CN221837769U - Floor, wallboard heat preservation heat insulation structure - Google Patents

Abstract

The utility model relates to the field of construction, and particularly refers to a floor and wallboard thermal insulation structure, comprising a base layer, a leveling layer, a primer layer, and a ceramic micro-bead layer, wherein the leveling layer is relatively laid on the base layer, the primer layer is relatively laid on the leveling layer, and the ceramic micro-bead layer is relatively laid on the primer layer; when the base layer is relatively located on the inner side, the ceramic micro-bead layer is relatively located on the outer side, and when the base layer is relatively located on the outer side, the ceramic micro-bead layer is relatively located on the inner side. With the above structure, the weight of the building can be reduced while meeting the building strength.

Description

A floor and wall thermal insulation structure

Technical Field

The utility model relates to the field of construction, in particular to a thermal insulation structure of a floor slab and a wall slab.

Background Art

Traditional building insulation is generally heavy, such as polystyrene particles, rock wool boards and other boards, which not only increase the weight of the wall, but also easily fall off after a long time, posing a safety risk; while internal insulation technology is prone to cracking the wall, thus affecting the appearance of the indoor wall and the thermal insulation effect. Thermal insulation coating technology increases the difficulty of construction. It is difficult to apply evenly during construction, and the surface is not easy to level after drying, which affects the overall appearance of the wall. The coating has limited ability to reflect sunlight and will absorb part of the sunlight, affecting the thermal insulation effect.

A thicker insulation layer will also affect the building's gross floor area and floor space ratio.

Therefore, the inventor conducted further research on this and developed a thermal insulation structure for floor slabs and wall panels, which resulted in the present case.

Utility Model Content

The utility model aims to provide a floor slab and wall slab thermal insulation structure, which can reduce the weight of a building while meeting the building strength requirements.

In order to achieve the above purpose, the technical solution of the utility model is as follows:

A floor and wall thermal insulation structure, comprising

Base layer, leveling layer, primer layer, ceramic bead layer, the leveling layer is relatively laid on the base layer, the primer layer is relatively laid on the leveling layer, and the ceramic bead layer is relatively laid on the primer layer; when the base layer is relatively located on the inner side, the ceramic bead layer is relatively located on the outer side, and when the base layer is relatively located on the outer side, the ceramic bead layer is relatively located on the inner side.

Ceramic microspheres are thin-walled sealed hollow spherical structures with the characteristics of light weight, heat insulation, sound insulation, high and low temperature resistance, wear resistance, high strength and good electrical insulation. They can be used as coatings on the inside or outside of buildings. When used as a thermal insulation layer, they can significantly reduce the weight of the floor structure.

Furthermore, when the base layer is a ceiling, the ceiling is located at the uppermost layer, the leveling layer is located below the ceiling, the primer layer is located below the leveling layer, and the ceramic microbead layer is located below the primer layer.

Furthermore, when the base layer is a floor slab, the floor slab is located at the lowest layer, the leveling layer is located above the ceiling, the primer layer is located above the leveling layer, and the ceramic microbead layer is located above the primer layer.

Furthermore, when the base layer is a wall, the wall is located at the innermost side, the leveling layer is laid on the outer side of the wall, the putty layer is laid on the outer side of the leveling layer, the primer layer is laid on the outer side of the putty layer, and the ceramic microbead layer is laid on the outer side of the primer layer.

Furthermore, a finishing layer is arranged outside the ceramic microbead layer.

Furthermore, when the base layer is a wall, the wall is located at the outermost side, the leveling layer is laid on the inner side of the wall, the putty layer is laid on the inner side of the leveling layer, the primer layer is laid on the inner side of the putty layer, and the inner side of the primer layer is a ceramic microbead layer.

Furthermore, a finishing layer is arranged inside the ceramic microbead layer.

Furthermore, in the cross section of the ceramic micro-bead layer, six other ceramic micro-beads are arranged around each ceramic micro-bead.

After adopting the above scheme, the utility model has the following advantages compared with the prior art:

The construction process is reduced, and the construction period can be shortened by more than 70% under the premise of adopting quick-drying technology; the construction area per unit time of the same manpower is also greatly increased, and there is a prospect of robot spraying; there is no safety hazard of falling off during construction, and it is easier to transport, thus achieving lightweight construction.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a schematic diagram of a structure in which the base layer is a ceiling;

Fig. 2 is a schematic diagram of a structure in which the base layer is a floor slab;

Fig. 3 is a schematic diagram of a structure in which the base layer is an inner wall;

Fig. 4 is a schematic diagram of a structure in which the base layer is an exterior wall;

FIG5 is a schematic cross-sectional view of a ceramic microbead layer;

Description of symbols

Base layer 1, leveling layer 2, primer layer 3, ceramic micro bead layer 4, putty layer 5, finishing layer 6.

DETAILED DESCRIPTION

The utility model is further described below in conjunction with the accompanying drawings and specific embodiments.

As shown in Figure 1, a floor and wall panel thermal insulation structure comprises, from top to bottom, a ceiling base layer 1, a leveling layer 2, a primer layer 3, and a ceramic bead layer 4, wherein the leveling layer 2 is a putty leveling layer 2, the primer layer 3 serves as an auxiliary thermal insulation material, and the ceramic bead layer 4 is located at the bottom layer as a core thermal insulation material.

As shown in Figure 2, a floor and wall panel thermal insulation structure comprises, from top to bottom, a ceramic microbead layer 4, a primer layer 3, a leveling layer 2, and a floor base layer 1, wherein the primer layer 3 serves as an auxiliary thermal insulation material, and the ceramic microbead layer 4 is located at the bottom layer as a core insulation material.

As shown in Figure 3, a floor and wall panel thermal insulation structure, from left to right, is a finishing layer 6, a ceramic bead layer 4, a primer layer 3, a putty layer 5, a leveling layer 2, and a base layer 1 wall, wherein the base layer 1 wall is located indoors, the leveling layer 2 is a mortar leveling layer 2, the primer layer 3 is used as an auxiliary thermal insulation material, and the ceramic bead layer 4 is used as a core thermal insulation material.

As shown in Figure 4, a floor and wall panel thermal insulation structure, from left to right, is a finishing layer 6, a ceramic microbead layer 4, a primer layer 3, a putty layer 5, a leveling layer 2, and a base layer 1 wall, wherein the base layer 1 wall is located outdoors, the leveling layer 2 is a waterproof mortar leveling layer 2, the putty layer 5 is a water-resistant putty layer 5, the primer layer 3 is used as an auxiliary thermal insulation material, and the ceramic microbead layer 4 is used as a core thermal insulation material.

As shown in FIG. 5 , the ceramic microbead layer used in this embodiment is magnified and cross-sectioned, and it can be seen that six other ceramic microbeads are arranged around each ceramic microbead, and the structure is stable.

The above-mentioned leveling layer, putty layer, and primer layer are commonly used technical terms in the construction field. Although the specific material specifications are different, they can be found among the commonly used materials for decorating buildings; the finishing layer is a surface layer used for decoration according to different architectural styles and is not a key thermal insulation structure.

The thermal insulation structure of the utility model can be applied to different types of buildings, such as civil buildings: schools, hospitals, residences, etc., or industrial buildings: tunnel projects, base stations, ships, etc.

The above are only specific embodiments of the present utility model. At the same time, all words such as "upper, lower, left, right, middle" involved in the present utility model are for reference only and are not absolutely limiting. Any non-substantial changes made using the present utility model shall be deemed as an infringement of the protection scope of the present utility model.

Claims (8)

1. A floor, wallboard heat preservation and insulation structure, its characterized in that: comprising

The base layer, the leveling layer, the primer layer and the ceramic micro-bead layer are oppositely paved on the base layer, the primer layer is oppositely paved on the leveling layer, and the ceramic micro-bead layer is oppositely paved on the primer layer; the ceramic bead layer is positioned relatively outside when the base layer is positioned relatively inside, and the ceramic bead opposing layer is positioned relatively inside when the base layer is positioned relatively outside.

2. The floor slab and wallboard heat preservation and insulation structure according to claim 1, wherein: when the base layer is a ceiling, the ceiling is positioned at the uppermost layer, the leveling layer is positioned below the ceiling, the primer layer is positioned below the leveling layer, and the ceramic microbeads are positioned below the primer layer.

3. The floor slab and wallboard heat preservation and insulation structure according to claim 1, wherein: when the base layer is a floor slab, the floor slab is positioned at the lowest layer, the leveling layer is positioned on the ceiling, the primer layer is positioned on the leveling layer, and the ceramic microbead layer is positioned on the primer layer.

4. The floor slab and wallboard heat preservation and insulation structure according to claim 1, wherein: when the base layer is a wall body, the wall body is positioned at the innermost side, the leveling layer is paved on the outer side of the wall body, the putty layer is paved outside the leveling layer, the primer layer is paved outside the putty layer, and the ceramic microbead layer is arranged outside the primer layer.

5. The floor slab and wallboard heat preservation and insulation structure according to claim 4, wherein: the outside of the ceramic microbead layer is provided with a facing layer.

6. The floor slab and wallboard heat preservation and insulation structure according to claim 1, wherein: when the base layer is a wall body, the wall body is positioned at the outermost side, the leveling layer is paved on the inner side of the wall body, a putty layer is paved on the inner side of the leveling layer, a primer layer is paved at the inner side of the putty layer, the inner side of the primer layer is a ceramic microsphere layer.

7. The floor slab and wallboard heat preservation and insulation structure according to claim 6, wherein: the inner side of the ceramic microsphere layer is provided with a facing layer.

8. The floor slab and wallboard heat preservation and insulation structure according to claim 1, wherein: in the cross section of the ceramic microsphere layer, six other ceramic microspheres are arranged around each ceramic microsphere.