction, and the right end of the testing copper sheet extends out of the opening end side of the fixing copper sheet, thereby forming a short end for testing; the front and back sides of the ceramic sheet are cut relative to the short end part by a laser cutting machine, and after the short end part is separated from the ceramic sheet, the short end part is bent upward 90° inwardly by a standard 90° peel tester, and the short end part can be vertically pulled to perform its peel strength test, and in the process, it is fixed by the fixing copper sheet. The utility model avoids the interference of bonding quality on the accuracy of the test result.

Description

A ceramic copper-clad substrate structure that is convenient for testing peel strength

Technical Field

The utility model relates to the technical field of ceramic copper-clad substrates, in particular to a ceramic copper-clad substrate structure which is convenient for detecting peeling strength.

Background Art

With the continuous advancement of electronic technology, in the packaging application of power electronic components, the heat dissipation substrate not only undertakes the functions of electrical connection and mechanical support, but also is an important channel for heat transmission. Ceramic substrate is a commonly used material in power modules. It has special thermal, mechanical and electrical properties and is an ideal choice for demanding power electronic applications. Currently, common types of ceramic substrates include HTCC, LTCC, TFC, DBC, DBA, DPC, etc.

In practical applications, the failure form of ceramic substrates is related to many factors such as substrate material, interface strength, residual stress in the manufacturing process, process defects, and the load borne. The normal stress perpendicular to the ceramic substrate interface is usually defined as peeling stress, and the surface force acting on the ceramic substrate interface is defined as shear force. The corresponding strengths are called peeling strength and shear strength, respectively, which are used as parameters to evaluate the strength of ceramic substrates.

For ceramic copper-clad substrates, the industry often uses peel strength as the evaluation standard for its production quality. Specifically, under the test conditions of an ambient temperature of 25°C and an ambient humidity of 65%, the ceramic copper-clad substrate samples are subjected to peel tests, the sample width is 5mm, and the displacement application rate is 50mm/min. The traditional test method in the industry is: the test sample needs to be bonded to the iron plate with an adhesive, and then the metal bottom pattern is milled with a blade, and finally the milled metal pattern is clamped with a chuck for a 90° peel test. However, if the above test method is used, each batch of samples needs to be repeatedly bonded multiple times, resulting in low efficiency. At the same time, the quality of bonding will greatly affect the test results of the peel strength. In the process of milling the metal bottom pattern, it is also easy to cause damage to the ceramic and the joint surface, thereby affecting the test results. Therefore, the above problems need to be solved urgently.

Summary of the invention

The technical problem to be solved by the utility model is to provide a ceramic copper-clad substrate structure which is convenient for testing peel strength, thereby eliminating the step of separately bonding each sample to an iron plate with an adhesive during traditional testing of peel strength of ceramic copper-clad substrates. The structure of the utility model can be directly cut by a laser cutting machine before testing, thereby avoiding interference of bonding quality on the accuracy of test results, saving time and effort, reducing test costs, and improving test efficiency and test accuracy.

In order to solve the above technical problems, the utility model adopts the following technical solutions: the utility model is a ceramic copper-clad substrate structure that is convenient for detecting peeling strength, and its innovation lies in: comprising a ceramic sheet, a fixing copper sheet and a detecting copper sheet; a fixing copper sheet is arranged in the middle position of the front side of the horizontally arranged ceramic sheet along its length direction, the fixing copper sheet is U-shaped, and its open end is arranged horizontally to the right along the length direction of the ceramic sheet; a rectangular detecting copper sheet matching with the fixing copper sheet is also arranged in the opening groove on the front side of the ceramic sheet relative to the fixing copper sheet along its length direction. The detection copper sheet and the fixing copper sheet are arranged at equal intervals, and the right end thereof extends horizontally and vertically out of the open end side of the fixing copper sheet, thereby forming a short end for detection; the front and back sides of the ceramic sheet are cut relative to the short end of the detection copper sheet by a laser cutting machine, and after the short end is separated from the ceramic sheet, the short end is bent vertically upward 90° along the cutting line inwardly by a standard 90° peeling tester, and the peeling strength test can be carried out by vertically pulling the short end, and it is fixed by the fixing copper sheet in the process.

Preferably, the fixing copper sheet and the detecting copper sheet are both formed synchronously by sequentially undergoing film lamination, exposure, development, etching solution immersion and film stripping.

Preferably, the ceramic sheet is made of alumina ceramic, and has a thickness of 0.38 mm and a size of 138*190 mm.

Preferably, the copper layer thickness of the fixing copper sheet is 0.3 mm, and the width of both side edges of the fixing copper sheet is 9 mm.

Preferably, the copper layer of the detection copper sheet has a thickness of 0.3 mm and a width of 5 mm.

Preferably, the distance between the portion of the testing copper sheet located inside the fixing copper sheet and the fixing copper sheet is consistent, so that during the peel strength test of the testing copper sheet, the fixing copper sheet is used to fix it.

Preferably, the short end of the copper sheet for testing needs to be long enough to ensure that after being bent 90°, it can be directly clamped by the chuck of a standard 90° peel tester for peel strength testing.

Preferably, the vertical pulling speed is 50 mm/min, and the peeling length must be ensured to be no less than 75 mm.

Beneficial effects of the utility model:

(1) The utility model eliminates the need to use adhesive to bond each sample to an iron plate during the traditional ceramic copper-clad substrate peel strength test. The test can be directly performed after the structure of the utility model is cut by a laser cutting machine, thereby avoiding the interference of the bonding quality on the accuracy of the test results, saving time and effort, reducing the test cost, and improving the test efficiency and test accuracy.

(2) The utility model eliminates the need to mill the metal pattern at the bottom of the traditional ceramic copper-clad substrate during peel strength testing, thereby avoiding possible damage to the ceramic and bonding layer, greatly saving time and improving test accuracy.

BRIEF DESCRIPTION OF THE DRAWINGS

In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

FIG1 is a schematic structural diagram of a ceramic copper-clad substrate structure that is convenient for testing peel strength according to the present invention.

FIG. 2 is a schematic diagram of the bending state of the copper sheet for detection of the present invention.

Among them, 1-ceramic sheet; 2-copper sheet for fixing; 3-copper sheet for detection.

DETAILED DESCRIPTION

The technical solution of the utility model will be clearly and completely described below through specific implementation methods.

The utility model discloses a ceramic copper-clad substrate structure which is convenient for detecting peel strength, comprising a ceramic sheet 1, a fixing copper sheet 2 and a detecting copper sheet 3; the specific structure is shown in Figures 1 and 2, the ceramic sheet 1 is made of alumina ceramic, and its thickness is 0.38mm, and its size is 138*190mm; a fixing copper sheet 2 is provided in the middle position of the front side of the horizontally arranged ceramic sheet 1 along its length direction, the fixing copper sheet 2 is U-shaped, and its open end is horizontally arranged to the right along the length direction of the ceramic sheet 1; wherein, the copper layer thickness of the fixing copper sheet 2 is 0.3mm, and the width of both side edges of the fixing copper sheet 2 is 9mm.

In the utility model, a rectangular detection copper sheet 3 matching with the fixing copper sheet 2 is provided in the opening groove of the front side of the ceramic sheet 1 along its length direction. As shown in Figures 1 and 2, the detection copper sheet 3 and the fixing copper sheet 2 are arranged at equal intervals, and the right end thereof extends horizontally and vertically out of the opening end side of the fixing copper sheet 2 to form a short end for detection; wherein the fixing copper sheet 2 and the detection copper sheet 3 are both formed synchronously after film pasting, exposure, development, etching solution immersion and film stripping in sequence.

As shown in Figures 1 and 2, the copper layer thickness of the detection copper sheet 3 is 0.3 mm and its width is 5 mm; the portion of the detection copper sheet 3 located inside the fixing copper sheet 2 is consistent with the spacing between the fixing copper sheet 2, and thus during the peel strength test of the detection copper sheet 3, it is fixed by the fixing copper sheet 2.

The utility model uses a laser cutting machine to cut the front and back sides of the ceramic sheet 1 relative to the short end portion of the detection copper sheet 3. After the short end portion is separated from the ceramic sheet 1, the short end portion is bent vertically upward 90° along the cutting line inwardly through a standard 90° peeling tester, and the peeling strength test can be carried out by vertically pulling the short end portion, and the copper sheet 2 is used to fix it in the process; wherein, the vertical pulling speed is 50mm/min, and the peeling length must be ensured to be not less than 75mm; the length of the short end of the detection copper sheet 3 of the utility model must ensure that after it is bent 90°, it is convenient to be directly clamped by the chuck of the standard 90° peeling tester for peeling strength test.

When testing the peel strength of the utility model, the short end of the copper sheet 3 for testing is first directly clamped by the chuck of a standard 90° peel tester, and then vertically pulled at a speed of 50 mm/min, and the maximum and minimum values of the peel force within a peel length of at least 75 mm are recorded, and the corresponding peel strength is calculated.

Beneficial effects of the utility model:

(1) The utility model eliminates the need to use adhesive to bond each sample to an iron plate during the traditional ceramic copper-clad substrate peel strength test. The test can be directly performed after the structure of the utility model is cut by a laser cutting machine, thereby avoiding the interference of the bonding quality on the accuracy of the test results, saving time and effort, reducing the test cost, and improving the test efficiency and test accuracy.

(2) The utility model eliminates the need to mill the metal pattern at the bottom of the traditional ceramic copper-clad substrate during peel strength testing, thereby avoiding possible damage to the ceramic and bonding layer, greatly saving time and improving test accuracy.

The embodiments described above are merely descriptions of preferred implementation modes of the present invention, and are not intended to limit the concept and scope of the present invention. Without departing from the design concept of the present invention, various modifications and improvements made to the technical solutions of the present invention by ordinary engineering and technical personnel in the field should fall within the protection scope of the present invention. The technical contents for which protection is sought in the present invention have been fully recorded in the technical requirements.

Claims (8)

1. Ceramic copper-clad substrate structure convenient to detect peel strength, its characterized in that: the device comprises a ceramic piece, a copper sheet for fixing and a copper sheet for detecting; a fixing copper sheet is arranged in the middle of the front surface of the ceramic sheet horizontally and transversely arranged along the length direction of the ceramic sheet, the fixing copper sheet is U-shaped, and the opening end of the fixing copper sheet is horizontally and rightwards arranged along the length direction of the ceramic sheet; a rectangular detection copper sheet matched with the front surface of the ceramic sheet relative to the opening groove of the fixing copper sheet is arranged in the length direction of the ceramic sheet, the detection copper sheet and the fixing copper sheet are arranged at equal intervals, the right end of the detection copper sheet horizontally and vertically extends out of the opening end side of the fixing copper sheet, and then a short end for detection is formed; the front and back sides of the ceramic piece are cut relative to the short end part of the copper piece for detection by the laser cutting machine, after the short end part is separated from the ceramic piece, the short end part is vertically bent upwards by 90 degrees along the cutting line to the inner side direction by the standard 90-degree peeling tester, the short end part can be vertically lifted for detecting the peeling strength, and the short end part is fixed by the copper piece for fixing in the process.

2. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the fixing copper sheet and the detecting copper sheet are formed synchronously after film pasting, exposure, development, etching solution soaking and film stripping in sequence.

3. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the ceramic sheet adopts alumina ceramic, the thickness of the ceramic sheet is 0.38mm, and the size of the ceramic sheet is 138 mm.

4. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the thickness of the copper layer of the copper sheet for fixing is 0.3mm, and the widths of the two side edges of the copper sheet for fixing are 9mm.

5. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the thickness of the copper layer of the copper sheet for detection is 0.3mm, and the width of the copper layer for detection is 5mm.

6. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the part of the copper sheet for detection, which is positioned in the copper sheet for fixing, is consistent with the interval between the copper sheets for fixing, and then the copper sheets for detection are fixed through the copper sheets for fixing in the process of detecting the peel strength of the copper sheets for detection.

7. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the short end length of the copper sheet for detection needs to be ensured to be bent for 90 degrees, and then the copper sheet for detection is convenient to directly clamp the copper sheet for detection by a chuck of a standard 90-degree peeling tester for detection of peeling strength.

8. The ceramic copper clad substrate structure for facilitating peel strength detection according to claim 1, wherein: the vertical pulling speed is 50mm/min, and the peeling length is required to be ensured to be not less than 75mm.