CN221883834U - A heat dissipation chip detection device - Google Patents

Abstract

The utility model discloses a heat dissipation chip detection device, which relates to the field of heat dissipation chip technology, specifically including an equipment platform, and also including: a detection component, including a mounting frame arranged on the equipment platform, and a temperature detector arranged on the mounting frame; a placement platform, which is provided with two and symmetrically arranged on the top of the equipment platform, and the center of the top of the placement platform is used to place the heat dissipation chip to be detected; a driving component, which is provided with two and corresponds to the two placement platforms one by one, and is used to drive the placement platform to approach or move away from the center of the top of the equipment platform. The utility model cooperates with each other through the two driving components provided, so that the two placement platforms can approach or move away from the center of the top of the placement platform in sequence and in an orderly manner, and then a temperature detector can be used to perform detection, and the overall detection is orderly, making the entire process smoother and faster, more convenient to use, and improving work efficiency.

Description

A heat dissipation chip detection device

Technical Field

The utility model relates to the technical field of heat dissipation chips, in particular to heat dissipation chip detection equipment.

Background Art

After the invention and mass production of transistors, various solid-state semiconductor components such as diodes and transistors were used in large quantities, replacing the functions and roles of vacuum tubes in circuits. In the mid-to-late 20th century, advances in semiconductor manufacturing technology made integrated circuits possible. Compared with hand-assembled circuits using individual discrete electronic components, integrated circuits can integrate a large number of micro-transistors into a small chip, which is a huge improvement. The scale production capacity, reliability, and modular approach of integrated circuits ensure the rapid adoption of standardized integrated circuits instead of designs using discrete transistors. Chips generate a lot of heat when working, and in severe cases can even burn electrical devices, so chips that can dissipate heat appeared.

After searching, the existing patent authorization announcement number is CN213275858U, which is a heat dissipation chip detection device, including a workbench, a positioning structure is installed on the upper wall of the workbench, a clamping structure is installed on the upper wall of the positioning structure, a supporting structure is installed on the upper wall of the workbench, and a detection structure is installed on the lower wall of the supporting structure. The positioning structure includes: a positioning plate, four positioning blocks, a main board, a chip, a charging seat and a charging head; in this device, the chip can be made to work in advance by replacing the positioning plate, so that this chip can be directly detected after the previous chip is detected, which solves the problem of existing heat dissipation chip detection equipment wasting detection time and reducing detection efficiency.

However, there are still certain inconveniences when implementing the above device: when the chip body is tested, there is only one set of positioning plate, main board and chip, and only one set of testing equipment, which increases the time for staff to constantly replace chips. When the staff replaces them, the detection efficiency is reduced, and the use effect is poor, so it is urgent to improve it.

Utility Model Content

The purpose of the utility model is to provide a heat dissipation chip detection device to solve the problems raised in the above background technology.

In order to achieve the above utility model purpose, the utility model adopts the following technical solutions:

The utility model provides a heat dissipation chip detection device, including a device platform, and also includes:

A detection component, including a mounting frame arranged on the equipment table, and a temperature detector arranged on the mounting frame;

Two placement tables are provided and are symmetrically arranged on the top of the equipment table. The center of the top of the placement table is used to place the heat dissipation chip to be tested;

Two drive assemblies are provided, and correspond to the two placement tables one by one, and are used to drive the placement tables to move toward or away from the center of the top of the equipment table;

There are two guide assemblies, which correspond to the two placement tables one by one;

The clamping assembly is arranged on the top of the placing platform and is used for clamping the heat dissipation chip on the placing platform.

Preferably, the clamping assembly includes a sleeve rotatably connected to the top of the placement table, and a spring is provided inside the sleeve, the top end of the sleeve is connected to a sleeve rod extending to the outside of the sleeve, and a support plate is fixed to the top end of the sleeve rod, and a resistance pad is provided at the bottom of the support plate.

Preferably, the clamping assembly also includes a fixing plate fixed at the middle position of the top surface of the placing table, and a rack is arranged on the end surface of the fixing plate, and a gear meshing with the rack is sleeved on the outside of the sleeve; an L-shaped plate is fixed to the top of the fixing plate, and a first electromagnet is arranged at the bottom of the L-shaped plate, and a second electromagnet cooperating with the first electromagnet is arranged on the top of the support plate.

Preferably, the cross section of the sleeve rod and the cross section inside the sleeve are both regular hexagonal structures.

Preferably, the driving assembly includes a motor installed on the top of the equipment table, and the output end of the motor is connected to a screw rod. A bearing seat is also fixed to the top of the equipment table, and the screw rod and the bearing seat are rotatably connected. A threaded block is threadedly connected to the screw rod, and the end of the threaded block is fixed to the end surface of the placement table.

Preferably, the guide assembly includes a mounting plate fixed on the top of the placement table, and a guide rod is fixed on the mounting plate, a guide block is slidably sleeved on the guide rod, and an end of the guide block is fixed to the end surface of the placement table.

Compared with the prior art, one or more of the above technical solutions have the following beneficial effects:

By cooperating with each other, the two placement tables can move toward or away from the center of the top of the placement table in order, and then a temperature detector can be used for detection. The overall detection is orderly, making the whole process smoother and faster, more convenient to use, and improving work efficiency.

Through the cooperation of the rack and gear, after the placement table moves to the center of the top of the equipment table, the clamping assembly automatically clamps the heat dissipation chip to be tested, which is convenient for subsequent testing. As the placement table returns, the support plate drives the resistance pad to return to its original state, which is conducive to the placement of new heat dissipation chips to be tested. The entire clamping process does not require tedious manual operations, which more effectively improves the detection efficiency.

BRIEF DESCRIPTION OF THE DRAWINGS

The drawings in the specification, which constitute a part of the present invention, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an improper limitation on the present invention.

In addition, the terms "installed", "set", "provided with", "connected", "connected", and "socketed" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral structure; it can be a mechanical connection, or an electrical connection; it can be a direct connection, or an indirect connection through an intermediate medium, or it can be an internal connection between two devices, elements, or components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

FIG1 is a schematic diagram of the initial state structure of the utility model as a whole;

FIG2 is a schematic diagram of the structure of the utility model when one of the placement tables moves to the center of the top of the equipment table;

FIG3 is an enlarged view of point A in FIG1 of the present utility model;

FIG4 is an enlarged view of point B in FIG1 of the present utility model;

FIG5 is an enlarged view of point C in FIG2 of the present utility model;

Figure 6 is a longitudinal sectional view of the sleeve of the utility model;

In the figure:

1. Equipment table; 2. Detection component; 201. Mounting frame; 202. Temperature detector; 3. Placement table; 4. Drive component; 401. Motor; 402. Screw; 403. Threaded block; 404. Bearing seat; 5. Guide component; 501. Mounting plate; 502. Guide rod; 503. Guide block; 6. Clamping component; 601. Support plate; 602. Resistance pad; 603. Sleeve; 604. Sleeve rod; 605. Spring; 606. Gear; 607. Fixing plate; 608. Rack; 609. L-shaped plate; 610. First electromagnet; 611. Second electromagnet.

DETAILED DESCRIPTION

In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

Please refer to FIG. 1 to FIG. 6 , a heat dissipation chip detection device includes a device platform 1, and also includes:

The detection component 2 includes a mounting frame 201 disposed on the equipment table 1, and a temperature detector 202 disposed on the mounting frame 201. As shown in FIG1 , the mounting frame 201 includes but is not limited to a frame structure in the prior art, and may also include an electric telescopic member in the prior art, such as an electric telescopic rod, an electric slide rail, etc., so as to control the temperature detector 202 to move horizontally and vertically, so as to more efficiently detect the heat dissipation chip to be detected. Since this is the prior art, its specific structure is not shown in the figure, and its specific principle will not be described in detail in this embodiment;

There are two placement tables 3, which are symmetrically arranged on the top of the equipment table 1. The center of the top of the placement table 3 is used to place the heat dissipation chip to be tested. Specifically, the placement table 3 is placed with a positioning plate, a positioning block, a main board, a chip, a charging seat, a charging head and other structures, as shown in Figure 1. This is the prior art (also refer to the comparative documents in the background technology), and will not be repeated in this embodiment;

There are two driving components 4, which correspond to the two placement tables 3 one by one, and are used to drive the placement tables 3 to move toward or away from the top center of the equipment table 1;

There are two guide assemblies 5, which correspond to the two placement tables 3 one by one;

The clamping assembly 6 is disposed on the top of the placement table 3 and is used to clamp the heat dissipation chip on the placement table 3 .

Furthermore, the clamping assembly 6 includes a sleeve 603 rotatably connected to the top of the placement table 3, and a spring 605 is arranged inside the sleeve 603, the top end of the sleeve 603 is connected to a sleeve rod 604 that penetrates to the outside of the sleeve 603, and a support plate 601 is fixed to the top end of the sleeve rod 604, and a resistance pad 602 is arranged at the bottom of the support plate 601.

Furthermore, the clamping assembly 6 also includes a fixing plate 607 fixed at the middle position of the top surface of the placing table 3, and a rack 608 is arranged on the end surface of the fixing plate 607, and a gear 606 meshing with the rack 608 is sleeved on the outside of the sleeve 603; an L-shaped plate 609 is fixed on the top of the fixing plate 607, and a first electromagnet 610 is arranged at the bottom of the L-shaped plate 609, and a second electromagnet 611 cooperating with the first electromagnet 610 is arranged on the top of the support plate 601;

Specifically, when in use, it can be seen from Figures 1 and 2 that in the initial state, the two placement tables 3 are symmetrically arranged on the table surface of the equipment table 1, and when it is necessary to detect the heat dissipation chip on the placement table 3, one of the driving components 4 is used to drive the placement table 3 connected thereto to move, so that the placement table 3 moves toward the top center of the equipment table 1. As shown in Figure 2, when the placement table 3 moves to the maximum limit, it is exactly at the top center of the equipment table 1, and the heat dissipation chip on it is exactly corresponding to the temperature detector 202. At this time, the temperature detector 202 can be used to detect the heat dissipation chip, and at this time, the other placement table 3 is in a standby state. At this time, the heat dissipation chip on the placement table 3 can be installed. The two driving components 4 cooperate with each other, so that the detection can be carried out in an orderly cycle, and the whole process is smoother and faster, more convenient to use, and improved work efficiency;

At the same time, it can be seen from FIG. 1 that in the initial state, the two clamping components 6 on the placement table 3 do not clamp the heat dissipation chip to be tested, and as the placement table 3 moves toward the top center of the equipment table 1, under the action of the rack 608, the gear 606 will drive the sleeve 603 to rotate, and the rotation of the sleeve 603 will drive the support plate 601 to rotate by the sleeve rod 604. When the placement table 3 stops at the top center of the equipment table 1, the support plate 601 rotates exactly ninety degrees, and it becomes the state in FIG. 2. At this time, by energizing the first electromagnet 610 and the second electromagnet 611, the two correspond to each other and repel each other magnetically, so that the second electromagnet 6 11 drives the support plate 601 and the sleeve rod 604 to descend and compress the spring 605, and the contact pad 602 at the bottom of the support plate 601 will contact and clamp the heat dissipation chip to be detected. The material of the contact pad 602 is an insulating elastic rubber material with a certain softness, thereby providing an effective and stable clamping effect; and as the placement table 3 returns, the power between the first electromagnet 610 and the second electromagnet 611 is cut off, and the support plate 601 drives the contact pad 602 to return to its original state, which is conducive to the placement of new heat dissipation chips to be detected. The entire clamping process does not require tedious manual operations, and the detection efficiency is more efficiently improved.

Furthermore, the cross-section of the sleeve rod 604 and the cross-section inside the sleeve 603 are both regular hexagonal structures, as shown in Figure 6. The sleeve rod 604 and the sleeve 603 with this structure can effectively drive the sleeve rod 604 to rotate synchronously when the sleeve 603 rotates, and the sleeve rod 604 itself can be extended and retracted up and down inside the sleeve 603.

Furthermore, the driving assembly 4 includes a motor 401 installed on the top of the equipment platform 1, and the output end of the motor 401 is connected to a screw 402, a bearing seat 404 is also fixed on the top of the equipment platform 1, and the screw 402 is rotatably connected to the bearing seat 404, a threaded block 403 is threadedly connected to the screw 402, and the end of the threaded block 403 is fixed to the end surface of the placement platform 3;

After the motor 401 is started, the motor 401 drives the screw rod 402 to rotate, so that the threaded block 403 drives the placement table 3 to move.

Furthermore, the guide assembly 5 includes a mounting plate 501 fixed on the top of the placement table 3, and a guide rod 502 is fixed on the mounting plate 501, a guide block 503 is slidably sleeved on the guide rod 502, and the end of the guide block 503 is fixed to the end surface of the placement table 3;

When the placement table 3 moves, the guide block 503 slides on the guide rod 502, so that the placement table 3 moves more stably and has a better use effect.

The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes within the technical scope disclosed by the present invention according to the technical scheme and the utility model concept of the present invention, which should be covered by the protection scope of the present invention.

Claims (6)

1. A heat dissipation chip detection device, comprising a device platform (1), characterized in that it also includes: A detection component (2) comprises a mounting frame (201) arranged on the equipment platform (1), and a temperature detector (202) arranged on the mounting frame (201); Two placement tables (3) are provided and are symmetrically arranged on the top of the equipment table (1); the center of the top of the placement table (3) is used to place the heat dissipation chip to be tested; Two drive assemblies (4) are provided and correspond one to one with the two placement tables (3), and are used to drive the placement tables (3) to move toward or away from the top center of the equipment table (1); There are two guide assemblies (5), which correspond one to one with the two placement tables (3); A clamping assembly (6) is arranged on the top of the placement platform (3) and is used to clamp the heat dissipation chip on the placement platform (3). 2. The heat dissipation chip detection equipment according to claim 1 is characterized in that: the clamping assembly (6) includes a sleeve (603) rotatably connected to the top of the placement table (3), and a spring (605) is arranged inside the sleeve (603), the top end of the sleeve (603) is connected to a sleeve rod (604) that penetrates to the outside of the sleeve (603), and a support plate (601) is fixed to the top end of the sleeve rod (604), and a resistance pad (602) is arranged at the bottom of the support plate (601). 3. The heat dissipation chip detection equipment according to claim 2 is characterized in that: the clamping assembly (6) also includes a fixing plate (607) fixed at the middle position of the top surface of the placement table (3), and a rack (608) is arranged on the end surface of the fixing plate (607), and the outer part of the sleeve (603) is sleeved with a gear (606) meshing with the rack (608); an L-shaped plate (609) is fixed to the top of the fixing plate (607), and a first electromagnet (610) is arranged at the bottom of the L-shaped plate (609), and a second electromagnet (611) matching the first electromagnet (610) is arranged on the top of the support plate (601). 4. The heat dissipation chip detection device according to claim 3 is characterized in that the cross section of the sleeve rod (604) and the cross section inside the sleeve (603) are both regular hexagonal structures. 5. The heat dissipation chip detection equipment according to claim 1 is characterized in that: the driving component (4) includes a motor (401) installed on the top of the equipment table (1), and the output end of the motor (401) is connected to a screw (402), and a bearing seat (404) is also fixed on the top of the equipment table (1), and the screw (402) and the bearing seat (404) are rotatably connected, and a threaded block (403) is threadedly connected to the screw (402), and the end of the threaded block (403) is fixed to the end face of the placement table (3). 6. The heat dissipation chip detection equipment according to claim 1 is characterized in that: the guide component (5) includes a mounting plate (501) fixed on the top of the placement table (3), and a guide rod (502) is fixed on the mounting plate (501), and a guide block (503) is slidably sleeved on the guide rod (502), and the end of the guide block (503) is fixed to the end surface of the placement table (3).